JPH0452021U - - Google Patents
Info
- Publication number
- JPH0452021U JPH0452021U JP9440590U JP9440590U JPH0452021U JP H0452021 U JPH0452021 U JP H0452021U JP 9440590 U JP9440590 U JP 9440590U JP 9440590 U JP9440590 U JP 9440590U JP H0452021 U JPH0452021 U JP H0452021U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- runner
- resin
- lead frame
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例および従来の金型の上型を除いた下型だけの平
面図である。
１……下型、２……交換ブロツク、３……キヤ
ビテイ、４ａ，４ｂ……カルポツト、５……ラン
ナ、６……樹脂溜り、７……クロスゲート。
FIGS. 1 and 2 are plan views of only the lower mold of an embodiment of the present invention and the conventional mold, excluding the upper mold, respectively. 1...Lower mold, 2...Replacement block, 3...Cavity, 4a, 4b...Carpot, 5...Runner, 6...Resin reservoir, 7...Cross gate.
Claims (1)
成されたキヤビテイ内に半導体チツプをマウント
したリードフレームをはさみ込み、複数のプラン
ジヤによりによりカツプからランナおよびランナ
から側路したゲートを通して前記キヤビテイに溶
融した熱硬化性樹脂を送り込み、前記半導体チツ
プを樹脂で包み込み封止する半導体装置の封止用
金型において、前記ランナの先端に樹脂溜りが設
けられていることを特徴とする半導体装置の封止
用金型。 It has an upper mold and a lower mold, and a lead frame with a semiconductor chip mounted thereon is sandwiched in the cavity formed by the upper mold and the lower mold, and a plurality of plungers are used to pass the lead frame from the cup to the runner and through the gate bypassed from the runner. A mold for sealing a semiconductor device in which a molten thermosetting resin is fed into the cavity and the semiconductor chip is wrapped and sealed with the resin, wherein a resin reservoir is provided at the tip of the runner. Mold for sealing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9440590U JPH0452021U (en) | 1990-09-07 | 1990-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9440590U JPH0452021U (en) | 1990-09-07 | 1990-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452021U true JPH0452021U (en) | 1992-05-01 |
Family
ID=31832315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9440590U Pending JPH0452021U (en) | 1990-09-07 | 1990-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452021U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244642A (en) * | 1993-02-16 | 1994-09-02 | Yokogawa Hewlett Packard Ltd | Modulator |
| JP2006326877A (en) * | 2005-05-23 | 2006-12-07 | Kasai Kogyo Co Ltd | Manufacturing method of trim element for car |
-
1990
- 1990-09-07 JP JP9440590U patent/JPH0452021U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244642A (en) * | 1993-02-16 | 1994-09-02 | Yokogawa Hewlett Packard Ltd | Modulator |
| JP2006326877A (en) * | 2005-05-23 | 2006-12-07 | Kasai Kogyo Co Ltd | Manufacturing method of trim element for car |