JPH0452056U - - Google Patents
Info
- Publication number
- JPH0452056U JPH0452056U JP9417790U JP9417790U JPH0452056U JP H0452056 U JPH0452056 U JP H0452056U JP 9417790 U JP9417790 U JP 9417790U JP 9417790 U JP9417790 U JP 9417790U JP H0452056 U JPH0452056 U JP H0452056U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- thermal head
- substrate
- resin layer
- convex glaze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案によるサーマルヘツドの断面図
を示したものである。第２図は従来のサーマルヘ
ツドの平面を示したものである。
１……基板、２……凸形状グレーズ、３……抵
抗体パターン、４……コモン側電極、５……リー
ド側電極、６……外部コンタクト部電極、７……
保護膜、８Ａ……コモン電極側樹脂層、８Ｂ……
リード電極側樹脂層、８Ｃ……外部コンタクト部
樹脂層、９……ＩＣ、１０……封止剤、１１……
樹脂層。
FIG. 1 shows a sectional view of a thermal head according to the present invention. FIG. 2 shows a plan view of a conventional thermal head. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Convex glaze, 3... Resistor pattern, 4... Common side electrode, 5... Lead side electrode, 6... External contact part electrode, 7...
Protective film, 8A...Common electrode side resin layer, 8B...
Lead electrode side resin layer, 8C...External contact portion resin layer, 9...IC, 10...Sealant, 11...
resin layer.
Claims (1)
その上に形成された抵抗体と電極及び保護膜を有
するサーマルヘツドにおいて、凸形状のグレーズ
部と、ＩＣ素子の封止剤部分と、各部電極の接続
端子部と、基板裏面を除く表面部分に樹脂層を形
成したことを特徴とするサーマルヘツド。 An IC element and a convex glaze part on a substrate,
In a thermal head that has a resistor, an electrode, and a protective film formed thereon, the convex glaze part, the sealant part of the IC element, the connection terminal part of each electrode, and the surface part except the back surface of the substrate. A thermal head characterized by forming a resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9417790U JPH0452056U (en) | 1990-09-06 | 1990-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9417790U JPH0452056U (en) | 1990-09-06 | 1990-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452056U true JPH0452056U (en) | 1992-05-01 |
Family
ID=31831926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9417790U Pending JPH0452056U (en) | 1990-09-06 | 1990-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452056U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010173136A (en) * | 2009-01-28 | 2010-08-12 | Kyocera Corp | Recording head and recording apparatus equipped with the same |
-
1990
- 1990-09-06 JP JP9417790U patent/JPH0452056U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010173136A (en) * | 2009-01-28 | 2010-08-12 | Kyocera Corp | Recording head and recording apparatus equipped with the same |
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