JPH0229734U - - Google Patents
Info
- Publication number
- JPH0229734U JPH0229734U JP10811888U JP10811888U JPH0229734U JP H0229734 U JPH0229734 U JP H0229734U JP 10811888 U JP10811888 U JP 10811888U JP 10811888 U JP10811888 U JP 10811888U JP H0229734 U JPH0229734 U JP H0229734U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat generating
- heating resistor
- thermal head
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の第１の実施例の薄膜方式の端
面型サーマルヘツドにおける電極パターンの構成
図、第２図〜第４図は従来の薄膜方式の端面型サ
ーマルヘツドにおける電極パターン例図、第５図
は従来の厚膜方式の端面型サーマルヘツドにおけ
る電極パターン例図、第６図は本考案の第２の実
施例の厚膜方式の端面型サーマルヘツドにおける
電極パターンの構成図である。
１１，２１，３１，４１，５１，６１：発熱抵
抗体、１２，２４，３４，４２，５４，６３：選
択電極、１３，１７，２３，３３，４３，５３：
共通電極、１４，４４，６４：下基板、１５，４
５，６５：上基板、１６，４６，６６：接着層、
２２，３２，５２：ボンデイングパツド、１８：
保温層。
FIG. 1 is a configuration diagram of an electrode pattern in a thin film type edge type thermal head according to a first embodiment of the present invention, and FIGS. 2 to 4 are examples of electrode patterns in a conventional thin film type edge type thermal head. FIG. 5 is a diagram illustrating an example of an electrode pattern in a conventional thick film type end face type thermal head, and FIG. 6 is a diagram showing a configuration of an electrode pattern in a thick film type end face type thermal head according to a second embodiment of the present invention. 11, 21, 31, 41, 51, 61: heating resistor, 12, 24, 34, 42, 54, 63: selection electrode, 13, 17, 23, 33, 43, 53:
Common electrode, 14, 44, 64: Lower substrate, 15, 4
5, 65: upper substrate, 16, 46, 66: adhesive layer,
22, 32, 52: Bonding pad, 18:
Thermal layer.
Claims (1)
熱抵抗体の上層か下層の何れか一方に保温層およ
び電極を形成して、該発熱抵抗体の断面を基板表
面に露出し、感熱媒体を該断面に沿つて摺動させ
、該発熱抵抗体に対して選択的に通電することに
より印字を行う端面型サーマルヘツドにおいて、
上記発熱抵抗体を形成する基板に接着する基板、
および該基板を接着する接着層を導電材料で構成
し、該基板および接着層を共通電極とすることを
特徴とする端面型サーマルヘツド。 A band-shaped heat generating resistor is formed in the main scanning direction, a heat insulating layer and an electrode are formed on either the upper layer or the lower layer of the heat generating resistor, and the cross section of the heat generating resistor is exposed on the substrate surface. In an edge-type thermal head that performs printing by sliding the heating resistor along the cross section and selectively energizing the heating resistor,
a substrate to be bonded to the substrate forming the heating resistor;
and an end face type thermal head characterized in that an adhesive layer for adhering the substrate is made of a conductive material, and the substrate and the adhesive layer serve as a common electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10811888U JPH0229734U (en) | 1988-08-17 | 1988-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10811888U JPH0229734U (en) | 1988-08-17 | 1988-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229734U true JPH0229734U (en) | 1990-02-26 |
Family
ID=31343152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10811888U Pending JPH0229734U (en) | 1988-08-17 | 1988-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229734U (en) |
-
1988
- 1988-08-17 JP JP10811888U patent/JPH0229734U/ja active Pending
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