JPH0452300A - Composite dispersion plating method - Google Patents
Composite dispersion plating methodInfo
- Publication number
- JPH0452300A JPH0452300A JP15866990A JP15866990A JPH0452300A JP H0452300 A JPH0452300 A JP H0452300A JP 15866990 A JP15866990 A JP 15866990A JP 15866990 A JP15866990 A JP 15866990A JP H0452300 A JPH0452300 A JP H0452300A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- plating
- eutectoid
- composite dispersion
- dispersion plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 73
- 239000006185 dispersion Substances 0.000 title claims abstract description 29
- 239000002131 composite material Substances 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 26
- 239000002245 particle Substances 0.000 claims abstract description 77
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 238000007796 conventional method Methods 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011246 composite particle Substances 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は複合分散めっき方法に関し、耐摩耗、耐食、耐
熱、耐潤滑性等、各種環境に対する部品の製造に有利に
適用される複合分散めっき方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a composite dispersion plating method, and the present invention relates to a composite dispersion plating method that is advantageously applied to the production of parts for various environments such as wear resistance, corrosion resistance, heat resistance, lubrication resistance, etc. Regarding the method.
従来より実施されている分散めっき方法は、めっき液中
に共析させようとする粒子を混合攪拌する方法が一般的
であり、共析性改善策として、（１）めっき槽の形状、
（２）めっき液の攪拌方法、（３）界面活性剤による粒
子表面の電荷（ゼータ電位）調整等がとられている。Conventional dispersion plating methods generally involve mixing and stirring particles to be eutectoid in a plating solution, and measures to improve eutectoid properties include (1) the shape of the plating tank,
(2) A method of stirring the plating solution, and (3) adjusting the charge (zeta potential) on the particle surface using a surfactant.
従来の方法では以下のような欠点、問題がある。 The conventional methods have the following drawbacks and problems.
（１）めっき槽の形状、めっき液の攪拌方法をいくら変
えても被めっき体の形状、大きさ等により各部均一な共
析量を得ることができない。(1) No matter how much the shape of the plating tank or the method of stirring the plating solution is changed, it is not possible to obtain a uniform eutectoid amount in each part due to the shape, size, etc. of the object to be plated.
（２）通常の粒子をめっき液中に添加分散させる方法で
は、共析量は多くて１５ｖｏ１％位であり、高い共析率
を得ることができない上、その共折率を制御することも
不可能であり、共析量の変動が大きい。(2) In the conventional method of adding and dispersing particles into a plating solution, the amount of eutectoid is about 15vo1% at most, and it is not possible to obtain a high eutectoid rate, and it is also difficult to control the eutectoid rate. possible, and the variation in the eutectoid amount is large.
（３〕２種以上の粒子を希望する比率で共析させること
が不可能である。(3) It is impossible to eutectoid two or more types of particles in a desired ratio.
（４） めっきの種類によっては、ｐＨがアルカリのめ
っき液を使用せねばならない場合があり、この場合、共
析性をよくするため粒子表面を正の電荷（ゼータ電位）
を与える各種界面活性剤が使用されるが、ゼータ電位は
ｐＨ依存性が高く、アルカリ側で電位を正とさせる界面
活性剤の選定は困難を極める。また、仮に正の電荷を与
える界面活性剤が選定できても、めっき皮膜としての性
能を満足するめっき条件の把握が困難である。(4) Depending on the type of plating, it may be necessary to use a plating solution with an alkaline pH, and in this case, the particle surface is positively charged (zeta potential) to improve eutectoid properties.
Although various surfactants are used that give a positive potential on the alkaline side, the zeta potential is highly dependent on pH, and it is extremely difficult to select a surfactant that makes the potential positive on the alkaline side. Furthermore, even if a surfactant that imparts a positive charge can be selected, it is difficult to grasp the plating conditions that will satisfy the performance of the plating film.
以上の如く、従来の分散めっき方法では、共析粒子の定
量化、高い共析率、複合粒子の共析量定量化及び複雑形
状への分散めっき法としては多くの課題を有している。As described above, the conventional dispersion plating method has many problems in quantifying eutectoid particles, high eutectoid rate, quantifying the amount of eutectoid of composite particles, and dispersion plating on complex shapes.
本発明は上記技術水準に鑑み、従来技術におけるような
不具合を解消しつる複合分散めっき方法を提供しようと
するものである。In view of the above-mentioned state of the art, the present invention aims to provide a composite dispersion plating method that eliminates the problems encountered in the prior art.
〔課題を解決するた杓の手段〕
本発明は
（１）複数の組成の粒子を分散島つきする方法において
、複数の組成の粒子を所定の比率に配合し、均一に混合
、造粒、粒度調整した後、杓つき浴中に分散させてめっ
きすることを特徴とする複合分散めっき方法。[Means for Solving the Problems] The present invention provides (1) a method for dispersing particles of a plurality of compositions into islands, in which particles of a plurality of compositions are blended in a predetermined ratio, uniformly mixed, granulated, and sized. A composite dispersion plating method characterized in that after adjustment, the plating is performed by dispersing in a ladle bath.
（２） めっき液中に共析させようとする粒子を共存さ
せて複合分散給つきする方法において、共析させようと
する粒子が単一組成の粒子の場合には該粒子の表面に、
又、複数の組成の混合粒子の場合には、これら粒子を均
一に混合、造粒、粒度調整後の粒子表面に、めっき皮膜
と同一材料の皮膜を形成した後、これら粒子をめっき浴
中に分散させてめっきすることを特徴とする複合分散め
っき方法。(2) In a method of coexisting particles to be eutectoid in a plating solution and providing composite dispersion, if the particles to be eutectoid have a single composition, on the surface of the particles,
In addition, in the case of mixed particles with multiple compositions, after uniformly mixing these particles, granulating them, and adjusting the particle size, a film of the same material as the plating film is formed on the particle surface, and then these particles are placed in a plating bath. A composite dispersion plating method characterized by dispersion and plating.
である。It is.
すなわち、本発明は従来の分散めっき方法での問題点を
解決する手段として、
（１）、各種粒子（セラミックス、高分子材料等）は、
その材質特有の物性、特に表面物性を有しており、夫々
物性の異る粒子をめっき皮膜中に共析させる場合、夫々
の粒子に対するめっき液と粒子の親和性を改善する界面
活性剤を選定する必要があるが、本発明では、あらかじ
め粒子の表面にめっき皮膜と同一成分系の材料を被覆、
例えばＣｕめっきであればＣｕ。That is, the present invention, as a means to solve the problems with the conventional dispersion plating method, (1) Various particles (ceramics, polymer materials, etc.)
The material has physical properties, especially surface properties, and when particles with different physical properties are eutectoid in the plating film, select a surfactant that improves the affinity of the plating solution and the particles for each particle. However, in the present invention, the surface of the particles is coated with a material having the same composition as the plating film,
For example, Cu for Cu plating.
ＮｉめっきであればＮｉ系めっきを行うことにより、分
散粒子の種類が変っても粒子表面が常に一定であるため
同一めっき条件で希望する分散めっきが可能である。す
なわち、粒子の材質が変っても、めっき液と粒子表面は
常に同じ状態であり、常に同じ電気化学特性を有してい
るため、めっき条件も常に一定の条件で行える特徴を有
している。また、共析量も従来の方法では多くて１５ｖ
ｏ１％であるが本発明方法では４０〜５０ｖｏ１％の共
析も可能である。In the case of Ni plating, by performing Ni-based plating, the particle surface is always constant even if the type of dispersed particles changes, so desired dispersion plating can be performed under the same plating conditions. That is, even if the material of the particles changes, the plating solution and the particle surfaces are always in the same state and always have the same electrochemical properties, so plating conditions can always be performed under constant conditions. In addition, the amount of eutectoid is at most 15v in the conventional method.
Although the amount is 1%, the method of the present invention allows eutectoiding of 40 to 50 vol.
（２）使用される環境により２種以上の粒子、例えば耐
摩耗性を狙った硬質粒子と耐潤滑性を狙った固体潤滑粒
子を同時に共析させる場合、従来の方法（２種以上の粒
子をそれぞれ単独でめっき浴中に添加する方法）では、
希望する粒子の共析率が得られないが、本発明方法では
希望する比率になるよう、あらかじめ２種以上の粒子を
秤量、配合し、バインダと十分混練した後、分散めっき
用粒度に調整した一次粒子をめっき浴中に添加し２種以
上の粒子を希望する比率で共析させるものである。(2) Depending on the environment in which it is used, when eutectoiding two or more types of particles at the same time, for example, hard particles aimed at wear resistance and solid lubricant particles aimed at lubrication resistance, the conventional method (two or more types of particles In the method of adding each separately to the plating bath),
Although the desired eutectoid ratio of particles cannot be obtained, in the method of the present invention, two or more types of particles are weighed and blended in advance to obtain the desired ratio, and after sufficiently kneading with a binder, the particle size is adjusted to the particle size for dispersion plating. Primary particles are added to a plating bath to eutectoid two or more types of particles in a desired ratio.
使用する粒子の大きさは、通常分散めっきに使用される
粒度のもの、あるいは、サブミクロン、粗大粒子と、特
に大きさに制限は受けない。また、バインダとしては、
ＣＭＣ（セルメチルセルロース）の如く、でんぷん性の
物質あるいは親水性の接着剤と幅広くから選定できる。The size of the particles used is not particularly limited, and may be the particle size normally used for dispersion plating, submicron particles, or coarse particles. In addition, as a binder,
You can choose from a wide range of starch materials such as CMC (cell methylcellulose) or hydrophilic adhesives.
（３）更に、２種以上の粒子を多量にめっき皮膜中に共
析させるためには、前記（２）で調整した複合粒子表面
を更に、前記（１）の方法とを併用することにより更に
高共析率の複合分散めっき皮膜が得られる。(3) Furthermore, in order to eutectoid a large amount of two or more types of particles into the plating film, the surface of the composite particles prepared in (2) above can be further improved by using the method in (1) above. A composite dispersion plating film with a high eutectoid rate can be obtained.
〔実施例１〕
Ｎｌｂつき皮膜の耐摩耗性向上を目的として、硬質粒子
分散めっきを行った結果、第１図に示す如く、通常の方
法、すなわち、めっき液中にＡｌ２Ｏ３を添加して分散
めっきを行った場合、浴中へのＡｌ２Ｏ３の添加量の増
大と共に共析量は増加傾向にあるが、最大共析率は約１
３ｖｏ１％である。[Example 1] Hard particle dispersion plating was performed for the purpose of improving the wear resistance of the Nlb coated coating. As shown in Fig. 1, the results were shown in Figure 1. When performing this, the eutectoid amount tends to increase as the amount of Al2O3 added to the bath increases, but the maximum eutectoid rate is approximately 1
It is 3vo1%.
これに対し、本発明方法による分散めっき、すなわち、
＾１□０３粒子表面に無電解めっき法により約０．１μ
ｍのＮ１−Ｐめっきを行った後、この粒子をＮｉめっき
浴中に添加して分散めっきを実施した結果、第２図に示
す如く、最大共析率は約４５ｖｏ１％まで上昇した。In contrast, dispersion plating according to the method of the present invention, that is,
＾１□03 Approximately 0.1μ on the particle surface by electroless plating
After performing N1-P plating of m, the particles were added to a Ni plating bath to perform dispersion plating, and as a result, as shown in FIG. 2, the maximum eutectoid rate increased to about 45vo1%.
〔実施例２〕
耐摩耗性及び潤滑特性を有する固体潤滑膜を分散めっき
法で制作するにあたり、従来の方法、すなわちＣｕめっ
き液中にＡｌ２Ｏ３及びフッ素化黒鉛Ｃ以下、（ＣＦ）
、という）の粒子を夫々添加して複合分散めっきを実施
した結果、めっき皮膜中のＡｌ２Ｏ３及び（［：Ｆ）、
の共析率は、第３図に示す如く、最大でＡｌ２Ｏ３３ｖ
ｏ１％、（ＣＦ）、５ ｖｏ１％であった。[Example 2] In producing a solid lubricant film with wear resistance and lubricating properties by dispersion plating, a conventional method was used, namely, Al2O3 and fluorinated graphite (CF) in Cu plating solution.
As a result of performing composite dispersion plating by adding particles of ([:F) and ([:F)] in the plating film,
As shown in Figure 3, the eutectoid rate of Al2O33v is at most
o1%, (CF), 5vo1%.
これに対し、本発明方法、すなわち、あらかじめ＾１□
０３と（ＣＦ）、の粒子をＣＭＣにて十分混合粘結させ
た後に、−次粒子の大きさが約３μｍなるよう粒度調整
してＡｌ２Ｏ３と（ＣＦ）、の複合粉を作製し、この複
合粉をＣｕ＆６つき液中に添加、分散めっきを実施した
結果、第４図に示す如く、最大でＡＩＪ、１８ ｖｏ１
％、（ＣＦ）、１５ ｖｏ１％であった。In contrast, in the method of the present invention, ^1□
After thoroughly mixing and caking the particles of 03 and (CF) using CMC, the particle size was adjusted so that the size of the secondary particles was approximately 3 μm to prepare a composite powder of Al2O3 and (CF). As a result of adding the powder to the Cu & 6 coating solution and carrying out dispersion plating, as shown in Figure 4, the maximum was AIJ, 18 vol.
%, (CF), 15 vol%.
〔実施例３〕
実施例２で作製したＡ１．０３． （ＣＦ）、複合粉
の表面に、無電解めっき方法で約０．１μｍのＣｕめっ
きを行った後、Ｃｕめっき浴中に添加して杓つきを行っ
た結果、第４図に示す如く最大で＾１２０３２５ｖｏ１
％、（ＣＰ）、２０ ｖｏ１％の共析率を示していた。[Example 3] A1.03. produced in Example 2. (CF), the surface of the composite powder was plated with Cu to a thickness of about 0.1 μm using an electroless plating method, and then added to a Cu plating bath and ladled. As a result, as shown in Figure 4, the maximum ^120325vol1
%, (CP), showed a eutectoid rate of 20 vo1%.
（１） あらかじめ共析させようとする粒子表面にめ
っき皮膜と同種系統のめっき皮膜を施すことにより、粒
子表面がめつき液中においてめっき液中の金属イオンと
同電位となり、陰極界面の電気二重層部において吸着現
象が促進され、従って共析率が向上する。(1) By applying a plating film of the same type as the plating film on the surface of the particles to be eutectoid in advance, the particle surface becomes at the same potential as the metal ions in the plating solution, creating an electric double layer at the cathode interface. The adsorption phenomenon is promoted in this region, and the eutectoid rate is therefore improved.
（２）２種以上の粒子を共析させる場合、めっき液中に
おける各粒子の表面電位は夫々異っており、その結果、
電位の高い方が優先的に陰極表面に吸着し共析されるが
、表面電位の低い粒子は、高い粒子に阻害され、共析率
が低下する。しかし、本発明方法では、２種以上の粒子
が一次粒子において複合体となっており、電位の低い粒
子も高い電位の粒子と共に陰極表面に吸着され、その結
果、共析率が向上する。(2) When eutectoiding two or more types of particles, the surface potential of each particle in the plating solution is different, and as a result,
Particles with a higher potential are preferentially adsorbed on the cathode surface and eutectoid, but particles with a lower surface potential are inhibited by the higher particles and the eutectoid rate decreases. However, in the method of the present invention, two or more types of particles form a composite in the primary particles, and particles with a low potential are also adsorbed on the cathode surface together with particles with a high potential, resulting in an improvement in the eutectoid rate.
更に、この複合粒子の表面をめっき皮膜と同系統の皮膜
で被覆することにより、前記１の効果とあいまって共析
率が向上する。Furthermore, by coating the surface of the composite particles with a film of the same type as the plating film, the eutectoid rate is improved in combination with the effect described in 1 above.
第１図は本発明の第１実施例との比較例としてあげた従
来法による共析率を示す図表、第２図は本発明の第１実
施例の共析率を示す図表、第３図は本発明の第２及び第
３実施例との比較例としてあげた従来法による共析率を
示す図表、第壱図は本発明の第２、第３実施例の共析率
を示す図表である。
明FIG. 1 is a chart showing the eutectoid rate of the conventional method as a comparative example with the first embodiment of the present invention, FIG. 2 is a chart showing the eutectoid rate of the first embodiment of the present invention, and FIG. Figure 1 is a chart showing the eutectoid rate of the conventional method given as a comparative example with the second and third embodiments of the present invention, and Figure 1 is a chart showing the eutectoid ratio of the second and third embodiments of the present invention. be. Akira
Claims (2)
、複数の組成の粒子を所定の比率に配合し、均一に混合
、造粒、粒度調整した後、めっき浴中に分散させてめっ
きすることを特徴とする複合分散めっき方法。(1) In a method of dispersion plating of particles of multiple compositions, particles of multiple compositions are blended in a predetermined ratio, uniformly mixed, granulated, and particle size adjusted, and then dispersed in a plating bath and plated. A composite dispersion plating method characterized by:
て複合分散めっきする方法において、共析させようとす
る粒子が単一組成の粒子の場合には該粒子の表面に、又
、複数の組成の混合粒子の場合には、これら粒子を均一
に混合、造粒、粒度調整後の粒子表面に、めっき皮膜と
同一材料の皮膜を形成した後、これら粒子をめっき浴中
に分散させてめっきすることを特徴とする複合分散めっ
き方法。(2) In a method of composite dispersion plating in which particles to be eutectoid coexist in a plating solution, if the particles to be eutectoid have a single composition, on the surface of the particles, In the case of mixed particles with multiple compositions, after uniformly mixing these particles, granulating them, and adjusting the particle size, a film of the same material as the plating film is formed on the particle surface, and then these particles are dispersed in a plating bath. A composite dispersion plating method characterized by plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15866990A JPH0452300A (en) | 1990-06-19 | 1990-06-19 | Composite dispersion plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15866990A JPH0452300A (en) | 1990-06-19 | 1990-06-19 | Composite dispersion plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0452300A true JPH0452300A (en) | 1992-02-20 |
Family
ID=15676772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15866990A Pending JPH0452300A (en) | 1990-06-19 | 1990-06-19 | Composite dispersion plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452300A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60212456A (en) * | 1984-04-05 | 1985-10-24 | Unitika Ltd | Polyester resin composition |
| WO1999011843A1 (en) * | 1997-09-03 | 1999-03-11 | Isuzu Motors Limited | Composite particles for composite dispersion plating and method of plating therewith |
-
1990
- 1990-06-19 JP JP15866990A patent/JPH0452300A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60212456A (en) * | 1984-04-05 | 1985-10-24 | Unitika Ltd | Polyester resin composition |
| WO1999011843A1 (en) * | 1997-09-03 | 1999-03-11 | Isuzu Motors Limited | Composite particles for composite dispersion plating and method of plating therewith |
| US6372345B1 (en) * | 1997-09-03 | 2002-04-16 | Nihon Parkerizing Co., Ltd. | Composite particles for composite dispersion plating and method of plating therewith |
| EP0937789A4 (en) * | 1997-09-03 | 2005-04-20 | Isuzu Motors Ltd | COMPOSITE PARTICLES FOR DISPERSION COMPOSITE PLATING AND CORRESPONDING VENEER |
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