JPH0452537B2 - - Google Patents
Info
- Publication number
- JPH0452537B2 JPH0452537B2 JP58233009A JP23300983A JPH0452537B2 JP H0452537 B2 JPH0452537 B2 JP H0452537B2 JP 58233009 A JP58233009 A JP 58233009A JP 23300983 A JP23300983 A JP 23300983A JP H0452537 B2 JPH0452537 B2 JP H0452537B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- information recording
- optical information
- producing
- recording thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052714 tellurium Inorganic materials 0.000 claims description 77
- 239000010409 thin film Substances 0.000 claims description 69
- 239000000654 additive Substances 0.000 claims description 46
- 230000003287 optical effect Effects 0.000 claims description 44
- 239000000203 mixture Substances 0.000 claims description 37
- 238000002156 mixing Methods 0.000 claims description 29
- 230000000996 additive effect Effects 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 23
- 238000007740 vapor deposition Methods 0.000 claims description 23
- 229910052738 indium Inorganic materials 0.000 claims description 18
- 229910052718 tin Inorganic materials 0.000 claims description 15
- 229910052725 zinc Inorganic materials 0.000 claims description 15
- 229910052787 antimony Inorganic materials 0.000 claims description 14
- 229910052732 germanium Inorganic materials 0.000 claims description 14
- 239000003638 chemical reducing agent Substances 0.000 claims description 13
- 229910052745 lead Inorganic materials 0.000 claims description 13
- 229910052711 selenium Inorganic materials 0.000 claims description 13
- 229910052793 cadmium Inorganic materials 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 9
- 229910018110 Se—Te Inorganic materials 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 229910002909 Bi-Te Inorganic materials 0.000 claims description 7
- 238000010894 electron beam technology Methods 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910017934 Cu—Te Inorganic materials 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 229910052716 thallium Inorganic materials 0.000 claims description 6
- 229910052720 vanadium Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- -1 semimetals Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 229910020512 Co—Te Inorganic materials 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 44
- 238000000034 method Methods 0.000 description 41
- 239000000843 powder Substances 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 11
- 230000008859 change Effects 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000000151 deposition Methods 0.000 description 9
- 239000011669 selenium Substances 0.000 description 9
- 230000008021 deposition Effects 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 238000006722 reduction reaction Methods 0.000 description 6
- 230000007704 transition Effects 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910003069 TeO2 Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910002665 PbTe Inorganic materials 0.000 description 1
- 229910018219 SeTe Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910005642 SnTe Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910001215 Te alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 235000015067 sauces Nutrition 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- FESBVLZDDCQLFY-UHFFFAOYSA-N sete Chemical compound [Te]=[Se] FESBVLZDDCQLFY-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
- G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
- G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
- G11B2007/24302—Metals or metalloids
- G11B2007/24316—Metals or metalloids group 16 elements (i.e. chalcogenides, Se, Te)
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
- G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
- G11B2007/24318—Non-metallic elements
- G11B2007/2432—Oxygen
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
- G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
- G11B7/2433—Metals or elements of Groups 13, 14, 15 or 16 of the Periodic Table, e.g. B, Si, Ge, As, Sb, Bi, Se or Te
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、光や熱を用いて高密度に情報を繰り
返し記録再生,消去書き換えすることが可能な光
学情報記録媒体として、テルル低酸化物TeOx(O
<x<2)を主成分とする薄膜を製造する方法に
関するもので、容易かつ再現性の良い光学情報記
録薄膜の製法を提供するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is an optical information recording medium capable of repeatedly recording, reproducing, erasing and rewriting information at high density using light and heat . (O
The present invention relates to a method for manufacturing a thin film whose main component is <x<2), and provides an easy and reproducible method for manufacturing an optical information recording thin film.
従来例の構成とその問題点
TeOx(O<x<2)の薄膜は、高感度で、かつ
信号品質の高い光学情報記録薄膜として公知であ
り(特公昭54−3725)、既にこれを用いて静止画
フアイル,文書フアイル等が製品化されている。Structure of the conventional example and its problems A thin film of TeO x (O<x<2) is known as an optical information recording thin film with high sensitivity and high signal quality (Japanese Patent Publication No. 54-3725), and it has already been used. Still image files, document files, etc. have been commercialized.
また、このTeOx(O<x<2)を主成分とし、
これに添加物を含ませて、書き換え可能な光学情
報記録薄膜を得る技術は既に公知であり、(特願
昭53−100626,昭和58年度第30回応用物理学関係
連合講演会予稿集)添加物としては、セレン,イ
オウ,ゲルマニウム,スズが適用されている。 In addition, this TeO x (O<x<2) is the main component,
The technology to obtain a rewritable optical information recording thin film by adding additives to this is already known (Patent Application 1982-100626, Proceedings of the 30th Applied Physics Association Lectures in 1981). The materials used include selenium, sulfur, germanium, and tin.
これら書き換え可能な光学情報記録薄膜は、何
度も繰り返し使用することが必要であり、従つて
これまでの追加記録可能(一度だけ記録する)型
の記録薄膜よりも、膜組成の均質性、再現性が、
より厳しく要求される。 These rewritable optical information recording thin films need to be used over and over again, and therefore have better uniformity and reproducibility in film composition than conventional recording thin films that can be recorded once (recorded only once). The gender is
stricter requirements.
従来、このTeOxを主成分とし、添加物を含ま
せる方法としては次のような方法が用いられてき
た。 Conventionally, the following methods have been used to add additives to TeO x as the main component.
(1) 主成分としてTeO2とTeのソース,添加物と
して例えばGe,Snのソースを用意し複数個の
ソースから、各々のソースの加熱温度を制御し
て、基材上に同時に蒸着し、添加物を含む
TeOx(O<x<2)を合成する方法。(1) Prepare sources of TeO 2 and Te as main components and sources of Ge and Sn as additives, and simultaneously deposit on the substrate from multiple sources by controlling the heating temperature of each source, Contains additives
A method for synthesizing TeO x (O<x<2).
この方法は、各ソースの加熱温度を独立に制
御することで任意の組成の添加物を含むTeOx
薄膜を得ることができ、また、連続的に多数回
の蒸着を行なうことができる等のメリツトが考
えられるが、これまでのところ例えばTeは非
常に蒸気圧の高い物質であるため蒸発速度の制
御が難しく、特性の再現性が十分では無く、ま
た突沸によりドロツプアウトが生じやすい等の
問題点が有つた。 This method allows TeO x containing additives of arbitrary composition by independently controlling the heating temperature of each source.
Possible advantages include being able to obtain thin films and performing multiple evaporation processes in succession, but so far it has not been possible to control the evaporation rate because Te, for example, is a substance with extremely high vapor pressure. There were other problems, such as difficulty in reproducing the properties, insufficient reproducibility of characteristics, and the tendency to cause dropouts due to bumping.
(2) TeO2ソースと、例えばGe,Sn等の添加物と
Teとの合金ソースを用意し、各々のソースの
加熱温度を制御して、基材上に蒸着し、添加物
を含むTeOx(O<x<2)を合成する方法。(2) TeO 2 source and additives such as Ge and Sn
A method of synthesizing TeO x (O<x<2) containing additives by preparing alloy sources with Te, controlling the heating temperature of each source, and depositing the alloy onto a substrate.
この方法は、(1)の方法に比較して非常に簡便な
方法であり、容易にTeOxに添加物を含ませる
ことができる。しかし、Teと添加物との間に
蒸気圧の差があると、Te系合金ソースからの
蒸発物の組成変化が生じ、膜中で厚さ方向に組
成ずれができてしまいその結果、膜特性の低下
あるいは再現性が悪くなるという問題があつ
た。This method is much simpler than method (1), and allows TeO x to contain additives easily. However, if there is a difference in vapor pressure between Te and the additive, the composition of the evaporated material from the Te-based alloy source will change, creating a compositional shift in the thickness direction in the film, resulting in film properties. There was a problem of a decrease in performance or poor reproducibility.
(3) TeO2と、添加物として金属,半金属物質と
を混合した原料をタングステンボートあるいは
モリブデンポートのような還元力の強い金属製
のポートに乗せ、真空蒸着する方法。(特願昭
53−100626,58−58158)
この方法は、金属製のポートに通電,加熱し
て、ポート表面でTeO2との間に還元反応をお
こさせ、TeO2中の酸素を一部除きながら蒸着
してTeOx(O<x<2)を得、同時に添加物も
含ませてしまおうというものである。この方法
は極めて容易に添加物を含むTeOx薄膜を得る
ことが出来るという特長が有るが、反面、反応
の進行に従つてポート表面の還元力が低下し、
膜厚方向においてTeとOの組成比のズレが生
じる、添加材料の濃度制御がむつかしい等の点
で問題があつた。(3) A method in which a raw material consisting of a mixture of TeO 2 and a metal or metalloid substance as an additive is placed on a tungsten boat or a metal port with strong reducing power, such as a molybdenum port, and vacuum evaporated. (Tokugansho
53-100626, 58-58158) In this method, a metal port is energized and heated to cause a reduction reaction with TeO 2 on the port surface, and evaporation is performed while removing some of the oxygen in TeO 2 . The idea is to obtain TeO x (O<x<2) and also incorporate additives at the same time. This method has the advantage of being able to obtain a TeO x thin film containing additives very easily, but on the other hand, as the reaction progresses, the reducing power of the port surface decreases.
There were problems such as a deviation in the composition ratio of Te and O in the film thickness direction and difficulty in controlling the concentration of the additive material.
(4) 前記(3)の方法において、金属製のポートの代
わりにTeO2と添加物の混合粉末中に更にあら
かじめ還元用の材料として例えばFe,Cr,W
等の粉末を混合し、真空蒸着する方法。(特願
昭58−58158)
この方法は、原料は石英ルツボ等、原料と反応
をおこしにくい安定な容器に入れ、容器の外壁
をコイルヒーター等で加熱して、TeO2と還元
用材料との間に還元反応をおこさせ、TeO2中
の酸素を一部除きながら蒸着してTeOx(O<x
<2)を得、同時に添加物も含ませてしまうも
のである。(4) In the method (3) above, instead of the metal port, a reducing material such as Fe, Cr, W, etc. is added in advance to the mixed powder of TeO 2 and additives.
A method of mixing powders such as powders and vacuum evaporating them. (Japanese Patent Application No. 58-58158) In this method, the raw material is placed in a stable container such as a quartz crucible that does not easily react with the raw material, and the outer wall of the container is heated with a coil heater, etc. to combine TeO 2 and the reducing material. A reduction reaction is caused in between, and TeO 2 is vapor-deposited while removing some of the oxygen in TeO x (O<x
<2) and also contain additives at the same time.
この方法は、(3)の方法に比べて、あらかじめ大
量の原料を用意し、そこから分散して用いるこ
とで再現性を向上させることができる。また毎
回ボートを取り代える必要がない等の利点が有
る反面、(3)の方法の場合と同じく、やはり反応
の進行にしたがつて還元剤が低下し、膜厚方向
におけるTeとOの組成比のずれが避けられな
い。Compared to method (3), this method can improve reproducibility by preparing a large amount of raw materials in advance and dispersing them for use. Also, while there are advantages such as not having to replace the boat every time, as in the case of method (3), the amount of reducing agent decreases as the reaction progresses, and the composition ratio of Te and O in the film thickness direction Misalignment is unavoidable.
発明の目的
本発明は、以上述べたような再現性,制御性,
均一性といつた課題を解決し、容易にかつ再現性
良くTeOxの中に添加物を含ませる方法を提供し
TeOx(O<x<2)を主材料とする書きかえ可能
な光学情報記録薄膜の新規な製法を提供すること
を目的とする。Purpose of the Invention The present invention provides reproducibility, controllability,
We provide a method to easily and reproducibly incorporate additives into TeO x by solving problems such as uniformity.
The purpose of the present invention is to provide a new method for producing a rewritable optical information recording thin film mainly composed of TeO x (O<x<2).
発明の構成
本発明は、上記目的を達成するため、以下に述
べるような工程で得られる混合体を蒸着ソースと
して用いることを特徴とする。Structure of the Invention In order to achieve the above object, the present invention is characterized in that a mixture obtained through the steps described below is used as a deposition source.
(a) TeO2と還元性物質とを混ぜ合わせる工程、
(b) 前記混合物を熱処理して、TeO2の一部を還
元性物質と反応させる工程、
(c) 前記焼結体に添加材料を混ぜ合わせる工程。(a) a step of mixing TeO 2 and a reducing substance; (b) a step of heat-treating the mixture to cause a part of TeO 2 to react with the reducing substance; (c) adding an additive material to the sintered body. The process of mixing.
本発明によれば、熱処理によつて生じたTeO2
の還元形の大部分は、還元金属の一部と結合して
化合物Te−Mを形成し、未反応のTeO2および、
反応の結果酸化されたMoと一緒になつて均一な
焼結体を形成する。蒸着時には、この焼結体中の
TeO2と、Te−M間の結合からはずれたTeとが
同時に蒸着され、基材上で主成分であるTeOx(O
<x<2)を形成するわけであるが、この焼結体
を用いる方法は還元しながら蒸着する方法に比べ
て急激な反応が無いためソースが吹きこぼれると
いつた現象は無く、またTeの解離は序々に一定
の速度で進行するため膜厚方向で組成がズレるこ
とも少ない。また、一度に大量にソースを作成
し、そこから分取して使用することで、他の方法
に比べてはるかに再現性よく同じ特性のTeOx膜
が得られる。 According to the present invention, TeO 2 generated by heat treatment
Most of the reduced form of combines with a part of the reduced metal to form the compound Te-M, leaving unreacted TeO2 and
As a result of the reaction, it combines with oxidized Mo to form a uniform sintered body. During vapor deposition, the
TeO 2 and Te removed from the Te-M bond are simultaneously deposited, and the main component TeO x (O
< x < 2), but the method using this sintered body does not cause a rapid reaction compared to the method of vapor deposition while reducing, so there is no problem of the source boiling over, and it is also possible to Since the dissociation progresses gradually at a constant speed, there is little deviation in the composition in the film thickness direction. In addition, by creating a large amount of source at once and then using it in fractions, TeO x films with the same characteristics can be obtained with much better reproducibility than other methods.
また、この焼結体中に混ぜ合わされた添加材料
は、焼結体中に均質に分散することにより、蒸着
時に、主成分TeOxと分離されることが少なく、
大きな組成ずれを生じずに主成分TeOx薄膜中に
均質に含有される。添加材料とTeOxの蒸気圧,
融点を近く選べばTeOx薄膜中の添加物濃度は更
に均一になる。 In addition, the additive material mixed in the sintered body is dispersed homogeneously in the sintered body, so that it is less likely to be separated from the main component TeO x during vapor deposition.
It is homogeneously contained in the main component TeO x thin film without major compositional deviation. Additive materials and vapor pressure of TeO x ,
If the melting points are chosen close to each other, the additive concentration in the TeO x thin film becomes more uniform.
実施例の説明
本発明による蒸着ソースを作る工程の例を以下
に詳述する。DESCRIPTION OF THE EMBODIMENTS An example of a process for making a deposition source according to the invention is detailed below.
まず、乳鉢の中に、TeO2粉末と還元性物質を
入れよく混合する。混合は、ボールミルを用いる
ことも可能である。又、アルコール,アセトン等
を加えて混合することで均一にすることが容易に
なる。混合した粉末は、乾燥した後、石英ボート
に乗せ、電気炉で熱処理する。熱処理の際はN2,
Ar等の不活性ガス雰囲気中で行なう。熱処理温
度は還元物質によつて異なるが、おおよそ400℃
から1000℃の間で反応し、きれいな焼結体を得る
ことができた。熱処理温度が400℃以下では反応
が十分進行せず、1000℃以上では処理中にTe成
分が多量に蒸発してしまい好ましくない。とりわ
け600℃〜700℃の間では蒸発成分が少ない、再現
性良く、十分反応が進んだきれいな焼結体が得ら
れた。 First, put TeO 2 powder and a reducing substance in a mortar and mix well. A ball mill can also be used for mixing. Further, by adding and mixing alcohol, acetone, etc., it becomes easier to make the mixture uniform. After the mixed powder is dried, it is placed on a quartz boat and heat-treated in an electric furnace. N 2 during heat treatment,
It is carried out in an inert gas atmosphere such as Ar. The heat treatment temperature varies depending on the reducing substance, but is approximately 400℃.
The reaction took place between 1000°C and 1000°C, and a clean sintered body was obtained. If the heat treatment temperature is below 400°C, the reaction will not proceed sufficiently, and if it is above 1000°C, a large amount of Te component will evaporate during the treatment, which is not preferable. Particularly between 600°C and 700°C, a clean sintered body with few evaporated components, good reproducibility, and sufficient reaction progress was obtained.
還元性物質としては、Al,Si,Ti,V,Cd,
In,Sn,Sb,Ta,W,Cr,Mn,Fe,Co,Ni,
Cu,Zn,Ge,Mo,Bi,Pb等の金属又は半金属
またはS,Se,C等を用いることができる。上
記還元性物質は、熱処理によつてTeO2と反応し、
例えばmTeO2+nM→TeM+MO+TeO2のよう
な模式で示される変化をおこす。すなわちTeO2
の一部は還元性物質Mの一部によつて還元され
Teとなり、同時にMは、Oを奪つてMO,
M2O3,MO2といつた形の酸化物となる。この
時、還元されて生じたTeの大部分は、未反応で
残されていたMと結合しM2Te,MTe,M2Te3,
MTe2のような形をとり、焼結体中に含まれる。
従つて、熱処理の結果、得られる焼結体は、M−
Te合金,M−O酸化物,TeO2の集合体になつて
いると言える。 Reducing substances include Al, Si, Ti, V, Cd,
In, Sn, Sb, Ta, W, Cr, Mn, Fe, Co, Ni,
Metals or metalloids such as Cu, Zn, Ge, Mo, Bi, Pb, S, Se, C, etc. can be used. The above reducing substance reacts with TeO 2 by heat treatment,
For example, a change shown in the formula mTeO 2 +nM→TeM+MO+TeO 2 occurs. i.e. TeO2
A part of is reduced by a part of the reducing substance M.
Te becomes Te, and at the same time M takes O and MO,
It forms oxides such as M 2 O 3 and MO 2 . At this time, most of the reduced Te is combined with the unreacted M, resulting in M 2 Te, MTe, M 2 Te 3 ,
It takes the form of MTe 2 and is contained in the sintered body.
Therefore, the sintered body obtained as a result of the heat treatment has M-
It can be said that it is an aggregate of Te alloy, M-O oxide, and TeO 2 .
前述の還元性物質の中で、Cu,Sb,Pb,Al,
In,Zn,Bi,Ge,Se,Cdは、二酸化テルルを適
度な速度で還元するばかりでなく、還元されて生
じるTeとの相溶性が良く均一な焼結体を得るこ
とができた。とりわけCu,Al,Sb,Pb,Inの各
元素は、Teとの相溶性が非常に高く、極めて均
一な焼結体が得られることがわかつた。 Among the reducing substances mentioned above, Cu, Sb, Pb, Al,
In, Zn, Bi, Ge, Se, and Cd not only reduced tellurium dioxide at an appropriate rate, but also had good compatibility with Te produced by reduction, and a uniform sintered body could be obtained. In particular, the elements Cu, Al, Sb, Pb, and In were found to have very high compatibility with Te, resulting in an extremely uniform sintered body.
還元剤の混合比は15mol%ないし80mol%が適
当であつた。混合比が15mol%以下では還元が十
分に進行せず、この焼結体を用いて蒸着したテル
ル低酸化物薄膜は、後に述べるように非常にO成
分の多い膜で、光吸収係数が小さく記録前後の光
学的変化が十分であつた。また、混合比が80mol
%以上では、還元が進みすぎて、この焼結体を用
いて蒸着してテルル低酸化物薄膜は、非常にTe
成分の多い膜となり熱的に不安定な特性となつて
光学情報記録膜としては使用できなかつた。混合
比が15mol%から80mol%の間では、適度にTeO2
の還元が進んだ焼結体が得られ、それを用いて混
合比に応じた特性の光学情報記録体の主成分とし
てのテルル低酸化物薄膜が得られることがわかつ
た。 The appropriate mixing ratio of the reducing agent was 15 mol% to 80 mol%. When the mixing ratio is less than 15 mol%, the reduction does not proceed sufficiently, and the low tellurium oxide thin film deposited using this sintered body is a film with a very high O content, as will be described later, and the light absorption coefficient is recorded as low. The front and rear optical changes were sufficient. Also, the mixing ratio is 80mol
% or more, the reduction progresses too much and the low tellurium oxide thin film deposited using this sintered body has a very low Te
The film contained many components and had thermally unstable characteristics, making it impossible to use it as an optical information recording film. When the mixing ratio is between 15 mol% and 80 mol%, a moderate amount of TeO 2
It was found that a sintered body in which the reduction of was progressed was obtained, and that it was possible to obtain a tellurium low oxide thin film as the main component of an optical information recording medium with characteristics depending on the mixing ratio.
この焼結体に機能を改良あるいは付加するため
の添加物を含ませる手段としては、上述のよう
な、TeO2に還元性物質を混合するのと同様の方
法を用いる。 As a means for incorporating additives to improve or add functions to this sintered body, a method similar to the above-mentioned method of mixing a reducing substance with TeO 2 is used.
添加材料としては、例えばTi,V,Ta,Cr,
Mo,W,Mn,Fe,Co,Ni,Pt,Cu,Ag,
Zn,Cd,Al,In,Tl,Si,Ge,Sn,Pb,As,
Sb,Bi,S,Se等の金属,半金属,非金属元素
を単体または酸化物の形で、それぞれ単独に、あ
るいは各物質間の化合物として用いることができ
る。添加物の最適な添加量は、添加物によつてそ
れぞれ異なるが、どれも10〜40wt%の範囲で記
録特性,安定性の良好な蒸着薄膜が得られた。添
加物は、前述のように蒸着時には、蒸着薄膜の中
に取り込まれてTeOx(O<x<2)中のTe微粒
子に作用し、例えば元素単体としてTeと結合し、
Te微粒子が可逆的な相転移を起こしやすくする。
あるいは、Teの周囲に存在し、熱拡散係数を大
きくする等の動きをすると考えられる。 Examples of additive materials include Ti, V, Ta, Cr,
Mo, W, Mn, Fe, Co, Ni, Pt, Cu, Ag,
Zn, Cd, Al, In, Tl, Si, Ge, Sn, Pb, As,
Metals, semimetals, and nonmetallic elements such as Sb, Bi, S, and Se can be used alone or in the form of oxides, or as a compound between each substance. Although the optimum amount of the additive varies depending on the additive, a deposited thin film with good recording properties and stability was obtained in the range of 10 to 40 wt%. As mentioned above, during vapor deposition, the additive is taken into the vapor deposited thin film and acts on the Te fine particles in TeO x (O<x<2), for example, it combines with Te as a single element,
Te particles facilitate reversible phase transition.
Alternatively, it is thought that it exists around Te and acts to increase the thermal diffusion coefficient.
前述の添加物質の中で蒸着膜組成の均質性を高
める、あるいは、蒸着温度を低くして基材にダメ
ージを与えない等の条件を満足するために、
TeOxの融点および蒸気圧に出来るだけ近い融点、
蒸気圧をもつた材料を選ぶ。このことから特に、
Zn,Cd,In,Tl,Ge,Sn,Pb,As,Sb,Bi,
S,Seが有効であつた。中でもGe,Sn,Se,
Bi,In,Znを用いた場合は、蒸着が容易で、か
つ得られた薄膜の記録特性が優れていた。 In order to satisfy the conditions such as increasing the homogeneity of the deposited film composition among the above-mentioned additives, or lowering the deposition temperature so as not to damage the base material,
a melting point as close as possible to the melting point and vapor pressure of TeO x ,
Choose a material with vapor pressure. For this reason, especially
Zn, Cd, In, Tl, Ge, Sn, Pb, As, Sb, Bi,
S and Se were effective. Among them, Ge, Sn, Se,
When Bi, In, and Zn were used, vapor deposition was easy, and the resulting thin films had excellent recording properties.
これらの添加物は、どれも10〜30wt%の添加
量の範囲に選んだ時、特に書き換え特性に優れた
薄膜が得られる。添加量があまり多くなると膜の
書き換え特性が失なわれてしまう。また逆に少な
くなり過ぎても十分な書き換え特性が得られなか
つた。 When these additives are selected in amounts ranging from 10 to 30 wt%, a thin film with particularly excellent rewriting properties can be obtained. If the amount added is too large, the rewritability of the film will be lost. On the other hand, if the amount decreased too much, sufficient rewriting characteristics could not be obtained.
前述したように添加量は単体としてばかりでな
く酸化物あるいは窒化物,ハロゲン化物,炭化物
形で用いられることも可能であるが、単体で添加
する方がおおむね蒸着が容易であり、特性の再現
性が高かつた。ところが、これらの物質のテルル
化物は単体に比べて融点,蒸気圧等が主成分の焼
結体から蒸着されるTeOx(O<x<2)に非常に
近くなり、従つて、更に安定,かつ再現性に優れ
た蒸着ソースが得られ、このソースから得られる
蒸着薄膜は、添加物を単体で用いる場合よりも膜
組成が均質になることが分かつた。また、単体で
は、やや使用が難しいと思われる物質でも、テル
ルと結合させることで、十分使用できることが分
かつた。例えば、Ti−Te,V−Te,Ta−Te,
Cr−Te,Mo−Te,W−Te,Mn−Te,Fe−
Te,Co−Te,Ni−Te,Pt−Te,Cu−Te,Ag
−Te,Zn−Te,Cd−Te,Al−Te,In−Te,
Tl−Te,Si−Te,Ge−Te,Sn−Te,Pb−Te,
As−Te,Sb−Te,Bi−Te,S−Te,Se−Te
等の化合物を用いることができる。なかでも、
Ge−Te,Sn−Te,In−Te,Pb−Te,Sb−Te,
Se−Te,Zn−Te,Al−Te,Bi−Te,Cu−Te
から成るTe系化合物を単独あるいは組み合わせ
た場合には、記録・消去特性に極めて優れた蒸着
薄膜が得られた。 As mentioned above, it is possible to add it not only as a single substance but also in the form of oxide, nitride, halide, or carbide, but it is generally easier to evaporate and the reproducibility of characteristics is easier when added alone. It was expensive. However, the melting point, vapor pressure, etc. of telluride of these substances are very close to those of TeO x (O<x<2) deposited from a sintered body, which is the main component, and are therefore more stable and stable. It was also found that a vapor deposition source with excellent reproducibility was obtained, and that the thin film deposited from this source had a more homogeneous film composition than when the additive was used alone. It was also discovered that even substances that are considered difficult to use alone can be used satisfactorily by combining them with tellurium. For example, Ti-Te, V-Te, Ta-Te,
Cr-Te, Mo-Te, W-Te, Mn-Te, Fe-
Te, Co−Te, Ni−Te, Pt−Te, Cu−Te, Ag
−Te, Zn−Te, Cd−Te, Al−Te, In−Te,
Tl-Te, Si-Te, Ge-Te, Sn-Te, Pb-Te,
As-Te, Sb-Te, Bi-Te, S-Te, Se-Te
Compounds such as can be used. Among them,
Ge−Te, Sn−Te, In−Te, Pb−Te, Sb−Te,
Se−Te, Zn−Te, Al−Te, Bi−Te, Cu−Te
When using Te-based compounds consisting of either alone or in combination, vapor-deposited thin films with extremely excellent recording and erasing properties were obtained.
これらのTe系化合物を、前述の元素単体、元
素間の化合物と組み合わせて使用することも可能
である。例えばSn−Te,In−Te,Pb−Te,Sb
−Te,Se−Te,Zn−Te,Al−Te,Bi−Te,
Cu−Te等と、Geを組み合わせた蒸着ソースは、
極めて安定かつ再現性良く特性の良好な書き換え
可能な光学情報記録薄膜の製造が行なえることが
わかつた。 It is also possible to use these Te-based compounds in combination with the above-mentioned elements alone or inter-element compounds. For example, Sn-Te, In-Te, Pb-Te, Sb
−Te, Se−Te, Zn−Te, Al−Te, Bi−Te,
The evaporation source that combines Cu-Te etc. and Ge is
It has been found that it is possible to produce a rewritable optical information recording thin film that is extremely stable, has good reproducibility, and has good characteristics.
混合体中に占める添加物の重量組成比として
は、10〜40wt%が適当である。テルル化物を用
いた場合には、比較的広い範囲の添加量で、書き
換え可能な蒸着膜が得られ、しかも添加量が少々
ずれても特性が大きく変わるということは無く再
現性を高める極めて有効な方法であつた。 The appropriate weight composition ratio of the additive in the mixture is 10 to 40 wt%. When telluride is used, a rewritable deposited film can be obtained with a relatively wide range of addition amounts, and even if the addition amount is slightly different, the characteristics do not change significantly, making it an extremely effective method for improving reproducibility. It was a method.
GeがTeOx(O<x<2)薄膜中で、Teの結晶
化温度を高め、膜の熱的安定性を高めることは既
に公知(第30回応用物理学関係連合講演会予稿集
1983)である。前記焼結体に、テルル化物と、と
もに添加されたGeは、その添加濃度に応じた濃
度で再現性よく膜の中に含まれることがわかつ
た。例えば、Sn−Te,In−Te,Pb−Te,Sb−
Te,Se−Te,Zn−Te,Al−Te,Bi−Te,Cu
−Te等と併せてGeを用いた場合、Geの添加量が
0〜10wt%の領域で安定性に優れた記録薄膜が
再現性良く得られた。Geの添加濃度が10%を越
えると、短いパルスで膜を結晶化することが困難
であつた。 It is already known that Ge increases the crystallization temperature of Te in TeO x (O<x<2) thin films and increases the thermal stability of the film (Proceedings of the 30th Applied Physics Association Conference).
1983). It was found that Ge added to the sintered body together with telluride was contained in the film with good reproducibility at a concentration that corresponded to the added concentration. For example, Sn−Te, In−Te, Pb−Te, Sb−
Te, Se−Te, Zn−Te, Al−Te, Bi−Te, Cu
When Ge was used in combination with -Te, etc., a recording thin film with excellent stability was obtained with good reproducibility in the range of 0 to 10 wt% of Ge. When the concentration of Ge added exceeds 10%, it was difficult to crystallize the film with a short pulse.
第1図は、上記のようにして得た混合体蒸着ソ
ースを用いて、添加物を含むTeOx薄膜を形成す
る方法を示したものである。真空系1の真空度は
10-3Torr〜10-7Torr程度で良いが、10-5Torr以
下では、付着性の高い、強い膜が得られる。例え
ば、前記混合体2を石英容器3に入れ、コイルヒ
ーター4で外部から加熱して支持台5上に設置さ
れた基板6上に、添加物を含むTeOx薄膜を蒸着
して形成する。ヒーター温度は500℃〜1000℃が
適当であり、この間で蒸着速度,膜組成を制御す
ることができる。コイルヒーター4は電極7を介
して外部電極8に接続され、通電加熱する仕組み
になつている。 FIG. 1 shows a method of forming a TeO x thin film containing an additive using the mixture deposition source obtained as described above. The vacuum degree of vacuum system 1 is
A temperature of about 10 -3 Torr to 10 -7 Torr is sufficient, but a strong film with high adhesion can be obtained at a pressure of 10 -5 Torr or less. For example, the mixture 2 is placed in a quartz container 3, heated from the outside with a coil heater 4, and a TeO x thin film containing an additive is deposited on a substrate 6 placed on a support stand 5. A suitable heater temperature is 500°C to 1000°C, and the deposition rate and film composition can be controlled within this range. The coil heater 4 is connected to an external electrode 8 via an electrode 7, and has a mechanism for heating with electricity.
混合体蒸着ソースは大量に製造しておき、そこ
から分取して使用することで均質になり、更に再
現性を高めることができる。 The mixture vapor deposition source can be produced in large quantities and then used in fractions to make it homogeneous and further improve reproducibility.
混合体は、N2,Ar等の不活性ガス中でアニー
ルすることにより、各成分間のなじみが良くなり
蒸着時の突沸等を無くすることができる。ただし
アニール温度が主成分の焼結体を焼成する時の温
度を越えると、焼結体の特性が変化してしまうの
で、アニール温度は焼成温度よりも、やや低目に
設定することが必要である。 By annealing the mixture in an inert gas such as N 2 or Ar, the components become more compatible and bumping during vapor deposition can be eliminated. However, if the annealing temperature exceeds the temperature at which the main component sintered body is fired, the characteristics of the sintered body will change, so it is necessary to set the annealing temperature slightly lower than the firing temperature. be.
蒸着時における加熱方法としては、前記のよう
にヒーターで外側から全体を加熱する方法以外
に、電子線ビームを用いて局所的に急加熱する方
法がある。この場合にはソースとして混合体の粉
末を押し固めた例えば円板状のペレツトに成形し
て用いる方が加熱がしやすい。電子線ビームによ
る方法はヒータを用いる場合に比べて、(イ)ペレツ
トの温度を急激にかつ局所的に昇温させることが
可能であり、ヒータで全体を加熱する場合よりも
組成ズレがより少なくなる、(ロ)応答が速いので蒸
着速度のコントロールが容易であるといつた利点
に加えて、(ハ)後に述べるように、更に耐湿性が改
善向上することがわかつた。焼結体を主原料に用
いる方法で作つた膜は、他の方法による膜より
も、膜の構造が緻密であり、そのため外気の影響
を受けにくいと考えられるが、電子線ビームによ
る薄膜は、膜構造が更に緻密かつ均質で、外気の
影響がほとんどおよばないため湿度劣化が小さい
と考えられる。 As a heating method during vapor deposition, in addition to the method of heating the whole from the outside with a heater as described above, there is a method of rapidly heating locally using an electron beam. In this case, it is easier to heat the sauce by compacting the powder of the mixture and forming it into, for example, a disc-shaped pellet. Compared to the case of using a heater, the method using an electron beam makes it possible to (a) raise the temperature of the pellet rapidly and locally, and there is less compositional deviation than when heating the entire pellet with a heater; In addition to (b) the advantage that the response is fast and the deposition rate can be easily controlled, it was also found that (c) the moisture resistance is further improved as will be described later. Films made using a method that uses sintered bodies as the main raw material have a denser structure than films made using other methods, and are therefore thought to be less susceptible to the effects of outside air. However, thin films made using an electron beam The membrane structure is more dense and homogeneous, and it is hardly affected by the outside air, so it is thought that humidity deterioration is small.
次に、更に具体的な例をもつて、本発明を説明
する。 Next, the present invention will be explained using more specific examples.
実施例 1
出発原料として、TeO2粉末と、Cu粉末を用
い、TeO2を111.72g(約0.7mol),Cuを19.68g
(約0.3mol)の割合で前述したような方法で少量
のアルコールを用いて混合した。混合粉末100g
を石英ボートに乗せ、電気炉を用いて熱処理し
た。炉心管に試料を入れて2/H程度のN2ガ
スを流しながら、炉の温度を上げて約30分間で
700℃とし、そのまま約2H保持したのち、試料を
炉の低温部に引き出して冷却した。約1H後、炉
から取り出したところ黒カツ色のガラス状の固形
物が得られる。Example 1 Using TeO 2 powder and Cu powder as starting materials, 111.72 g (about 0.7 mol) of TeO 2 and 19.68 g of Cu
(approximately 0.3 mol) using a small amount of alcohol. Mixed powder 100g
was placed on a quartz boat and heat treated using an electric furnace. Put the sample into the furnace core tube, raise the temperature of the furnace while flowing N2 gas at about 2/H, and heat it for about 30 minutes.
After the temperature was set to 700°C and maintained for about 2 hours, the sample was taken out to the low temperature section of the furnace and cooled. After about 1 hour, when taken out from the furnace, a black-colored glassy solid was obtained.
この固形物を石英ボートから取り出し、その一
部を用いて第1図の系によつて蒸着を行なつた。
真空度は1×10-5Torr、ヒータ温度700℃とし、
石英容器に前記固形物の小さな固まり約200mgを
入れ、加熱したところ、膜厚が約1200Åでやや黄
色味をおびたカツ色の透明なTeOx薄膜がアクリ
ル樹脂基材上に形成された。この薄膜にλ=830
mmの半導体レーザ光を光学系を用いて集光し、照
射すると照射部が黒化変態することが確かめられ
た。 This solid material was taken out from the quartz boat, and a portion thereof was used for vapor deposition using the system shown in FIG.
The degree of vacuum is 1×10 -5 Torr, the heater temperature is 700℃,
When about 200 mg of the solid substance was placed in a quartz container and heated, a transparent TeO x thin film with a thickness of about 1200 Å and a slightly yellowish cutlet color was formed on the acrylic resin substrate. λ=830 for this thin film
It was confirmed that when the semiconductor laser beam of mm diameter was focused using an optical system and irradiated, the irradiated area was transformed into black.
実施例 2
実施例1で得た固形物を粉砕して得た粉末と、
Sn粉末を各々重量比で0,5,10,20,30,40,
50%の割合になるように混合した後、第1図の系
で蒸着した。真空度は1×10-5Torr、ヒータ温
度750℃とし石英容器に前記粉末を各300mg入れ、
加熱したところ、膜厚が800〜1200Åで、黄カツ
色の透明な薄膜がアクリル樹脂基材中に形成され
た。この薄膜にλ=830nmの半導体レーザ光を光
学系を用いて、ややフオーカスを甘くして集光
し、1mW/μ2程度の弱い光として1μsecの間照射
したところ薄膜は黒化変態した。次に同じ半導体
レーザ光を用い、黒化変態部分にフオーカスを合
わせて、5mW/μ2程度の強い強度で約50μsecの
間照射するとSnの添加量が5〜40wt%の膜では
黒化変態した部分が再び元の黄カツ色の状態に戻
ることが確かめられた。ただし、添加量が5%以
下では、完全に元の状態に戻らず、逆に40%を越
えると、全く可逆性は無かつた。復帰後の膜の透
過率,反射率等を詳しく調べた結果Snの添加量
が10〜30wt%の範囲ではくり返し良く可逆的変
化が行なわれた。Example 2 A powder obtained by crushing the solid obtained in Example 1,
The weight ratio of Sn powder is 0, 5, 10, 20, 30, 40,
After mixing at a ratio of 50%, vapor deposition was performed using the system shown in Figure 1. The degree of vacuum was 1 × 10 -5 Torr, the heater temperature was 750°C, and 300 mg of each of the above powders was placed in a quartz container.
When heated, a yellow transparent thin film with a film thickness of 800 to 1200 Å was formed in the acrylic resin base material. When this thin film was irradiated with semiconductor laser light of λ = 830 nm using an optical system with a slightly loose focus and irradiated with a weak light of about 1 mW/μ 2 for 1 μsec, the thin film turned black. Next, using the same semiconductor laser beam and focusing on the blackened transformation area, we irradiated it with a strong intensity of about 5mW/ μ2 for about 50μsec, and the film with Sn addition amount of 5 to 40wt% showed black transformation. It was confirmed that the part returned to its original yellow color. However, if the amount added was less than 5%, the original state could not be completely restored, and if it exceeded 40%, there was no reversibility at all. A detailed study of the transmittance, reflectance, etc. of the film after restoration revealed that reversible changes occurred repeatedly when the amount of Sn added was in the range of 10 to 30 wt%.
実施例 3
実施例1においてCuの混合比を0〜100mol%
の間で変えて同様の実験を行なつた結果、混合比
が0〜90mol%の範囲に渡つて黒カツ色の均一な
焼結体が得られた。この焼結体を用いて実施例1
を同様に蒸着した結果、混合比が0〜15mol%の
間では非常に光学的濃度の小さい膜で、半導体レ
ーザ光の照射によつても大きい濃度変化が得られ
なかつた。また、混合比が80mol%以上になる
と、光学的濃度は上がるが、膜として不安定であ
つて、蒸着してすぐにはカツ色の透明膜である
が、室温でどんどん変化し、不透明なややメタリ
ツクな黒色の膜になつてしまつた。混合比が15〜
80mol%の間では、安定な黄色味をおびたカツ色
透明な膜が得られ、半導体レーザ光により黒化変
態した。Example 3 In Example 1, the mixing ratio of Cu was 0 to 100 mol%
As a result of conducting a similar experiment with the mixture ratio between 0 and 90 mol %, uniform black sintered bodies were obtained. Example 1 using this sintered body
When the mixture ratio was between 0 and 15 mol %, the optical density of the film was very low, and even when irradiated with semiconductor laser light, no large change in concentration was obtained. In addition, when the mixing ratio exceeds 80 mol%, the optical density increases, but the film is unstable. Immediately after vapor deposition, it is a cut-colored transparent film, but it gradually changes at room temperature and becomes slightly opaque. It turned into a metallic black film. Mixing ratio is 15~
Between 80 mol% and 80 mol%, a stable cutlet-colored transparent film with a yellowish tinge was obtained, which was transformed into black by semiconductor laser light.
オージエ電子分光法を用いて組成分析した結果
膜厚方向の組成ズレはほとんど無く均質であり、
また混合比が少ないものから多いものにかけて
O/Teの値が減少していることがわかつた。 Composition analysis using Auger electron spectroscopy revealed that the film was homogeneous with almost no compositional deviation in the thickness direction.
It was also found that the O/Te value decreased from low to high mixing ratios.
実施例 4
実施例1においてCuに代えてAlを用い、その
混合比を0〜100mol%の範囲に渡つて同様の実
験を行なつた結果、混合比が10〜80mol%の範囲
で、黒色の焼結体が得られた。この焼結体を用い
て実施例1と同様に蒸着した結果、混合比が0〜
20mol%の間では非常に光学的濃度の小さい膜
で、半導体レーザ光の照射によつて大きい濃度変
化が得られなかつた。また、混合比が60mool%
以上になると光学的濃度は上がるが、やや膜とし
て不安定であり、室温でカツ色から黒色へと変化
してしまつた。混合比が20〜60mol%の間では安
定な黄カツ色の膜が得られ半導体レーザ光を照射
すると黒化変態した。オージエ電子分光法を用い
て組成分析した結果、Alの添加濃度に敏感に
O/Te比が変化するることがわかつた。Example 4 A similar experiment was conducted in Example 1 using Al instead of Cu and the mixing ratio ranged from 0 to 100 mol%. A sintered body was obtained. As a result of vapor deposition using this sintered body in the same manner as in Example 1, the mixing ratio was 0 to 0.
When the optical density was between 20 mol % and 20 mol %, the film had a very low optical density, and no large change in concentration could be obtained by irradiation with semiconductor laser light. Also, the mixing ratio is 60mool%
Above this value, the optical density increases, but the film is somewhat unstable, changing from a cutlet color to black at room temperature. When the mixing ratio was between 20 and 60 mol%, a stable yellow film was obtained, which transformed to black when irradiated with semiconductor laser light. As a result of compositional analysis using Auger electron spectroscopy, it was found that the O/Te ratio changes sensitively to the concentration of Al added.
実施例 5
Cu粉末に代えて、Si,Ti,V,Cd,In,,Sn,
Sb,Ta,W,Cr,Mn,Fe,Co,Ni,Zn,Ge,
Mo,S,Se,Cの各元素を用い、実施例1,2
と同様の実験を行ない、それぞれ焼結体を得るこ
とができた。この中で、Sb,Pb,In,Zn,Bi,
Ge,Se,Cdを用いた場合は、それぞれ黒色,黄
カツ色,黒カツ色,黒色,灰カツ色,黄カツ色,
赤カツ色,灰カツ色のガラス状で均質な焼結体が
得られた。特にSb,Pb,Inを用いた場合は、Cu
の場合と同様に広い混合比に渡つて均質なガラス
状の焼結体を得ることができた。反対に、Si,
C,Mnを用いた場合は、やや不均質な焼結体し
か得られなかつた。Example 5 Instead of Cu powder, Si, Ti, V, Cd, In, Sn,
Sb, Ta, W, Cr, Mn, Fe, Co, Ni, Zn, Ge,
Examples 1 and 2 using each element of Mo, S, Se, and C
We conducted similar experiments and were able to obtain sintered bodies in each case. Among these, Sb, Pb, In, Zn, Bi,
When using Ge, Se, and Cd, black, yellow cutlet color, black cutlet color, black, gray cutlet color, yellow cutlet color,
A glassy, homogeneous sintered body with a reddish or grayish color was obtained. Especially when using Sb, Pb, and In, Cu
As in the case of , homogeneous glass-like sintered bodies could be obtained over a wide range of mixing ratios. On the contrary, Si,
When C and Mn were used, only a slightly non-uniform sintered body was obtained.
これらの焼結体を真空中で加熱して、それぞれ
TeOx(O<x<2)薄膜が得られた。 By heating these sintered bodies in vacuum, each
A TeO x (O<x<2) thin film was obtained.
実施例 6
次に、複数の還元物質を用いて得るべきTeOx
薄膜の特性を細かく制御する方法を検討した。実
施例5に述べた還元性物質は、その還元能力はど
れも同じというわけでは無く、MO2あるいは
M2O3のように酸化され比較的還元能力の高い激
しい反応をするものと、MO,M2Oのようにしか
酸化されず、比較的還元能力の低い、おだやかな
反応をするものに分かれる。従つて、この両者を
組み合わせて細かい制御をすることができる。実
施例4の結果、前者の代表としてAl、後者の代
表としてCuが特に使い易いことがわかつた。Example 6 Next, TeO x to be obtained using multiple reducing substances
We investigated methods for finely controlling the properties of thin films. The reducing substances mentioned in Example 5 do not all have the same reducing ability, and MO 2 or
There are two types: those that are oxidized and undergo a violent reaction with a relatively high reducing ability, such as M 2 O 3 , and those that are only oxidized and have a relatively low reducing ability, such as MO and M 2 O, that undergo a gentle reaction. . Therefore, fine control can be achieved by combining the two. As a result of Example 4, it was found that Al is particularly easy to use as a representative of the former, and Cu is particularly easy to use as a representative of the latter.
そこで、TeO2に、Au,Cuをそれぞれ混合比
を変えて混合し、各700℃,N2ガス雰囲気で2H
熱処理して黒カツ色の焼結体を得た。これらの焼
結体各200mgを用いて10-5Torrの真空度でヒータ
で加熱した結果、混合比のわずかな変化に対応し
た特性の膜が得られた。この結果を半導体レーザ
で照射して詳しく調べて、Alの混合比x〓および
Cuの混合比x〓が、15x〓50,かつ20≦x〓≦
60mol%で、また2成分を同時に混合するときに
は50≦x〓+x〓≦80mol%の領域において特に光学
的情報の記録特性に適した薄膜が得られ、混合体
の母材料として適当であることが分かつた。 Therefore, TeO 2 was mixed with Au and Cu at different mixing ratios, and each was heated at 700℃ for 2 hours in a N 2 gas atmosphere.
A black sintered body was obtained by heat treatment. As a result of heating 200 mg of each of these sintered bodies with a heater at a vacuum level of 10 -5 Torr, a film with characteristics that corresponded to slight changes in the mixing ratio was obtained. We investigated this result in detail by irradiating it with a semiconductor laser, and determined the Al mixing ratio x〓 and
Cu mixing ratio x〓 is 15x〓50, and 20≦x〓≦
60 mol%, and when the two components are mixed at the same time, a thin film particularly suitable for optical information recording properties can be obtained in the region of 50≦x〓+x〓≦80mol%, and it is suitable as a base material for the mixture. I understand.
実施例 7
実施例6で得た焼結体のうち、出発組成が、
(TeO2)30(Al)30(Cu)40mol%の焼結体を選び、こ
れを粉砕して微粉末化した。この粉末に添加物と
して、Ti,V,Ta,Cr,Mo,W,Mn,Fe,
Ni,Pt,Cu,Ag,Zn,Cd,Al,In,Tl,Si,
Ge,Sn,Pb,As,Sb,Bi,S,Seを各々単体
または酸化物の形にして0〜50wt%の範囲で5
%ごとに混合し、実施例2と同様の実験を行つた
ところ、単体の場合はそれぞれ添加量が10〜
40wt%,酸化物の場合は20〜60wt%の範囲で書
き換え可能な黄カツ色の薄膜が得られた。この中
で、Zn,Cd,In,Tl,Ge,Sn,Pb,As,Sb,
Bi,S,Seを単体で用いた場合は、ソースの主
成分である焼結体となじみが良く蒸着時のヒータ
ー温度が近く、均一な蒸着膜を得ることが出来
た。特にGe,Sn,Se,Bi,In,Znを用いて混合
した蒸着ソースを用いた場合は、ヒーター温度
400℃〜700℃で十分で有り容易にかつ、再現性の
良い蒸着が行なえた。添加量は10〜30wt%の範
囲で特に、くり返し特性にすぐれた薄膜が得られ
た。Example 7 Among the sintered bodies obtained in Example 6, the starting composition was
A sintered body containing (TeO 2 ) 30 (Al) 30 (Cu) 40 mol % was selected and crushed to form a fine powder. Additives to this powder include Ti, V, Ta, Cr, Mo, W, Mn, Fe,
Ni, Pt, Cu, Ag, Zn, Cd, Al, In, Tl, Si,
Ge, Sn, Pb, As, Sb, Bi, S, Se each in the form of a single substance or oxide, 5% by weight in the range of 0 to 50wt%.
When the same experiment as in Example 2 was carried out by mixing each percentage, it was found that in the case of a single substance, the amount added was 10 to 10%.
A yellowish thin film was obtained that was rewritable at 40 wt%, and in the case of oxides in the range of 20 to 60 wt%. Among these, Zn, Cd, In, Tl, Ge, Sn, Pb, As, Sb,
When Bi, S, and Se were used alone, they were compatible with the sintered body, which is the main component of the source, and the heater temperature during vapor deposition was close, making it possible to obtain a uniform vapor-deposited film. Particularly when using a mixed evaporation source using Ge, Sn, Se, Bi, In, and Zn, the heater temperature
A temperature of 400°C to 700°C was sufficient and vapor deposition could be performed easily and with good reproducibility. When the amount added was in the range of 10 to 30 wt%, a thin film with particularly excellent repeatability was obtained.
反対に、Ti,Fe,Co,Ta,Ni,Pt,W,Cr
等の比較的蒸気圧の低いものを用いた場合は、主
成分の焼結体と均一な膜を形成しにくかつた。 On the contrary, Ti, Fe, Co, Ta, Ni, Pt, W, Cr
When using materials with relatively low vapor pressure such as, it was difficult to form a uniform film with the sintered body as the main component.
実施例 8
添加物として各種元素のテルル化物を検討し
た。焼結体としては、出発組成が(TeO2)30
(Al)30(Cu)40mol%のものを実施例1と同様の方
法で焼結したものを用いた。Example 8 Tellurides of various elements were investigated as additives. As a sintered body, the starting composition is (TeO 2 ) 30
(Al) 30 (Cu) 40 mol% was sintered in the same manner as in Example 1.
テルル化物として、TeSmを用い、焼結体との
混合比を0〜50wt%の範囲で良く混ぜ合わせた。
この粉末を約2g秤量し、治具を用いて直径20
mm,厚さ約1.5mmのペレツト状の物体にプレス成
形した。プレス圧力は5t/cm2である。このペレツ
トを第1図のような系を用い、1×10-5Torrの
真空中で出力5KWの電子線ビームで加熱したと
ころ、10A/Sの速度で厚さ約1000Åの非常に均
質な薄膜をアクリル樹脂基材上に形成できた。こ
の薄膜の特性を半導体レーザと光学系を用いて照
射光のパワーと、照射時間を変えながら測定した
ところ、添加量が10〜40wt%の広範囲で非常に
繰り返しの優れた薄膜が得られた。10%以下では
十分な書き換え特性が得られず、逆に40%を越え
ると、非常にTerichな膜となり、膜の安定性が
低下するることがわかつた。 TeSm was used as the telluride and mixed well with the sintered body at a mixing ratio of 0 to 50 wt%.
Weigh out about 2g of this powder and use a jig to
It was press-formed into a pellet-like object with a thickness of approximately 1.5 mm. Press pressure is 5t/ cm2 . When this pellet was heated with an electron beam with an output of 5KW in a vacuum of 1 x 10 -5 Torr using the system shown in Figure 1, a very homogeneous thin film with a thickness of about 1000 Å was formed at a rate of 10A/S. could be formed on an acrylic resin base material. When the properties of this thin film were measured using a semiconductor laser and an optical system while changing the power of the irradiation light and the irradiation time, a thin film with excellent repeatability was obtained over a wide range of additive amounts of 10 to 40 wt%. It was found that when the content is less than 10%, sufficient rewriting characteristics cannot be obtained, and on the other hand, when it exceeds 40%, the film becomes extremely terich and the stability of the film decreases.
実施例 9
テルル化物として、Ge−Te,Sn−Te,In−
Te,Pb−Te,Sb−Te,Se−Te,Zn−Te,Al
−Te,Bi−Te,Cu−Teを用いて、実施例7と
同様の実験を行なつたところ、やはり10〜40wt
%の添加濃度領域で、蒸着が容易かつ再現性の良
い書き換え可能な膜のできる蒸着ソースが得られ
た。Example 9 As telluride, Ge-Te, Sn-Te, In-
Te, Pb-Te, Sb-Te, Se-Te, Zn-Te, Al
When we conducted the same experiment as in Example 7 using -Te, Bi-Te, and Cu-Te, we found that 10 to 40 wt.
A vapor deposition source capable of forming a rewritable film with easy vapor deposition and good reproducibility was obtained in the additive concentration range of 1.5%.
実施例 10
加熱方法の違いによる特性の違いを観察した。
実施例8において、TeSnの混合比を20wt%に選
び、一方は第1図のような系でヒータ加熱によ
り、他方は電子線ビーム加熱によりパイレツクス
ガラス基板上に蒸着したところ、どちらも見掛け
は変わらないやや黒つぽい薄膜が得られた。のの
2種の膜を50℃,90H%の恒温、恒湿槽内に放置
し、その透過率変化を定期的に調べたところ第2
図に示すように、電子線ビームによる膜bはヒー
ター加熱による膜aに比べて変化が少なく、湿気
による影響を受けにくく、より安定であることが
わかつた。Example 10 Differences in characteristics due to differences in heating methods were observed.
In Example 8, the mixing ratio of TeSn was chosen to be 20 wt%, and one part was deposited on a Pyrex glass substrate by heater heating in the system shown in Figure 1, and the other part was deposited on a Pyrex glass substrate by electron beam heating. A slightly darkish thin film was obtained that did not change. Two types of NONO's membranes were left in a constant temperature and humidity chamber at 50℃ and 90H%, and changes in their transmittance were periodically examined.
As shown in the figure, it was found that the film b produced by the electron beam showed less change than the film a produced by heater heating, was less affected by moisture, and was more stable.
次に、複数の添加物質を用いて、得るべき
TeOxを主成分とする記録薄膜の特性を細かく制
御する方法を検討した。実施例7,9等に述べた
添加物質は、その蒸着特性,あるいは膜中でのふ
るまいが一定で無く、例えば相転移温度を高くす
る物質、相転移に要する照射時間を短くするよう
に働く物質等がある。 Next, by using multiple additive substances,
We investigated a method to finely control the properties of recording thin films containing TeO x as the main component. The additive substances described in Examples 7 and 9 do not have constant deposition characteristics or behavior in the film, such as substances that increase the phase transition temperature or substances that work to shorten the irradiation time required for phase transition. etc.
実施例 11
書き換え機能を高める成分としてSn−Te,膜
の安定化を促進する成分としてGeを用い、各添
加量を変化して実施例7と同様の方法で蒸着し添
加量が10〜40wt%の領域で書き換え可能な安定
性に優れた薄膜を得た。とりわけ15〜30wt%領
域では、特にくり返しが良く、10万回の記録−消
去を確認できた。Example 11 Using Sn-Te as a component that enhances the rewriting function and Ge as a component that promotes film stabilization, vapor deposition was performed in the same manner as in Example 7 by changing the amount of each addition, and the amount of addition was 10 to 40 wt%. We obtained a highly stable thin film that can be rewritten in the region of . Especially in the 15 to 30 wt% range, the repeatability was particularly good, and we were able to confirm recording and erasing 100,000 times.
第3図は、TeSnの添加量を20wt%としGeの添
加量を変化したときの黒化転移温度の変化を表わ
したものである。Geの添加量が8wt%では転移温
度は約200℃と高く転移に際し、かなり大きいレ
ーザーのパワーが必要であり、10wt%では240℃
と更に高く、Geを更に添加した膜では転移が困
難であつた。 FIG. 3 shows the change in blackening transition temperature when the amount of TeSn added is 20 wt% and the amount of Ge added is changed. When the amount of Ge added is 8wt%, the transition temperature is as high as about 200℃, and a considerably high laser power is required for the transition, and when the amount of Ge added is 10wt%, it is 240℃.
This was even higher, and it was difficult to transfer in a film with further addition of Ge.
実施例 12
実施例11におけるSnTeを、InTe,PbTe,
Sb2Te3,SeTe,ZnTe,Al2Te3,,Bi2Te3,
Cu2Teに書き換えて蒸着し、同様の効果を得るこ
とが出来た。Example 12 SnTe in Example 11 was replaced with InTe, PbTe,
Sb 2 Te 3 , SeTe, ZnTe, Al 2 Te 3 , Bi 2 Te 3 ,
We were able to obtain the same effect by rewriting Cu 2 Te and depositing it.
実施例 13
次に、この蒸着方法を用いて光学記録用デイス
クを試作した。第4図に示した系で記録・消去実
験を行なつた。まず、この1800rpmで回転するデ
イスク面10に、半導体レーザ11の光をレンズ
系12,ミラー13,レンズ14を用いてスポツ
トの強度分布が半値で、デイスク回転方向が
10μ,半径方向が1μに集光したレーザスポツト1
5をトータルパワー10mWで照射したところ、照
射された部分は黒化変態し、黒いトラツク16が
形成された。Example 13 Next, an optical recording disk was prototyped using this vapor deposition method. Recording/erasing experiments were conducted using the system shown in FIG. First, the light from the semiconductor laser 11 is applied to the disk surface 10, which rotates at 1800 rpm, using the lens system 12, mirror 13, and lens 14, so that the spot intensity distribution is half the value and the disk rotation direction is
Laser spot 1 condensed to 10μ and 1μ in the radial direction
When 5 was irradiated with a total power of 10 mW, the irradiated area turned black and a black track 16 was formed.
次に、別のレンズ系17,ミラー18,ハーフ
ミラー19,レンズ20を介して別の半導体レー
ザ21の光を、その波長830μmの限界まで絞り込
んだ0.8μの円スポツト22に集光した。このレー
ザスポツト22を単一周波数5MHzで変調しつつ
トータルパワー8mWで、上記の黒いトラツク1
6の上を照射したところ、照射部は元の状態に回
復し信号の記録によるビツト群23が形成され
た。 Next, the light from another semiconductor laser 21 was focused through another lens system 17, a mirror 18, a half mirror 19, and a lens 20 onto a circular spot 22 of 0.8 μm, which was narrowed down to its wavelength of 830 μm. While modulating this laser spot 22 with a single frequency of 5MHz and a total power of 8mW, the black track 1 above is
When the top of 6 was irradiated, the irradiated area recovered to its original state and a bit group 23 was formed by recording the signal.
信号の検出は、デイスクからの反射光24を、
再生用のレンズ系25で集光し、デイテクター2
6を入れて読みとる。スプクトルアナライザを用
いてC/Nを測定したところ、58dBのC/Nが
得られた。 To detect the signal, the reflected light 24 from the disk is
The light is collected by the reproduction lens system 25 and sent to the detector 2.
Enter 6 and read. When the C/N was measured using a spectrum analyzer, a C/N of 58 dB was obtained.
次に、最初の細長いレーザスポツト15を照射
したところ記録ビツト23は消去されてスペクト
ルアナライザでは信号の検出は出来なかつた。 Next, when the first elongated laser spot 15 was irradiated, the recorded bit 23 was erased and the spectrum analyzer could no longer detect the signal.
発明の効果
以上のように本発明によれば、
(1) 特性の再現性に優れている
(2) 組成ずれがおきにくい
(3) 突沸によるドロツプ・アウトが無い
(4) 湿度劣化が小さい
(5) 特性の制御,蒸着が容易
等の特徴をもつ、TeOx薄膜への添加物の含有方
法を得、書き換え可能な光学情報記録薄膜を容易
に得ることができる。Effects of the Invention As described above, according to the present invention, (1) Excellent reproducibility of characteristics (2) Composition deviation is less likely to occur (3) There is no drop-out due to bumping (4) Humidity deterioration is small ( 5) A method for incorporating additives into a TeO x thin film, which has characteristics such as controlled properties and easy vapor deposition, has been obtained, and a rewritable optical information recording thin film can be easily obtained.
第1図は本発明の一実施例における焼結体を用
いてTeOx系薄膜を製造する装置の断面図、第2
図はTeOx系薄膜の蒸着方法の違いによる耐湿特
性の差を示すグラフ、第3図はTeOx系薄膜にGe
を添加したときの黒化変態温度の変化を示す図、
第4図は本発明の製造方法で形成した光デイスク
に情報信号を記録・再生・消去する装置の概略図
である。
1……真空系、2……混合体、6……基板。
FIG. 1 is a cross-sectional view of an apparatus for producing a TeO x based thin film using a sintered body in one embodiment of the present invention, and FIG.
The figure is a graph showing the difference in moisture resistance due to the different vapor deposition methods of TeO x -based thin films.
A diagram showing the change in blackening transformation temperature when adding
FIG. 4 is a schematic diagram of an apparatus for recording, reproducing, and erasing information signals on an optical disk formed by the manufacturing method of the present invention. 1...Vacuum system, 2...Mixture, 6...Substrate.
Claims (1)
Ti,V,W,Cr,Mn,Fe,Co,Ni,Cu,Zn,
Ge,Mo,Cd,In,Sn,Sb,Ta,Bi,Pbの金
属,半金属またはS,Se,Cの中の少なくとも
一種を混合して、(TeO2)100−x〓Mx〓(O<x〓
80mol%,Mは還元性物質M1,M2,……,Moの
集合体でx1+x2+……+xo=x〓)の形で熱処理を
行ない、二酸化テルルの一部が還元された形で含
まれる焼結体Nを得、この焼結体Nを主材に、添
加材料Lを加えた混合体Pを形成し、この混合体
Pを蒸着ソースとして真空中で加熱して、基板上
にTeOx(O<x<2)を主成分とし、添加物を含
んだ光学情報記録薄膜を形成することを特徴とす
る光学情報記録薄膜の製造方法。 2 還元性物質の添加量を15x〓80mol%とす
ることを特徴とする特許請求の範囲第1項記載の
光学情報記録薄膜の製造方法。 3 還元性物質として、Cu,Sb,Pb,Al,In,
Zn,Bi,Ge,Se,Cdの中から選んだ少なくとも
一種の還元性物質を用いることを特徴とする特許
請求の範囲第1項記載の光学情報記録薄膜の製造
方法。 4 還元性物質としてCuを選び、その組成比x〓
が15≦x〓≦80mol%とすることを特徴とする特許
請求の範囲第1項記載の光学情報記録薄膜の製造
方法。 5 還元性物質としてAlを選び、その組成比x〓
が15≦x〓≦60mol%とすることを特徴とする特許
請求の範囲第1項記載の光学情報記録薄膜の製造
方法。 6 還元物質としてCu,Alを選び、同時に混合
することを特徴とする特許請求の範囲第1項記載
の光学情報記録薄膜の製造方法。 7 AlおよびCuの組成比x〓,x〓がそれぞれ15≦
x〓≦50,20≦x〓≦60,50≦x〓+x〓≦80mol%であ
ることを特徴とする特許請求の範囲第6項記載の
光学情報記録薄膜の製造方法。 8 熱処理を、不活性ガス中で行なうことを特徴
とする特許請求の範囲第1項記載の光学情報記録
薄膜の製造方法。 9 熱処理温度を400℃〜1000℃の間で行うこと
を特徴とする特許請求の範囲第1項記載の光学情
報記録薄膜の製造方法。 10 熱処理温度を600℃〜700℃の間で行うこと
を特徴とする特許請求の範囲第1項記載の光学情
報記録薄膜の製造方法。 11 真空度を1×10-5Torr程度以下に設定す
ることを特徴とする特許請求の範囲第1項記載の
光学情報記録薄膜の製造方法。 12 添加材料Lとして、Ti,V,Ta,Cr,
Mo,W,Mn,Fe,Co,Ni,Pt,Cu,Ag,
Zn,Cd,Al,In,Tl,Si,Ge,Sn,Pb,As,
Sb,Bi,S,Seの金属,半金属,非金属元素を、
単体または化合物として少なくとも1種類用い、
その添加量の総和x〓を10x〓40wt%に選ぶこ
とを特徴とする特許請求の範囲第1項記載の光学
情報記録薄膜の製造方法。 13 添加材料Lとしては、Zn,Cd,In,Tl,
Ge,Sn,Pb,As,Sb,Bi,S,Seから成る物
質群から、単独または化合物として少なくとも1
種類用い、その添加量の総和x〓を10x〓40wt
%に選ぶことを特徴とする特許請求の範囲第12
項記載の光学情報記録薄膜の製造方法。 14 添加材料Lとして、Ge,Sn,Se,Bi,
In,Znから成る物質群から単独又は化合物とし
て少なくとも1種類用い、その添加量の総和x〓
を、10x〓30wt%に選ぶことを特徴とする特
許請求の範囲第9項,第10項又は第13項記載
の光学情報記録薄膜の製造方法。 15 添加材料Lとして、Ti−Te,V−Te,
Ta−Te,Cr−Te,Mo−Te,W−Te,Mn−
Te,Fe−Te,Co−Te,Ni−Te,Pt−Te,Cu
−Te,Ag−Te,Zn−Te,Cd−Te,Al−Te,
In−Te,Tl−Te,Si−Te,Ge−Te,Sn−Te,
Pb−Te,As−Te,Sb−Te,Bi−Te,S−Te,
Se−Teからなる。Te系化合物を単独または組み
合わせて用い、その添加量の総和x〓を、10x〓
40wt%に選ぶことを特徴とする特許請求の範囲
第1項記載の光学情報記録薄膜の製造方法。 16 添加材料として、Ge−Te,Sn−Te,In
−Te,Pb−Te,Sb−Te,Se−Te,Zn−Te,
Al−Te,Bi−Te,Cu−Teから成るTe系化合物
を単独又は組み合わせて用い、その添加量の総和
x〓を、10x〓40wt%に選ぶことを特徴とする
特許請求の範囲第15項記載の光学情報記録薄膜
の製造方法。 17 添加材料として、Sn−Te,In−Te,Pb−
Te,Sb−Te,Se−Te,Zn−Te,Al−Te,Bi
−Te,Cu−Teから成る。Te系化合物を単独又
は組み合わせて少なくとも1種用い、更に、Ge
を加え、その添加量の総和x〓を、10x〓40wt
%,そのうちGeの添加量をO<x〓≦10wt%に選
ぶことを特徴とする特許請求の範囲第1項記載の
光学情報記録薄膜の製造方法。 18 15≦x〓30かつ、O<x〓8wt%とするこ
とを特徴とする特許請求の範囲第17項記載の光
学情報記録薄膜の製造方法。 19 混合体Pを、加圧成形してペレツト状にし
て用いることを特徴とする特許請求の範囲第1項
記載の光学情報記録薄膜の製造方法。 20 混合体Pの加熱手段として電子線ビームを
用いることを特徴とする特許請求の範囲第1項記
載の光学情報記録薄膜の製造方法。 21 混合体Pを不活性ガス中でアニールした
後、蒸着ソースとして使用することを特徴とする
特許請求の範囲第1項記載の光学情報記録薄膜の
製造方法。 22 アニール温度を焼結温度より低く設定する
ことを特徴とする特許請求の範囲第21項記載の
光学情報記録薄膜の製造方法。[Claims] 1 Al, Si,
Ti, V, W, Cr, Mn, Fe, Co, Ni, Cu, Zn,
By mixing at least one of Ge, Mo, Cd, In, Sn, Sb, Ta, Bi, Pb metals, semimetals, or S, Se, and C, (TeO 2 )100−x〓 M x〓( O<x〓
80 mol%, M is an aggregate of reducing substances M 1 , M 2 , ..., Mo , and heat treatment is performed in the form x 1 + x 2 + ... + x o = x〓), and part of the tellurium dioxide is reduced. A sintered body N containing the sintered body N is obtained, a mixture P is formed by adding an additive material L to this sintered body N as a main material, and this mixture P is heated in a vacuum as a vapor deposition source. A method for producing an optical information recording thin film, which comprises forming an optical information recording thin film containing TeO x (O<x<2) as a main component and an additive on a substrate. 2. The method for producing an optical information recording thin film according to claim 1, characterized in that the amount of the reducing substance added is 15 x 80 mol%. 3 As reducing substances, Cu, Sb, Pb, Al, In,
A method for producing an optical information recording thin film according to claim 1, characterized in that at least one reducing substance selected from Zn, Bi, Ge, Se, and Cd is used. 4 Select Cu as the reducing substance and its composition ratio x〓
15. The method for producing an optical information recording thin film according to claim 1, wherein x satisfies 15≦x≦80 mol%. 5 Select Al as the reducing substance and its composition ratio x〓
15. The method for producing an optical information recording thin film according to claim 1, wherein x satisfies 15≦x≦60 mol%. 6. The method for producing an optical information recording thin film according to claim 1, characterized in that Cu and Al are selected as reducing substances and mixed at the same time. 7 The composition ratios x〓 and x〓 of Al and Cu are each 15≦
The method for producing an optical information recording thin film according to claim 6, characterized in that x≦50, 20≦x≦60, 50≦x〓+x≦80 mol%. 8. The method for producing an optical information recording thin film according to claim 1, wherein the heat treatment is performed in an inert gas. 9. The method for producing an optical information recording thin film according to claim 1, wherein the heat treatment temperature is between 400°C and 1000°C. 10. The method for producing an optical information recording thin film according to claim 1, wherein the heat treatment is carried out at a temperature between 600°C and 700°C. 11. The method for producing an optical information recording thin film according to claim 1, characterized in that the degree of vacuum is set to about 1×10 −5 Torr or less. 12 As the additive material L, Ti, V, Ta, Cr,
Mo, W, Mn, Fe, Co, Ni, Pt, Cu, Ag,
Zn, Cd, Al, In, Tl, Si, Ge, Sn, Pb, As,
Sb, Bi, S, Se metals, semimetals, nonmetallic elements,
At least one type used alone or as a compound,
The method for producing an optical information recording thin film according to claim 1, characterized in that the total amount x〓 of the added amounts is selected to be 10x〓40wt%. 13 The additive materials L include Zn, Cd, In, Tl,
At least one substance from the substance group consisting of Ge, Sn, Pb, As, Sb, Bi, S, and Se, alone or as a compound.
Using different types, the total amount of addition x〓 is 10x〓40wt
Claim 12, characterized in that
A method for producing an optical information recording thin film as described in 2. 14 As additive material L, Ge, Sn, Se, Bi,
At least one substance from the substance group consisting of In and Zn is used alone or as a compound, and the total amount x〓
The method for producing an optical information recording thin film according to claim 9, 10, or 13, characterized in that 10x=30wt% is selected. 15 As the additive material L, Ti-Te, V-Te,
Ta-Te, Cr-Te, Mo-Te, W-Te, Mn-
Te, Fe−Te, Co−Te, Ni−Te, Pt−Te, Cu
−Te, Ag−Te, Zn−Te, Cd−Te, Al−Te,
In-Te, Tl-Te, Si-Te, Ge-Te, Sn-Te,
Pb-Te, As-Te, Sb-Te, Bi-Te, S-Te,
Consists of Se-Te. Using Te-based compounds alone or in combination, the total amount x〓 of the added amount is 10x〓
A method for producing an optical information recording thin film according to claim 1, characterized in that the content is selected to be 40 wt%. 16 Ge-Te, Sn-Te, In as additive materials
−Te, Pb−Te, Sb−Te, Se−Te, Zn−Te,
Using T e- based compounds consisting of Al-Te, Bi-Te, and Cu-Te, either singly or in combination, the total amount added
16. The method for producing an optical information recording thin film according to claim 15, characterized in that x〓 is selected to be 10x〓40wt%. 17 As additive materials, Sn-Te, In-Te, Pb-
Te, Sb-Te, Se-Te, Zn-Te, Al-Te, Bi
-Te, Cu-Te. At least one Te-based compound is used alone or in combination, and Ge
and the total amount of addition x〓, 10x〓40wt
%, of which the amount of Ge added is selected to be O<x〓≦10wt%. 18. The method for producing an optical information recording thin film according to claim 17, characterized in that 15≦x〓30 and O<x〓8wt%. 19. The method for producing an optical information recording thin film according to claim 1, characterized in that the mixture P is press-molded into pellets. 20. The method for producing an optical information recording thin film according to claim 1, characterized in that an electron beam is used as a heating means for the mixture P. 21. The method for producing an optical information recording thin film according to claim 1, wherein the mixture P is annealed in an inert gas and then used as a vapor deposition source. 22. The method for producing an optical information recording thin film according to claim 21, wherein the annealing temperature is set lower than the sintering temperature.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58233009A JPS60125946A (en) | 1983-12-09 | 1983-12-09 | Production of optical information recording thin film |
| DE8484304250T DE3473670D1 (en) | 1983-06-27 | 1984-06-22 | Method of producing optical recording medium |
| EP84304250A EP0130755B1 (en) | 1983-06-27 | 1984-06-22 | Method of producing optical recording medium |
| US06/624,571 US4659588A (en) | 1983-06-27 | 1984-06-26 | Method of producing optical recording medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58233009A JPS60125946A (en) | 1983-12-09 | 1983-12-09 | Production of optical information recording thin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60125946A JPS60125946A (en) | 1985-07-05 |
| JPH0452537B2 true JPH0452537B2 (en) | 1992-08-24 |
Family
ID=16948381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58233009A Granted JPS60125946A (en) | 1983-06-27 | 1983-12-09 | Production of optical information recording thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60125946A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2577349B2 (en) * | 1986-02-27 | 1997-01-29 | 株式会社東芝 | Optical recording medium |
-
1983
- 1983-12-09 JP JP58233009A patent/JPS60125946A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60125946A (en) | 1985-07-05 |
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