JPH045275B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a hybrid device using ceramics etc.
This invention relates to a multi-chip hybrid IC board configured to automatically determine the dimensional accuracy of the IC board.

2. Description of the Related Art In recent automatic assembly of electronic devices, assembly precision is required in order to make products smaller and faster.

Hybrid ICs using ceramics consist of semiconductor integrated circuits and miniaturized individual parts (capacitors,
The accuracy of the parts is ±0.2mm, and the mounting accuracy using automatic machines is ±0.2mm, while the dimensional accuracy of the board to be mounted is ±0.2mm. Maximum ±1.0% due to conditions. Therefore, with such dimensional accuracy, for example, 50.8 mm square (2 inches)
In the case of multi-piece mounting using a board, it is necessary to allow for a dimensional difference of ±0.508 mm on the board during component mounting, and there is a drawback that program mounting control to preset locations by automatic assembly is not possible. In addition, in the case of a 50.8mm square (2 inch) board, 50.8±1
Due to dimensional error of %, maximum 51.31mm, minimum 0.29mm
The difference is about 1.02 mm, but if the desired pattern accuracy is 0.2 mm width, there is a drawback that thick film wiring is impossible.

The present invention aims to solve the above-mentioned drawbacks by forming dimensional accuracy marks on a multi-chip hybrid IC board using the same material (paste material, etc.) used for printing thick film resistors. Automatically detect the dimensional accuracy of the board after firing using a photoelectric element, perform automatic assembly according to the dimensions of the board, and form a defective module discrimination mark to indicate a defective module board. This makes it possible to avoid defective boards and automatically mount only good products.

Hereinafter, an example in which the present invention is applied to a module board for an electronic sensor will be described in detail.
Figure 1 is a plan view of an example of a board on which a dimensional accuracy discrimination mark (hereinafter referred to as size discrimination mark) and a defective module discrimination mark have been attached.
The figure shows a state in which chip components are mounted on individually divided boards. In Figure 1, 1 is a multi-chip hybrid IC ceramic board, 2 is a sensor module mounted on the board, and is 50.8 mm.
In the case of a square (2 inch) board, 10 sensor modules can be mounted at the same time. The ten sensor modules are labeled with numbers 1-10.

On the board 1, as discrimination marks, there are two timing marks 3 for the automatic assembly machine, three size discrimination marks 4, S, M, and L, and marks 5 for identifying defective modules, which are indicated by numbers 1 to 10. There will be 10. These marks are printed with the same paste material as the thick film resistor. 6 represents a printing reference position.

The size discrimination mark 4 indicates that the substrate dimensions after firing are L size (51.31 to 50.97 mm) and M size (50.97 mm).
This is a mark to determine which size it corresponds to: 50.63 mm) and S size (50.63 to 50.29 mm). The defective module discrimination mark 5 is used to indicate the number of a defective module among the ten modules. Further, the timing mark 3 is used to indicate a mark length reference and a mark interval. FIG. 1 shows that the board 1 is of M size and that the fourth module is defective.

By printing and forming the marks 3, 4, and 5 on the substrate 1 as described above, the size of the substrate 1 and the defective module number can be identified by identifying the marks at the time of chip mounting. After size identification, thick film printing and component mounting are performed using three types of screen printing masks that match each size. In this case, the substrate size is divided into three stages, and the dimensional tolerance for each size is a maximum of 0.34 mm, so thick film wiring with a pattern accuracy of 0.2 mm can be sufficiently performed.

By patterning the letters S, M, and L at the same time as printing the thick film resistor,
The size of the board can be easily determined and at the same time it can be read by an automatic assembly machine. In addition, in this example, a mark is provided to identify defective modules, so expensive ICs,
and can be automated without mounting electronic components.

Fig. 2 shows the positional relationship between the chip components mounted on the board and the thick film resistor wiring. , good quality chip parts 8, 8 (e.g. capacitors, resistors, etc.)
The figure shows the state in which the chisel has been taken out and bonded to this module.

Next, an example of the operation of an automatic assembly machine for discriminating a board provided with size discrimination marks and the like shown in FIG. 1 will be explained using a chip mounter as an example. FIG. 3 shows an example of a chip mounter drive circuit, and FIG. 4 shows a timing chart of the drive circuit. In FIG. 3, 9 and 10 are marks using photoelectric switches, etc., namely, automatic assembly machine timing mark 3, size discrimination mark 4,
This sensor detects the defective board discrimination mark 5, and the sensor 9 reads the timing mark.
The sensor 10 also reads size discrimination marks and defective marks. Here, the board size in Figure 1 is M
Now, the case where the defective module is No. 4 will be explained. The signal from sensor 9 is sent to board 1 in Figure 1.
In this case, 15 signals are output. This signal is introduced into the input terminal of the counter 11, and the counter outputs a signal from the terminal corresponding to the number of pulses. Since the sensor 10 is a sensor that reads the board size and defective module discrimination mark,
The number of signals from sensor 9 is 4th (see Figure 4)
The signal from the sensor 10 is output. At this time,
The input conditions of the gate M of the AND circuit 12 are satisfied,
The signal from this circuit is the chip mounter 13's
Since the signal is sent to the input of the Y table drive circuit 14, the XY table moves in accordance with the substrate size M, and the chip is mounted in this state. However, when the second signal is output from sensor 10 (the number of output signals from sensor 9 at this time is the 9th signal, module No. 4), the counter output corresponding to module No. 4 and the output from sensor 10 When the AND condition is satisfied, the output thereof is input to the chip mounter drive inhibition circuit 15, and the chip is not mounted on the board. The output of this drive prohibition circuit 15 is
This is input to the table drive circuit 16, and the XY table moves from module No. 4 to the position corresponding to module No. 5.

As explained above, according to the multi-chip hybrid IC substrate of the present invention, the yield of dimensional tolerance can be made as high as about 100% against variations due to substrate firing. Furthermore, since the discrimination mark is formed using the same material as the thick film resistor printing material on the substrate, there is no need for a separate material for mark formation, and it can be formed simultaneously with the resistor printing. Moreover, since a defective module can be distinguished, by not mounting parts on this module, post-process management and the completion yield of assembled products are improved. Furthermore, it has the advantage of being fully automated, achieving high reliability, and high-speed implementation.

[Brief explanation of drawings]

Fig. 1 is a plan view showing an example of a hybrid IC board according to the present invention with dimensional accuracy discrimination marks and defective module discrimination marks, and Fig. 2 is a plan view showing a state in which chip components are mounted on individually divided modules. FIG. 3 shows a configuration diagram of a drive circuit of an example of a chip mounter, and FIG. 4 shows a timing chart of the drive circuit. 1: Multi-piece board, 2: Sensor module, 3: Automatic assembly machine timing mark, 4: Size discrimination mark, 5: Defective module discrimination mark, 8: Chip parts, 9, 10: Sensor, 1
1: Counter, 12: AND circuit, 13: Chip mounter, 14, 16: XY table drive circuit, 15: Chip mounter drive prohibition circuit.

Claims (1)

[Claims] 1. In a board having a plurality of modular boards, on which a semiconductor chip or electronic component is mounted after thick film resistors are printed, the board is made of the same material as the thick film resistor is printed on the board. A multi-chip hybrid IC board characterized by forming a dimensional accuracy discrimination mark for determining the dimensional accuracy of the board and a defective module discrimination mark for indicating a defective module board.