JPH0452948Y2 - - Google Patents
Info
- Publication number
- JPH0452948Y2 JPH0452948Y2 JP1989035232U JP3523289U JPH0452948Y2 JP H0452948 Y2 JPH0452948 Y2 JP H0452948Y2 JP 1989035232 U JP1989035232 U JP 1989035232U JP 3523289 U JP3523289 U JP 3523289U JP H0452948 Y2 JPH0452948 Y2 JP H0452948Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- shielding plate
- housing body
- heat
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000005476 soldering Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 description 22
- 239000003779 heat-resistant material Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
「産業上の利用分野」
本考案は、ジヤツクの端子片脚部をプリント基
板の上面側から下面側に貫通突出させ、自動半田
付装置等の半田槽に漬けることによつて半田付け
固定する際に、ジヤツクのハウジング本体部およ
びハウジングスリーブ部を汎用の安価な材料で形
成しても、半田槽の熱によつてハウジング本体部
およびハウジングスリーブ部が熱変形するのを防
止できるようにしたジヤツクに関するものであ
る。[Detailed explanation of the invention] "Industrial application field" The invention is based on a method in which one leg of the terminal of the jack protrudes through the printed circuit board from the top side to the bottom side, and is immersed in a solder bath of an automatic soldering machine, etc. Therefore, when soldering and fixing, even if the housing body and housing sleeve of the jack are made of general-purpose and inexpensive materials, the housing body and housing sleeve can be prevented from being thermally deformed by the heat of the solder bath. This relates to jacks that can be prevented.
「従来の技術」
従来のジヤツクは、第3図に示すように、ハウ
ジング本体部1の前面側にハウジングスリーブ部
3を一体に設け、ハウジング本体部1の開口背面
側に裏蓋5を設け、ハウジング本体部1の底面か
ら突出した端子片7,7の脚部7a,7aをプリ
ント基板9の端子孔(図示省略)を貫通突出さ
せ、自動半田付装置等の半田槽11に漬けること
によつて端子片7,7の脚部7a,7aをプリン
ト基板9の所定のパターン部に半田付け固定する
ようにしていた。このとき、半田槽11から矢印
で示す方向に伝わる熱によつてハウジング本体部
1およびハウジングスリーブ部3が熱変形するの
を防止するため、ハウジング本体部1およびハウ
ジングスリーブ部3を耐熱性の高い材料(例えば
耐熱性の高いプラスチツク材料)で形成してい
た。``Prior Art'' As shown in FIG. 3, a conventional jack includes a housing sleeve portion 3 integrally provided on the front side of the housing body portion 1, a back cover 5 provided on the open back side of the housing body portion 1, The legs 7a, 7a of the terminal pieces 7, 7 protruding from the bottom surface of the housing main body 1 are made to protrude through terminal holes (not shown) of the printed circuit board 9, and are immersed in a solder bath 11 of an automatic soldering device, etc. The legs 7a, 7a of the terminal pieces 7, 7 are fixed to predetermined pattern portions of the printed circuit board 9 by soldering. At this time, in order to prevent the housing body part 1 and the housing sleeve part 3 from being thermally deformed due to the heat transmitted from the solder bath 11 in the direction shown by the arrow, the housing body part 1 and the housing sleeve part 3 are made of a highly heat-resistant material. It was made of a material (for example, a highly heat-resistant plastic material).
「考案が解決しようとする問題点」
しかしながら、第3図に示す従来例では、半田
時に半田槽11から伝わる熱によつてハウジング
本体部1およびハウジングスリーブ部3が熱変形
するのを防止するため、ハウジング本体部1およ
びハウジングスリーブ部3を耐熱性の高い材料
(例えば耐熱性の高いプラスチツク材料)で形成
しなければならないので、ハウジング本体部1お
よびハウジングスリーブ部3を形成する材料が限
定され、汎用の安価な材料(例えば耐熱性の低い
プラスチツク材料)を用いることができないとい
う問題点があつた。"Problems to be Solved by the Invention" However, in the conventional example shown in FIG. Since the housing body part 1 and the housing sleeve part 3 must be made of a highly heat-resistant material (for example, a highly heat-resistant plastic material), the materials for forming the housing body part 1 and the housing sleeve part 3 are limited. There was a problem in that general-purpose, inexpensive materials (for example, plastic materials with low heat resistance) could not be used.
本考案は上述の問題点に鑑みなされたもので、
ハウジング本体部およびハウジングスリーブ部を
汎用の安価な材料(例えば耐熱性の低いプラスチ
ツク材料)で形成しても、半田時に半田槽の熱に
よつてハウジング本体部およびハウジングスリー
ブ部が熱変形するのを防止できるジヤツクを提供
することを目的とするものである。 This idea was created in view of the problems mentioned above.
Even if the housing body and housing sleeve are made of a general-purpose, inexpensive material (for example, a plastic material with low heat resistance), it is difficult to prevent the housing body and the housing sleeve from being thermally deformed by the heat of the solder bath during soldering. The purpose is to provide a jack that can be prevented.
「問題点を解決するための手段」
本考案は、ハウジング本体部の前面側にハウジ
ングスリーブ部を一体に設け、前記ハウジング本
体部の底面から突出した端子片の脚部をプリント
基板の上面側から下面側に貫通突出させ半田槽に
漬けることによつて半田付け固定するようにした
ジヤツクにおいて、前記ハウジング本体部の底面
と前記プリント基板の上面との間に第1の熱遮蔽
板を設け、この第1の熱遮蔽板の前面側にヒンジ
部を介して前記ハウジングスリーブ部と前記半田
槽との間を遮断する第1の熱遮蔽板を一体に設け
てなることを特徴とするものである。さらに、部
品点数を少なくして組立を容易にするために、前
記第1の熱遮蔽板の背面側に前記ハウジング本体
部の開口背面を覆う裏蓋を一体に設けてなること
を特徴とするものである。"Means for Solving Problems" The present invention provides a housing sleeve integrally on the front side of the housing body, and connects the legs of the terminal pieces protruding from the bottom of the housing body from the top side of the printed circuit board. In the jack, which is protruded through the lower surface side and fixed by soldering by being immersed in a solder bath, a first heat shielding plate is provided between the bottom surface of the housing main body and the top surface of the printed circuit board; The present invention is characterized in that a first heat shield plate is integrally provided on the front side of the first heat shield plate through a hinge portion to isolate between the housing sleeve portion and the solder bath. Furthermore, in order to reduce the number of parts and facilitate assembly, a back cover is integrally provided on the back side of the first heat shielding plate to cover the opening back side of the housing main body. It is.
「作用」
ジヤツクの端子片脚部をプリント基板の上面側
から下面側に貫通突出させ、自動半田付装置等の
半田槽に漬けることによつてプリント基板の所定
のパターン部に半田付け固定する。この半田時に
おいて、ハウジング本体部の底面とプリント基板
の上面との間に設けられた第1の熱遮蔽板は、半
田槽からプリント基板を介してハウジング本体部
に伝わる熱を遮蔽する。また、ハウジングスリー
ブ部と半田槽との間を遮断する第2の熱遮蔽板
は、半田槽からハウジングスリーブ部に伝わる熱
を遮断する。さらに、ヒンジ部を介して一体に設
けられた第1,2の熱遮蔽板は1つの部品として
取り扱われ、半田付けが終わつた後に不要となつ
た第2熱遮蔽板は、ヒンジ部で切断除去される。
また、第1熱遮蔽板の背面側にハウジング本体部
の開口背面を覆う裏蓋を一体に設けた場合には、
第1,2熱遮蔽板及び裏蓋は1つの部品として取
り扱われ、この裏蓋をハウジング本体部の開口背
面に取付けることによつて第1,2熱遮蔽板もハ
ウジング本体部に取付けられることになる。``Function'' One terminal leg of the jack is made to protrude through the printed circuit board from the upper surface side to the lower surface side, and is soldered and fixed to a predetermined pattern part of the printed circuit board by immersing it in a solder bath of an automatic soldering device or the like. During this soldering, the first heat shielding plate provided between the bottom surface of the housing body and the top surface of the printed circuit board blocks heat transmitted from the solder bath to the housing body through the printed circuit board. Further, the second heat shielding plate that blocks the connection between the housing sleeve portion and the solder tank blocks heat transmitted from the solder tank to the housing sleeve portion. Furthermore, the first and second heat shielding plates, which are integrally provided through the hinge part, are treated as one component, and the second heat shielding plate, which is no longer needed after soldering, is cut and removed at the hinge part. be done.
In addition, when a back cover that covers the opening back of the housing body is integrally provided on the back side of the first heat shield plate,
The first and second heat shield plates and the back cover are treated as one component, and by attaching the back cover to the opening back of the housing body, the first and second heat shield plates are also attached to the housing body. Become.
「実施例」
第1図は本考案の実施例を示すもので、この図
において、第3図と同一部分(構成材料が異なつ
ている場合を含む)は同一符号とする。第1図に
おいて、1は、耐熱性の低い材料(例えば汎用の
安価なプラスチツク材料)で形成されたハウジン
グ本体部である。このハウジング本体部1の前面
側には、ハウジングスリーブ部3が一体に設けら
れている。前記ハウジング本体部1の下部にはプ
リント基板9が設けられ、このプリント基板9の
上面と前記ハウジング本体部1の下面との間に
は、耐熱性の高い材料(例えば高価な耐熱性の高
いプラスチツク材料)(本考案はこれに限るもの
ではないが)で形成された第1の熱遮蔽板21が
設けられている。前記第1熱遮蔽板21の前面側
の下部にはヒンジ部23を介して前記ハウジング
スリーブ部3と半田槽11との間を遮蔽する第2
の熱遮蔽板25が一体に設けられている。前記第
1熱遮蔽板21の背面側の上部には前記ハウジン
グ本体部1の開口背面を覆う裏蓋27が一体に設
けられている。この裏蓋27の係合子29は前記
ハウジング本体部1の背面側に形成された係合孔
30に係合している。前記ハウジング本体部1内
には端子片7,7が係止され、この端子片7,7
の脚部7a,7aは、前記ハウジング本体部1の
底面から突出し、前記第1熱遮蔽板21及びプリ
ント基板9の貫通孔を貫通して外部に突出してい
る。Embodiment FIG. 1 shows an embodiment of the present invention. In this figure, the same parts as in FIG. 3 (including the case where the constituent materials are different) are given the same reference numerals. In FIG. 1, reference numeral 1 denotes a housing main body made of a material with low heat resistance (for example, a general-purpose inexpensive plastic material). A housing sleeve portion 3 is integrally provided on the front side of the housing body portion 1. A printed circuit board 9 is provided at the lower part of the housing body 1, and a material having high heat resistance (for example, an expensive plastic with high heat resistance) is disposed between the upper surface of the printed circuit board 9 and the lower surface of the housing body 1. A first heat shielding plate 21 is provided, which is made of a material (although the present invention is not limited thereto). A second heat shielding plate 21 is provided at the lower part of the front side of the first heat shielding plate 21 via a hinge part 23 to shield between the housing sleeve part 3 and the solder bath 11.
A heat shielding plate 25 is integrally provided. A back cover 27 is integrally provided at the upper part of the back side of the first heat shielding plate 21 to cover the back side of the opening of the housing main body 1 . The engaging element 29 of the back cover 27 engages with an engaging hole 30 formed on the back side of the housing main body 1. Terminal pieces 7, 7 are locked in the housing main body 1, and these terminal pieces 7, 7
The leg portions 7a, 7a protrude from the bottom surface of the housing main body 1, pass through the first heat shield plate 21 and the through holes of the printed circuit board 9, and protrude to the outside.
上述のようにしてジヤツクを取付けたプリント
基板9を搬送装置(図示省略)等によつて半田槽
11に導き、端子片7,7の脚部7a,7aを半
田槽11に漬けることによつてプリント基板9の
所定のパターン部に半田付け固定する(例えば自
動半田付装置)。この半田時において、ハウジン
グ本体部1の底面とプリント基板9の上面との間
に設けられた第1熱遮蔽板21は、半田槽11か
らプリント基板9を介してハウジング本体部1に
向つて図中矢印で示す方向に伝わる熱を遮蔽す
る。また、ハウジングスリーブ部3と半田槽11
との間を遮断する第2熱遮蔽板25は、半田槽1
1からハウジングスリーブ部3に向つて図中矢印
で示す方向に伝わる熱を遮断する。また、半田付
けが終わつた後に不要となつた第2熱遮蔽板25
は、ヒンジ部23で切断除去される。さらに、第
1,2熱遮蔽板21,25及び裏蓋27は一体に
設けられているので、1つの部品として取り扱わ
れ、裏蓋27の係合子29をハウジング本体部1
の背面側に形成された係合孔30に係合するだけ
で、ハウジング本体部1に取付けることができ
る。 The printed circuit board 9 with the jack attached as described above is led to the solder bath 11 by a conveyance device (not shown) or the like, and the legs 7a, 7a of the terminal pieces 7, 7 are immersed in the solder bath 11. It is soldered and fixed to a predetermined pattern portion of the printed circuit board 9 (for example, using an automatic soldering device). During this soldering, the first heat shielding plate 21 provided between the bottom surface of the housing main body 1 and the top surface of the printed circuit board 9 moves from the solder tank 11 toward the housing main body 1 via the printed circuit board 9. Shields heat transmitted in the direction indicated by the middle arrow. In addition, the housing sleeve part 3 and the solder tank 11
The second heat shielding plate 25 that blocks the connection between the solder tank 1 and
1 to the housing sleeve portion 3 in the direction shown by the arrow in the figure. Also, the second heat shielding plate 25, which is no longer needed after soldering is finished,
is cut and removed at the hinge portion 23. Furthermore, since the first and second heat shield plates 21 and 25 and the back cover 27 are provided integrally, they can be handled as one component, and the engagement element 29 of the back cover 27 can be attached to the housing main body.
It can be attached to the housing main body 1 by simply engaging with the engagement hole 30 formed on the back side of the housing.
前記実施例では、第2熱遮蔽板は第1熱遮蔽板
の前面側の下部にヒンジ部を介して一体に設ける
ようにしたが、本考案はこれに限るものでなく、
第2熱遮蔽板は第1熱遮蔽板の前面側にヒンジ部
を介して一体に設けられ、ハウジングスリーブ部
と前記半田槽との間を遮蔽するものであればよ
い。例えば、第2図に示すように、第2熱遮蔽板
25aは第1熱遮蔽板21の前面側の上部にヒン
ジ部aを介して一体に設けるようにしてもよい。 In the above embodiment, the second heat shield plate is integrally provided at the lower part of the front side of the first heat shield plate via a hinge part, but the present invention is not limited to this.
The second heat shielding plate may be integrally provided on the front side of the first heat shielding plate via a hinge portion and shielding between the housing sleeve portion and the solder bath. For example, as shown in FIG. 2, the second heat shielding plate 25a may be integrally provided on the upper part of the front side of the first heat shielding plate 21 via a hinge part a.
前記実施例では、第1熱遮蔽板の背面側にハウ
ジング本体部の開口背面を覆う裏蓋を一体に設
け、部品点数を少なくして組立を容易にしたが、
本考案はこれに限るものでなく、第1熱遮蔽板と
裏蓋とを別体に形成しても良い。 In the embodiment described above, a back cover that covers the opening back of the housing main body is integrally provided on the back side of the first heat shielding plate to reduce the number of parts and facilitate assembly.
The present invention is not limited to this, and the first heat shielding plate and the back cover may be formed separately.
「考案の効果」
本考案によるジヤツクは、上記のように、ハウ
ジング本体部の底面とプリント基板の上面との間
に第1熱遮蔽板を設け、かつハウジングスリーブ
部と前記半田槽との間に第2熱遮蔽板を設けて、
半田時において、半田槽からプリント基板を介し
てハウジング本体部に伝わる熱と、半田槽からハ
ウジングスリーブ部に伝わる熱とを遮断している
ので、ハウジング本体部及びハウジングスリーブ
部を汎用の安価な材料(例えば耐熱性の低いプラ
スチツク材料)で形成しても、半田槽の熱によつ
てハウジング本体部およびハウジングスリーブ部
が熱変形するのを防止することができる。このた
め、従来例のようにハウジング本体部及びハウジ
ングスリーブ部を形成する材料が耐熱性の高い特
定の材料(例えば耐熱性の高いプラスチツク材
料)に限定されず、ハウジング本体部及びハウジ
ングスリーブ部を汎用の安価な材料(例えば耐熱
性の低いプラスチツク材料)で形成することがで
きる。さらに、第2熱遮蔽板は、ヒンジ部を介し
て第1熱遮蔽板に一体に設けられているので、必
要とする部品点数を少なくして組立を容易にし、
かつ半田付けが終わつた後に不要となつた第2熱
遮蔽板をヒンジ部で切断して除去することができ
る。また、第1熱遮蔽板の背面側にハウジング本
体部の開口背面を覆う裏蓋を一体に設けるように
した場合には、必要とする部品点数をさらに少な
くして組立をさらに容易にすることができる。"Effects of the Invention" As described above, the jack according to the invention includes a first heat shield plate between the bottom surface of the housing body and the top surface of the printed circuit board, and a first heat shield plate between the housing sleeve section and the solder bath. Providing a second heat shield plate,
During soldering, the heat transmitted from the solder bath to the housing body via the printed circuit board and the heat transmitted from the solder bath to the housing sleeve are blocked, so the housing body and housing sleeve can be made of general-purpose, inexpensive materials. Even if they are made of a plastic material with low heat resistance, for example, the housing body and the housing sleeve can be prevented from being thermally deformed by the heat of the solder bath. Therefore, unlike the conventional example, the material forming the housing body and the housing sleeve is not limited to a specific material with high heat resistance (for example, a plastic material with high heat resistance), but the housing body and the housing sleeve can be made into a general-purpose material. It can be made of inexpensive materials (for example, plastic materials with low heat resistance). Furthermore, since the second heat shield plate is integrally provided with the first heat shield plate via the hinge portion, the number of required parts is reduced and assembly is facilitated.
Moreover, after the soldering is finished, the second heat shielding plate that is no longer needed can be removed by cutting it at the hinge portion. Furthermore, if a back cover is integrally provided on the back side of the first heat shielding plate to cover the back side of the opening of the housing body, the number of required parts can be further reduced, making assembly even easier. can.
第1図は本考案によるジヤツクの一実施例を示
す断面図、第2図は他の実施例を示す要部の断面
図、第3図は従来例を示す断面図である。
1……ハウジング本体部、3……ハウジングス
リーブ部、7……端子片、7a……端子片7の脚
部、9……プリント基板、11……半田槽、21
……第1熱遮蔽板、23,23a……ヒンジ部、
25,25a……第の熱遮蔽板、27……裏蓋。
FIG. 1 is a cross-sectional view showing one embodiment of a jack according to the present invention, FIG. 2 is a cross-sectional view of main parts of another embodiment, and FIG. 3 is a cross-sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Housing body part, 3... Housing sleeve part, 7... Terminal piece, 7a... Leg part of terminal piece 7, 9... Printed circuit board, 11... Solder tank, 21
...first heat shielding plate, 23, 23a...hinge part,
25, 25a...first heat shielding plate, 27...back cover.
Claims (1)
ーブ部を一体に設け、前記ハウジング本体部の
底面から突出した端子片の脚部をプリント基板
の上面側から下面側に貫通突出させ半田槽に漬
けることによつて半田付け固定するようにした
ジヤツクにおいて、前記ハウジング本体部の底
面と前記プリント基板の上面との間に第1の熱
遮蔽板を設け、この第1熱遮蔽板の前面側にヒ
ンジ部を介して前記ハウジングスリーブ部と前
記半田槽との間を遮蔽する第2の熱遮蔽板を一
体に設けてなることを特徴とするジヤツク。 (2) ハウジング本体部の前面側にハウジングスリ
ーブ部を一体に設け、前記ハウジング本体部の
底面から突出した端子片の脚部をプリント基板
の上面側から下面側に貫通突出させ半田槽に漬
けることによつて半田付け固定するようにした
ジヤツクにおいて、前記ハウジング本体部の底
面と前記プリント基板の上面との間に第1の熱
遮蔽板を設け、この第1熱遮蔽板の前面側にヒ
ンジ部を介して前記ハウジングスリーブ部と前
記半田槽との間を遮蔽する第2の熱遮蔽板を一
体に設け、前記第1熱遮蔽板の背面側に前記ハ
ウジング本体部の開口背面を覆う裏蓋を一体に
設けてなることを特徴とするジヤツク。[Claims for Utility Model Registration] (1) A housing sleeve is integrally provided on the front side of the housing body, and the legs of the terminal pieces protruding from the bottom of the housing body are connected from the top side of the printed circuit board to the bottom side. In the jack, which is protruded through and fixed by soldering by being dipped in a solder bath, a first heat shielding plate is provided between the bottom surface of the housing body and the top surface of the printed circuit board, and the first heat shielding plate is provided between the bottom surface of the housing body and the top surface of the printed circuit board. A jack characterized in that a second heat shielding plate is integrally provided on the front side of the shielding plate via a hinge portion to shield between the housing sleeve portion and the solder bath. (2) A housing sleeve is integrally provided on the front side of the housing body, and the legs of the terminal pieces protruding from the bottom of the housing body are penetrated and protruded from the top side of the printed circuit board to the bottom side, and immersed in a solder bath. In the jack, a first heat shield plate is provided between the bottom surface of the housing body and the top surface of the printed circuit board, and a hinge portion is provided on the front side of the first heat shield plate. A second heat shielding plate is integrally provided to shield between the housing sleeve portion and the solder bath via a second heat shielding plate, and a back cover covering the opening rear side of the housing main body portion is provided on the back side of the first heat shielding plate. A jack characterized by being installed in one piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989035232U JPH0452948Y2 (en) | 1989-03-28 | 1989-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989035232U JPH0452948Y2 (en) | 1989-03-28 | 1989-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02126383U JPH02126383U (en) | 1990-10-18 |
| JPH0452948Y2 true JPH0452948Y2 (en) | 1992-12-11 |
Family
ID=31540410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989035232U Expired JPH0452948Y2 (en) | 1989-03-28 | 1989-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452948Y2 (en) |
-
1989
- 1989-03-28 JP JP1989035232U patent/JPH0452948Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02126383U (en) | 1990-10-18 |
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