JPH0452949Y2 - - Google Patents

Description

[Detailed description of the invention] [Field of industrial application] This invention relates to a connector. Specifically, this invention relates to a connector for detachably connecting an external memory (storage medium), such as a memory cartridge for a game machine or an IC card, to an information processing device that cooperates with the external memory.

[Prior Art]

This type of connector typically includes a large number of connector terminals, one end of which is fixedly connected to the circuit board of the information processing device, and the other end of which is pressure-connected to the connector terminal of the external memory. It has a connected structure.

[The problem that the idea aims to solve]

Conventional connectors like this are all constructed in one piece, so when one end of a connector terminal is soldered to securely connect it to a circuit board, the one large connector is connected to the circuit board. I had to attach it to the top and solder it. Therefore, in such a soldering process, a large connector must be handled, resulting in poor workability.

Moreover, with conventional connectors, during solder dipping, for example, flux, solutions such as detergents, and dirt may adhere to the other end of the connector terminal that should be pressed into contact with the connector electrode of an external memory, and the connector electrode at that part may become attached. In some cases, connection performance deteriorated. Additionally, there was a risk that some of the resins, which have poor heat resistance, would be deformed by the heat during soldering.

Therefore, the main purpose of this invention is to provide a connector that allows easy work such as soldering.

[Means to solve the problem]

Simply put, this invention is a connector for electrically connecting an external memory to a circuit board through a large number of connector terminals, with one end fixedly connected to the circuit board and the other end extending from them. a first piece supporting a first terminal having;
and a second terminal that is removably integrally attached to the first piece and has one end that is press-contacted to the other end of the first terminal and the other end that is press-contacted to the connector electrode of the external memory. A connector comprising a second piece.

[Effect]

The first piece is mounted on a circuit board and one end of the first terminal is eg soldered to a conductive pattern on the circuit board. Then add the second piece to the first piece.
By fitting the pieces together, the first piece and the second piece are integrated, and the other end of the first terminal and one end of the second terminal are connected by pressure contact. The other end of the second terminal is then connected to one end of the first terminal. Therefore, when the connector electrode of the storage medium is press-connected to the other end of the second terminal, the connector electrode is electrically connected to the conductive pattern of the circuit board through the second terminal and the first terminal. .

[Effect of idea]

According to this invention, since the first piece and the second piece can be removed and worked on, handling is easier and workability is improved compared to the conventional integrated structure. In particular, the first part of the first piece
For example, when soldering a terminal to a circuit board, it is sufficient to remove the second piece.
No unnecessary deposits are formed on the terminals of the
The stability or reliability of the connection between the connector electrode and the connector terminal is improved, and there is no risk of deforming or discoloring the resin included in the second piece, which has poor heat resistance.

Incidentally, since the first terminal of the first piece is permanently connected, the contact force can be increased even if the plating thickness is thin. On the other hand, since the other end of the second terminal of the second piece is required to have a long life, the contact pressure with the connector electrode of the external memory is set to be lower to reduce wear on the plating. . Therefore,
The ability to integrate the second piece with the first piece after the first piece has been connected onto the circuit board reduces the amount of time the second piece is in the manufacturing process. This is very effective in preventing deterioration of the contact portion of the second terminal.

Furthermore, according to this invention, the first piece and the second piece can be replaced individually, so if, for example, a malfunction or defective product occurs, only the corresponding piece needs to be replaced, so the entire This not only improves manufacturing yields, but also provides great advantages in maintenance.

The above-mentioned objects, other objects, features and advantages of the present invention will become clearer from the following detailed description of embodiments with reference to the drawings.

〔Example〕

Referring to FIG. 1, the loading device 10 includes:
For example, it is attached to an adapter 12 for a "Family Computer" (trademark). However, the loading device can be attached to any information processing device.

The loading device 10 includes a tray 14 made of plastic, for example, and a cover 1 for covering the tray 14 made of transparent plastic, for example.
6, the tray 14 and the cover 16
are supported by a frame 22 (FIG. 2) so as to be freely openable and closable, and are attached to the adapter 12. Then, the external memory 18 is inserted from the open end of the tray 14 in the direction of arrow A so that its main surface is along the bottom surface of the tray 14.

In addition, as the external memory 18, in this embodiment, a thin type (card type) as disclosed in Utility Model Application No. 1983-97511 (Utility Model Application No. 2-18127) filed on the same date is used. However, by changing the shape and size of the tray 14, cover 16, etc. of the loading device 10, it will be possible to load an external memory of any shape or size.

In this embodiment, conductive plates 20 are attached to both main surfaces of the external memory 18, and although not shown, the conductive plates 20 are connected to the outside of the external memory 18 by an appropriate method inside the external memory 18. It is electrically connected to a ground portion of a circuit board (not shown) of the memory 18.

Loading device 10 includes a frame 22 as shown in FIG. The frame 22 has side sides 22a
and 22b and front side 22c and rear side 22
It is formed into a rectangular shape having a diameter d, and an appropriate number of through holes 24 are formed in each of the sides 22a and 22b. The through hole 24 allows the frame 22 to be screwed into the adapter 12 as shown in FIG. 1, for example.

The tray 14 and the cover 16 are rotatably attached to the frame 22 by attachment portions 26a and 26b surrounded by one-dot chain lines in FIG. 2A so that they can be rotated or opened and closed.

Referring to FIG. 3, in the mounting portion 26a,
A protrusion 28 that protrudes inward is formed on the side 22a of the frame 22, and a through hole 30 is formed in the protrusion 28.
is formed. A boss 32 formed on the outer surface of the tray 14 and projecting outward is fitted into the through hole 30. A keyhole-shaped notch 34 shown in FIG. 3B is formed in the tip 16a of the cover 16. This notch 34 fits into the outer periphery of the boss 32 described above, so that the tip 16a of the cover 16 is fitted into the gap between the protrusion 28 and the side plate 18 of the tray 14. Note that the cover 16 has a notch 3.
Although not shown, a side plate 16b (FIG. 4 or 5), which will be described later, is restrained by the frame 22 to prevent the cover 16 from coming off. Ru. In this manner, tray 14 and cover 16 are attached to frame 22.
They are supported so that they can be opened and closed respectively.

In the embodiment shown in FIG. 3, since the tray 14 and the cover 16 are supported by the common boss 32, the cover 16 and the tray 14 are supported on the same axis. Another support structure may be used, and the support structures do not necessarily need to be supported on the same axis.

As can be seen from FIG. 1, the tray 14 has a bottom plate 36 and side plates 38 rising from both side edges of the bottom plate 36. The open end side of the side plate 38 is flared outwardly so that the external memory 18 can be easily inserted onto the tray 14. An electrode 40 is formed approximately in the widthwise center of the bottom plate 36 of the tray 14, and this electrode 40
When the external memory 18 is inserted and placed on the tray 14, it makes electrical contact with the aforementioned conductive plate 20.

Note that a protrusion 42 is formed on the inner surface of the bottom plate 38 of the tray 14, and between the lower end surface of the protrusion 42 and the upper surface of the bottom plate 36, as can be clearly seen from FIG. An interval slightly thicker than 18 is formed. Therefore, the external memory 18 is inserted so that its both ends fit between the protrusion 42 and the bottom surface of the tray 16, so that the protrusion 42 acts as a means for restricting movement of the external memory 18 in the thickness direction. act.

As can be clearly seen from Figure 2E and Figure 4,
A boss 44 is formed on the upper surface of the bottom plate 22e of the frame 22, and a boss 46 is formed on the lower surface of the bottom plate 36 of the tray 14 at a position corresponding to the boss 44. One end and the other end of a coil spring 48 are fitted into the outer peripheries of the two bosses 44 and 46, respectively. The coil spring 48 is a spring for resiliently biasing the tray 14 in the direction of arrow B in FIG. 4, that is, in the direction in which the tray 14 is opened.

Although not shown in detail, one end of the coil spring 48 is electrically connected to the aforementioned electrode 40 formed on the bottom plate 36 of the tray 14, and the other end of the coil spring 48 is connected to the bottom surface 22e of the frame 22. Ground terminal 5 shown in Figure 2 E attached to the bottom surface of
electrically connected to 0. When the external memory 18 is inserted and placed on the tray 14 as shown in FIG. 1, the conductive plate 20 of the external memory 18 comes into contact with the electrode 40. Therefore, for example, even if the hand of a person holding the external memory 18 is charged with static electricity, the static electricity flows to the ground terminal 50 through the conductive plate 20, the electrode 40, and the coil spring 48. This prevents electric shock from being applied to a semiconductor memory element (not shown) built in 18 or the like.

By using the coil spring 48 for biasing the tray 14 in the opening direction also as a relay member for static electricity to the ground terminal 50, it is possible to reduce costs, and the movable parts such as the tray 14 There is no need to connect a ground lead wire to dissipate static electricity, and the possibility of breakage of such a lead wire is reduced as much as possible.

Further, as can be clearly seen from FIGS. 2A and 4, a reversing spring 52 made of, for example, a torsion coil spring is attached to one outer surface of the cover 16. That is, the reversing spring 52 includes a coil portion 52c, one end 52a extending from the coil portion 52c is fixed to the side 22a of the frame 22, and the other end 52b similarly extending from the coil portion 52c is fixed to the side plate 16b of the cover 16. (Fig. 4). Then, the coil portion 5 of the reversing spring 52
2c is not fixed anywhere and is freely displaceable.

When the cover 16 is closed, a biasing force is applied by the reversing spring 52 to rotate the cover 16 in the direction of the tray 14, that is, in the direction in which the cover 16 is closed, and when the cover 16 is opened, the cover 16 is rotated in the direction away from the tray 14. That is, a biasing force acts in the direction in which the cover 16 opens. That is, in the reversing spring 52, the direction in which the spring force acts (biasing direction) is reversed with respect to its neutral point.

The neutral point is in the state shown in FIG. 5B. Figure 5B
In the state shown in FIG. 2, one end 52a of the reversing spring 52 is fixed to the side 22a of the frame 22 (FIG. 2), and the other end 52 is fixed to the side plate 16b of the cover 16.
b, that is, the fulcrum and point of action of the reversal spring 52 are in line with the support shaft 30 of the cover 16. This time is the neutral point. The neutral point of such a reversing spring 52 is between the closed state of the tray 14 shown in FIG. 5C and the maximum open state of the tray 14 shown in FIG. 5A, preferably when the opening degree of the tray 14 is It is set to a position or state slightly smaller than the maximum opening.

FIG. 5A shows the tray 14 and cover 16 opened to their maximum opening degrees. From the state shown in FIG. 5B to the state shown in FIG. 5A, the spring force of the reversing spring 52 acts to rotate the cover 16 in the direction of arrow B. In the state shown in FIG. 5A, the other end 52b of the reversing spring 52, that is, the point of action, is located above the straight line connecting the one end 52a of the reversing spring 52, that is, the fulcrum, and the support shaft 30, and the straight line and the other end 52b, that is, The angle X with the point of action is cover 1
Specify the maximum opening degree of 6.

FIG. 5C shows the tray 14 and cover 16 in their respective closed states. From the state shown in FIG. 5B to the state shown in FIG. 5C, the spring force of the reversing spring 52 acts to rotate the cover 16 in the direction of arrow C. In the state shown in FIG. 5C, the reversal spring 5
The other end 52b of 2, that is, the point of action is the one end 52
a, that is, it is located below the straight line connecting the fulcrum and the support shaft 30 by an angle Y.

Unlock the tray 14 and store the external memory 18.
When loading or unloading (FIG. 1) the cover 16 and therefore the tray 1
Push down on 4. Then, tray 14
is opened to the maximum opening degree shown in FIG. 5A by the biasing force of the coil spring 48. During this process, the cover 16 is pressed against the tray 14 by the biasing force of the reversing spring 52 until the neutral point of the reversing spring 52 is reached. Therefore, the coil spring 48 becomes the reverse spring 52.
Push up trays 14 and 16 against the Then, after passing the neutral point of the reversing spring 52, the biasing direction of the reversing spring 52 is reversed, and even if the tray 14 stops at its maximum opening, the cover 16
Further opened by. For that purpose, tray 1
4 and the cover 16, a relatively large gap is formed between the cover 16 and the cover 16, as shown in FIG. 4 or 5A. Therefore, the cover 16 does not get in the way when loading or unloading the external memory 18 (FIG. 1).

Conversely, when changing from the state shown in FIG. 5A to the state shown in FIG. 5C, the cover 16 is pushed down against the biasing force of the reversing spring 52. During this process, the reversal spring 52
Until the neutral point of
After passing the neutral point of the reversing spring 52, the reversing spring 52
The biasing direction of the cover 16 is reversed, and the biasing direction of the reverse spring 5 is reversed.
2 in the direction of arrow C and comes into tight contact with the tray 14. Therefore, in the state shown in FIG. 5C, the cover 16 effectively prevents foreign matter such as dirt and dust from entering the tray 14.

Note that in order to restrict the rotation of the tray 14 and the cover 16 in the direction of the arrow B in FIG. An engaging portion is formed respectively.

Further, in this embodiment, a torsion coil spring is used as the reversal spring 52. However, springs with a similar effect may also be utilized, such as flat springs.

Furthermore, a locking mechanism 54 for locking the tray 14 in the closed state as shown in FIG.
As shown in FIG. As such a lock mechanism 54, for example, one having a structure similar to that disclosed in Japanese Patent Application Laid-Open No. 62-51091 cited above can be used.

That is, the lock mechanism 54 includes a key mechanism 54a provided on the bottom plate 22e of the frame 22, and a lock cam mechanism 54b provided below the front end of the tray 14, which corresponds to a lock and includes a heart cam. However, since this point is not important here, further explanation will be omitted.

Referring to FIG. 4, a protrusion 56 is formed below the bottom plate 36 of the tray 14. As shown in FIG. The bottom plate 22e of the frame 22 is located below the protrusion 56.
In addition, a switch 58 operated by this protrusion 56
is provided. The switch 58 includes a movable contact 60 that is pushed down by the protrusion 56 when the tray 14 is pushed down, and two fixed contacts 62a that the movable contact 60 contacts simultaneously when the movable contact 60 is pushed down against the spring 62. and 62
Contains b. Then, as shown in Figure 4, tray 1
4 is open, the protrusion 56 is the movable contact 6
0, and therefore the movable contact 60 is moved away from the spring 6
2, it is fired upwards. Therefore, the movable contact 60 does not come into contact with the fixed contacts 62a and 62b. In this manner, switch 58 is configured as a normally-opened switch.

The switch 58 is configured such that the external memory 18 (FIG. 1) is inserted and placed on the tray 14, and the tray 14 is placed on the fifth
This is so that the external memory 18 becomes electrically active only after it is completely closed to the state shown in FIG.

That is, as shown in FIG.
One fixed contact 62a is connected to an R/W (read/write) terminal from an information processing device (not shown), and the other fixed contact 62b is connected to a power supply Vcc via a pull-up resistor and connected to a connector 66 (described later). Connected. And this connector 66
and connector electrode of external memory 18 (10th
) is connected to the R/W terminal of a semiconductor memory element (not shown) housed in the external memory 18.

As shown in FIG. 4, when the tray 14 is open, the switch 58 is off, so the R/W signal from the information processing device is not applied to the external memory 18. In other words, the R/W terminal of the external memory 18 is connected to the power supply through a pull-up resistor.
A high level from Vcc is given. Therefore, in this state, writing of data to the external memory 18 is prohibited, and the external memory 18 is substantially disabled.

On the other hand, as shown in FIG.
4 is pushed down, the movable contact 60 is pushed down by the protrusion 56, and the movable contact 60 simultaneously contacts the fixed contacts 62a and 62b, so that the switch 58 is turned on. Therefore, an R/W signal from the information processing device is applied to the R/W terminal of the external memory 18, data writing to the external memory 18 is permitted, and the external memory 18 is activated.

Although in this embodiment the switch 58 is turned on when the tray 14 is closed, a switch with the opposite operation could be used to accomplish the same purpose. Therefore, the configuration or structure of the switch 58 itself may be arbitrary as long as it functions as fail-safe as described above.

As shown in FIG. 2, the rear side 22 of the frame 22
A connector 66 is attached to the rear of d.
This connector 66 is for electrically connecting the external memory 18 inserted and mounted on the tray 14 to the adapter 12 or information processing device shown in FIG. 1.

Referring to FIG. 7, connector 66 includes a lower piece 68 and an upper piece 70. The lower piece 68 is attached to the circuit board 72 of the information processing device or the adapter 12 as shown in FIG.
0 is removably attached to its lower piece 68. When the connector 66 is constructed of two pieces 68 and 70 in this way, one large connector 66 is attached to the circuit board 70 when assembled.
It does not need to be installed on top. There is an advantage.

That is, first, the lower piece 68 is attached to the circuit board 72.
The terminals of the lower piece 68 are electrically connected and mechanically fixed to a pattern (not shown) on the circuit board 72 by, for example, solder dipping. At that stage, the lower piece 68 is fixed onto the circuit board 72. After that, lower piece 68
the upper piece 7 so that it fits into the upper piece 70.
0, both pieces 68 and 70 are integrated to complete one connector 66. As described above, since soldering can be performed with only the lower piece 68 attached, the soldering work can be performed more easily than when one large connector 66 is attached on the circuit board 72.

Moreover, in the event of a failure or defective product,
Since it is necessary to replace only the lower piece 68 or the upper piece 70, it is not only easier to work in the manufacturing process, but also very advantageous in terms of maintenance.

Referring to FIG. 8, the lower piece 68 is made of plastic, for example, and includes a plate-shaped base 74 with a notch 74a formed approximately in the center in the axial direction.
6 is formed. A post 78 is formed on the lower surface of the flange 76 and projects downward. This post 78 connects the lower piece 68 to the circuit board 72 (FIG. 7).
At the same time, it is inserted into a hole (not shown) in the circuit board 72. Note that a flange 80 is also formed at approximately the center of the lower end of the base 74.

A large number of terminals 82 are formed on one main surface of the base 74, extending in its height direction and distributed in its axial direction. The terminals 82 are insulated from each other by thin partitions 84 formed at regular intervals, as best seen in FIG. 8C. That is,
Terminals 82 are arranged and fixed between each partition 84.

Specifically, the upper end 82a of the terminal 82
As shown in FIG. B, it extends to the upper end surface of the base 74, and is fixed in this state by thermocompression bonding the partitions 84 on both sides. Each terminal 82 is also fixed slightly below and in the center by a holding part (not shown) formed by a partition 84 at the lower end of the base 74.

Referring to FIG. 8C, FIG. 8E, and FIG. 8F, each terminal 82 is bent slightly below its center and protrudes below the base 74 within the plane of the lower end surface of the base 74. . What should be noted is that, for example, the leftmost terminal in FIG. 8C and the second terminal from the left have different bending positions, as can be clearly seen from FIGS. 8E and 8F. The position of the lower end 82a also differs in the thickness direction of the base 74. Therefore, the lower ends 82b of each terminal 82 are arranged in a staggered manner, as shown in FIG. 8C. As a result, even if the width of the base 74 is narrow, a large number of terminals 8 can be used.
2 can be arranged while maintaining an appropriate interval (pressure resistance). Further, since the holes (not shown) of the circuit board 72 (FIG. 7) into which the lower end 82b is inserted are also formed in a staggered manner, the intervals between the holes of the circuit board 72 are set appropriately. Even if a large number of holes are drilled, the mechanical strength of that part will not be weakened.

Referring to FIG. 9, the upper piece 70 includes a base 86 made of plastic, for example, and a holding part 8 made of plastic similarly to the base 86.
8, there are a large number of connector terminals 90, the shape of which can be clearly seen especially with reference to FIG.
By means of a thin partition 92 (Fig. 9A), the base 8
They are distributed in the width direction of 6 and are installed insulated from each other.

As can be clearly seen from Figure 7, connector terminal 9
0 is bent so that its upper part 90a faces the upper opening 93 and its lower part 90b faces the lower opening 94. The upper opening 93 is oriented toward the open end of the tray 14, and the lower opening 94 is oriented downward at an offset of approximately 90 degrees from the upper opening 93. Then, the tip of the upper part 90a of the connector terminal 90 is connected to the connector electrode 106 (first
1) acts as a contact point 90c. Further, the lower portion 90b of the connector terminal 90 is exposed on the inner wall surface of the lower opening 94.

The base 7 of the lower piece 68 mentioned above is inserted into the lower opening 94.
4 is inserted, each terminal 82 exposed on the main surface of the base 74 of the lower piece 68 is pressed into contact with the lower part 90b of the corresponding connector terminal 90, as clearly seen in FIG. At this time, the lower part 90b of the connector terminal 90
In the figure, the state shown by the dotted line is transformed into the state shown by the solid line. Therefore, due to such elastic deformation of the connector terminals 90, the electrical connection between each pair of the connector terminals 90 and the terminals 82 becomes more complete. In this way, one connector 66 is completed.

Note that a screw hole 96 is formed in the holding portion 88 for attaching the connector 66 integrated as described above to the frame 22. Furthermore, a rib 98 formed approximately at the center in the width direction of the lower opening 94 fits into the notch 74a of the base 74 of the lower piece 68 when the lower piece 68 is fitted into the upper piece 70.

As shown in FIG. 9B, the upper opening 93 of the upper piece 70 has a contact point 90c of the connector terminal 90 at a position slightly eccentric from the widthwise center of the base 86.
A protrusion 100 is formed to protrude in the same direction. As shown in FIG. 10, when the external memory 18 slides on the tray 14 and the opening 102 at the tip in the insertion direction is pushed into the upper opening 93 of the connector 66, the protrusion 100 enters into the opening 102. . However, if an external memory 18' with a thickness thinner than the normal thickness is inserted by mistake, 2
The protrusion 100 abuts the front edge of the incorrectly inserted thin external memory 18', as shown by the dash-dot line. Therefore, since the external memory 18' is stopped before reaching the contact 90c of the connector terminal 90, the connector terminal 90 is not deformed even when the external memory 18' is inserted. In this way, incorrect insertion of external memories with similar planar shapes and sizes but different thicknesses is prevented.

The protrusion 100 further cooperates with the external memory 18 to effectively prevent the external memory 18 from being inserted upside down. That is, as shown in FIG. 11, a large number of connector electrodes 106 are formed on the front edge of the circuit board 104 of the external memory 18, distributed in the width direction of the circuit board 104 and insulated from each other.
This connector electrode 106 is for connecting a semiconductor memory element (not shown) etc. mounted on the circuit board 104 to the connector terminal 90 of the connector 66. In the front end opening 102 of the external memory 18, a rib 10 is provided at a position slightly eccentric from the widthwise center of the case of the external memory 18.
8 is formed. The off-center direction of the rib 108 is opposite to the protrusion 100 of the connector 66.

Therefore, as shown in FIG. 11A, when the external memory 18 is correctly inserted, the ribs 108 do not touch the protrusions 100, and the external memory 18 has the connector electrodes 106 aligned with the contacts 9 of the connector terminals 90.
It can be inserted until reaching 0c. however,
As shown in FIG. 11B, when the external memory 18 is inserted upside down, the rib 108 and the protrusion 100 are on the same side with respect to the widthwise center of the case, and the rib 108 comes into contact with the protrusion 100. Therefore, the external memory 18 can no longer be inserted, thereby preventing the external memory 18 from being inserted upside down.

Note that, as shown by dotted lines in FIG. 7 or 10, contacts 90c at both ends of the connector terminals 90 are located slightly above the remaining contacts shown by solid lines. Then, the connector electrode 10 of the circuit board 104 of the external memory 18 shown in FIG.
Power supply Vcc and ground (GND) on both ends of 6.
be connected. Then, when the tray 14 is pushed down from the state shown in FIG.
0 contact 90c, and then the remaining connector electrodes contact the remaining connector terminals.

In this way, when loading the external memory 18 and connecting the connector electrode 106 to the connector terminal 80, first connect the power supply Vcc and ground, and then connect the other signal lines. Latch-up and the resulting destruction of circuit components such as semiconductor memory devices can be prevented. That is, in the structure in which the tray 14 is rotated to press-connect the contacts 90c of the connector terminals 80 to the connector electrodes 106 as described above, since the connector electrodes 106 are formed on the same plane, the positions of the contacts 90c may be changed. Otherwise, the order in which the connector electrodes and contacts 90c are connected cannot be defined.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of an adapter including a loading device in which a connector according to an embodiment of the present invention is used. Fig. 2 is an illustrative view showing the loading device of Fig. 1, in which Fig. 2A is a plan view, Fig. 2B is a left side view, Fig. 2C is a front view, and Fig. 2D is a right side view. , and FIG. 2E shows a bottom view. FIG. 3 is an enlarged illustrative view of the main parts of the loading device, showing the attachment portion between the tray and the cover and the frame. Figure 4 is the second
FIG. 3 is a partially cutaway front view showing the tray and cover in the illustrated embodiment in an open state; FIG. 5 is an illustrative diagram for explaining the difference between the reversing spring and the maximum open state of the tray and cover due to it,
FIG. 5A shows the respective fully open state, FIG. 5B shows the neutral point state of the reversing spring, and FIG. 5C shows the respective closed state. FIG. 6 is a partial circuit diagram showing an example of the connection mode of the switch. FIG. 7 is an illustrative cross-sectional view showing an embodiment of this invention broken down into a lower piece and an upper piece. Fig. 8 is an illustrative view showing the lower piece of this embodiment, Fig. 8A is a front view, Fig. 8B is a top view, Fig. 8C is a bottom view, Fig. 8D is a right side view, and Fig. 8D is a right side view. 8E is a cross-sectional view taken along line E--E of FIG. 8A, and FIG. 8F is a cross-sectional view taken along line F-- of FIG. 8A.
A cross-sectional view at F is shown. Figure 9 is an illustrative view showing the upper piece of this embodiment; Figure 9A is a front view, Figure 9B is a partially cutaway plan view, Figure 9C is a bottom view, and Figure 9D is a right side view. FIG. 9E shows a rear view. FIG. 10 is an illustrative cross-sectional view showing a state in which the lower piece and the upper piece of the embodiment are integrated and mounted on a circuit board. FIG. 11 is an illustrative view showing that the external memory can be prevented from being inserted upside down by the cooperation between the external memory and the connector. FIG. 11A shows the case of normal insertion, and FIG. Indicates when inserted in the correct orientation. In the figure, 10 is a loading device, 18 is an external memory, 66 is a connector, 68 is a lower piece,
70 is an upper piece, 90 is a connector terminal, and 104 is a connector electrode.

Claims (1)

[Claims for Utility Model Registration] 1. A connector for electrically connecting an external memory to a circuit board through a large number of connector terminals, the connector having one end fixedly connected to the circuit board and the other end extending therefrom. a first piece that supports a first terminal, and one end that is removably integrally attached to the first piece and is pressed into contact with the other end of the first terminal, and the external memory. a second piece supporting a second terminal having the other end pressed against a connector electrode of the connector. 2 the first piece includes a base;
The other end of the terminal is disposed on the main surface of the base, the second piece has an opening that fits into the base of the first piece, and the one end of the second terminal is disposed on the inner wall of the opening, and when the base of the first piece is fitted into the opening, the other end of the first terminal and the one end of the second terminal are pressed into contact within the opening. The connector according to claim 1 of the utility model registration claim, which is connected to the connector. 3. The second piece has a second opening opened in a direction substantially perpendicular to the opening, the other end of the second terminal is exposed to the second opening, and the second 3. The connector according to claim 2, wherein the connector electrode is press-connected to the other end of the second terminal when the external memory is inserted into the opening of the connector.