JPH0453001Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention integrates a light-emitting or light-receiving element and an integrated circuit element for processing signals converted into light or electricity by the element. ease of assembly, economical effects,
This invention relates to an optical transceiver module with improved reliability.

[Conventional technology]

A well-known optical transceiver module that converts an electrical signal into an optical signal or converts an optical signal into an electrical signal and outputs the signal is a signal processing module that includes an integrated circuit element (IC) 2 on a printed circuit board 1, as shown in FIG. The circuit 3 and the light emitting or light receiving element 4 are mounted separately, and the substrate 1
An optical fiber connector 5 to the element 4 is attached to one side of the
Most of the structures have a structure in which a plate 6 with a mark 6 is fixed, and a light-shielding case 7 separate from the plate encloses the element mounting part.

[Problem that the invention attempts to solve]

However, the optical transmitting/receiving module having such a structure requires a lot of effort to assemble due to the large number of parts, which is disadvantageous in terms of cost and also increases in external dimensions.

Furthermore, since there are many soldered parts for each component, there is also a problem in reliability in terms of performance.

[Means for solving problems]

In order to eliminate the above-mentioned problem, this invention has a plurality of first circuit boards on the edge of the base instead of a printed circuit board.
A main frame in which a lead pin and one die bonding part are bent at right angles to the base and in mutually opposite directions, and a plurality of main frames which are independent from this frame and whose tips are bent in the same direction as the first lead pin. A signal processing integrated circuit element (so-called hybrid IC) that uses a lead frame consisting of two lead pins and has a light emitting or light receiving element integrated on one side of the die bonding part of the frame.
This element is also bonded to the main frame and the second frame.
The lead pins are electrically connected to each other via wire bonding parts, and the lead frame after mounting the element is connected to the optical fiber on the optical axis of the light emitting or light receiving element, except for a part of the first and second lead pins. It is covered and held by a package with a connecting connector.

In this way, since the integrated circuit element, the light emitting or light receiving element, the connector and the package are integrally molded, the number of parts is reduced and the mounting and assembly time is shortened.

Furthermore, for the same reason, the entire module can be made smaller and lower in cost.Furthermore, as the number of parts is reduced, the number of soldering parts is also reduced, which improves reliability in terms of performance.

〔Example〕

An embodiment of this invention is shown in the attached FIGS. 1 to 3.

The lead frame 10 of the exemplary module is stamped into the shape of FIG. 3 in the deployed state. Reference numeral 11 in the figure indicates a main frame having a die-bonding portion 13 on one end of the base 12, and first lead pins 15 connected to the connecting frame 14 on both side edges of the base, and 16 indicates the connecting frame 14. This is a second lead pin arranged in parallel with each lead pin 15, and the lead frame 10 is constituted by both of them. Then, before covering the frame with the package 17 shown in FIG.
Then, the first and second lead pins 15 and 16 are bent 90 degrees downward. FIG. 1 shows the frame after this molding.

On the other hand, it is preferable that the die bonding portion and the first and second lead pins 1 are provided on one surface of the die bonding portion 13.
5, 16 before bending the light emitting or light receiving element 1.
8 integrated signal processing integrated circuit elements 19
This element 19 and the main frame 1 are then glued together.
The first and second lead pins 16 are electrically connected by a bond wire 20.

The package 17 has a connector 21 for connecting an optical fiber on the optical axis of the element 18 mounted on a lead frame, and is made by fusing or gluing two halves of a synthetic resin case. Transfer mold and cover. After this, the third
When the connecting frame shown in the figure is removed, the optical transceiver module shown in FIG. 2 is completed.

Note that a capacitor, an amplifying coil, etc. may be mounted on the base 12 of the lead frame. Also,
If necessary, the length of the base can be increased, and in addition to the above capacitors, an integrated circuit element for optical communication having functions different from those of the element 19, such as a parallel-to-serial mutual conversion function and an arithmetic function, can be mounted. It's fine.

Furthermore, the connector 21 may be of the so-called screw lock type as shown in the figure, in which the connector on the optical fiber side is received and screwed together, or may be of the bayonet connection type, or an elastic claw provided on one of the male and female connectors that connects the connector with the other. Any known method may be used, such as a claw lock method in which the connector is locked in a recess in the connector.

Furthermore, a condenser lens 22 formed of transparent resin or glass is disposed on the light emitting or light receiving element 18.
(Fig. 2) may be attached.

〔effect〕

As described above, according to this invention, an optical transmitter/receiver module is constructed by bonding an integrated circuit element for signal processing with an integrated light-emitting or light-receiving element to the die-bonding part provided on the lead frame, and connecting this element and the main body of the lead frame. Since the frame and the second lead pin are wire-bonded and the lead frame except for a part of the lead pins is covered and held by a package with a connector, the number of parts constituting the photoelectric conversion circuit is reduced, and the connector The package and the package can be integrally molded, so the mounting and assembly time can be shortened.

In addition, since the number of parts is small, reliability is increased, and at the same time miniaturization and cost reduction can be realized.

[Brief explanation of drawings]

Fig. 1 is a perspective view of an embodiment of this invention with the package removed, Fig. 2 is a perspective view of the completed product with the package provided, Fig. 3 is an exploded view of the lead frame, and Fig. 4 is a conventional FIG. 2 is a perspective view of an optical transceiver module of FIG. 10... Lead frame, 11... Main frame, 12... Base, 13... Die bonding part, 1
5... First lead pin, 16... Second lead pin, 17... Package, 18... Light emitting or light receiving element, 19... Integrated circuit element, 20... Bond wire, 21... Connector, 22... Light gathering lens.

Claims (1)

[Claims for Utility Model Registration] (1) A plurality of first lead pins and one
The two die-bond parts are bent at right angles to the base and in mutually opposite directions, and the main frame is connected to the main frame.
A plurality of second pins bent in the same direction as the lead pin
A lead frame consisting of a lead pin,
A signal processing integrated circuit element integrated with a light emitting or light receiving element adhered to one surface of the die bonding part, a wire bonding part electrically connecting this element to the main frame and the second lead pin, and the light emitting or light receiving element 1. An optical transceiver module comprising an optical fiber connector on the optical axis of the module, and a package that covers and holds a lead frame on which an element is mounted except for a portion of the first and second lead pins. (2) The optical transmitting/receiving module according to claim (1) of the utility model registration, characterized in that a condensing lens is attached to the light emitting or light receiving element. (3) A utility model characterized in that an integrated circuit element for optical communication having a function different from the integrated circuit element, a capacitor, an amplification coil, etc. is mounted on the base of the main frame. An optical transmitting/receiving module as set forth in claim (1) or (2) of the registered claims.