JPH0453013B2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an information carrier disk (hereinafter simply referred to as a disk) made by bonding two disk-shaped substrates including at least one disk-shaped substrate having an information medium layer.
The present invention relates to a manufacturing method.

Conventional technology Conventionally, an information medium layer has been provided on a transparent substrate, such as an unrecorded recording medium layer on one side of a disc-shaped transparent substrate, or a reflective layer formed on uneven pits on which predetermined information signals have been recorded. using a disc substrate with the information medium layer facing each other, or simply bonding a protective substrate so as to face the information medium layer,
For example, optical discs on which information is recorded and reproduced using laser light, video discs for reproduction only, and the like have been put into practical use. The method of bonding these two disc-shaped substrates together is to sandwich a viscous adhesive between the two substrates and, while rotating the two substrates, apply the adhesive to the entire surface between the two substrates. Although no method has been proposed for uniformly filling and bonding, the bonding method previously devised by the inventors had a configuration as shown in FIG.

That is, a disk-shaped disk substrate 2 having a recording medium layer 1 formed on one side is passed through a center bossk to a rotary tool 6 having a groove 3 for vacuum suction and a ventilation hole 4 and having a shaft 5 on the center of rotation. Fix it. Next, a viscous adhesive 8 is applied concentrically with the center boss 7, and the protective substrate 9 is stacked and left until the adhesive 8 comes into contact with the entire circumference of the center boss 7 due to the weight of the protective substrate 9. After filling the entire surface of the substrates with the adhesive 8 by rotating the two substrates and shaking off the excess adhesive, the adhesive is applied while rotating at a speed slower than the rotation speed at which the two substrates are rotated. It is now possible to cure the material and then bond it together.

Problems to be Solved by the Invention However, when the two substrates are rotated and the excess adhesive is shaken off, excess adhesive 11 has accumulated on the outer peripheral edge 10 of the disk, and the adhesive 11 remains as it hardens. When the adhesive 11 is applied to the outer peripheral edge 10 of the disk,
The adhesive will protrude irregularly, so by curing the adhesive while rotating at a speed sufficiently lower than the rotation speed when filling and shaking off the adhesive,
The adhesive 11 is evened out to obtain a smooth cured state, but since the adhesive 11 is cured while protruding from the outer peripheral edge 10 of the disk, the outer shape of the disk is different from the outer shape of the two substrates. It's going to be bigger. For this reason, for example, if the disk is placed in a case such as a disk cartridge, or if the adhesive protrudes outward and becomes a problem, it is necessary to finish the external shape of the disk after pasting the two boards together. It was hot.

The present invention aims to provide a manufacturing method that does not require post-processing of the outer shape even when the outer shape and appearance of the disk are in question.

Means for Solving the Problems In order to solve the above-mentioned problems, the excess adhesive on the outer circumferential edge of the disk is removed by suction before the adhesive protruding onto the outer circumferential edge of the disk is cured.

Effect: After rotating the two substrates and uniformly filling the entire surface with the viscous adhesive between the substrates,
While rotating the two substrates at a slower speed than the rotation that fills the entire surface with the adhesive, a suction nozzle is brought into contact with the adhesive that has accumulated on the outer edges to suction the two substrates, allowing them to be bonded together without any adhesive protruding from the outer edges. It is something that can be done.

As a result, the outer diameter of the disk is almost the same as the outer diameter of the two substrates, and since finishing processing such as external shaping is required, low-cost bonding is possible.

Embodiment Hereinafter, an embodiment of the present invention will be described based on the drawings. In FIG. 1, the recording medium layer 1, disk substrate 2, vacuum suction groove 3, ventilation hole 4, shaft 5, rotating tool 6, center boss 7, adhesive 8, and protective substrate 9 are the same as in the conventional example shown in FIG. They are shown with the same number in the configuration. FIG. 2 is a plan view showing the suction state in FIG. 1. In FIGS. 1 and 2, 12 is a suction nozzle, which is composed of a pipe whose tip is constricted on the side that contacts the outer peripheral edge of the disk.As shown in FIG. The shape is an elongated ellipse, the length of which is longer than the thickness of the two substrates, and the tip of the suction nozzle 12 is flat. Furthermore, since the suction nozzle 12 is constructed of a thin pipe, the thickness of the suction nozzle 12 is even thinner than the width of the opening 13. This is important to prevent the adhesive from wrapping around the disk surface during blotting.

In other words, as shown in Figure 2, the disk is indicated by arrow 1.
When suctioning is performed by rotating in the direction 4, the excess adhesive 15 on the outer peripheral edge of the disk is scraped off at the end of the suction nozzle 12 on the side 16 that contacts the adhesive, and then the excess adhesive 15 is removed from the opening. By blotting from step 13, more reliable blotting becomes possible; however, if the time from blotting off the excess adhesive 15 to blotting takes longer, the scraped excess adhesive 15 may be deposited on the disk surface. The tip of the suction nozzle 12 needs to be as thin as possible because the suction nozzle 12 wraps around the inside of the body. Note that the suction nozzle 12 can be easily brought into contact with the outer peripheral edge of the disk by, for example, pressing it with a spring.

Next, a method for bonding two disc-shaped substrates together by removing excess adhesive using the suction nozzle 12 will be described with reference to FIGS. 1 to 5. First, as shown in FIG. 4, insert the center boss into the shaft 5 of the rotating tool 6, place the disk substrate 2 with the recording medium layer 1 facing up, and pass the disk substrate 2 through the groove 3 and ventilation hole 4 of the rotating tool 6. Vacuum adsorption. The rotating tool 6 is rotated around the shaft 5 while this vacuum suction is being performed, but this can be easily done by using a motor and a rotating joint (not shown) as is commonly done. It is something that can be done. Next, an ultraviolet polymerized adhesive 8 is applied to the disk substrate 2, and the protective substrate 9 is brought into contact with the entire circumference of the adhesive 8. If the protective board 9 is left alone in this state, the weight of the protective board 9 will cause
As shown in FIG. 5, the adhesive 8 spreads toward the inner and outer circumferences of the disc-shaped substrate. At this time, it is also possible to apply appropriate pressure to the protective substrate 9.

As shown in FIG. 5, after the adhesive 8 has spread and the inner circumferential side of the adhesive 8 is in contact with the entire circumference of the center boss 7, the two substrates are rotated around the axis 5 of the rotating tool 6. As a result, the adhesive 8 spreads toward the outer peripheral edge of the disk due to centrifugal force, and the adhesive overflowing from the outer peripheral edge is scattered by centrifugal force as shown in the conventional example in FIG. Therefore, it does not wrap around the disk surface. After rotating the disk at this time, the rotation time is important in order to obtain an adhesive layer with a uniform thickness or to fill the entire surface of the disk.
This condition depends on the viscosity of the adhesive, but specifically, the adhesive is 1000CP to 2000CP (25℃)
When using a viscosity of 300~
A predetermined adhesive layer thickness could be obtained at 1000 rpm and a rotation time of 30 to 90 seconds, and the adhesive could be uniformly filled over the entire surface between the two substrates. Next, as shown in FIGS. 1 and 2, the suction nozzle 12 is brought into contact with the suction nozzle 12 while rotating at a rotation speed sufficiently lower than the rotation speed at which the adhesive is filled, and the adhesive overflows to the outer peripheral edge of the disk and is scattered by centrifugal force. After removing the unused excess adhesive 15, by irradiating ultraviolet rays from the direction of arrow 16, bonding can be carried out in a short time.

Effects of the Invention When the present invention fully adheres two disc-shaped substrates with a viscous adhesive, the excess adhesive overflowing to the outer edge is sucked while rotating the two disc-shaped substrates before curing the excess adhesive. By sucking up excess adhesive while keeping the nozzle in contact with the outer periphery, it is possible to bond without excess adhesive protruding from the outer periphery, and the outer diameter of the disk is the same as the outer diameter of the two substrates. This makes it possible to perform low-cost bonding without the need for finishing processes such as external shaping.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an apparatus in which the method for manufacturing an information carrier disk of the present invention is carried out, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a front view of the tip of the suction nozzle of the same apparatus, and FIG. 5 is a sectional view of an apparatus showing the method of manufacturing an information carrier disk of the present invention, and FIG. 6 is a sectional view of an apparatus implementing the conventional method of manufacturing an information carrier disk. 2...Disk substrate, 6...Rotating tool, 8...Adhesive, 9...Protection board, 12...Suction nozzle.

Claims (1)

[Claims] 1. A viscous adhesive is sandwiched between two disk-shaped substrates, and the adhesive is applied between the two substrates while rotating the two substrates around their center holes. filling, then rotating the two substrates at a rotation speed slower than the rotation speed of the two substrates at the time of filling,
A method for manufacturing an information carrier disk in which excess adhesive is removed by bringing a suction nozzle into contact with the outer peripheral edges of the two substrates. 2. The method of manufacturing an information carrier disk according to claim 1, wherein the suction nozzle has a substantially flat tip and an opening formed of a thin pipe having an elongated rectangular or elliptical shape.