JPH0453023Y2 - - Google Patents

Info

Publication number
JPH0453023Y2
JPH0453023Y2 JP9235987U JP9235987U JPH0453023Y2 JP H0453023 Y2 JPH0453023 Y2 JP H0453023Y2 JP 9235987 U JP9235987 U JP 9235987U JP 9235987 U JP9235987 U JP 9235987U JP H0453023 Y2 JPH0453023 Y2 JP H0453023Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
liquid
spray
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9235987U
Other languages
Japanese (ja)
Other versions
JPS63201374U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9235987U priority Critical patent/JPH0453023Y2/ja
Publication of JPS63201374U publication Critical patent/JPS63201374U/ja
Application granted granted Critical
Publication of JPH0453023Y2 publication Critical patent/JPH0453023Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Physical Or Chemical Processes And Apparatus (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 [産業上の利用分野] 本考案はプリント基板に現像液やエツチング液
等を噴き付けて現像やエツチング等の液体処理を
行う装置の液はけ性の改良に関するものである。
[Detailed description of the invention] [Industrial application field] The present invention relates to improving the liquid repellency of a device that performs liquid processing such as development and etching by spraying a developer, etching liquid, etc. onto a printed circuit board. be.

[従来の技術] 従来、このような装置として、例えば第5図に
示すものがあつた。この装置はプリント基板の現
像、エツチング及び水洗いを行う装置である。
[Prior Art] Conventionally, as such a device, there has been one shown in FIG. 5, for example. This device is a device for developing, etching, and washing printed circuit boards.

図で、1はプリント基板2をA方向に搬送する
チエーン式の基板搬送手段であり、回転駆動する
ギア3と、ギア3が掛けられたチエーン4と、プ
リント基板2の搬送路に沿つて配置されていてチ
エーン4を介して伝達されるギア3の動力で回転
してプリント基板2を搬送する摩擦ローラ5から
なる。
In the figure, 1 is a chain-type board transport means for transporting the printed circuit board 2 in the A direction, and a gear 3 that rotates, a chain 4 on which the gear 3 is attached, and a chain-type board transport means arranged along the transport path of the printed circuit board 2. The friction roller 5 rotates with the power of a gear 3 and conveys the printed circuit board 2 through a chain 4.

6は現像部、7はエツチング部、8は水洗部で
あり、それぞれには送られてくるプリント基板2
の上側と下側に配置されたスプレー噴射器61,
71,81と62,72,82が設けられてい
る。
6 is a developing section, 7 is an etching section, and 8 is a washing section, each of which receives printed circuit boards 2 that are sent.
Spray injectors 61 arranged on the upper and lower sides of the
71, 81 and 62, 72, 82 are provided.

現像部6、エツチング部7及び水洗部8では、
上側と下側に配置されたスプレー噴射器でプリン
ト基板2の上面と下面に現像液、エツチング液及
び水を噴き付けて、現像、エツチング及び水洗い
を行う。
In the developing section 6, etching section 7 and washing section 8,
A developing solution, an etching solution, and water are sprayed onto the upper and lower surfaces of the printed circuit board 2 using spray injectors placed on the upper and lower sides, thereby performing development, etching, and water washing.

[考案が解決しようとする問題点] このような装置では、送られてくるプリント基
板の姿勢が変わらないため、第6図に示すよう
に、プリント基板上面の中央部に現像液やエツチ
ング液がわずかながら滞留する。この滞留部分2
1は、基板の下面や上面の液はけのよいところに
比べて現像不良やエツチング不良になり、パター
ン形成の品質にばらつきが生じるという問題点が
あつた。
[Problems to be solved by the invention] In such a device, the orientation of the printed circuit board that is sent does not change, so as shown in Figure 6, the developer or etching solution is not deposited in the center of the top surface of the printed circuit board. It stays a little. This retention part 2
No. 1 had a problem in that compared to the lower and upper surfaces of the substrate where the liquid drains well, poor development and etching occur, resulting in variations in the quality of pattern formation.

本考案はこのような問題点を解決するためにな
されたものであり、プリント基板に噴射した液体
の液はけ性が良好なプリント基板の液体処理装置
を実現することを目的とする。
The present invention has been made to solve these problems, and an object of the present invention is to realize a liquid treatment device for a printed circuit board that has good liquid repellency for the liquid sprayed onto the printed circuit board.

[問題点を解決するための手段] 本考案は、 一定方向に送られるプリント基板の上側と下側
にスプレー噴射器を配置し、これらのスプレー噴
射器でプリント基板に液体を噴射し、プリント基
板を液体処理する装置において、 前記プリント基板を回転自由に支持する基板支
持手段と、 前記上側と下側のスプレー噴射器を互いに逆方
向に移動させ、プリント基板の回転の支点よりも
一端側にある上面と他端側にある下面に液体を噴
射してプリント基板をローリングさせ、基板上に
滞留した液体を流し落とす噴射器移動手段、 を具備したことを特徴とするプリント基板の液体
処理装置である。
[Means for solving the problem] The present invention places spray injectors above and below the printed circuit board that is fed in a fixed direction, and these spray injectors inject liquid onto the printed circuit board. In an apparatus for liquid processing, the substrate supporting means rotatably supports the printed circuit board, and the upper and lower spray injectors are moved in opposite directions to each other so as to be located on one end side of the rotational fulcrum of the printed circuit board. A liquid processing device for a printed circuit board, comprising: an injector moving means that injects liquid onto the upper surface and the lower surface at the other end to roll the printed circuit board and flush away the liquid accumulated on the board. .

[実施例] 以下、図面により本考案を説明する。[Example] The present invention will be explained below with reference to the drawings.

第1図は本考案にかかるプリント基板の液体処
理装置の一実施例の要部構成図である。この図で
はエツチング部の構成を示している。第1図で、
第5図と同一のものは同一符号を付ける。
FIG. 1 is a diagram illustrating a main part of an embodiment of a liquid processing apparatus for a printed circuit board according to the present invention. This figure shows the structure of the etching section. In Figure 1,
Components that are the same as those in FIG. 5 are given the same reference numerals.

第1図で、9は基板支持手段としての固定治具
であり、第2図に示すように、プリント基板2を
収納するフレーム91、フレーム91の両辺に設
けられた軸92,93からなる。固定治具9は、
基板搬送手段の搬送部に軸92,93を支点とし
て回転自由に支持されている。支持状態を第3図
に示す。
In FIG. 1, reference numeral 9 denotes a fixing jig as a board supporting means, and as shown in FIG. 2, it consists of a frame 91 for housing the printed circuit board 2, and shafts 92 and 93 provided on both sides of the frame 91. The fixing jig 9 is
It is rotatably supported by the transport section of the substrate transport means with shafts 92 and 93 as fulcrums. The supported state is shown in FIG.

第3図で、41,42はプリント基板の送り方
向(A方向)に移動する搬送部である。軸92,
93は搬送部41,42に設けられた軸支持部4
3,44内に支持され、これによつて固定治具9
は搬送部41,42に回転自由に支持されてい
る。搬送部41,42は第1図の紙面と直交する
方向に移動する。搬送部41,42の移動は、例
えば、回転駆動するローラの動力をベルトで搬送
部に与えたり、回転駆動するギアの動力をチエー
ンで搬送部に与えること等によつて行う。
In FIG. 3, reference numerals 41 and 42 are conveyance units that move in the direction of feeding the printed circuit board (direction A). shaft 92,
Reference numeral 93 indicates the shaft support portion 4 provided in the conveyance portions 41 and 42.
3, 44, whereby the fixing jig 9
are rotatably supported by the transport sections 41 and 42. The conveyance units 41 and 42 move in a direction perpendicular to the paper plane of FIG. The conveyance units 41 and 42 are moved, for example, by applying power to rotationally driven rollers to the conveyance unit using a belt, or by applying power to rotationally driven gears to the conveyance unit through a chain.

再び第1図にもどり、73,74はスプレー噴
射器71,72が複数個取付けられたスプレーユ
ニツト、75,76はスプレーユニツト73,7
4をB−B′方向に揺動させる噴射器移動手段で
ある。これらの移動手段は、例えばスプレーユニ
ツト73がB方向に移動させられたときは、スプ
レーユニツト74はB′方向に移動させるという
ように、スプレー噴射器71と72を互いに逆方
向に移動させる。
Returning to FIG. 1 again, 73 and 74 are spray units to which a plurality of spray injectors 71 and 72 are attached, and 75 and 76 are spray units 73 and 7.
4 in the BB' direction. These moving means move the spray injectors 71 and 72 in opposite directions, for example, when spray unit 73 is moved in direction B, spray unit 74 is moved in direction B'.

次に、このような装置の動作を説明する。 Next, the operation of such a device will be explained.

第2図は第1図の装置の動作手順を示したフロ
ーチヤートである。
FIG. 2 is a flowchart showing the operating procedure of the apparatus shown in FIG.

第2図で、先ずプリント基板2を固定治具9に
セツトする。
In FIG. 2, first, the printed circuit board 2 is set on the fixture 9.

次に、セツトした基板を搬送部41,42で送
つて上側のスプレー噴射器71と下側の噴射器7
2の間に配置する。
Next, the set substrate is sent by the conveyors 41 and 42 to the upper spray injector 71 and the lower injector 7.
Place it between 2.

ここで、上下スプレー噴射器71と72の噴射
を開始する。
Here, the upper and lower spray injectors 71 and 72 start spraying.

その後、スプレーユニツト73と74を、互い
に逆方向に水平揺動させ始める。この水平揺動
は、スプレーユニツト73と74の一方をB方向
に他方をB′方向に移動させた後、今度は一方を
B′方向に他方をB方向に移動させる これによつて、軸92,93(支点)よりも一
端側にあるプリント基板2の上面と他端側にある
プリント基板2の下面にエツチング液が噴射さ
れ、その後一端側にあるプリント基板2の下面と
他端側にあるプリント基板2の上面にエツチング
液が噴射される。そして、このような噴射が交互
に繰り返される。
Thereafter, the spray units 73 and 74 begin to be horizontally oscillated in opposite directions. This horizontal swing moves one of the spray units 73 and 74 in the B direction and the other in the B' direction, and then one of the spray units 73 and 74 is moved in the B' direction.
Move the other one in the direction B' and the other in the direction B. As a result, the etching liquid is sprayed onto the top surface of the printed circuit board 2 on one end side of the shafts 92 and 93 (fulcrum) and the bottom surface of the printed circuit board 2 on the other end side. After that, an etching liquid is sprayed onto the lower surface of the printed circuit board 2 at one end and the upper surface of the printed circuit board 2 at the other end. Then, such injection is repeated alternately.

液の噴射力により、プリント基板2は固定治具
9ごとに第1図の実線と破線に示すようにC−
C′方向にローリングする。このように基板がロー
リングするように噴射器により加える噴射力を偏
心圧力とする。
Due to the jet force of the liquid, the printed circuit board 2 is moved to C- for each fixing jig 9 as shown by the solid line and broken line in FIG.
Roll in the C′ direction. The injection force applied by the injector to cause the substrate to roll in this manner is referred to as eccentric pressure.

このローリングにより、プリント基板2に噴き
付けられたエツチング液は基板から流れ落ち、基
板上における液の滞留は防止される。
This rolling causes the etching liquid sprayed onto the printed circuit board 2 to flow down from the substrate, thereby preventing the liquid from remaining on the substrate.

なお、第4図で、スプレー噴射器の噴射開始
と、スプレーユニツトの水平揺動の開始は同時に
行つても第4図に示す順序と逆に行つてもよい。
In FIG. 4, the start of spraying from the spray injector and the start of horizontal swinging of the spray unit may be performed at the same time or in the reverse order as shown in FIG.

また、第1図に示す構成は、実施例で挙げたエ
ツチング部に限らず、現像部、水洗部、エツチン
グ後に残つたレジストを除去するレジスト剥離部
に適用してもよい。更に、スプレー噴射器により
プリント基板に各種の薬液処理例えば脱脂、酸洗
い、中和処理等を行う装置に適用してもよい。
Furthermore, the configuration shown in FIG. 1 may be applied not only to the etching section mentioned in the embodiment, but also to a developing section, a washing section, and a resist stripping section for removing resist remaining after etching. Furthermore, the present invention may be applied to an apparatus that performs various chemical treatments such as degreasing, pickling, and neutralization treatments on printed circuit boards using a spray injector.

また、搬送部41,42の移動方向は第1図の
紙面に直交する方向に限らず、スプレー噴射器の
揺動方向と同一方向であつてもよい。
Furthermore, the moving direction of the conveyance units 41 and 42 is not limited to the direction perpendicular to the paper plane of FIG. 1, but may be the same direction as the swinging direction of the spray injector.

[効果] 本考案によれば、スプレー噴射器の偏心圧力に
よりプリント基板がローリングするため、基板に
噴き付けられた液体は基板上に滞留せず液はけ性
が著しく向上する。これによつて、現像やエツチ
ング等の不良が大幅に解消され、品質を向上でき
る。
[Effects] According to the present invention, since the printed circuit board is rolled by the eccentric pressure of the spray injector, the liquid sprayed on the circuit board does not stay on the circuit board, and the liquid drainage property is significantly improved. This greatly eliminates defects in development, etching, etc., and improves quality.

また、本考案にかかる装置では、基板上に滞留
した液体を除去する工程を別個に設ける必要がな
いことから、化学処理や水洗いの工程に用いるこ
とによつて処理時間が大幅に短縮される。
In addition, since the apparatus according to the present invention does not require a separate process for removing liquid accumulated on the substrate, processing time can be significantly shortened by using the apparatus in chemical treatment or water washing processes.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案にかかるプリント基板の液体処
理装置の一実施例の要部構成図、第2図は第1図
の装置の基板支持手段の構成図、第3図は第3図
の基板支持手段の支持状態を示した図、第4図は
第1図の装置の動作説明図、第5図は従来におけ
るプリント基板の液体処理装置の一例の構成図、
第6図は第5図の装置で処理したプリント基板の
状態を示した図である。 2……プリント基板、41,42……搬送部、
6……現像部、7……エツチング部、8……水洗
部、61,62,71,72,81,82……ス
プレー噴射器、9……基板支持手段、92,93
……軸。
FIG. 1 is a block diagram of essential parts of an embodiment of a liquid processing device for printed circuit boards according to the present invention, FIG. 2 is a block diagram of a substrate support means of the device shown in FIG. 1, and FIG. 3 is a block diagram of the substrate of FIG. 4 is an explanatory diagram of the operation of the device shown in FIG. 1; FIG. 5 is a diagram showing the configuration of an example of a conventional liquid processing device for printed circuit boards;
FIG. 6 is a diagram showing the state of a printed circuit board processed by the apparatus shown in FIG. 2...Printed circuit board, 41, 42...Transportation section,
6... Developing section, 7... Etching section, 8... Washing section, 61, 62, 71, 72, 81, 82... Spray injector, 9... Substrate supporting means, 92, 93
……shaft.

Claims (1)

【実用新案登録請求の範囲】 一定方向に送られるプリント基板の上側と下側
にスプレー噴射器を配置し、これらのスプレー噴
射器でプリント基板に液体を噴射し、プリント基
板を液体処理する装置において、 前記プリント基板を回転自由に支持する基板支
持手段と、 前記上側と下側のスプレー噴射器を互いに逆方
向に移動させ、プリント基板の回転の支点よりも
一端側にある上面と他端側にある下面に液体を噴
射してプリント基板をローリングさせ、基板上に
滞留した液体を流し落とす噴射器移動手段、 を具備したことを特徴とするプリント基板の液体
処理装置。
[Scope of Utility Model Registration Claim] In a device that treats a printed circuit board with liquid by disposing spray injectors above and below a printed circuit board that is fed in a certain direction, and spraying a liquid onto the printed circuit board with these spray injectors. , board support means for freely supporting the printed circuit board; and the upper and lower spray injectors are moved in opposite directions to the upper surface and the other end of the printed circuit board at one end and the other end relative to a rotational fulcrum of the printed circuit board, respectively. A liquid processing device for a printed circuit board, comprising: an injector moving means for rolling the printed circuit board by jetting a liquid onto a certain lower surface, and washing off the liquid accumulated on the board.
JP9235987U 1987-06-16 1987-06-16 Expired JPH0453023Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9235987U JPH0453023Y2 (en) 1987-06-16 1987-06-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9235987U JPH0453023Y2 (en) 1987-06-16 1987-06-16

Publications (2)

Publication Number Publication Date
JPS63201374U JPS63201374U (en) 1988-12-26
JPH0453023Y2 true JPH0453023Y2 (en) 1992-12-14

Family

ID=30953997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9235987U Expired JPH0453023Y2 (en) 1987-06-16 1987-06-16

Country Status (1)

Country Link
JP (1) JPH0453023Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140934A (en) * 2012-01-04 2013-07-18 Samsung Electro-Mechanics Co Ltd Vertical transfer jig and wet processing apparatus using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140934A (en) * 2012-01-04 2013-07-18 Samsung Electro-Mechanics Co Ltd Vertical transfer jig and wet processing apparatus using the same

Also Published As

Publication number Publication date
JPS63201374U (en) 1988-12-26

Similar Documents

Publication Publication Date Title
KR20080010307A (en) Substrate processing equipment
TW200903624A (en) Apparatus for treating substrates
KR100871893B1 (en) Transfer device of printed circuit board and printed circuit board used therefor
JP4602567B2 (en) Substrate cleaning device
JPH08244930A (en) Substrate transfer device
TWI254341B (en) An inclined liquid-draining device
KR20080009645A (en) Substrate processing equipment
JP2002273354A (en) Substrate processing apparatus and processing method using chemical liquid
KR20070084294A (en) Substrate processing apparatus, conveying apparatus and processing method
JP3230030U (en) Liquid homogenization processing device for printed circuit boards
JP3995044B2 (en) Substrate processing equipment
JPH11300300A (en) Substrate processing method and apparatus
JPH0451507Y2 (en)
KR100567833B1 (en) Apparatus for processing substrate
JPH06122981A (en) Surface treatment equipment
JPH07204547A (en) Liquid processing equipment for thin plate members
JPH0377276B2 (en)
KR100918165B1 (en) Substrate treatment system
JPH0649956B2 (en) Substrate surface treatment method
JP3978065B2 (en) Substrate processing apparatus and processing method
KR200173811Y1 (en) In-line type development device for photolithography process
JPH0259872B2 (en)
WO2005013342A1 (en) Resist removing apparatus
JP2506919B2 (en) Development device
JPH059164Y2 (en)