JPH0453041B2 - - Google Patents

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Publication number
JPH0453041B2
JPH0453041B2 JP59213836A JP21383684A JPH0453041B2 JP H0453041 B2 JPH0453041 B2 JP H0453041B2 JP 59213836 A JP59213836 A JP 59213836A JP 21383684 A JP21383684 A JP 21383684A JP H0453041 B2 JPH0453041 B2 JP H0453041B2
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Japan
Prior art keywords
coating
weight
parts
melting point
inorganic
Prior art date
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Expired - Lifetime
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JP59213836A
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Japanese (ja)
Other versions
JPS6193510A (en
Inventor
Ryukichi Usuki
Takeshi Yokota
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Fujikura Ltd
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Fujikura Ltd
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Priority to JP59213836A priority Critical patent/JPS6193510A/en
Publication of JPS6193510A publication Critical patent/JPS6193510A/en
Publication of JPH0453041B2 publication Critical patent/JPH0453041B2/ja
Granted legal-status Critical Current

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  • Inorganic Insulating Materials (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 この発明は、高温での電気特性の優れた無機絶
縁電線に関する。 〔従来の技術〕 従来より金属導線体上にガラス質組成物を焼き
付けた無機絶縁電線が知られている。(特公昭37
−2124号公報、特公昭39−2124号公報参照昭)こ
のような無機絶縁電線は、例えばSiO220〜50%、
PbO10〜60%、K2O10〜30%の組成のフリツト泥
漿を金属導線上に塗布し、500〜800℃で焼成し、
ガラス質の無機絶縁被膜を導体上に形成する方法
などによつて製造される。 〔発明が解決しようとする問題点〕 しかしながら、このような製造方法によつて得
られた無機絶縁電線にあつては、次のような問題
点があり、その解決が望まれている。 無機絶縁被膜がガラス質の連続被膜で形成さ
れており、かつ絶縁被膜と金属導体との熱膨張
係数に大きな差があるため、熱歪が被膜中に蓄
積され、被膜剥離を起し易い。特に、コイル巻
きした場合にはこの傾向が著るしく、通常500
℃程度の温度から20℃の室温に取り出した場合
は2〜3回のヒートシヨツクテストによつて被
膜が剥離することがある。 導体径が細くなるほど上記熱歪の蓄積度合が
大きくなり、一層被膜剥離が生じやすくなる。
このため、径0.5mm以下の導体には絶縁被膜を
形成することができなかつた。 このため、ガラス質の組成を変化させて金属
導体と絶縁被膜との熱膨張径数の差を小さくし
たり、導体への密着性を向上したりしようとす
ると、無機絶縁電線本来の特徴である高温絶縁
性が大きく低下してしまう。 〔問題点を解決するための手段〕 そこで、この発明では可撓性に優れた含鉛フリ
ツトと高温絶縁性の良好な高融点無機物を主成分
とし、これに導体との密着力向上に効果のある結
合酸化物と、上記各成分の固体粒子の沈降を防止
する水または有機溶剤に可溶な熱分解性樹脂とか
らなるスラリー状の塗覆液を金属導体上に塗覆、
焼成し、多孔質で密着性のよい絶縁被膜を形成す
ることにより、上記問題を解決するとともに固体
粒子の沈降による長時間連続製造での被膜特性の
バラツキを迎えるようにした。 この発明の無機絶縁は、導体上に、含鉛フリツ
ト35〜75重量部と、Al2O3、SiO2、MgO、TiO2
ZrO2よりなる群から選ばれた1種以上の高融点
無機物25〜65重量部と、Fe、Ni、Co、Sb、Mo
の各酸化物からなる群から選ばれた1種以上の結
合酸化物0.5〜10重量部とからなる組成物100重量
部に対し、水または有機溶剤に可溶な熱分解性樹
脂0.05〜5重量部を添加してなる塗覆液を塗覆
し、これを上記樹脂の熱分解温度以上に添加して
樹脂を熱分解して消失せしめ、さらに高温で焼成
して多孔質の絶縁幕を設けたものである。 まず、この発明で使用される含鉛フリツトとし
てはPbOとB2O3を含み、PbO含優量が50重量鵜
以上でかつフリツトの軟化溶融点が700℃以下の
ものが用いられる。このようなフリツトとして
は、例えば以下に示すような組成のものがある。 PbO 50〜85%(重量%、以下同じ) B2O3 3〜9% SiO2 1〜4% ZnO 4〜15% PbO 50〜85% B2O3 3〜9% SiO2 2〜15% Al2O3 1〜8% ZrO2またはTiO3 2〜10% PbO 50〜80% B2O3 2〜9% SiO2 1.5〜8% Al2O3 0.5〜4% ZnO 15〜28% この含鉛フリツトは、常法のごとく、上記組成
のガラス原料を一旦溶融し、水中に投入して急冷
したのち200メツシユ程度の密度に粉砕したもの
が使用される。 また、高優点無機物としてはFl2O3
SiO2MgO、TiO、TrO2の酸化物の1種以上が使
用される。この高融点無機物はいずれも融点が
1000℃以上の高融点の酸化物であり、得られる絶
縁被膜の高温絶縁性を主に担うものであり、さら
に焼成時、上記含鉛フリツトの溶融ガラス中に一
部溶け込み、ガラス自体の融点を上昇させる働き
を持つているものである。 さらに、結合酸化物としては、Fe、Ni、Co、
Sb、Moの酸化物の1種もしくは2種以上が任意
の割合で混合したものが用いられる。この結合酸
化物は、焼成時導体と反応し絶縁被膜と金属導体
との間に強固な結合層を生成し密着力を増大させ
る働きを持つもである。又これら無機物の沈降防
止及びバインダーとしての前記樹脂としては、水
または有機溶剤に可溶であり、かつ熱分解性のも
のが用いられる。このような樹脂としては、例え
ばポリエチレンオキサイド(分子量10万〜300万)
や、ポリメチルメタクリレート、メチルメタクリ
レート−n−ブチルメタクリレート共重合体、n
−ブチルメタクリレート−isoブチルメタクリレ
ート共重合体、エチルメタクルレート−メチルア
クリレート共重合体などが挙げられる。 そして、上記含鉛フリツトと高融点無機物と結
合酸化物との混合比は、含鉛フリツトが35〜75重
量部、高融点無機物が25〜65重量部、結合酸化物
が0.5〜10重量部の割合とされる。含鉛フリツト
が35重量部未満では絶縁被膜の導体への密着性、
可撓性が十分でなく、75重量部を越えると分解ガ
スの消失が難しくなり発泡したり、フクレを生じ
たりしてコイル巻きしたときフレーキングを起こ
し易くある欠点が出ると共に多孔質化が不充分と
なり、耐熱衝撃性が悪くなる。また、高融点無機
物が25重量部未満では被膜の高温絶縁性が不足
し、かつ多孔質化が達し得ず、65重量部を越える
と逆に多孔質変が進行しすぎて被膜が危くなり、
不都合を来す。さらに、結合酸化物は、含鉛フリ
ツトと孔融点無機物との混合物100重量部に対し
て0.5〜10重量部加えられる。0.5重量部未満では
絶縁被膜の導体への密着性が不足し、10重量部を
超えると密着力は十分であるが絶縁性が低下する
傾向が著しくなつて不都合である。そして、含鉛
フリツトと高融点無機物と結合酸化物との混合物
100重量部に対して上記樹脂が0.05〜5重量部添
加される。添加量が0.05重量部未満では目的とす
る固体粒子の沈降防止効果が得られず、5重量部
を越えると樹脂の分解消失に要する時間が長くな
ると共に分解ガスによるフクレや発泡を起こし易
くなる。したがつて、5重量部添加しても十分な
沈降防止効果が得られない場合や、分解ガスによ
るフクレ、発泡が生じ易い場合には前記樹脂以外
にガイロメ粘土、ベントナイト、モンモリロナイ
ト、などの無機沈降防止剤を一諸に用いてもよ
い。 また、この発明に用いられる金属導体として
は、高温での耐食性が良好なものが望ましく、例
えばニツケルクラツド銅、ステンレスクラツド
銅、ニツケルクラツド銀、ニツケル鉄クラツド
銅、クロメル、コンスタンタン、ニクロム、タン
グステン、チタン、銀−パラジウム合金などが目
的、用途に応じて選択される。また、導体の線径
は特に限定されないが、絶縁被膜が多孔質で形成
されるので熱歪が少なくすることが可能であり、
比較的小径のものにまで適用でき、最小径で0.05
mmφまでの細線が使用できる。 そして、含鉛フリツト、高融点無機物、結合酸
化物および樹脂からなるスラリー状の組成物を作
成する。具体的にはまず樹脂を水またはエステ
ル、ケトン、芳香族炭化水素など有機溶剤に溶解
し、高粘土の樹脂液を調製する。樹脂液の濃度
は、樹脂の種類と溶液としたときの粘土等によつ
て適宜決めらるが、通常は7重量%以下とされ
る。つぎに、この樹脂液に含鉛フリツト、高融点
無機物および結合酸化物を加え、撹拌するかボー
ルミルで混練して塗覆液とするか又は含鉛フリツ
ト、高融点無機物、結合酸化物と水又は有機溶剤
とからなる組成物を予めボールミルで混合粉砕し
た泥状物に前記樹脂液を添加して混合し粘度調整
した上で塗覆液とする。 このスラリー状の塗覆液の固形分は、特に限定
されないが、その粘土、固体粒子の沈降性、金属
導体への塗布厚さなど勘案し適宜決められ、通常
は55〜70重量%程度とされる。 次に、このようにして得られたスラリー状の塗
覆液を金属導体の表面に塗布し高温で焼成して被
膜を形成する。この被膜形成は、金属導体を塗覆
液中に浸漬する等の手段によつて行えば良く、又
被覆厚の調整は塗布焼成の操作を必要に応じ複数
回繰返して行い、書房の被覆厚となるようにして
もよい。 また、焼成する際にはこれに先立つて樹脂を熱
分解して消失させる。まず、樹脂の熱分解可能な
温度に保持された加熱炉に入れ、樹脂分解を加熱
して熱分解し、塗膜中より熱分解ガスとして揮散
せしめる。加熱時間は通常1〜5分程度の範囲か
ら、塗膜中の樹脂含有量、塗膜厚み等によつて決
められる。樹脂が塗膜中より消失したならば、更
に昇温し800〜1000℃の焼成温度とし、焼成を行
う。なお、焼成時間は塗膜の厚さ、導体の径、種
類、塗覆液の組成等によつて適宜決められるが、
通常1〜5分の範囲とされる。この焼成によつ
て、高融点無機物の粒子の表面に溶融した含鉛フ
リツトのガラスが付着し、このガラスが結合剤
(バインダー)となつて高有点無機物粒子どうし
が結合し、導体上に固着され多孔質の無機被膜と
なる。例えて言うならば“アワオコシ”の状態い
似たものとなる。また、焼成時結合酸化物によつ
て、金属導体表面と無機被膜との間で反応が起き
強固な結合が生成しそれにより、良好な密着性が
確保される。かくして焼成された絶縁被膜の厚み
は通常2.5〜25μm程度とされるが、無機絶縁電線
の用途によつてはこの範囲に限らず、適宜決める
ことができる。 なお、必要に応じてこの絶縁被膜上にシリコー
ン樹脂、フツ素樹脂、ウレタウン樹脂などを主体
とする樹脂被膜を形成することもできる。 〔作 用〕 このような無機絶縁電線にあつては得られる絶
縁被膜が多孔質であるので、巻線加工を行つても
絶縁被膜が金属導体から剥離することがなく、さ
らにガラス質の連続被膜ではないので熱衝撃に対
して高い抵抗力を示す。また、被膜の実質的な構
成材料が高融点の酸化物であるので高温での絶縁
性が優秀であり、焼成時に一部の高融点の酸化物
が含鉛フリツトのガラス中に固溶して、ガラス自
体の融点が高くなるから、低融点のガラスを用い
てもそのフリツトの融点以上の高温迄使用出来
る。さらに、多孔質被膜であるので、小径導体に
被覆しても熱歪の蓄積が少ないため0.05mmφ程度
の細線にも適用できる。 また、樹脂を用いて塗覆液の粘性を上げ、固形
粒子の沈降防止を図つているので、塗覆液中で固
形粒子がその比重の違いにかかわらず、均一に分
散されるため塗覆工程で塗覆の組成が変化して絶
縁被覆の特性にバラツキが生じたり、特性低下が
生じたりするこがない。このような塗覆液の粘土
を上げるために炭酸ソーダ、亜硝酸ソーダ、塩化
バリウムなどの塩基性塩類、いわゆる“トメグス
リ”を使用しているが、このような塩類を添加す
ると絶縁被膜の高温絶縁性が低下する欠点があ
る。この点、この発明では樹脂を使用し、これを
焼成時に熱分解して消失させているので被膜中に
は樹脂分が残らず、かかる不都合は生じない。 〔実施例〕 以下、実施例を示してこの発明の作用効果を明
確にする。 実施例 1 第1表に示す配合組成の混合物を、平均分子量
約100万のポリエチレンオキサイドの1重量%水
溶液に分散し、固形分60%の分散液とし、これを
ボールミルで70時間微粉砕し、固形分かすべて
10μ以下なるようにして塗覆液とした。この塗覆
液を径0.25mmのニツケルラツド銅線に塗布しつい
でこれを500〜550℃の範囲に温度コントロールし
た炉中に導入し、5分間加熱してポリエチレンオ
キサイドを熱分解して、塗膜中より消失せしめ、
ついで800〜900℃に温度コントロールした焼成炉
で3分間焼成し、厚み13μmの無機多孔質絶縁被
膜を形成した。第1表中の含鉛フリツトは先の
の組成のものを用い、高融点無機物はAl2O385重
量部、TiO215重量部からなるものを用い、結合
酸化物はCoOとNiOの等量混合物を用いた。 かくして得られた無機絶縁電線について ○イ 絶縁被膜の密着性、可撓性 ○ロ 高温絶縁特性 ○ハ 耐熱衝撃性 ○ニ 絶縁被膜の特性のバラツキ について検討した。密着性、可撓性については、
絶縁電線をその外径の10倍径にコイル巻き加工
し、絶縁被膜の剥離の有無を顕微鏡観察して評価
した。高温の絶縁性はJIS2コ撚り試料により500
℃における絶縁抵抗と絶縁破壊電圧(BDV)で
評価した。耐熱衝撃性は、20倍径のボビンに巻き
付け加工したコイルを600℃で15分間加熱後、直
ちに20℃の空気中に取り出す形のテストを繰り返
し行いコイル巻きされた線の被覆層が剥離するサ
イクル数で評価した。また、絶縁被膜の特性のバ
ラツキは、電線長100m毎に採取した合計30点の
サンブルについてそれぞれの500℃における絶縁
破壊電圧(BDV)を測定し、これらの平均値、
標準偏差を求めて評価した。結果を第1票に併せ
て示した。
[Industrial Application Field] This invention relates to an inorganic insulated wire with excellent electrical properties at high temperatures. [Prior Art] Inorganic insulated wires in which a vitreous composition is baked onto a metal conductor have been known. (Tokuko Showa 37
-2124 Publication, Japanese Patent Publication No. 39-2124 Publication (1985) Such inorganic insulated wires are made of, for example, 20 to 50% SiO 2 ,
A frit slurry with a composition of 10 to 60% PbO and 10 to 30% K2O is applied onto the metal conductor wire, fired at 500 to 800℃,
It is manufactured by forming a glassy inorganic insulating film on a conductor. [Problems to be Solved by the Invention] However, the inorganic insulated wire obtained by such a manufacturing method has the following problems, and it is desired to solve them. Since the inorganic insulating coating is formed of a continuous glassy coating and there is a large difference in thermal expansion coefficient between the insulating coating and the metal conductor, thermal strain accumulates in the coating and peeling of the coating is likely to occur. This tendency is especially noticeable when coil-wound, and usually 500
When the film is taken out from a temperature of approximately 20°C to a room temperature of 20°C, the coating may peel off after two or three heat shock tests. As the conductor diameter becomes smaller, the degree of accumulation of the thermal strain increases, and coating peeling becomes more likely to occur.
For this reason, it has not been possible to form an insulating film on a conductor with a diameter of 0.5 mm or less. Therefore, if we try to change the glass composition to reduce the difference in thermal expansion diameter between the metal conductor and the insulating coating or to improve the adhesion to the conductor, it is difficult to change the original characteristics of inorganic insulated wire. High-temperature insulation properties will be greatly reduced. [Means for solving the problem] Therefore, in this invention, lead-containing frit with excellent flexibility and high-melting point inorganic material with good high-temperature insulation properties are used as main ingredients, and in addition to these, lead-containing frit with excellent flexibility and a high-melting point inorganic material with good high-temperature insulation properties are used. coating a metal conductor with a slurry-like coating liquid consisting of a certain bond oxide and a pyrolyzable resin soluble in water or an organic solvent that prevents the solid particles of each of the above components from settling;
By firing to form a porous insulating film with good adhesion, the above problems were solved, and at the same time, variations in film properties during long-term continuous production due to sedimentation of solid particles were avoided. The inorganic insulation of this invention contains 35 to 75 parts by weight of lead-containing frit on a conductor, Al 2 O 3 , SiO 2 , MgO, TiO 2 ,
25 to 65 parts by weight of one or more high melting point inorganic substances selected from the group consisting of ZrO 2 and Fe, Ni, Co, Sb, Mo
0.05 to 5 parts by weight of a thermally decomposable resin soluble in water or an organic solvent per 100 parts by weight of a composition consisting of 0.5 to 10 parts by weight of one or more combined oxides selected from the group consisting of oxides of A porous insulating screen is formed by coating with a coating liquid containing 30% of the above resin, adding this to a temperature higher than the thermal decomposition temperature of the resin, causing the resin to thermally decompose and disappear, and then firing at a high temperature. It is. First, the lead-containing frit used in the present invention contains PbO and B 2 O 3 , has a predominant PbO content of 50% by weight or more, and has a softening melting point of 700° C. or less. Examples of such frits include those having the compositions shown below. PbO 50-85% (weight%, same below) B 2 O 3 3-9% SiO 2 1-4% ZnO 4-15% PbO 50-85% B 2 O 3 3-9% SiO 2 2-15% Al 2 O 3 1-8% ZrO 2 or TiO 3 2-10% PbO 50-80% B 2 O 3 2-9% SiO 2 1.5-8% Al 2 O 3 0.5-4% ZnO 15-28% This The lead-containing frit is used by melting the glass raw material having the above composition, quenching it in water, and pulverizing it to a density of about 200 mesh, as in the conventional method. In addition, the highly advantageous inorganic substances include Fl 2 O 3 ,
One or more of the following oxides are used: SiO 2 MgO, TiO, TrO 2 . All of these high melting point inorganic substances have a melting point of
It is an oxide with a high melting point of 1000℃ or higher, and is mainly responsible for the high-temperature insulation properties of the resulting insulating film.Furthermore, during firing, it partially melts into the molten glass of the lead-containing frit, lowering the melting point of the glass itself. It has the function of raising the temperature. Furthermore, the combined oxides include Fe, Ni, Co,
One type or a mixture of two or more types of oxides of Sb and Mo can be used in an arbitrary ratio. This bonding oxide reacts with the conductor during firing to form a strong bonding layer between the insulating coating and the metal conductor, thereby increasing adhesion. The resin used to prevent sedimentation of these inorganic substances and as a binder is one that is soluble in water or an organic solvent and is thermally decomposable. Examples of such resins include polyethylene oxide (molecular weight 100,000 to 3 million).
, polymethyl methacrylate, methyl methacrylate-n-butyl methacrylate copolymer, n
-Butyl methacrylate-isobutyl methacrylate copolymer, ethyl methacrylate-methyl acrylate copolymer, and the like. The mixing ratio of the lead-containing frit, the high-melting point inorganic substance, and the combined oxide is 35 to 75 parts by weight of the lead-containing frit, 25 to 65 parts by weight of the high-melting point inorganic substance, and 0.5 to 10 parts by weight of the combined oxide. It is considered a percentage. If the lead-containing frit is less than 35 parts by weight, the adhesion of the insulation coating to the conductor
It does not have sufficient flexibility, and if it exceeds 75 parts by weight, it becomes difficult to dissipate decomposed gas, causing foaming and blistering, which causes flaking when coiled, which has the disadvantage of not becoming porous. It becomes insufficient, and the thermal shock resistance deteriorates. In addition, if the high melting point inorganic substance is less than 25 parts by weight, the film will lack high-temperature insulation and will not be able to become porous, and if it exceeds 65 parts by weight, the porosity will progress too much and the film will become dangerous. ,
cause inconvenience. Further, the bonding oxide is added in an amount of 0.5 to 10 parts by weight per 100 parts by weight of the mixture of lead-containing frit and pore melting point mineral. If it is less than 0.5 parts by weight, the adhesion of the insulating coating to the conductor will be insufficient, and if it exceeds 10 parts by weight, although the adhesion will be sufficient, there will be a significant tendency for the insulation to deteriorate, which is disadvantageous. and a mixture of a lead-containing frit, a high melting point inorganic substance, and a combined oxide.
The above resin is added in an amount of 0.05 to 5 parts by weight per 100 parts by weight. If the amount added is less than 0.05 parts by weight, the desired effect of preventing sedimentation of solid particles cannot be obtained, and if it exceeds 5 parts by weight, the time required for the resin to decompose and disappear becomes longer and blisters and foaming due to decomposed gas are likely to occur. Therefore, if a sufficient sedimentation prevention effect cannot be obtained even after adding 5 parts by weight, or if blistering or foaming is likely to occur due to decomposed gas, inorganic sediments such as gyrome clay, bentonite, montmorillonite, etc. may be added in addition to the above resins. A combination of inhibitors may also be used. The metal conductor used in this invention is preferably one that has good corrosion resistance at high temperatures, such as nickel-clad copper, stainless steel-clad copper, nickel-clad silver, nickel-iron-clad copper, chromel, constantan, nichrome, tungsten, titanium, A silver-palladium alloy or the like is selected depending on the purpose and use. In addition, the wire diameter of the conductor is not particularly limited, but since the insulating coating is porous, it is possible to reduce thermal strain.
Applicable to relatively small diameter objects, with a minimum diameter of 0.05
Thin wire up to mmφ can be used. Then, a slurry-like composition consisting of a lead-containing frit, a high melting point inorganic substance, a bonded oxide, and a resin is prepared. Specifically, first, a resin is dissolved in water or an organic solvent such as an ester, a ketone, or an aromatic hydrocarbon to prepare a high clay resin liquid. The concentration of the resin liquid is appropriately determined depending on the type of resin and the clay used in the solution, but is usually 7% by weight or less. Next, a lead-containing frit, a high-melting point inorganic substance, and a combined oxide are added to this resin liquid, and the coating liquid is prepared by stirring or kneading in a ball mill, or the lead-containing frit, a high-melting point inorganic substance, a combined oxide, and water or The resin liquid is added to a slurry obtained by mixing and pulverizing a composition consisting of an organic solvent and an organic solvent in a ball mill in advance, and the mixture is mixed to adjust the viscosity, and then used as a coating liquid. The solid content of this slurry-like coating liquid is not particularly limited, but is determined appropriately by taking into account the clay, sedimentation properties of solid particles, coating thickness on the metal conductor, etc., and is usually about 55 to 70% by weight. Ru. Next, the slurry-like coating liquid thus obtained is applied to the surface of the metal conductor and fired at a high temperature to form a film. This coating may be formed by immersing the metal conductor in the coating solution, and the coating thickness may be adjusted by repeating the coating and baking process multiple times as necessary to match the coating thickness of the book. You may do so. Furthermore, prior to firing, the resin is thermally decomposed to disappear. First, the resin is placed in a heating furnace maintained at a temperature at which it can be thermally decomposed, and the resin is heated to be thermally decomposed and volatilized from the coating film as thermal decomposition gas. The heating time is usually in the range of about 1 to 5 minutes, and is determined by the resin content in the coating film, the coating thickness, etc. Once the resin has disappeared from the coating film, the temperature is further increased to a firing temperature of 800 to 1000°C, and firing is performed. The firing time is determined as appropriate depending on the thickness of the coating film, the diameter and type of the conductor, the composition of the coating liquid, etc.
It is usually in the range of 1 to 5 minutes. Through this firing, the glass of the molten lead-containing frit adheres to the surface of the high-melting point inorganic particles, and this glass acts as a binder to bind the high-melting point inorganic particles to each other and fix them on the conductor. It becomes a porous inorganic film. To put it in an analogy, it would be similar to the state of "Awa Okosi". Further, during firing, the bonded oxide causes a reaction between the metal conductor surface and the inorganic coating to form a strong bond, thereby ensuring good adhesion. The thickness of the insulating coating thus fired is usually about 2.5 to 25 μm, but is not limited to this range and can be determined as appropriate depending on the use of the inorganic insulated wire. Note that, if necessary, a resin coating mainly made of silicone resin, fluororesin, uretown resin, etc. can be formed on this insulating coating. [Function] Since the insulating coating obtained from such inorganic insulated wires is porous, the insulating coating does not peel off from the metal conductor even when the wire is wound. It exhibits high resistance to thermal shock. In addition, since the actual constituent material of the coating is a high melting point oxide, it has excellent insulation properties at high temperatures, and some of the high melting point oxides dissolve into the glass of the lead-containing frit during firing. Since the melting point of the glass itself becomes high, even if a glass with a low melting point is used, it can be used up to a high temperature above the melting point of the frit. Furthermore, since it is a porous coating, there is little accumulation of thermal strain even if it is coated on a small diameter conductor, so it can be applied to a thin wire of about 0.05 mmφ. In addition, since resin is used to increase the viscosity of the coating liquid and prevent solid particles from settling, solid particles are uniformly dispersed in the coating liquid regardless of their specific gravity, so the coating process This prevents variations in the properties of the insulating coating or deterioration of the properties due to changes in the composition of the coating. Basic salts such as soda carbonate, sodium nitrite, and barium chloride, so-called "tomegusuri", are used to raise the clay of the coating solution, but when such salts are added, the high-temperature insulation of the insulation coating is It has the disadvantage of decreasing performance. In this regard, in the present invention, since a resin is used and the resin is thermally decomposed and disappeared during firing, no resin remains in the coating, and such inconvenience does not occur. [Examples] Hereinafter, examples will be shown to clarify the effects of this invention. Example 1 A mixture having the composition shown in Table 1 was dispersed in a 1% by weight aqueous solution of polyethylene oxide having an average molecular weight of about 1 million to obtain a dispersion with a solid content of 60%, which was pulverized in a ball mill for 70 hours. all solids
The coating liquid was prepared so that the thickness was 10μ or less. This coating liquid was applied to a Nickelrad copper wire with a diameter of 0.25 mm, and then introduced into a furnace whose temperature was controlled within the range of 500 to 550°C, and heated for 5 minutes to thermally decompose the polyethylene oxide, which caused the coating film to deteriorate. Make it disappear more,
Then, it was fired for 3 minutes in a firing furnace whose temperature was controlled at 800 to 900°C to form an inorganic porous insulation coating with a thickness of 13 μm. The lead-containing frit in Table 1 has the composition shown above, the high-melting point inorganic substance consists of 85 parts by weight of Al 2 O 3 and 15 parts by weight of TiO 2 , and the combined oxides include CoO, NiO, etc. A mixture of amounts was used. Regarding the inorganic insulated wires obtained in this way, ○A adhesion and flexibility of the insulation coating ○B High-temperature insulation properties ○C Thermal shock resistance ○D Variations in the properties of the insulation coating were investigated. Regarding adhesion and flexibility,
An insulated wire was wound into a coil with a diameter 10 times its outer diameter, and the presence or absence of peeling of the insulating coating was evaluated by microscopic observation. High temperature insulation is 500 by JIS 2-stranded sample.
The insulation resistance and breakdown voltage (BDV) at ℃ were evaluated. Thermal shock resistance is measured by repeatedly testing a coil wound around a 20x diameter bobbin at 600°C for 15 minutes, then immediately taking it out into the air at 20°C, and determining the cycle in which the coating layer of the coiled wire peels off. Evaluated by number. In addition, variations in the characteristics of the insulation coating can be determined by measuring the breakdown voltage (BDV) at 500°C for a total of 30 samples taken from every 100 m of wire length, and calculating the average value of these,
Evaluation was performed by finding the standard deviation. The results are shown together with the first vote.

【表】 比較のため、配合例3の混合物を水に分散した
ものについて、同様の絶縁破壊電圧を測定し、そ
の平均値、標準偏差を求めたところ、それぞれ
160V、11.3であつた。 実施例 2 実施例1における配合例3の塗覆液を、線径
0.1mm、0.2mm、0.3mm、0.5mm、1.0mmのニツケルク
ラツド銅線に実施例1と同様に塗布し、焼成し
た。これらの無機絶縁電線を20倍径のボビンにコ
イル巻き加工し、実施例1と同様の条件で耐熱衝
撃性を検討した。結果を第2表に示す。
[Table] For comparison, we measured the dielectric breakdown voltage of the mixture of Formulation Example 3 dispersed in water, and calculated the average value and standard deviation.
It was 160V, 11.3. Example 2 The coating liquid of Formulation Example 3 in Example 1 was
Nickel clad copper wires of 0.1 mm, 0.2 mm, 0.3 mm, 0.5 mm, and 1.0 mm were coated and fired in the same manner as in Example 1. These inorganic insulated wires were coil-wound onto a bobbin with a diameter 20 times larger, and their thermal shock resistance was examined under the same conditions as in Example 1. The results are shown in Table 2.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、この発明の無機絶縁電線
によれば、含鉛フリツトと高融点無機物との混合
比が連続ガラス被膜を形成しえない量比となつて
いるので、得られる絶縁被膜は多孔質となり、こ
れによつて可撓性が良く、熱衝撃に強い絶縁被膜
となる。また、結合酸化物と柔軟性のある含鉛フ
リツトを使用しているので、被膜の密着性が高く
なる。さらに、被膜の実質的な構成材料に高融点
で高絶縁性の高融点無機物を用いているので、高
温での絶縁特性も優れたものとなる。また、絶縁
被膜が多孔質であり、かつ硬度の高いシリカ、ア
ルミナなどの高融点無機物で構成されているの
で、耐摩耗性が良好な無機絶縁電線が得られる。
さらに又水は有機溶剤に可溶な熱分解性の樹脂を
添加して塗覆液の粘性を上げ比重の異なる固形粒
子を均一に分散させているため、長時間連続して
製造した場合でも特性のバラツキが少なく、かつ
添加される樹脂が熱分解性に優れたものであるか
ら、焼成時に分解物が残り、絶縁特性が低下する
様な問題を生じない優れた効果が得られるもので
ある。
As explained above, according to the inorganic insulated wire of the present invention, the mixing ratio of the lead-containing frit and the high melting point inorganic material is such that a continuous glass coating cannot be formed, so the resulting insulating coating is porous. This results in an insulating coating that has good flexibility and is resistant to thermal shock. Furthermore, since a bonded oxide and a flexible lead-containing frit are used, the adhesion of the coating is increased. Furthermore, since a high melting point inorganic substance with a high melting point and high insulation properties is used as a substantial constituent material of the coating, the insulation properties at high temperatures are also excellent. Furthermore, since the insulating coating is porous and made of a high-melting-point inorganic material such as silica or alumina that has high hardness, an inorganic insulated wire with good wear resistance can be obtained.
Furthermore, water is used to increase the viscosity of the coating liquid by adding a thermally decomposable resin soluble in an organic solvent to uniformly disperse solid particles with different specific gravities. Since there is little variation in the temperature and the resin added has excellent thermal decomposition properties, excellent effects can be obtained without causing problems such as decomposition products remaining during firing and deterioration of insulation properties.

Claims (1)

【特許請求の範囲】 1 PbO、B2O3を含み、軟化溶融点が700℃以下
の含鉛フリツト35〜75重量部と、 Al2O3、SiO2、MgO、TiO2、ZrO2よりなる群
から選ばれた1種以上の高融点無機物25〜65重量
部と、 Fe、Ni、Co、Sb、Moの酸化物よりなる群か
ら選ばれた1種以上の結合酸化物0.5〜10重量部
とからなる組成物100重量部に対し、 水または有機溶剤に可溶な熱分解性樹脂0.05〜
5重量部を添加してなる混合物が焼成され多孔質
の無機絶縁被膜として設けられたことを特徴とす
る無機絶縁電線。
[Claims] 1. 35 to 75 parts by weight of a lead-containing frit containing PbO and B 2 O 3 and having a softening and melting point of 700°C or less, and from Al 2 O 3 , SiO 2 , MgO, TiO 2 , ZrO 2 25 to 65 parts by weight of one or more high melting point inorganic substances selected from the group consisting of; and 0.5 to 10 parts by weight of one or more combined oxides selected from the group consisting of oxides of Fe, Ni, Co, Sb, and Mo. 0.05 to 100 parts by weight of a pyrolyzable resin soluble in water or an organic solvent,
1. An inorganic insulated wire characterized in that a porous inorganic insulating coating is formed by firing a mixture in which 5 parts by weight is added.
JP59213836A 1984-10-12 1984-10-12 Inorganic insulated wire Granted JPS6193510A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59213836A JPS6193510A (en) 1984-10-12 1984-10-12 Inorganic insulated wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59213836A JPS6193510A (en) 1984-10-12 1984-10-12 Inorganic insulated wire

Publications (2)

Publication Number Publication Date
JPS6193510A JPS6193510A (en) 1986-05-12
JPH0453041B2 true JPH0453041B2 (en) 1992-08-25

Family

ID=16645830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59213836A Granted JPS6193510A (en) 1984-10-12 1984-10-12 Inorganic insulated wire

Country Status (1)

Country Link
JP (1) JPS6193510A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582061B2 (en) * 1987-01-17 1997-02-19 住友電気工業株式会社 Wire for audio and visual equipment
JP2582067B2 (en) * 1987-03-25 1997-02-19 住友電気工業株式会社 Wire for audio and visual equipment
US7795538B2 (en) * 2007-11-06 2010-09-14 Honeywell International Inc. Flexible insulated wires for use in high temperatures and methods of manufacturing
US8680397B2 (en) * 2008-11-03 2014-03-25 Honeywell International Inc. Attrition-resistant high temperature insulated wires and methods for the making thereof

Also Published As

Publication number Publication date
JPS6193510A (en) 1986-05-12

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