JPH0453150A - Method of testing integrated circuits - Google Patents

Abstract

PURPOSE:To improve the mechanical strength of an electrical connection between an integrated circuit and a conductive pattern and make it possible to use an insertion board repeatedly by using a conductor lead in a state in which it is reinforced by an insulation film and making it possible to move the connection between the conductor pattern and the conductor lead to the inside of the conductor lead. CONSTITUTION:In a great number of tape-shaped conductor leads 14 formed on the bottom surface of an insulation film 12, the inner end 14a thereof projects into a through hole 13, and an outer end 14b thereof projects from the outer end of the insulation film 12. The portion which is inner more than the outer end 14b is exposed inside through holes 15, 16. During a first use of an insulation board 4, the inner end 14a of each lead 14 of the film 12, a connection terminal 3 of an integrated circuit 1, and a portion 17 where the outer end 14b of each lead 14 is connected to a pattern 11 are TAB connected. Thus, a terminal 3 is connected to a pin 7 via the lead 14 and a pattern 11. During a second use of the board 4, the lead 14 is connected to the pattern 11 in a portion where the board 4 is exposed to the through hole 15. During a third use of the board 4, the lead 14 is connected to the pattern 11 in a portion where the board 4 is exposed to the transmission hole 16.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a method for testing the characteristics of an integrated circuit mounted on a predetermined insulating substrate, which enables repeated use of the insulating substrate on which the integrated circuit is mounted, and also improves the relationship between the integrated circuit and the insulating substrate. For the purpose of stabilizing the electrical connection, an insulating substrate with an integrated circuit accommodating area in the center is provided with a large number of conductive patterns on all sides of the accommodating area to be connected to the measurement terminals of the integrated circuit testing equipment. A large number of tape-shaped conductor leads whose ends face the external connection terminals of the integrated circuit and whose middle parts and outer ends face the conductor pattern are formed on an insulating film, and the insulating film has a plurality of tape-shaped conductor leads arranged in the integrated circuit accommodating part. A first through-hole facing each other and a second through-hole exposing the conductor lead at a portion overlapping the conductor pattern are provided, and the inner end of the conductor lead protrudes from the first through-hole of the insulating film. At the same time, the outer end of the conductor lead is made to protrude beyond the outer edge of the insulating film, and when the insulating substrate is used for the first time, the inner end of the conductor lead is crimped to the external connection terminal of the integrated circuit. At the same time, the outer end of the conductor lead is crimped to the conductor pattern, the crimping between the conductor lead and the conductor pattern is peeled off, and the integrated circuit and the insulating film are replaced. During repeated use, the conductor pattern and the conductor lead are crimped each time using the conductor lead in the portion exposed in the second through hole, and the conductor lead is crimped in sequence so as not to overlap with the previous crimping. The structure is characterized in that it is moved inward in the length direction.

[Industrial application field]

The present invention relates to a method for testing an integrated circuit, and more particularly to a method for making it possible to repeatedly use an insulating substrate on which an integrated circuit is mounted and for stabilizing the electrical connection between the integrated circuit and the insulating substrate.

[Conventional technology]

FIG. 5 is a schematic side sectional view of a test integrated circuit mounted on an insulating substrate according to the prior art.

In FIG. 5, a circuit board 2 made of ceramic or the like is provided with external connection terminals 3. The integrated circuit 1 on which desired circuit elements have been formed and mounted is housed in an integrated circuit accommodating portion 5 at the center of an insulating substrate (printed wiring board) 4, and a large number of conductor patterns 6 formed on the upper surface of the insulating substrate 4 are One end is connected to a pin 7 embedded in an insulating substrate 4, and the other end is connected to an integrated circuit 1 via a wire 8.
Connect to terminal 3 of the

For the wire 8, for example, a gold wire with a diameter of 100 μm is used.

The integrated circuit accommodating portion 5 has a configuration in which a through hole in which a shelf board portion 9 for supporting the four corners of the integrated circuit 1 is formed is provided in the insulating substrate 3. The integrated circuit I accommodated in the integrated circuit accommodating portion 5 is It is held on the insulating substrate 3 by a large number of wires 8.

The characteristics of the test integrated circuit l extracted from a large number of products by sampling are determined by mounting the insulating substrate 4 on an integrated circuit testing device, and each pin 6 is in contact with a measurement terminal.

[Problem to be solved by the invention]

In the above-mentioned method for testing an integrated circuit 1 according to the prior art, the integrated circuit 1 is held by a wire 8 having low mechanical strength, and when external vibration or impact is applied to the insulating substrate 4, the wire is easily affected by the vibration or impact. A part of the wire 8 may be cut off, and the wire bonding of the cut wire 8 must be manually re-bonded, which is troublesome.

In addition, the insulating substrate 4 has a large number of conductor patterns 6 formed thereon and has pins 7 corresponding to each conductor pattern 6 embedded therein.
It is disposable only once without being used repeatedly, that is, it is disposable because removing the used wire 8 is extremely troublesome.

An object of the present invention is to eliminate the above-mentioned cutting caused by using the wire 8 and to enable the insulating substrate 4 to be used repeatedly.

[Means to solve the problem]

According to FIG. 1, which shows an embodiment of the method of the present invention, an insulating substrate 4 having an integrated circuit accommodating portion 5 in the center has a large number of conductor patterns I connected to measurement terminals of an integrated circuit testing device.
A large number of tape-shaped conductor leads 14 are formed on all sides of the housing part 5, and a large number of tape-shaped conductor leads 14 whose inner ends face the external connection terminals 3 of the integrated circuit 1 and whose middle and outer ends face the conductor pattern 11 are covered with an insulating film. 12, and the insulating film 12 has a first through hole 13 facing the integrated circuit accommodating portion 5 and a second through hole 15, 16 through which the conductor lead 14 is exposed in a portion overlapping with the conductor pattern II. The inner end of the conductor lead 14 is made to protrude from the first through hole 13 of the insulating film 12, and the outer end of the conductor lead I4 is made to protrude from the outer edge of the insulating film 12. When using the conductor lead 14, the inner end of the conductor lead 14 is crimped to the external connection terminal 3 of the integrated circuit 1, and the outer end of the conductor lead 14 is crimped to the conductor pattern 11. When the insulating substrate 4 is used repeatedly after the second time, in which the integrated circuit 1 and the insulating film 12 are peeled off and the insulating film 12 is replaced, the crimping between the conductor pattern 11 and the conductor lead 14 is removed by the second transparent The portion of the conductor lead 14 exposed within the hole 15.16
This integrated circuit testing method is characterized by sequentially moving the conductor leads 14 inward in the length direction so as not to overlap with the previous crimping.

[Effect]

According to the above means, one end of the conductor lead formed on the insulating film is connected to the integrated circuit, the other end of the conductor lead is connected to the conductor pattern of the insulating substrate, and when the insulating substrate is repeatedly used, the conductor lead is attached to the insulating film. A through hole is provided to expose the middle part of the conductor pattern, and the connecting part between the conductor pattern and the conductor lead can be moved inside the conductor lead.

That is, in the present invention, a conductor lead with low mechanical strength is reinforced with an insulating film, and the connection part between the conductor pattern and the conductor lead can be moved inside the conductor lead, thereby making it possible to connect the integrated circuit and the conductor pattern. This improves the mechanical strength of the electrical connections and allows the insulating substrate to be used repeatedly.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for testing an integrated circuit according to an embodiment of the present invention will be described below with reference to the drawings.

Figure 1 shows a schematic plan view (A) and a cross-sectional view (A) of an integrated circuit mounted on an insulating substrate for testing according to an embodiment of the method of the present invention.
b), Figure 2 is a schematic plan view of the insulating substrate shown in Figure 1, Figure 3 is a schematic bottom view of the insulating film shown in Figure 1, and Figure 4 is mounted on the insulating substrate during the third use. FIG. 2 is a schematic cross-sectional view of an integrated circuit.

Figure 1 shows the first use of the insulating substrate 4, which is used repeatedly, and shows the measurement terminals of the integrated circuit testing equipment and the integrated circuit
As shown in detail in FIG. 2, the insulating substrate 4 for electrically connecting the
A large number of conductor patterns 11 are provided slightly away from the accommodating part 5 in all directions, each conductor pattern 11 is connected to a pin 7 implanted in the insulating substrate 4, and integrated circuits l are supported at the four corners of the accommodating part 5. It has a shelf part 9. The conductive pattern 11 is formed by plating copper with a thickness of 0.1 mm, for example, with gold.

For example, the square insulating film 12 made of polyimide is
As the details are shown in FIG. 3, the first
A through hole 13 is formed in the center, and rectangular second through holes 15 and 16 are formed near each of the four outer edges. A large number of tape-shaped conductor leads 14 formed on the lower surface of the insulating film 12 have an inner end 14a protruding into the through hole I3, an outer end 14b protruding from the outer edge of the insulating film 12, and an outer end 14b. The inner part is through hole 15.16
express within.

The conductor pattern (4) is formed, for example, by etching a μm-thick gold foil adhered to a polyimide film before molding.

When the insulating substrate 4 is used for the first time, the inner end 14a of each conductor lead I4 of the insulating film 12 and the connection terminal 3 of the integrated circuit 1 and the outer end 14b of each conductor lead 14 and the conductor pattern 11 are connected. The connection part I7 is TAB (Tap
e Automated Bonding) connection.

Therefore, each connection terminal 3 has a conductor lead 14. It comes to be connected to the pin 7 via the conductor pattern 11.

Next, when the insulating substrate 4 is used for the second time, the through holes 15 are
The conductor lead 14 is connected to the conductor pattern 11 at the portion exposed inside.
When using the insulating board 4 for the third time,
The conductive wire 14 is connected to the conductive pattern 11 by TAB at the portion exposed inside the through hole 16. At that time, the insulating film 12
However, if you cut the insulating film I2 along the extended line of the L-shaped broken line A or the broken line B drawn in FIG. 11, the new conductor lead I4 can be connected without being affected by it.

In FIG. 4, the insulating film 12 used for the third time of the insulating substrate 4 is cut along the extended line of the broken line B, and the conductor leads 12 are cut so as to protrude by an appropriate length from the outer edge of the insulating film 12.
4 is cut, and the code 18 is the conductor lead 1.
4 and connection terminal 3. This is a TAB connection part with conductor pattern II.

〔Effect of the invention〕

As explained above, according to the method of the present invention, by using conductor leads formed on an insulating film instead of conventional wires, the mechanical strength of the electrical connection between the integrated circuit and the conductor pattern is improved, and the conductor By making the connecting portion between the conductor lead and the conductor lead movable inside the conductor lead, it is possible to repeatedly use the insulating substrate on which the conductor pattern is formed.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of one embodiment of the method of the present invention, and FIG.
FIG. 3 is an insulating film shown in FIG. 1, FIG. 4 is an explanatory diagram of the insulating substrate used for the third time, and FIG. 5 is an explanatory diagram of the prior art. In the figure, 1 is an integrated circuit, 3 is an external connection terminal, 4 is an insulating substrate, 5 is an integrated circuit housing part, 11 is a conductor pattern, 12 is an insulating film, 13 is a first through hole, 14 is a conductor lead, 14a is an inner end of the conductor lead, 14b is an outer end of the conductor lead, and 15 and 16 are second through holes. 4. Insulation standard selection 1. Figure 1.

Claims (1)

[Claims] An insulating substrate (4) having an integrated circuit accommodating portion (5) in the center.
), a large number of conductor patterns (11) to be connected to the measurement terminals of the integrated circuit testing device are formed on all sides of the housing part (5), and the inner end is connected to the external connection terminal (3) of the integrated circuit (1). ), and a large number of tape-shaped conductor leads (14) whose middle part and outer end face the conductor pattern (11) are covered with an insulating film (1).
2), and the insulating film (12) has the integrated circuit housing portion (5).
The first through hole (13) facing the conductor pattern (11)
), and second through holes (15, 16) are provided to expose the conductor lead (14) at a portion overlapping the conductor lead (14), and the inner end of the conductor lead (14) is connected to the insulating film (12).
), and the outer end of the conductor lead (14) is made to protrude from the outer edge of the insulating film (12), and the first through hole (13) of the insulating substrate (4) In use, the inner end of the conductor lead (14) is crimped to the external connection terminal (3) of the integrated circuit (1), and the outer end of the conductor lead (14) is attached to the conductor pattern (11). Crimp the conductor lead (
14) and the conductor pattern (11) is peeled off and the integrated circuit (1) and the insulating film (12) are replaced. Each time, the conductor pattern (11) and the conductor lead (14) are crimped through the second through hole (15, 16).
) Using the conductor lead (14) of the part exposed in
A method for testing an integrated circuit, characterized by moving the circuit inward in the length direction.