JPH0453300A - Electronic component mounting device and electronic component mounting method using same - Google Patents

Abstract

PURPOSE:To prevent the occurrence of incorrect suction and mounting so as to improve a component mounting device in reliability by a method wherein the absolute positional deviation of a suction shaft at positions is corrected basing on the suction position correction data and the mounting position correction data. CONSTITUTION:First, in a manufacturing process of an electronic component mounting device, an absolute positional deviation D1 (n) of a component suction head 14 supporting a suction shaft 13 from the suction shaft 13 and an absolute positional deviation D2 (n) of the designed mounting position of transfer table 19 from the component suction head 14 are measured at each position and for each of the component suction heads 14 fixed to the positions, and the measured data are inputted as a correction data original for the device concerned when the device is manufactured. Then, in a mounting process, the corrections in the directions of a Z axis and an X axis at a P1 position are calculated basing on D1 (n) and D2 (n), instructions are given to a component feed device 3 and the drive motor of a movable table 4 to move a component feed position, and then an electronic component 1 is sucked.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus for holding and mounting electronic components on a circuit board, and an electronic component mounting method using the same.

(Prior Art) An electronic component mounting apparatus used in a conventional mounting method will be described with reference to FIGS. 3 and 4.

FIG. 3 is a perspective view showing the main parts of a conventional electronic component mounting apparatus;
FIG. 4 is a schematic plan view for explaining its operation.

In FIG. 3, the conventional electronic component mounting apparatus has a component storage belt 2 in which a large number of electronic components 1 are stored, as shown in FIG.
A movable table is equipped with a plurality of component supply devices 3 mounted in parallel to send out the electronic components 1 to a supply position by an electric motor (not shown), and is slid freely in the parallel direction by the electric motor (not shown). 4 and an X-table 8 and an X-table that are driven by two electric motors 6 and 7 and freely slide in the X-axis and Z-axis directions, on which the circuit board 5 on which the electronic component 1 (not shown) is mounted are attached. Xz stacked with 9
An X-table 1, 10 component suction heads each having a suction nozzle 11 removably attached to its lower end and a suction shaft 13 with a rotating gear 12 fixed to its upper end movably and rotatably. Drive devices 15 for raising and lowering the suction shafts 13 marked 14 and 14 are arranged at equal intervals on the circumference, and further, as shown in FIG.
5 and P7, there is a conveyance table J9 intermittently rotated by a drive shaft]8, on which a rotation device 17 having a gear 16 that meshes with the gear 12 is disposed, and P3 shown in FIG.
and a holding position regulating device 20 disposed at.

The operation of the electronic component mounting apparatus configured as follows will be explained.

In FIG. 4, first, the moving table 4 is moved in the Z-axis direction, and a predetermined electronic component stored in the component storage band 2 is moved to P.
] - is positioned at the component supply position below the suction nozzle 11 that is stopped. Next, the drive device 15 is activated to lower the suction shaft 13 and use the suction nozzle 11 at the tip to remove the electronic component 1.
After adsorbing, it rises.

Subsequently, the transport table 19 is intermittently rotated by an angle of 36 degrees by the drive shaft 18, and the process moves to P2. At P3, the drive device 15 operates again, and the electronic component being sucked is lowered between the two pairs of regulating claws of the mounting/holding position regulating device 20. The holding position regulating device 20 operates to regulate the relative position between the suction nozzle 11 and the electronic component 1 . At P5, the rotation device 17 operates,
The suction shaft 13 is rotated so as to match the mounting direction of the circuit board 5. At P6, the electric motors 6 and 7 of the XZX table 1 are activated, and the position of the installed circuit board 5 is adjusted so that it is directly below the suction nozzle 11 at P6, and then the drive device 15 is activated. Then, the electronic component 1 is mounted. At P7, it is rotated in the opposite direction to the rotation performed at P5, and preparation for the next suction is completed.

(Problem to be Solved by the Invention) However, in the above configuration, the mounting of each suction shaft 13 in the circumferential direction (Z-axis direction) and the radial direction (X-axis direction) causes errors, and the mounting of each suction shaft 13 Due to the rotation center error, as the electronic component 1 to be attracted becomes smaller, a problem arises in which suction failure occurs and the suction rate decreases, or the mounting position on the circuit board 5 shifts, resulting in mounting failure. was there.

The present invention solves the above problems and provides a highly reliable electronic component mounting method that does not cause suction failures or mounting failures.

(Means for Solving the Problems) In order to solve the above problems, the present invention measures the rotation center position and mounting circumferential and radial positions of each suction shaft 13 during the assembly process of an electronic component mounting apparatus. The absolute positional deviation amount is stored and the position is corrected in the mounting process of P6 or the component suction process of P1.

(Function) With the above configuration, by correcting the absolute positional deviation of the suction shaft at each position as suction position correction data and mounting position correction data, a stable component suction state of the component supply unit and accurate mounting can be achieved. becomes possible.

(Example) Embodiments of the present invention will be described with reference to the drawings.

Note that the external appearance of the electronic component mounting apparatus according to the present invention is the same as that of the conventional example, so the drawings and explanation thereof will be omitted. Furthermore, the operations observed in 1'' are as follows, except that a correction operation for the absolute positional deviation of the adsorption shaft 13 is inserted before the adsorption operation of Pl- and before the attachment operation of P6 shown in Fig. 4. Since this is the same as the conventional example, its explanation will be omitted.

Next, the correction operation according to the present invention will be explained with reference to a process block diagram in FIG. 1 and a schematic enlarged plan view of essential parts in FIG. 2.

In FIG. 2, first, in the manufacturing process of the electronic component mounting apparatus, the absolute positional deviation amount Ds, (n) between the component suction heel 1 to 14 supporting the suction shaft 13 and the suction shaft 13, and the transfer table 19 For the design of the installation, the absolute positional deviation amount D2(n) between the position and the above component suction head 4 must be measured for each position and for each component suction head 14 fixed at this position (Step #]-), and this is At the time of completion, input it as correction data specific to the device (step #2).

Next, implementation] In the second step, first, in P1, the above D
Calculate the correction values in the X-axis direction and the X-axis direction from the correction data of i, (1,,) and D, (1-).Step #3) After giving a command (not shown) and moving the component supply position (step #4), the electronic component is suctioned (step #5).

Next, the mounting process of P6 will be explained. First, at P5, the rotation device 17 is activated and the suction shaft 13 is rotated by 90 degrees. At P6, the above correction data of Dl(1) changes the Z-axis correction value in the X-axis direction, Convert the sign of the Z-axis correction value in the axial direction, and add the correction data of I) 2 (1) to this to calculate the correction value. Step # (3),
A command was given to electric motors 6 and 7 of Z child table 0, and X table 8 and 2 table 9 were moved (step #7
), the electronic component 1 is mounted on the circuit board 5 (step #
8).

(Effects of the Invention) As explained above, according to the present invention, since the device has the absolute positional deviation amount of a plurality of component suction heads as position correction data, it is possible to prevent suction due to poor positional accuracy of the suction shaft. A highly reliable electronic component mounting device is obtained, with only defects and misalignment of the mounting position on the circuit board eliminated.

Further, since assembly positional stacking (positional deviation) of a plurality of component suction heads does not affect the suction rate and component mounting position accuracy, assembly can be performed with low accuracy and an inexpensive electronic component mounting apparatus can be obtained.

[Brief explanation of drawings]

Fig. 1 is a process block diagram showing the position correction operation according to the present invention, Fig. 2 is a schematic enlarged plan view of main parts showing manufacturing errors of the component suction head, and Fig. 3 is a conventional electronic component mounting apparatus. FIG. 4 is a perspective view showing the main parts of the device, and FIG. 4 is a schematic plan view thereof. 1 - Electronic components, 2 - Component storage belt, 3 - Component supply device, 4 - Moving table, 5 - Circuit board, 6, 7 - Electric motor, 8 - X table,
9...Z table, 10...XZ child table 1
1... Suction nozzle, 1.2.16... Gear, 13
... Suction shaft, 14... Component suction head, 15...
・Drive device, 17... Rotating device, 18... Drive shaft,
19... Conveyance table, 20... Holding position regulating device. Patent applicant Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] (1) A plurality of component supply devices are mounted in parallel to feed electronic components stored in a component storage belt, etc. to a supply position by a drive device with an electric motor, and the components are slid freely in the parallel direction by the drive device with an electric motor. a moving table for positioning the electronic component at a suction position; and an XZ table sliding in orthogonal axial directions by drive devices each having an electric motor for positioning a circuit board on which the electronic component is mounted at a mounting position. , a drive device that lifts and lowers multiple component suction heads, each of which has a removable suction nozzle attached to its lower end and a suction shaft with a rotating gear fixed to its upper end that can be moved vertically and rotatably. In addition, there is a transport table mounted at equal intervals on the circumference, a rotating device equipped with a gear that meshes with the above-mentioned gear, which is placed at positions before and after the mounting position of the transport table, and a holding position located after the suction position. In an electronic component mounting device consisting of a regulating device and a comprehensive control device that manages the operation of each device, the absolute positional deviation amount of the suction shaft and component suction head obtained during assembly of the above device and the designed mounting position of the transfer table An electronic component mounting apparatus characterized in that an absolute positional deviation amount of a mounted component suction head is memorized. (2) The process of operating the component supply device to feed electronic components onto the component supply line, the process of operating the supply table to position a predetermined electronic component at the suction position, and the process of regulating the holding position of the suctioned electronic component , the process of rotating the suction shaft to align the direction of the suctioned electronic components with the mounting direction,
The process of operating the Z table to position the circuit board at the mounting position, the process of raising and lowering the suction shaft to mount electronic components,
In an electronic component mounting method consisting of a step of rotating the rotation angle in the opposite direction according to the mounting direction, the amount of positional deviation of the suction shaft relative to the component suction head stored in the device and the amount of positional deviation of the component suction head of the transfer table An electronic component mounting method comprising the step of correcting a suction position by driving motors of a component supply device and a supply table using the amount of positional deviation of a component suction head with respect to a designed mounting position. (3) In the electronic component mounting method described in claim (2), the amount of positional deviation of the suction shaft relative to the component suction head stored in the device and the mounting head relative to the designed mounting position of the component suction head on the transfer table. An electronic component mounting method comprising the step of correcting a mounting position by driving an electric motor of an XZ table using the amount of positional deviation.