JPH0453528U - - Google Patents
Info
- Publication number
- JPH0453528U JPH0453528U JP9713590U JP9713590U JPH0453528U JP H0453528 U JPH0453528 U JP H0453528U JP 9713590 U JP9713590 U JP 9713590U JP 9713590 U JP9713590 U JP 9713590U JP H0453528 U JPH0453528 U JP H0453528U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- insertion member
- piezoelectric plastic
- sensing device
- right angles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 239000002985 plastic film Substances 0.000 claims description 5
- 229920006255 plastic film Polymers 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
Landscapes
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Description
第１図はこの考案の実施例である組立構造が適
用される感震装置の断面図、第２図ＡおよびＢは
同感震装置の一部を構成する蓋体のそれぞれ正面
断面図および底面図、第３図ＡおよびＢは同じく
第１のインナーケースのそれぞれ平面図および正
面断面図、第４図ＡおよびＢは同じく第２のイン
ナーケースのそれぞれ平面図および正面断面図、
第５図Ａ〜Ｃおよび第６図Ａ〜Ｃは同じく圧電プ
ラスチツクフイルムのそれぞれ平面図、正面図、
側面図、第７図は同感震装置の組立図である。
１……感震装置、２……ケース本体、３……蓋
体、４，５……圧電プラスチツクフイルム、６…
…第１のインナーケース（第１の挿入部材）、７
……第２のインナーケース（第２の挿入部材）、
８……導電性ゴム、９……リード金具。
Fig. 1 is a sectional view of a seismic sensing device to which an assembled structure is applied, which is an embodiment of this invention, and Figs. 2 A and B are front sectional views and bottom views, respectively, of a lid that constitutes a part of the seismic sensing device. , FIGS. 3A and 3B are a plan view and a front sectional view, respectively, of the first inner case, and FIGS. 4A and B are a plan view and a front sectional view, respectively, of the second inner case.
5A to C and 6A to C are respectively a plan view and a front view of the piezoelectric plastic film.
The side view and FIG. 7 are assembly drawings of the seismic sensing device. DESCRIPTION OF SYMBOLS 1... Vibration sensing device, 2... Case body, 3... Lid body, 4, 5... Piezoelectric plastic film, 6...
...first inner case (first insertion member), 7
...second inner case (second insertion member),
8... Conductive rubber, 9... Lead metal fittings.
Claims (1)
流動体に２枚の圧電プラスチツクフイルムの下端
部を互いの側面を直角にして浸漬し、この圧電プ
ラスチツクフイルムの上端を蓋体の内側面でこの
蓋体にインサート成形されたリード金具の一端に
導電性ゴムを介して電気的に接続し、導電性ゴム
を支持する第１の挿入部材と、第１の挿入部材と
の間に前記圧電プラスチツクフイルムの上端を載
置して挟持する第２の挿入部材と、を蓋体の内側
面に装着することを特徴とする感震装置の組立構
造。 (2) 前記蓋体の内側面の中央部から円柱状の突
起を垂直下方に突出させるとともに、前記第１の
挿入部材の中央部に、前記突起の周面に外接する
平板状の少なくとも２枚の突片を互いに直角をな
すように垂直下方に突出形成した請求項(1)記載
の感震装置の組立構造。[Claims for Utility Model Registration] (1) The lower ends of two piezoelectric plastic films are immersed in a fluid housed in a case sealed with a lid, with their sides at right angles to each other, and the piezoelectric plastic films are a first insertion member whose upper end is electrically connected via conductive rubber to one end of a lead metal fitting insert-molded on the lid body on the inner surface of the lid body, and supports the conductive rubber; An assembly structure for a seismic sensing device, characterized in that a second insertion member for placing and holding the upper end of the piezoelectric plastic film between the members is attached to the inner surface of the lid. (2) A cylindrical protrusion projects vertically downward from the center of the inner surface of the lid, and at least two flat plate-shaped plates are provided at the center of the first insertion member and circumscribe the circumferential surface of the protrusion. 2. The assembly structure of a seismic sensing device according to claim 1, wherein the projecting pieces are formed to project vertically downward at right angles to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9713590U JPH0723706Y2 (en) | 1990-09-14 | 1990-09-14 | Assembly structure of seismic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9713590U JPH0723706Y2 (en) | 1990-09-14 | 1990-09-14 | Assembly structure of seismic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0453528U true JPH0453528U (en) | 1992-05-07 |
| JPH0723706Y2 JPH0723706Y2 (en) | 1995-05-31 |
Family
ID=31837242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9713590U Expired - Lifetime JPH0723706Y2 (en) | 1990-09-14 | 1990-09-14 | Assembly structure of seismic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723706Y2 (en) |
-
1990
- 1990-09-14 JP JP9713590U patent/JPH0723706Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0723706Y2 (en) | 1995-05-31 |
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