JPH0453827A - Production of polyamide resin - Google Patents
Production of polyamide resinInfo
- Publication number
- JPH0453827A JPH0453827A JP16327090A JP16327090A JPH0453827A JP H0453827 A JPH0453827 A JP H0453827A JP 16327090 A JP16327090 A JP 16327090A JP 16327090 A JP16327090 A JP 16327090A JP H0453827 A JPH0453827 A JP H0453827A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- condensate
- formulas
- iii
- polymerization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006122 polyamide resin Polymers 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000004985 diamines Chemical class 0.000 claims abstract description 11
- 239000000155 melt Substances 0.000 claims abstract description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims abstract description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 24
- 125000001931 aliphatic group Chemical group 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims 4
- 230000003252 repetitive effect Effects 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 15
- 230000005494 condensation Effects 0.000 abstract 3
- 238000009833 condensation Methods 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 28
- 238000000034 method Methods 0.000 description 20
- 229920001577 copolymer Polymers 0.000 description 18
- 239000004952 Polyamide Substances 0.000 description 17
- 229920002647 polyamide Polymers 0.000 description 17
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 15
- 239000002253 acid Substances 0.000 description 14
- 229920000098 polyolefin Polymers 0.000 description 13
- 239000000047 product Substances 0.000 description 13
- -1 Aromatic dicarboxylic acids Chemical class 0.000 description 12
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 10
- 239000005977 Ethylene Substances 0.000 description 10
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- 239000003365 glass fiber Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 238000001291 vacuum drying Methods 0.000 description 2
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- ZDVRPQIPVMARSE-UHFFFAOYSA-N 11-aminododecanoic acid Chemical compound CC(N)CCCCCCCCCC(O)=O ZDVRPQIPVMARSE-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- IZFHMLDRUVYBGK-UHFFFAOYSA-N 2-methylene-3-methylsuccinic acid Chemical compound OC(=O)C(C)C(=C)C(O)=O IZFHMLDRUVYBGK-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-UHFFFAOYSA-N 5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=CC)CC1C=C2 OJOWICOBYCXEKR-UHFFFAOYSA-N 0.000 description 1
- XUVUONUBXHYGCD-UHFFFAOYSA-N 6-chlorohexan-1-amine Chemical compound NCCCCCCCl XUVUONUBXHYGCD-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000001741 Ammonium adipate Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910003953 H3PO2 Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical group C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical group [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- TUNFSRHWOTWDNC-UHFFFAOYSA-N Myristic acid Natural products CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000019293 ammonium adipate Nutrition 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DHZBEENLJMYSHQ-XCVPVQRUSA-N cantharidin Chemical compound C([C@@H]1O2)C[C@@H]2[C@]2(C)[C@@]1(C)C(=O)OC2=O DHZBEENLJMYSHQ-XCVPVQRUSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 125000003630 glycyl group Chemical group [H]N([H])C([H])([H])C(*)=O 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- DPUXQWOMYBMHRN-UHFFFAOYSA-N hexa-2,3-diene Chemical compound CCC=C=CC DPUXQWOMYBMHRN-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- YAQXGBBDJYBXKL-UHFFFAOYSA-N iron(2+);1,10-phenanthroline;dicyanide Chemical compound [Fe+2].N#[C-].N#[C-].C1=CN=C2C3=NC=CC=C3C=CC2=C1.C1=CN=C2C3=NC=CC=C3C=CC2=C1 YAQXGBBDJYBXKL-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000002649 leather substitute Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- HKUFIYBZNQSHQS-UHFFFAOYSA-N n-octadecyloctadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC HKUFIYBZNQSHQS-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920005594 polymer fiber Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Landscapes
- Polyamides (AREA)
Abstract
Description
〈産業上の利用分野〉
本発明は構成成分単位のモノマーまたは塩の水溶液から
低次縮合物をつくり、これを溶融押出機を用いて高重合
度化するポリアミド樹脂の製造方法に関するものであり
、特に高温雰囲気下で使用されるコネクター、コイルボ
ビン等の薄肉成形品に適したポリアミド樹脂の!2遣方
法に関するものである。
〈従来の技術〉
ポリアミドはエンジニアリノグプラスチ、りとしての優
れた特性を利用して、自動車分野、電気・電子分野等で
幅広く使用されてきており、コネクター、コイルボビン
等の薄肉成形品用の材料としても多く使われている。
従来、これらの成形品はガラス繊維で強化したナイロン
6、ナイロン66が使用されてきたが(特開昭59−1
61461)、近年の技術革新による自動車のエンジン
ルームの温度上昇やマイクロエレクトロニクスの進展に
伴い、さらに高温雰囲気下での使用に耐え得る極薄肉成
形品の材料が要求されてきた。しかしながら、ナイロン
6やナイロン66の融点(Tm)はそれぞれ220℃、
260℃でありガラス繊維で強化した場合でも熱変形温
度の限界はそれぞれ融点どまりである。
最近、これらの高温雰囲気下での使用に耐え得るコポリ
アミド樹脂組成物として、テレフタル酸およびイノフタ
ル酸含有コポリアミド樹脂組成物またはそれらのガラス
強化品が数多く提案されている(特開昭59−1614
28、特開昭59155426、特開昭59−5353
6、特開昭62−156130)。
〈発明が解決しようとする課題〉
しかしながら、これらのテレフタル酸、イソフタル酸含
有のコポリアミド樹脂組成物はテレフタル酸成分単位が
多くなると溶融粘度が高くなり通常の溶融重合法では吐
出不可能だったり、ポリマ融点がポリマの熱分解温度に
近いため溶融重合時に分解や劣化を起こしたりしていた
。また、ナイロン塩より重合物に至るまで固体状態で重
合反応させる方法は重合物の組成が安定しないなどの問
題がある。
以上・の状況に鑑み本発明者らは、高温雰囲気下での使
用に充分耐え得る高い剛性と耐熱性を有し、安価でかつ
流動性の良いポリアミド樹脂組成物を製造する方法につ
いて鋭意検討した。
〈課題を解決するための手段〉
本発明者らは上記課題を解決すべく鋭意検討した結果、
[NI+2] リッチの低次縮合物を作り、溶融押出
機で高重合度化する際ジカルボン酸成分を添加すること
によって、安定した高重合度化ポリマが得られ上記の課
題が効率よく達成されることを見い出し本発明に到達し
た。
すなわち、本発明は
次の(I)〜(III)の反復成分
(I )−118−(CR2)e−C
(式中Rは炭素数6〜18の脂肪族基、R。
からなり、 (夏)および/または(II)を必須成分
として含む、ポリアミドを輩造するに当たっ7、(1)
〜(Ill)を構成するモノマー成分中位のトータルモ
ル数に対して0.3〜10モル%のノアミノ成分を過剰
に仕込み、 150℃〜300℃、20 kg/cm’
−G以下の条件下で、1%硫酸溶液の25℃における相
対粘度(ηr)が1.01−1.6を満足する[ N)
12] リッチの低次縮合物をつくり、該低次縮合物
を溶融押出機で高重合度化する際、不足のジカルボン酸
成分を添加することを特徴とするポリアミド樹脂の製造
方法である。
本発明のポリアミド樹脂とは(1)炭素数6〜18の脂
肪族アルキレンジアミンとテレフタル酸から合成される
脂肪族アルキレンテレフタルアミド単位、 (11)炭
素数6〜18の脂肪族アルキレンジアミンとイソフタル
酸から合成される脂肪族アルキレンイソフタルアミド単
位または炭素数6〜18の脂肪族アルキレ7ノアミンと
炭素数4〜18の脂肪族アルキレンジカルボン酸から形
成される縮合物、 (I)ラクタム類または炭素数5〜
18の脂肪族アミノカルボン酸成分il1位から形成さ
れ(1)または(11)が必須成分である綜合物である
。炭素数6〜18の脂肪族アルキレ7ノアミンの具体例
としては、】、6−ジアミノへ牛サン、 1.7−ジア
ミノへブタン、 1. 8−ノアミノオクタン、l、9
−ジアミノノナン、l、10ジアミノデカン、 111
−ノアミノオクタン、 1.12−ジアミノドデカン、
1.】4−ジアミノドデカン、 1 16−ジアミノ
へキサデカン、l、 18−ジアミノオクタデカンなど
を例示することができる。また、戻素数4〜18の脂肪
族アル牛レノジカルボン酸成分の具体例としては、フハ
ク酸、 グルタル酸、アジピン酸、 ピメリン酸、スペ
リン酸、アゼライン酸、セパ/ノ酸、ウンデカンニ酸、
ドデカンニ酸、グラ/リン酸、テトラデカンニ酸、ペ
ンタデカンニ酸、オクタデカ/二酸などを例示できる。
これらの脂肪族アル牛レノジカルボン酸成分のうちアジ
ピン酸、セバンン酸、ウノデカンニ酸、 ドデカンニ酸
が好ましい。また、ラクタム類の具体例としてはε−カ
プロラクタム、ζ−エナノトラクタム、η−カプリルラ
クタム、ω−ラウロラクタムなどを例示することができ
る。
戻素数5〜18の脂肪族アミノカルボン酸成分としては
具体的に6−アミツカブロノ酸、11−アミノドデカン
酸、12−アミノドデカン酸などを例示することができ
る。
本発明のポリアミドは(T)および/または(■)を必
須成分として含むポリアミドであり、 (I)、 (n
)がそれぞれihであっ°〔も良いし、(+)/(I+
)、 (1)/([[+>および(■)/(t[I)の
2元共重合ポリアミドまたは(1)/(n)/ (I)
の3元共重合ポリアミドを含むものである。
ここで用いられるポリアミドの重合度については特に制
限がなく、通常1%硫酸溶液の25℃における相対粘度
(ηr)が15〜5.0にあるものを任意に用いること
ができる。
本発明の150℃〜300℃、20 kg/c■2−G
以下の条件下でつくる低次縮合物とは、 (1)記載の
水溶液を加圧重合釜に仕込み、tgI拌条件下で150
℃〜300℃に加熱する。反応温度は150℃〜300
℃にする必要があり、好ましくは180°C〜280℃
である。、反応温度が150℃よりも低いと反応時間が
長くなり好ましくない、逆に反応温度が300℃よりも
高いと低次縮合物の粘度が高くなりすぎたり、あるいは
析出し吐出ができなくなるので好ましくない。
本発明の低次縮合物をつくるときの圧力とは、その時の
低次縮合物と水の混合物による平衡圧力を意味し、内温
の上昇にしたがつて圧力も上昇するので、系内は20
kg/c冒2−f;以下の一定圧力に保つように操作さ
れる。低次縮合物は少量の水の存在により、顕著な凝固
点降下を与えるために、150℃〜300℃の温度で溶
融状態のまま重合釜から吐出する事ができる。したがっ
て、釜内圧力は20 kg/cm2−G以下、好ましく
は5−18 kg/cm2Gに保つ必要がある。
本発明の[NH2] リッチの低次縮合物とは、通常の
ポリアミド重合ではモノマーおよび塩中に含まれるトー
タルcooni nとトータルNH2基量が等量になる
ように原料仕込みするのが一般的であるが、本発明では
原料仕込時にジアミン成分を大過剰にして[N112]
リッチの低次縮合物を積極的に作ることに主眼を置い
たものである。構成成分のモノマーまたは塩のンカルボ
ン酸成分単位およびジアミン成分単位のトータルモル数
に対して03〜IOモル%過剰にジアミン成分を仕込む
ことを意味する。ここでいうジアミン成分とは戻素数6
〜18の脂肪族γルキレ7ジアミ/であるが、本ポリア
ミドを構成するジアミン成分を添加するのが好ましい。
ジアミン成分の添加量は0.3〜lOモル%、好ましく
は0.6〜8モル%の範囲にあることが必要である。添
加■が0.3モル%より少ないと溶融押出しによる高重
合度化条件が狭くなり、安定した運転が不可能になるの
で好ましくない。また、10モル%よりも多くなると溶
融押出機での高重合度化が難しくなるので好ましくない
。
本発明の低次縮合物の相対粘度(ηr)は101−1.
6であることが必要であり、好ましくは1.01〜1.
5、より好ましくは1.01〜l 4の範囲であること
が必要である。相対粘度が101よりも低いと溶融押出
し高重合度化工程で組成比が変動する原因になったり、
高m合皮化不充分となり好ましくない。また、相対粘度
が1、 6よりも大きいと低次縮合物の溶融粘度が高く
なりすぎ吐出不良を起こしたり、あるいは低次縮合物が
析出したりして吐出不良を起こすので好ましくない。
本発明の低次縮合物を作る装置については特に制限がな
(、バッチ反応釜、または1〜4槽式の連続反応装置な
ど公知のものを使用できる。
本発明の該低次縮合物を溶融押出機で高重合度化する方
法と、は、ベントロ付き溶融押出機を用いて、減圧また
は窒素ガス雰囲気下で溶融押出しすることによって高重
合度化する方法である。
本発明によれば、 [N112] リッチの低次縮合物
にジカルボン酸成分を添加して溶融押出しすることよっ
て、非常に効率よく安定した高重合度化ポリマを得るこ
とができる。ジカルボン酸成分としてはアジピン酸、セ
パノン酸等の脂肪族ジカルボン酸またはテレフタル酸、
イソフタル酸等の芳香族ジカルボン酸を挙げることがで
きるが、好ましくはイソフタル酸、テレフタル酸であり
、特に好ましくはテレフタル酸である。ジカルボン酸の
添加量は低次縮合物の過剰[N112]に相当するモル
数また、は[NI+2] −20x I O−’mol
/gになるようにするのが好ましい。ジカルボン酸の添
加量が低次縮合物の[NI+23 よりも多くなったり
、 [NI+2]−20XICM’■ol/gよりも少
なくなると良好な高重合度化ペレットが得られなくなる
ので好ましくない。
また、本発明によれば、溶融押出し工程で良好な高重合
度化ペレットを得るにはリン系触媒の存在が不可欠であ
り、添加量は低次縮合物に対して005〜2wt%が好
ましく、より好ましくは0゜1〜12W<Industrial Application Field> The present invention relates to a method for producing a polyamide resin, in which a low-order condensate is prepared from an aqueous solution of monomers or salts as constituent units, and the degree of polymerization is increased using a melt extruder. This polyamide resin is especially suitable for thin-walled molded products such as connectors and coil bobbins that are used in high-temperature environments! This is related to the 2-way method. <Prior art> Polyamide has been widely used in the automobile field, electric/electronic field, etc. due to its excellent properties as an engineering plastic, and is used as a material for thin-walled molded products such as connectors and coil bobbins. It is also often used as Conventionally, nylon 6 and nylon 66 reinforced with glass fibers have been used for these molded products (Japanese Patent Laid-Open No. 59-1
61461), and with the rise in temperature in automobile engine compartments due to recent technological innovations and advances in microelectronics, there has been a demand for materials for ultra-thin molded products that can withstand use in even higher temperature environments. However, the melting points (Tm) of nylon 6 and nylon 66 are 220°C and 220°C, respectively.
Even when the temperature is 260° C. and reinforced with glass fiber, the limit of the heat distortion temperature remains at the melting point. Recently, many copolyamide resin compositions containing terephthalic acid and inophthalic acid, or glass-reinforced products thereof, have been proposed as copolyamide resin compositions that can withstand use in these high-temperature environments (Japanese Patent Laid-Open No. 59-1614).
28, JP 59155426, JP 59-5353
6, Japanese Patent Publication No. 62-156130). <Problems to be Solved by the Invention> However, in these copolyamide resin compositions containing terephthalic acid and isophthalic acid, as the number of terephthalic acid component units increases, the melt viscosity becomes high, and it may be impossible to discharge using a normal melt polymerization method. Because the polymer melting point is close to the thermal decomposition temperature of the polymer, decomposition and deterioration occurred during melt polymerization. In addition, the method of conducting a polymerization reaction from a nylon salt to a polymer in a solid state has problems such as the composition of the polymer being unstable. In view of the above circumstances, the present inventors have conducted extensive studies on a method for producing a polyamide resin composition that is inexpensive and has good fluidity, has high rigidity and heat resistance that can withstand use in high-temperature atmospheres. . <Means for Solving the Problems> As a result of intensive studies by the present inventors to solve the above problems,
[NI+2] By creating a rich low-order condensate and adding a dicarboxylic acid component when increasing the degree of polymerization using a melt extruder, a stable polymer with a high degree of polymerization can be obtained and the above problems can be efficiently achieved. We have discovered this and arrived at the present invention. That is, the present invention consists of the following repeating components (I) to (III) (I)-118-(CR2)e-C (wherein R is an aliphatic group having 6 to 18 carbon atoms, R. 7, (1) in producing a polyamide containing (summer) and/or (II) as essential components.
A noamino component of 0.3 to 10 mol% is charged in excess to the average total mole number of the monomer components constituting ~(Ill), and the mixture is heated at 150°C to 300°C, 20 kg/cm'
The relative viscosity (ηr) of a 1% sulfuric acid solution at 25°C satisfies 1.01-1.6 under the following conditions: -G [N)
12] A method for producing a polyamide resin, which is characterized in that when a rich low-order condensate is produced and the low-order condensate is increased in degree of polymerization using a melt extruder, an insufficient dicarboxylic acid component is added. The polyamide resin of the present invention is (1) an aliphatic alkylene terephthalamide unit synthesized from an aliphatic alkylene diamine having 6 to 18 carbon atoms and terephthalic acid, (11) an aliphatic alkylene diamine having 6 to 18 carbon atoms and isophthalic acid. an aliphatic alkylene isophthalamide unit synthesized from or a condensate formed from an aliphatic alkylene 7-noamine having 6 to 18 carbon atoms and an aliphatic alkylene dicarboxylic acid having 4 to 18 carbon atoms; (I) lactams or 5 carbon atoms; ~
It is a composite formed from the il1 position of 18 aliphatic aminocarboxylic acid components and in which (1) or (11) is an essential component. Specific examples of aliphatic alkylene 7-noamines having 6 to 18 carbon atoms include ], 6-diaminohebyusan, 1,7-diaminohebbutane, 1. 8-Noaminooctane, l, 9
-diaminononane, l, 10diaminodecane, 111
-Noaminooctane, 1,12-diaminododecane,
1. Examples include 4-diaminododecane, 116-diaminohexadecane, and 18-diaminooctadecane. In addition, specific examples of aliphatic alkylene dicarboxylic acid components having a return prime number of 4 to 18 include succinic acid, glutaric acid, adipic acid, pimelic acid, superic acid, azelaic acid, sepa/noic acid, undecanionic acid,
Examples include dodecanoic acid, gly/phosphoric acid, tetradecanoic acid, pentadecanoic acid, and octadeca/diacid. Among these aliphatic alkaline dicarboxylic acid components, adipic acid, sebannic acid, unodecandioic acid, and dodecanoic acid are preferred. Furthermore, specific examples of lactams include ε-caprolactam, ζ-enanotractam, η-capryllactam, and ω-laurolactam. Specific examples of the aliphatic aminocarboxylic acid component having a return prime number of 5 to 18 include 6-amitsucabronoic acid, 11-aminododecanoic acid, and 12-aminododecanoic acid. The polyamide of the present invention is a polyamide containing (T) and/or (■) as essential components, (I), (n
) are ih, respectively, and (+)/(I+
), (1)/([[+> and (■)/(t[I) binary copolymer polyamide or (1)/(n)/(I)
It contains a tertiary copolymerized polyamide. There is no particular restriction on the degree of polymerization of the polyamide used here, and any polyamide having a relative viscosity (ηr) of 1% sulfuric acid solution at 25° C. of 15 to 5.0 can be used. 150°C to 300°C, 20 kg/c■2-G of the present invention
The lower-order condensate prepared under the following conditions is as follows: (1) The aqueous solution described in (1) is charged into a pressure polymerization kettle, and under tgI stirring conditions 150
Heat to 300°C. Reaction temperature is 150℃~300℃
℃, preferably 180°C to 280°C
It is. If the reaction temperature is lower than 150°C, the reaction time will be longer, which is undesirable. Conversely, if the reaction temperature is higher than 300°C, the viscosity of the lower-order condensate will become too high, or it will precipitate, making it impossible to discharge, so it is not preferable. do not have. The pressure when producing the low-order condensate of the present invention means the equilibrium pressure due to the mixture of the low-order condensate and water at that time, and the pressure increases as the internal temperature rises, so the pressure inside the system is 20
The pressure is maintained at a constant pressure of 2-f kg/c; The lower condensate can be discharged from the polymerization vessel in a molten state at a temperature of 150 DEG C. to 300 DEG C., since the presence of a small amount of water provides a significant freezing point depression. Therefore, the pressure inside the pot must be maintained at 20 kg/cm2-G or less, preferably 5-18 kg/cm2-G. The [NH2]-rich low-order condensate of the present invention refers to the raw materials that are generally prepared in normal polyamide polymerization so that the total amount of NH2 groups contained in the monomer and salt is equal to the total amount of NH2 groups. However, in the present invention, the diamine component is added in large excess when preparing raw materials [N112]
The main focus is on actively producing low-order rich condensates. This means that the diamine component is charged in an excess of 03 to IO mol % relative to the total number of moles of the carboxylic acid component units and diamine component units of the monomers or salts as constituent components. The diamine component here refers to the return prime number 6.
-18 aliphatic γ-alkylene 7 diamine/, but it is preferable to add the diamine component constituting the present polyamide. The amount of the diamine component added must be in the range of 0.3 to 10 mol%, preferably 0.6 to 8 mol%. If the amount of addition (2) is less than 0.3 mol%, the conditions for increasing the degree of polymerization by melt extrusion become narrower, making stable operation impossible, which is not preferable. Moreover, if it exceeds 10 mol%, it becomes difficult to achieve a high degree of polymerization in a melt extruder, which is not preferable. The relative viscosity (ηr) of the low-order condensate of the present invention is 101-1.
6, preferably 1.01 to 1.
5, more preferably in the range of 1.01 to l4. If the relative viscosity is lower than 101, it may cause the composition ratio to fluctuate during the melt extrusion process to increase the degree of polymerization.
This is not preferable because the conversion to high m synthetic leather is insufficient. Furthermore, if the relative viscosity is greater than 1 or 6, the melt viscosity of the lower-order condensate becomes too high, causing discharge failure, or the lower-order condensate precipitates, causing discharge failure, which is not preferable. There are no particular limitations on the apparatus for producing the lower condensate of the present invention (any known device such as a batch reaction vessel or a 1- to 4-tank continuous reaction apparatus can be used). [ N112] By adding a dicarboxylic acid component to a rich low-order condensate and melt-extruding it, a stable highly polymerized polymer can be obtained very efficiently.As the dicarboxylic acid component, adipic acid, sepanonic acid, etc. aliphatic dicarboxylic acid or terephthalic acid,
Aromatic dicarboxylic acids such as isophthalic acid can be mentioned, but isophthalic acid and terephthalic acid are preferred, and terephthalic acid is particularly preferred. The amount of dicarboxylic acid added is the number of moles corresponding to the excess [N112] of the lower condensate, or [NI+2] -20x I O-'mol
/g. If the amount of dicarboxylic acid added is more than [NI+23] of the low-order condensate or less than [NI+2]-20XICM'■ol/g, it is not preferable because good pellets with a high degree of polymerization cannot be obtained. Further, according to the present invention, the presence of a phosphorus catalyst is essential to obtain pellets with a good degree of polymerization in the melt extrusion process, and the amount added is preferably 0.05 to 2 wt% based on the lower condensate. More preferably 0°1~12W
【%である。添
加量が0.05wt%よりも少ないと良好な高重合度化
ペレットが得られず、2wt%より多くても効果が上が
らず好ましくない。リン系化合物の具体例としてはH3
P0A+1I3PO3、H3PO2、II 4 P 2
0v、Na11tPOa・21120、Na2HPOa
・12H20、N113P04−121120、Na1
12POa・1120、HatP207弓0H20、N
a 2 Ht P 20 ? −61+ 20、
N15P30+s、 Call5P(011)2、C
a11sPO(ONa)2、Cs1sPO(OH)2、
Mn(II2PO2)2、(C61+5O)3Pなどを
挙げることができる。好ましくはHz P Oa、1l
JP207である。リン化合物の添加方法については特
に制限がなく、低次縮合物を作るとき、あるいは低次縮
合物に予めブレンドし溶融押出しする方法などが簡便で
適している。
本発明によって得られるポリアミド樹脂は変性ポリオレ
フィンとブレンドすることが好ましい。
変性ポリオレフィンとはエチレン、プロピレン、ブテン
−15ペンテン−1,4−メチルペンテン−1,イソブ
チレン、I、 4−へキサジエン、シンクロペンタジ
ェン、215−フルボルナジエン、5−エチリデンノル
ボルネン、5−エチル−2゜5−ノルボルナジェン、5
−(1−プロペニル)−2−ノルボルネン、ブタジェン
、イソプレン、スチレンの内から選ばれた少なくともl
liのオレフィンをラジカル重合して得られるポリオレ
フィンにカルボン酸基、カルボン酸エステル基、カルボ
ン酸金属基、カルボ/酸無水物基、カルボン酸アミド基
、イミド基、アミノヒドロ牛ンエチル基の内から選ばれ
た少なくとも1種の官能基を有する中i体成分(以下、
官能基含有成分と称する)を導入して得られる変性ポリ
オレフィンである。
官能基含有成分の例を挙げると、アクリル酸、メタクリ
ル酸、マレイン酸、フマル酸、イタフン酸、クロトン酸
、メチルマレイン酸、メチルフマル酸、メサフン酸、
シトラコン酸、 グルタフッ酸およびこれらのカルボン
酸金属塩、マレイン酸水素メチル、イタフン酸水素メチ
ル、 (メタ)アクリル酸メチル、 (メタ)アクリル
酸エチル、 (メタ)アクリル酸ブチル、°(メタ)ア
クリル酸2エチルヘキンル、 (メタ)アクリル酸ヒド
ロキ/エチル、 (メタ)アクリル酸アミノエチル、マ
レイノ酸ジメチル、イタコン酸ンメチル、無水マレイン
酸、無水イタコン酸、無水シトラコン酸、エンドピノク
ロー[2,2,]]−]]5−ヘプテン2−ジカルボン
酸、エンドピンクロー12゜2、I]−5−へブテン−
2,3−ジカルボン酸無水物などのα、β−不飽和カル
ボン酸銹導体ならびにここで記したα、β−不飽和カル
ボン酸、そのエステル、その無水物、 (メタ)アクリ
ル酸グリ/ノル、 (メタ)アクリルグリ/ノルエーテ
ル、ビニルグリンノルエーテルなどのエボキン含有不飽
和化合物にアンモニア、メチルアミ/、エチルアミン、
ブチルアミン、ペキンルアミン、 ドデ/ルアミン、オ
レイルアミン、ステアリルアミン、ンクロへキンルアミ
ノ、ベンジルアミン、アニリン、ナフチルアミン、ツメ
チルアミン、ジエチルアミン、メチルエチアミン、ジブ
チルアミン、ジステアリルアミン、ジノクロへ牛/ルア
ミン、エチルノクロヘキ/ル2ミン、メチルアニリノ、
フェニルナフチルアミン、メラミン、エタノールアミン
、 3−アミノ−1−プロパツール、 ノエタノールア
ミン、モルホリン、α−アミノ−2−ピロリドン、a−
アミノ−ε−カプロラクタム、αモノメチルアミノ−ε
−カプロラクタム、αモノエチルアミノ−ε−カプロラ
クタム、α−モノベイノルアミノーε−カプロラクタム
、末端アミノ基のナイロンオリゴマー等を付加せしめて
得られるN−置換アミド化合物、N−置換イミド化合物
、N−[換ヒドロキ/エチル化合物などである。
これらの官能基含有成分を導入する方法は、特に制隔は
なく、主成分のオレフィン類と混合して共重合せしめた
り、ポリオレフイノにラジカル開始剤を用いてグラフト
導入するなどの方法を用いることができる。官能基含有
成分の導入■は通常、変性ポリオレフィン全体に幻して
、 0.001〜40モル%、好ましくは0.01〜3
5モル%の範囲内であるのが適当である。官能基含有成
分量が0.001モル%に満たないと変性ポリオレフィ
ンと共重合ポリアミドの親和性が不足し、1IIIIi
撃性付与効果が不十分になる傾向がある。一方、官能基
含有成分量が40モル%を越えるとゲル化などの副反応
が起こりやすくなる傾向がある。
本発明で特に有用な変性ポリオリフインの具体例として
はエチレン/(メタ)アクリル酸共重合体、およびこれ
らの共重合体中のカルボン酸部分の一部または全てをナ
トリウム、リチウム、亜鉛、カルンウム、カリウムなど
と塩にしたもの、エチレン/(メタ)アクリル酸メチル
共重合体、エチレン/(メタ)アクリル酸メチル共重合
体、エチレン/(メタ)アクリル酸エチル−g−fi水
ママレイン酸共重合体g″はグラフトを表わす。以下同
シ)、エチレン/(メタ)アクリル酸メチルg−無水マ
レイン酸共重合体、エチレン/(メタ)アクリル酸メチ
ル共重合体、エチレン/アクリル酸エチル−g−マレイ
ミド共重合体、エチレ//アクリル酸エチル−g−フェ
ニルマレイミド共重合体およびこれら共重合体の部分ケ
ン化物、エチレン/プロピレン二g−無ホマレイン酸共
重合体、エチレン/フテンー1−g−無水マレイン酸共
t1合体、 エチレン/プロピレン/1,4−一−キ
サノエ/−g−無水マレイン酸共出合体、エチレン/プ
ロピレン/シンクロペンタジェン−g無水マレイン酸共
重合体、エチレン/プロピレン/2,5−フルボルナン
エン−g−無水マレイン酸共重合体、エチレン/プロピ
レン−g−N−フェニルマレイミド共重合体、エチレン
/ブテノ1−g−N−7工ニルマレイミド共重合体、ス
チレン/ブタノエン−g−無水マレイン酸共重合体、ス
チレン/無水マレイノ酸共重合体などを挙げることがで
きる。
変性ポリオレフィンの配合量は共重合ポリアミド100
重量部に対して0〜toOii1部であり、好ましくは
5〜90f!量部の範囲内である。配合量が1ootr
量部を越えると成形品の耐熱性が不足するので好ましく
ない。
本発明にお1ブる上記変性ポリオレフィン配合ポリアミ
ドは更に充填剤を添加することが好ましい。
充填剤[C]とは、ガラス製の繊維あるいはビーズ、タ
ルク、カオリン、ウオラストナイト、マイカ、 、ノリ
力、 アルミナ、ケイソウ土、 クレーセラコラ、ベン
ガラ、グラファイト、二酸化チタン、酸化亜鉛、銅、ス
テンレスなどの粉状または板状の無機系化合物、他のポ
リマー繊維(炭素繊維)などであり、好ましくはガラス
繊維である。
ガラス繊維として特に好ましいのは直径3〜20μm程
度のガラスチロブトストランド、ガラス糸などである。
かかる充填剤の配合割合は共重合ポリアミド]OO[!
置部に対して0〜10011!量部の範囲にあることが
必要であり、好ましくは5〜901r量部の範囲、特に
好ましくはlO〜90賃量部である。充填剤の配合量が
100重量部を越えると溶融時の流動性が悪くなり、成
形品を射出成形する事が困難となるばかりでなく、成形
品外観が悪くなるので好ましくない。
本発明の共重合ポリアミドに充填剤および変性ポリオレ
フィンを配合する方法については特に制限がなく、公知
のいずれの方法も使用することができる。配合方法の具
体的例としてはポリアミドのベレットに変性ポリオレフ
ィンおよび充填剤をトライブレンドし、これを単軸スク
リューまたは二輪スクリュー押出機で溶融混練する方法
などが挙げられる。
また、本発明で得られるポリアミド樹脂組成物にはその
成形性や物性を損なわない限りにおいて、任意の工程に
おいて、他の成分たとえば顔料、染料、耐熱剤、触媒、
酸化防止剤、耐候剤、滑剤、結晶核剤、帯電防止剤、可
う剤、他の重合体などを添加することができる。
〈実施例〉
以下に実施例を示し本発明をさらに詳しく説明する。な
お、実施例および比較例中の諸特性は次の方法で測定し
た。
l)融点(Tm)
D S C(PERKIN−ELMER7型)を用い、
サンプル8〜l0mgを昇温速度20℃/minで測定
して得られた融解曲線の最大値を示す温度をTmとした
。
2)ポリアミドの末端基濃度[11+12]ポリアミド
Igを100m1のフSノール/エタノール(50/
50 w を比)混合溶媒に溶かし、175ONの塩酸
水溶液で滴定して求めた。
3)ポリアミドの末端基濃度[C00II]ポリアミド
0.5gを50m1の熱ベンノルアルコールに溶かし、
1 / 50 N −K OHのメタノール溶液で滴定
して求めた。
4)成形品外観
成形品の表面の肌荒れ、気泡、色調、光沢等を見た。
○: 光沢があり表面が平滑である。
△・ 光沢は落ちるが表面が平滑である。
×: 光沢もなく表面がザラザラである。
4)成形品の物性は次の方法で測定した。
引張り強度 : ASTM−D638曲げ強
度 ASTM−D790曲げ弾性率
: ASTM−D790I zod衝撃強度
: ASTM−D256熱変形温度(HDT):
ASTM−D648荷重 4.6kgf/e園2
荷重Ig、 6kgf/cm2
〈実施例】〉
ヘキサメチレンアンモニウムアジペート(66塩)9.
00kg、 テレフタル酸6,47kg。
へキサメチレンジアミンの64.5wt%水溶液8.4
1kgおよびイオン交換水6.40kgを0.05m”
のバッチ式m合釜に仕込み(ジアミノ成分単位およびジ
アミノ成分単位のトータルモル数に対して5モル%へキ
サメチレンジアミンを過剰仕込み)、窒素置換を充分行
った後水蒸気圧17.5kg/c■2−Gの加圧下で加
熱を続けた。攪拌下3.5hrかけて240℃に昇温し
た後、さらに30分間240℃〜245℃で維持し反応
を完結させた後、重合釜低部から差圧17. 5 kg
/c■2−(Hで低次縮合物を水中に吐出した。この低
次縮合物の粘度は+)r=]、]5、融点は299℃、
[C0OHコ =5 2x I O−’mol
/g、 [NI+2] = I O5x]
0−”mol/gであり、 53 X 10−’mo
l/g [)IH2] リ、チの低次縮合物であった
。得られた低次縮合物を100℃で24hr真空乾燥し
た後、低次縮合物1kgに対して43gのテレフタル酸
をトライブレンドし、30mmφのベント式二軸押出機
で260℃〜335℃の温度条件で溶融押出しをした。
ポリマ粘度ηr=2.90、ポリマ融点300℃の白色
ベレットを得た。
このペレット100重量部に対して長さ3mm直径13
μmのガラス繊維チ曹ブトストラッド65f11部をト
ライブレンドし、30mmφ単軸押出機でポリマ融点+
20℃の温度で溶融混合した。
この混合物を射出成形機により成形し、テストピースを
作成した。得られたテストピースを評価した結果を表1
に示す。
〈実施例2〉
テレフタル酸7.21kg、 ヘキサメチレンジアミ
7の64.5wt%水溶o8.51kg。
カプロラクタム5.25kgおよびイオノ交換水6.6
6kgを0.05m3のバッチ式加圧重合釜に仕込み(
ジアミン成分単位およびジカルボン酸成分単位のトータ
ルモル数に対して3モル%へキサメチレンジアミンを過
剰仕込み)、窒素置換を充分行った後、水蒸気圧15.
0 kg/e■2−〇の加圧下で加熱を続けた。攪拌
下5時間かけて225℃に昇温した後、さらに225℃
〜232℃で30分間反応を這行させた後、攪拌を止め
重合缶低部から差圧15. 0 kg/ex2−Gで低
次縮合物を抜きだした。得られた低次縮合物の融点は3
02℃、r)rは1.10、[C00II] = I
14 x l O−’mol/z、 [Nl+2]
= + 43 x 10−’mol/g、 であり、
[HF1t]=29xlO−’嘗at/g CNl+
2] リッチの低次縮合物であった。この低次縮合物1
kgに対してテレフタル酸24gをトライブレンドし、
実施例1の方法で溶融押出し、フンパウンドおよび成形
をし評価した。結果を表1に示した。
〈実施例3〉
テレフタルl116.70kg、 イソフタル酸3゜
61 k g、 ヘキサメチレンジアミンの64.5
W1%水溶液を12.26kgおよびイオン交換水5.
50kgを0.05m”のバッチ式重合釜に仕込み(ジ
アミン成分単位およびノカルボンMff分単位のトータ
ルモル数に対して5モル%へキサメチレンジアミンを過
剰仕込み)、窒素置換を充分行った後水蒸気圧17.
5 kg/c■2−Gの加圧下で加熱を続けた。攪拌下
5hrかけて230”Cに昇温した後、さらに30分間
235℃〜240℃で維持し反応を完結させた後、重合
釜低部から差圧17、 5 kg/cm”−Gで低次縮
合物を水中に吐出した。
この低次縮合物の粘度はηr=1.15、融点は318
℃であった。得られた低次縮合物を100’Cで24h
「真空乾燥した後、低次縮合物1kgに対して43gの
テレフタル酸をトライブレンドし、実施例1の方法で溶
融押出し、コンパウンドおよび成形をし評価した。結果
を表1に示した。
〈実施例4〜10>
実施例1の方法に従って原料および仕込量、テレフタル
酸添加量および変性ポリオリフイン、ガラス繊維配合量
などを変えて評価した結果を表1に示す。
く比較例1〉
fし79 ル1k15. 89 k g、 66ji
i+ o、 00kg1 へキサメチレンジアミンの
64.5wt%水溶fi6.37kgおよびイオン交換
水6.36kgを用いて、実施例1の方法で低次縮合物
を作った。この低次縮合物の粘度はηr=1.16、融
点は296℃、 [C0OR] = 82 x lO−
5mol/g、 [N112]= 63 x 10−
’mol/g7’ J51り、 19XIO−’■of
/g [CQOI+] リッチの低次縮合物であった。
得られた低次縮合物を100”Cで24fir真空乾燥
した後、30mmφのベント式二軸押出機で260℃〜
320”Cの温度条件で溶融押出しをした。発泡が著し
くベレット化ができながった。
〈比較例2〉
テレフタル酸5.30kg、 へキサメチレンジアミ
ンの64.5wt%水溶f15. 73kg、 66
塩11.00kgおよびイオン交換水6.36kgを0
.05m”のバッチ式重合釜に仕込み、窒素ガスで置換
した後水蒸気圧1.7. 5 kg/e■2−Gの加圧
下で加熱を続けた。245℃に達した後放圧を開始し、
さらに最高到達湿度315℃まで加熱を統イナな。次に
、この最高到達温度を保ち、放圧終了後100■mug
の減圧下で5〜lO分維持し重合を完結させた。このポ
リマを吐出した所、熱分解による発泡が著しく、しかも
不透明な白色ポリマであり、はとんどカッティングでき
なかった。
〈発明の効果〉
本発明で得られるポリアミド樹脂は特に高温雰囲気下で
の使用に耐え得る高い剛性と耐熱性を有し、安価でかつ
流動性も良好であることから、コネクター コイルボビ
ン等の薄肉成形品材料として遇している。[%. If the amount added is less than 0.05 wt%, good pellets with a high degree of polymerization cannot be obtained, and if the amount added is more than 2 wt%, the effect will not be improved, which is not preferable. A specific example of a phosphorus compound is H3
P0A+1I3PO3, H3PO2, II 4 P 2
0v, Na11tPOa・21120, Na2HPOa
・12H20, N113P04-121120, Na1
12POa・1120, HatP207 bow 0H20, N
a 2 Ht P 20 ? -61+20,
N15P30+s, Call5P(011)2, C
a11sPO(ONa)2, Cs1sPO(OH)2,
Examples include Mn(II2PO2)2 and (C61+5O)3P. Preferably Hz P Oa, 1l
It is JP207. There are no particular restrictions on the method of adding the phosphorus compound, and methods such as when preparing a low-order condensate, or a method in which it is blended in advance with a low-order condensate and melt-extruded are simple and suitable. The polyamide resin obtained according to the invention is preferably blended with a modified polyolefin. Modified polyolefins include ethylene, propylene, butene-15pentene-1,4-methylpentene-1, isobutylene, I, 4-hexadiene, synclopentadiene, 215-flubornadiene, 5-ethylidenenorbornene, 5-ethyl-2゜5-norbornagene, 5
At least 1 selected from -(1-propenyl)-2-norbornene, butadiene, isoprene, and styrene.
The polyolefin obtained by radical polymerization of the olefin of The intermediate i-form component (hereinafter referred to as
This is a modified polyolefin obtained by introducing a functional group-containing component. Examples of functional group-containing components include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itafonic acid, crotonic acid, methylmaleic acid, methylfumaric acid, mesafonic acid,
Citraconic acid, glutafluoric acid and their carboxylic acid metal salts, methyl hydrogen maleate, methyl hydrogen itafunate, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, °(meth)acrylic acid 2-ethylhexyl, hydroxy/ethyl (meth)acrylate, aminoethyl (meth)acrylate, dimethyl maleinoate, methyl itaconate, maleic anhydride, itaconic anhydride, citraconic anhydride, endopinochlor [2,2,] -]]5-heptene 2-dicarboxylic acid, endopin claw 12゜2, I]-5-hebutene-
α,β-unsaturated carboxylic acid conductors such as 2,3-dicarboxylic anhydride, α,β-unsaturated carboxylic acids mentioned herein, their esters, their anhydrides, (meth)acrylic acid glyc/nor, Evoquin-containing unsaturated compounds such as (meth)acrylic glycol/nor ether and vinyl glycol norether, ammonia, methyl amine/, ethyl amine, etc.
Butylamine, pechinluamine, dode/luamine, oleylamine, stearylamine, chlorohexylamine, benzylamine, aniline, naphthylamine, trimethylamine, diethylamine, methylethiamine, dibutylamine, distearylamine, dinochloramine, ethylnochlorhexylamine 2min, methylanilino,
Phenylnaphthylamine, melamine, ethanolamine, 3-amino-1-propatol, noethanolamine, morpholine, α-amino-2-pyrrolidone, a-
Amino-ε-caprolactam, α-monomethylamino-ε
N-substituted amide compounds, N-substituted imide compounds, N-[ Examples include converted hydroxy/ethyl compounds. The method of introducing these functional group-containing components is not particularly limited, and methods such as mixing with the main component olefins and copolymerizing them, or grafting them into polyolefin using a radical initiator can be used. can. The introduction of the functional group-containing component (2) is usually 0.001 to 40 mol%, preferably 0.01 to 3 mol%, based on the entire modified polyolefin.
It is suitably within the range of 5 mol%. If the amount of the functional group-containing component is less than 0.001 mol%, the affinity between the modified polyolefin and the copolyamide will be insufficient, and 1IIIi
The impact imparting effect tends to be insufficient. On the other hand, if the amount of functional group-containing components exceeds 40 mol %, side reactions such as gelation tend to occur more easily. Specific examples of modified polyolefins particularly useful in the present invention include ethylene/(meth)acrylic acid copolymers, and some or all of the carboxylic acid moieties in these copolymers replaced with sodium, lithium, zinc, carunium, or potassium. etc., ethylene/methyl(meth)acrylate copolymer, ethylene/methyl(meth)acrylate copolymer, ethylene/ethyl(meth)acrylate-g-fihydromamamaleic acid copolymerg '' represents a graft. Hereinafter, ethylene/methyl(meth)acrylate g-maleic anhydride copolymer, ethylene/methyl(meth)acrylate copolymer, ethylene/ethyl acrylate-g-maleimide copolymer Polymer, ethyl//ethyl acrylate-g-phenylmaleimide copolymer and partially saponified products of these copolymers, ethylene/propylene di-g-anofomaleic acid copolymer, ethylene/phthene-g-maleic anhydride co-t1 copolymer, ethylene/propylene/1,4-1-xanoe/-g-maleic anhydride copolymer, ethylene/propylene/synchropentadiene-g-maleic anhydride copolymer, ethylene/propylene/2,5- Flubornane-g-maleic anhydride copolymer, ethylene/propylene-g-N-phenylmaleimide copolymer, ethylene/buteno-g-N-7-enylmaleimide copolymer, styrene/butanoene-g-maleic anhydride Examples include acid copolymers, styrene/maleino acid anhydride copolymers, etc. The blending amount of the modified polyolefin is 100% of the copolymerized polyamide.
It is 0 to 1 part by weight, preferably 5 to 90f! Within the range of quantitative parts. The blending amount is 1ootr
Exceeding this amount is not preferable because the molded product will lack heat resistance. It is preferable that a filler is further added to the modified polyolefin-containing polyamide according to the present invention. Fillers [C] include glass fibers or beads, talc, kaolin, wollastonite, mica, glue, alumina, diatomaceous earth, clay ceracola, red iron, graphite, titanium dioxide, zinc oxide, copper, stainless steel, etc. powder or plate-like inorganic compounds, other polymer fibers (carbon fibers), etc., and glass fibers are preferable. Particularly preferred glass fibers are glass tyrobuton strands, glass threads, etc. having a diameter of about 3 to 20 μm. The blending ratio of such filler is copolyamide]OO[!
0 to 10011 against Okibe! The amount should be in the range of 10 to 90 parts, preferably 5 to 901 parts, particularly preferably 10 to 90 parts. If the blending amount of the filler exceeds 100 parts by weight, the fluidity during melting will deteriorate, making it difficult to injection mold the molded product, and the appearance of the molded product will deteriorate, which is not preferable. There is no particular restriction on the method of blending the filler and modified polyolefin into the copolyamide of the present invention, and any known method can be used. A specific example of the blending method is a method in which a modified polyolefin and a filler are triblended into a pellet of polyamide, and this is melt-kneaded using a single screw or two-wheel screw extruder. In addition, the polyamide resin composition obtained by the present invention may contain other components such as pigments, dyes, heat resistant agents, catalysts,
Antioxidants, weathering agents, lubricants, crystal nucleating agents, antistatic agents, softeners, other polymers, and the like can be added. <Example> The present invention will be explained in more detail by showing examples below. In addition, various properties in Examples and Comparative Examples were measured by the following methods. l) Melting point (Tm) Using DSC (PERKIN-ELMER7 type),
The temperature at which the maximum value of the melting curve obtained by measuring 8 to 10 mg of the sample at a heating rate of 20° C./min was defined as Tm. 2) End group concentration of polyamide [11+12] Polyamide Ig was mixed with 100 ml of FSN/ethanol (50/
It was determined by dissolving 50 w in a mixed solvent and titrating it with a 175ON aqueous hydrochloric acid solution. 3) End group concentration of polyamide [C00II] Dissolve 0.5 g of polyamide in 50 ml of hot benol alcohol,
It was determined by titration with a methanol solution of 1/50 N-KOH. 4) Appearance of molded product The surface roughness, air bubbles, color tone, gloss, etc. of the molded product were observed. ○: Glossy and smooth surface. △・ The gloss is reduced, but the surface is smooth. ×: The surface is rough and has no luster. 4) Physical properties of the molded product were measured by the following method. Tensile strength: ASTM-D638 bending strength ASTM-D790 bending modulus
: ASTM-D790I zod impact strength
: ASTM-D256 Heat Distortion Temperature (HDT):
ASTM-D648 load 4.6 kgf/e Garden 2 Load Ig, 6 kgf/cm2 <Example>> Hexamethylene ammonium adipate (66 salt)9.
00kg, terephthalic acid 6,47kg. 64.5 wt% aqueous solution of hexamethylene diamine 8.4
1kg and 6.40kg of ion exchange water to 0.05m”
(5 mol% hexamethylene diamine was added in excess of the total number of moles of diamino component units and diamino component units) into a batch-type m-cooker, and after sufficient nitrogen substitution, the water vapor pressure was 17.5 kg/c. Heating was continued under a pressure of 2-G. After raising the temperature to 240°C over 3.5 hours with stirring, and maintaining the temperature at 240°C to 245°C for another 30 minutes to complete the reaction, a differential pressure of 17.0°C was applied from the bottom of the polymerization vessel. 5 kg
/c■2-(H) The lower condensate was discharged into water.The viscosity of this lower condensate was +)r=], ]5, the melting point was 299°C,
[C0OH = 5 2x I O-'mol
/g, [NI+2] = IO5x]
0-"mol/g, 53 x 10-'mo
l/g [)IH2] It was a low-order condensate of Li and Chi. After vacuum drying the obtained low-order condensate at 100°C for 24 hours, 43g of terephthalic acid was triblended with respect to 1 kg of the low-order condensate, and the mixture was heated at a temperature of 260°C to 335°C using a 30mmφ vented twin-screw extruder. Melt extrusion was carried out under the following conditions. A white pellet having a polymer viscosity ηr=2.90 and a polymer melting point of 300°C was obtained. For 100 parts by weight of this pellet, the length is 3 mm and the diameter is 13.
Tri-blend 11 parts of 65mm glass fiber nitride carbonate strut, and use a 30mmφ single-screw extruder to obtain a polymer with a melting point of +
Melt mixing was carried out at a temperature of 20°C. This mixture was molded using an injection molding machine to create a test piece. Table 1 shows the results of evaluating the obtained test piece.
Shown below. <Example 2> 7.21 kg of terephthalic acid, 8.51 kg of 64.5 wt% aqueous solution of hexamethylene diamide 7. Caprolactam 5.25 kg and ion exchange water 6.6
Charge 6 kg into a 0.05 m3 batch type pressure polymerization pot (
Hexamethylene diamine was charged in excess by 3 mol % based on the total number of moles of diamine component units and dicarboxylic acid component units), and after sufficient nitrogen substitution, the water vapor pressure was reduced to 15.
Heating was continued under a pressure of 0 kg/e 2-0. After raising the temperature to 225°C over 5 hours with stirring, the temperature was further increased to 225°C.
After allowing the reaction to proceed at ~232°C for 30 minutes, stirring was stopped and the pressure difference from the bottom of the polymerization vessel was 15. The lower condensate was extracted at 0 kg/ex2-G. The melting point of the obtained lower condensate is 3
02℃, r) r is 1.10, [C00II] = I
14 x l O-'mol/z, [Nl+2]
= + 43 x 10-'mol/g,
[HF1t]=29xlO−'嘗at/g CNl+
2] It was a rich, low-order condensate. This lower condensate 1
Tri-blend 24g of terephthalic acid per kg,
Melt extrusion, molding and molding were carried out by the method of Example 1, and evaluation was made. The results are shown in Table 1. <Example 3> 116.70 kg of terephthal, 3.61 kg of isophthalic acid, 64.5 kg of hexamethylene diamine
12.26 kg of W1% aqueous solution and ion exchange water5.
50 kg was charged into a 0.05 m'' batch type polymerization pot (5 mol% hexamethylene diamine was charged in excess of the total number of moles of diamine component units and nocarboxylic Mff min units), and after sufficient nitrogen substitution, the water vapor pressure 17.
Heating was continued under a pressure of 5 kg/c 2-G. The temperature was raised to 230"C over 5 hours with stirring, and then maintained at 235°C to 240°C for an additional 30 minutes to complete the reaction. The sub-condensate was discharged into water. The viscosity of this low-order condensate is ηr=1.15, and the melting point is 318.
It was ℃. The obtained lower condensate was heated at 100'C for 24 h.
After vacuum drying, 43 g of terephthalic acid was triblended with respect to 1 kg of the low-order condensate, and the mixture was melt-extruded, compounded, and molded using the method of Example 1, and evaluated. The results are shown in Table 1. Examples 4 to 10> Table 1 shows the results of evaluations performed by changing the raw materials and charging amounts, the amount of terephthalic acid added, and the amount of modified polyolefin and glass fiber blended according to the method of Example 1. Comparative Example 1> 1k15.89kg, 66ji
i+o, 00 kg1 A lower condensate was prepared by the method of Example 1 using 6.37 kg of 64.5 wt% aqueous fi of hexamethylene diamine and 6.36 kg of ion-exchanged water. The viscosity of this low-order condensate is ηr=1.16, the melting point is 296°C, [C0OR] = 82 x 1O−
5mol/g, [N112] = 63 x 10-
'mol/g7' J51ri, 19XIO-'■of
/g [CQOI+] It was a rich low-order condensate. The obtained low-order condensate was vacuum-dried at 100"C and 24fir, and then heated to 260℃ using a 30mmφ vented twin-screw extruder.
Melt extrusion was carried out at a temperature of 320"C. Foaming was significant and pelletization was not possible. <Comparative Example 2> 5.30 kg of terephthalic acid, 64.5 wt% aqueous solution of hexamethylene diamine f15. 73 kg, 66
11.00 kg of salt and 6.36 kg of ion exchange water
.. 05m" batch type polymerization reactor, and after purging with nitrogen gas, heating was continued under pressure of water vapor pressure of 1.7.5 kg/e2-G. After reaching 245°C, depressurization was started. ,
Furthermore, it can be heated up to a maximum humidity of 315℃. Next, maintain this maximum temperature and 100 μg after pressure release is completed.
Polymerization was completed under reduced pressure of 5 to 10 minutes. When this polymer was discharged, it foamed significantly due to thermal decomposition, and was an opaque white polymer that could hardly be cut. <Effects of the Invention> The polyamide resin obtained by the present invention has high rigidity and heat resistance that can withstand use in high-temperature atmospheres, is inexpensive, and has good fluidity, so it can be used for thin-walled molding of connectors, coil bobbins, etc. It is treated as a product material.
Claims (1)
〜18の脂肪族基、または▲数式、化学式、表等があり
ます▼であり、nは5〜18の整数を表わす。) からなり、( I )および/または(II)を必須成分と
して含む、ポリアミドを製造するに当たって、( I )
〜(III)を構成するモノマー成分単位のトータルモル
数に対して0.3〜10モル%のジアミン成分を過剰に
仕込み、150℃〜300℃、20kg/cm^2−G
以下の条件下で、1%硫酸溶液の25℃における相対粘
度(ηr)が1.01〜1.6を満足する[NH_2]
リッチの低次縮合物をつくり、該低次縮合物を溶融押出
機で高重合度化する際、不足のジカルボン酸成分を添加
することを特徴とするポリアミド樹脂の製造方法。[Claims] Repetitive components of the following (I) to (III) (I) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (II) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (III) ▲ Numerical formulas, There are chemical formulas, tables, etc.▼ (In the formula, R is an aliphatic group with 6 to 18 carbon atoms, and R' is an aliphatic group with 4 carbon atoms.
~18 aliphatic groups, or ▲There are mathematical formulas, chemical formulas, tables, etc.▼, and n represents an integer from 5 to 18. ) and containing (I) and/or (II) as essential components, (I)
A diamine component of 0.3 to 10 mol% is added in excess to the total number of moles of the monomer component units constituting ~(III), 150°C to 300°C, 20kg/cm^2-G
Under the following conditions, the relative viscosity (ηr) of 1% sulfuric acid solution at 25°C satisfies 1.01 to 1.6 [NH_2]
1. A method for producing a polyamide resin, which comprises producing a rich low-order condensate, and adding an insufficient dicarboxylic acid component when increasing the degree of polymerization of the low-order condensate using a melt extruder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2163270A JP2515915B2 (en) | 1990-06-20 | 1990-06-20 | Method for producing polyamide resin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2163270A JP2515915B2 (en) | 1990-06-20 | 1990-06-20 | Method for producing polyamide resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0453827A true JPH0453827A (en) | 1992-02-21 |
| JP2515915B2 JP2515915B2 (en) | 1996-07-10 |
Family
ID=15770621
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2163270A Expired - Fee Related JP2515915B2 (en) | 1990-06-20 | 1990-06-20 | Method for producing polyamide resin |
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| Country | Link |
|---|---|
| JP (1) | JP2515915B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023298A (en) * | 2006-10-30 | 2007-02-01 | Toray Ind Inc | Polyamide resin composition for connectors |
| CN102628409A (en) * | 2011-12-06 | 2012-08-08 | 马勒技术投资(中国)有限公司 | Discontinuous rotation surface cast iron inlaying ring |
| JPWO2015093060A1 (en) * | 2013-12-20 | 2017-03-16 | 三井化学株式会社 | Semi-aromatic polyamide resin composition and molded product thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02163263A (en) * | 1989-07-21 | 1990-06-22 | Toshiba Corp | Sorter device |
-
1990
- 1990-06-20 JP JP2163270A patent/JP2515915B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02163263A (en) * | 1989-07-21 | 1990-06-22 | Toshiba Corp | Sorter device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023298A (en) * | 2006-10-30 | 2007-02-01 | Toray Ind Inc | Polyamide resin composition for connectors |
| CN102628409A (en) * | 2011-12-06 | 2012-08-08 | 马勒技术投资(中国)有限公司 | Discontinuous rotation surface cast iron inlaying ring |
| JPWO2015093060A1 (en) * | 2013-12-20 | 2017-03-16 | 三井化学株式会社 | Semi-aromatic polyamide resin composition and molded product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2515915B2 (en) | 1996-07-10 |
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