JPH0455135U - - Google Patents
Info
- Publication number
- JPH0455135U JPH0455135U JP9704090U JP9704090U JPH0455135U JP H0455135 U JPH0455135 U JP H0455135U JP 9704090 U JP9704090 U JP 9704090U JP 9704090 U JP9704090 U JP 9704090U JP H0455135 U JPH0455135 U JP H0455135U
- Authority
- JP
- Japan
- Prior art keywords
- board
- mounting table
- circuit board
- circuit
- chip supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Automatic Assembly (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9704090U JPH0455135U (2) | 1990-09-13 | 1990-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9704090U JPH0455135U (2) | 1990-09-13 | 1990-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0455135U true JPH0455135U (2) | 1992-05-12 |
Family
ID=31837083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9704090U Pending JPH0455135U (2) | 1990-09-13 | 1990-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455135U (2) |
-
1990
- 1990-09-13 JP JP9704090U patent/JPH0455135U/ja active Pending
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