JPH0455376A - Production of activated brazing filler metal - Google Patents
Production of activated brazing filler metalInfo
- Publication number
- JPH0455376A JPH0455376A JP16432790A JP16432790A JPH0455376A JP H0455376 A JPH0455376 A JP H0455376A JP 16432790 A JP16432790 A JP 16432790A JP 16432790 A JP16432790 A JP 16432790A JP H0455376 A JPH0455376 A JP H0455376A
- Authority
- JP
- Japan
- Prior art keywords
- brazing filler
- filler metal
- plating
- metal
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 36
- 238000005219 brazing Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000945 filler Substances 0.000 title abstract description 22
- 238000007747 plating Methods 0.000 claims abstract description 20
- 239000011888 foil Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 abstract description 9
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 229910052793 cadmium Inorganic materials 0.000 abstract description 2
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 238000009713 electroplating Methods 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910052763 palladium Inorganic materials 0.000 abstract description 2
- 229910052697 platinum Inorganic materials 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、セラミックスをろう付する際に用いる活性ろ
う材の簡便な製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a simple method for producing an active brazing material used in brazing ceramics.
〔従来の技術]
セラミックスのろう付けに用いる活性ろう材は、高真空
中でTi又はZrとろう材用金属を溶融混合したのち圧
延して作る合金箔と、Ti又は2「の箔又は根とろう材
用金!1ifi!i又は板を重ね合わせて圧延して作る
積層箔とがある。[Prior art] The active brazing material used for brazing ceramics is made of an alloy foil made by melting and mixing Ti or Zr and a brazing material metal in a high vacuum, and then rolling it, and a Ti or 2" foil or root. There is gold for brazing filler metal!1ifi!i and laminated foil made by stacking and rolling plates.
【発明が解決しようとする課題1
これら従来の活性ろう材の製造には熱間圧延工程が必要
であるが、活性金属を含むろう材の場合、活性金属の酸
化を防止するために、高真空中又は不活性ガス中で圧延
を行なわねばならず、特別な圧延装置が必要であった。Problem to be Solved by the Invention 1 The production of these conventional active brazing fillers requires a hot rolling process, but in the case of brazing fillers containing active metals, high vacuum rolling is required to prevent oxidation of the active metals. Rolling had to be carried out in medium or inert gas, and special rolling equipment was required.
1課題を解決するための手段]
発明者らは、圧延工程のない、簡単な活性ろう材箔の製
法について研究し、活性金属上にろう材成分をメッキす
ることにより問題を解決した。Means for Solving 1 Problem] The inventors researched a simple method for producing active brazing filler metal foil that does not require a rolling process, and solved the problem by plating a brazing filler metal component onto an active metal.
すなわち本発明は、Ti又はZrの箔又は板の表面に、
メッキ法により、ろう材成分の金属層を設けることを特
徴とする活性ろう材の製造方法である。That is, in the present invention, on the surface of a Ti or Zr foil or plate,
This is a method for producing an active brazing material, characterized in that a metal layer of a brazing material component is provided by a plating method.
本発明の方法において、活性金属としてはTi又は2「
が用いられ、それらの箔又は板は、一般に市販されてい
るものでよ(、厚みや寸法は任意に選択できる。In the method of the invention, the active metal is Ti or
These foils or plates are generally commercially available (thickness and dimensions can be selected arbitrarily).
ろう材成分としては、メッキ法が適用できるものであれ
ば何でもよく、例えばAu、 Ag、 Cu、 Ni、
Zn、Cd、 Sn、 Pd、 Pt、などが挙げられ
る。これらのうち単成分でも、二種以上を用いても良い
、二種以上の場合は、合金メッキでも、積層メッキでも
よい。The brazing filler metal component may be anything as long as the plating method can be applied, such as Au, Ag, Cu, Ni, etc.
Examples include Zn, Cd, Sn, Pd, and Pt. Of these, a single component or two or more types may be used. In the case of two or more types, alloy plating or laminated plating may be used.
メッキ法は電解メッキ、無電解メッキのいずれでもよく
、従来公知の方法、条件すべてが適用できる。The plating method may be either electrolytic plating or electroless plating, and all conventionally known methods and conditions can be applied.
本発明の方法によって得られた活性ろう材は、従来の活
性ろう材と同様にセラミックスのろう付けに用いること
ができる。The activated brazing material obtained by the method of the present invention can be used for brazing ceramics in the same way as conventional active brazing materials.
[作用]
メッキによるろう材の積層は、低温による処理が行われ
るので、活性金属の酸化による活性ろう材の性能低下を
生じない、また、メッキ条件の設定によりろう材の積層
量を任意に制御することができる。[Function] Since the lamination of brazing filler metal by plating is performed at low temperatures, there is no reduction in the performance of the active brazing filler metal due to oxidation of the active metal, and the amount of lamination of brazing filler metal can be arbitrarily controlled by setting the plating conditions. can do.
【実施例1
厚さ50mmのTi箔(竹内金属箔扮工業社製)を10
0■■角に切断し、陰極に接続した後、硫酸銅浴により
4.3gw+の厚さになるよう銅メッキをかけ、更に
Niワット浴によりlOμ閣の厚さになるようにNiメ
ッキをかけて、活性ろう材をつくった。[Example 1] 10 pieces of Ti foil (manufactured by Takeuchi Metal Foil Industry Co., Ltd.) with a thickness of 50 mm
After cutting it into 0 x squares and connecting it to the cathode, it was copper plated in a copper sulfate bath to a thickness of 4.3 gw+, and then Ni plated in a Ni watt bath to a thickness of 10 μm. I made an activated brazing filler metal.
この活性ろう材を用いて、3 x4 X20m腸のSi
J<セラミックス試験片の端面どうじを、1×10−’
Torrの真空下、 1000℃においてろう付した。Using this activated brazing filler metal, a 3 x 4 x 20m Si
J<The end face of the ceramic test piece is 1×10-'
Brazing was carried out at 1000° C. under a vacuum of Torr.
接合強度は約30kg/am”であり、Ti箔/Cu箔
/Ni箔を重ねて圧延したものと同様の性能を示した。The bonding strength was about 30 kg/am'', and showed the same performance as that of a stacked Ti foil/Cu foil/Ni foil rolled.
【効果]
本発明のメッキによるろう相成分の積層は、低温で処理
されるので、活性金属の酸化による変質が生じない、ま
た、従来の圧延による場合、活性金属の種類により延性
が異なり、活性金属層とメッキ成分層との厚み比、すな
わち成分比を制御するのが困難であったが、本発明のメ
ッキ処理においては、温度、電流密度1時間を制御する
ことにより、活性金属の種類いかんにかかわらず、容易
に任意の厚み比にすることができる。[Effects] Lamination of wax phase components by plating of the present invention is processed at low temperatures, so no deterioration due to oxidation of active metals occurs.In addition, when conventional rolling is used, ductility varies depending on the type of active metal, It has been difficult to control the thickness ratio of the metal layer and the plating component layer, that is, the component ratio, but in the plating process of the present invention, by controlling the temperature and current density for 1 hour, it is possible to control the thickness ratio of the metal layer and the plating component layer, regardless of the type of active metal. Regardless of the thickness, any thickness ratio can be easily achieved.
本発明により従来の熱間圧延の場合の不活性ガス雰囲気
下、あるいは真空下での特別な圧延装置を必要とせずに
、セラミックス用活性ろう材を簡便に得ることができる
ようになった。According to the present invention, it has become possible to easily obtain an active brazing filler metal for ceramics without the need for a special rolling device under an inert gas atmosphere or vacuum as in the case of conventional hot rolling.
そのため、必要なときに必要な分量だけの必要な組成の
活性ろう材を手軽に製造することが容易になり、低コス
ト化及び短納期化が実現した。Therefore, it has become easy to manufacture the active brazing filler metal of the required composition in the required amount and at the required time, resulting in lower costs and shorter delivery times.
Claims (1)
りろう材成分の金属層を設けることを特徴とする活性ろ
う材の製造方法。(1) A method for producing an active brazing material, which comprises providing a metal layer of a brazing material component on the surface of a Ti or Zr foil or plate by a plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16432790A JPH0455376A (en) | 1990-06-25 | 1990-06-25 | Production of activated brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16432790A JPH0455376A (en) | 1990-06-25 | 1990-06-25 | Production of activated brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0455376A true JPH0455376A (en) | 1992-02-24 |
Family
ID=15791060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16432790A Pending JPH0455376A (en) | 1990-06-25 | 1990-06-25 | Production of activated brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455376A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029330A (en) * | 2018-01-12 | 2019-07-19 | 中南大学 | A kind of ormolu composite material and preparation method |
-
1990
- 1990-06-25 JP JP16432790A patent/JPH0455376A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110029330A (en) * | 2018-01-12 | 2019-07-19 | 中南大学 | A kind of ormolu composite material and preparation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018524250A (en) | Method for making a composite material | |
| JPH04329891A (en) | Tin plated copper alloy material and its production | |
| JP6176854B2 (en) | Composite material with active metal brazing material layer | |
| KR20230153361A (en) | Sheet for joining with preform layer formed, method for manufacturing joined body, and member to be joined with preform layer formed | |
| JP5030633B2 (en) | Cr-Cu alloy plate, semiconductor heat dissipation plate, and semiconductor heat dissipation component | |
| JP2018111111A (en) | Metal bonded body and semiconductor device manufacturing method | |
| JPH0520392B2 (en) | ||
| JP2011192840A (en) | Flat aluminum coated copper ribbon for semiconductor element | |
| JP3629578B2 (en) | Ti-based material and Cu-based bonding method | |
| EP0084161B1 (en) | Lead frames for electronic and electric devices | |
| JPH1158072A (en) | Method of manufacturing copper brazing sheet | |
| JP2004141937A (en) | Au-Sn alloy powder for surface coating for solder paste | |
| Su et al. | Interfacial reactions of liquid Sn and Sn-3.5 Ag solders with Ag thick films | |
| JPH02267261A (en) | Production of target for sputtering | |
| JPS59141393A (en) | Brazing filler material | |
| KR102220724B1 (en) | NiSnP BRAZING FILLER METAL, BRAZING FILLER ALLOY PANNEL AND BRAZING METHOD | |
| JPS6396239A (en) | Material for electrically conductive parts of electronic and electrical appliance | |
| KR101689387B1 (en) | Method for manufacturing metallic substrate having metal foam layer on the surface and metallic substrate manufactured thereby | |
| JPS62161466A (en) | Metallic member for joining ceramics | |
| JP4538579B2 (en) | Manufacturing method of semiconductor joining member | |
| JPH02274849A (en) | Production of oxide dispersion-strengthened copper alloy stock | |
| JPH0215874A (en) | Method and material for joining metal and ceramics | |
| JPS5837103A (en) | Production of composite sintered body for electric contactor | |
| JPS6050521B2 (en) | Manufacturing method of alloy thin plate | |
| JPS61159539A (en) | Manufacture of shape memory alloy |