JPH04553U - - Google Patents
Info
- Publication number
- JPH04553U JPH04553U JP4135790U JP4135790U JPH04553U JP H04553 U JPH04553 U JP H04553U JP 4135790 U JP4135790 U JP 4135790U JP 4135790 U JP4135790 U JP 4135790U JP H04553 U JPH04553 U JP H04553U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating substrate
- common electrode
- flat insulating
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の端面型サーマルヘツドの一実
施例の断面を一部打ち欠いて示す斜視図であり、
第２図ａ及びｂは従来例の構成を示す断面図であ
る。
１……平板状セラミツク基板、２……共通電極
、３……ＩＣ接続電極、５……発熱抵抗体。
FIG. 1 is a partially cutaway perspective view of an embodiment of the end-face type thermal head of the present invention.
FIGS. 2a and 2b are cross-sectional views showing the structure of a conventional example. DESCRIPTION OF SYMBOLS 1... Flat ceramic substrate, 2... Common electrode, 3... IC connection electrode, 5... Heat generating resistor.
Claims (1)
ち一方の面上に備えられている共通電極と、 上記平面状絶縁基板の厚さ方向に垂直な面のう
ち上記共通電極の備えられている面と対向する面
上に備えられているＩＣ接続電極と、 上記平面状絶縁基板の厚さ方向に平行な面に備
えられている保温層と、 上記保温層上から上記共通電極及びＩＣ電極上
の一部にかけて厚膜印刷により形成されている発
熱抵抗体とからなり、 上記厚膜発熱抵抗体の端縁部が上記共通電極及
びＩＣ接続電極と重ね合わされた状態にて融着さ
れていることを特徴とする端面型サーマルヘツド
。[Claims for Utility Model Registration] A flat insulating substrate; a common electrode provided on one of the planes perpendicular to the thickness direction of the flat insulating substrate; and a thickness of the flat insulating substrate. an IC connection electrode provided on a surface perpendicular to the direction opposite to the surface provided with the common electrode; and a heat insulation provided on a surface parallel to the thickness direction of the planar insulating substrate. layer, and a heating resistor formed by thick film printing from above the heat insulating layer to part of the common electrode and IC electrode, and the edge of the thick film heating resistor is connected to the common electrode and IC electrode. An end face type thermal head characterized by being fused to a connecting electrode in an overlapping state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4135790U JPH04553U (en) | 1990-04-18 | 1990-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4135790U JPH04553U (en) | 1990-04-18 | 1990-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04553U true JPH04553U (en) | 1992-01-06 |
Family
ID=31551956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4135790U Pending JPH04553U (en) | 1990-04-18 | 1990-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04553U (en) |
-
1990
- 1990-04-18 JP JP4135790U patent/JPH04553U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6162039U (en) | ||
| JPS58175941U (en) | thermal head | |
| JPH04553U (en) | ||
| JPS6170394U (en) | ||
| JPS6187942U (en) | ||
| JPH0217341U (en) | ||
| JPH0222838U (en) | ||
| JPS58110443U (en) | Heating element structure of thermal recording head | |
| JPS62175929U (en) | ||
| JPH01125642U (en) | ||
| JPH01110928U (en) | ||
| JPS603045U (en) | thermal head | |
| JPH04551U (en) | ||
| JPS605842U (en) | thermal print head | |
| JPS6219252U (en) | ||
| JPS61158451U (en) | ||
| JPS629534U (en) | ||
| JPH0339549U (en) | ||
| JPS6380137U (en) | ||
| JPH01178953U (en) | ||
| JPH0299648U (en) | ||
| JPH0180356U (en) | ||
| JPS59155139U (en) | thermal printer head | |
| JPS60191345U (en) | thermal printing head | |
| JPS63149735U (en) |