JPH0455532B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to internal lead bonding, external lead bonding,
This invention relates to a tool cleaning mechanism for a bonder that performs pellet bonding, etc.

[Prior Art] As is well known, an internal lead bonding bonder is used to collectively bond the internal leads of a film carrier and an electrode of a semiconductor pellet, and an external lead bonding bonder is used to bond the internal leads of a film carrier and the electrodes of a semiconductor pellet together. The semiconductor pellet bonded to the lead (generally called the external lead in the case of external lead bonding) is punched out from a film carrier together with the external lead, and the external lead attached to this semiconductor pellet is bonded all at once to a lead frame, etc. A pellet bonding bonder is used to bond only semiconductor pellets to a lead frame or the like. The case of the internal lead bonding bonder will be explained below.

Conventionally, as internal lead bonding bonders, those shown in, for example, Japanese Patent Application Laid-Open No. 60-234336 and Japanese Patent Application Laid-Open No. 61-16533 are known. The tools used in such bonders are generally made of a very hard material and are heated to a high temperature with a cartridge heater or the like. Therefore, the tool is less likely to wear out, but rather, various foreign substances adhere to the surface during welding due to the high temperature. Since the tool is at a high temperature, this foreign material hardens very quickly, is brittle, and has the property of making it difficult to transmit the heat of the tool to the internal leads and semiconductor pellets.

In this way, with internal lead bonding bonders, dirt such as oxides accumulates on the tool surface due to repeated bonding, and if bonding is continued without cleaning, the heat conduction efficiency of the tool surface deteriorates and the internal The bond between the lead and the semiconductor pellet deteriorates. Therefore, it is common practice to periodically clean tools every 50 to 200 times.

Conventionally, as an internal lead bonding bonder equipped with a tool cleaning mechanism, for example, Japanese Patent Application Laid-Open No. 60-246643
The one shown in Publication No. 1 is known. This structure is
It is equipped with a metal brush for brushing tools and a lapping surface (grindstone) for lapping tools.

[Problems to be Solved by the Invention] Brushing with a metal brush is ineffective if foreign matter sticks to the tool because the metal brush has flexibility. Therefore, since it is necessary to brush with a metal brush every time the bonding is performed, there is a problem in that productivity is poor. Further, since foreign matter cannot be completely removed with a metal brush, it is necessary to wrap the joint with a grindstone after a predetermined number of bonding operations.

However, in the conventional example above, the grindstone is fixed to an XY table and the grindstone and tool are simply slid relative to each other, so the bottom surface of the tool and the surface of the grindstone do not match, and the bottom surface of the tool can only be partially cleaned. There was a problem.

The object of the present invention is to make it possible to bring the lower surface of the tool into close contact with the grinding wheel surface regardless of the inclination angle of the tool.
To provide a bonder tool cleaning mechanism capable of performing stable cleaning.

[Means for Solving the Problems] The problems of the above-mentioned conventional technology include a cleaning table that is rotatably supported and provided near the joining position where internal lead joining etc. is performed, and a cleaning table that is rotatable together with the cleaning table. a cleaning turntable held on a cleaning table so as to be able to tilt slightly in the radial direction; a grindstone attached to the top surface of the cleaning turntable; This problem can be solved by comprising an elastic member that urges the rotary table upward, and a cleaning table rotation drive mechanism that rotationally drives the cleaning table.

[Operation] Since the grindstone is driven to rotate and has a floating mechanism that can freely tilt, cleaning can be performed with the grindstone in close contact with the bottom surface of the tool regardless of the angle of inclination of the bottom surface of the tool.

[Example] An example of the present invention will be described below with reference to FIGS. 1 to 5. This example is based on the above-mentioned Japanese Patent Application Laid-Open No.
An example in which the present invention is applied to bonders shown in Japanese Patent Application Laid-open No. 234336 and Japanese Patent Application Laid-Open No. 61-16533 will be shown. Therefore, the structure common to the conventional example will be briefly explained.

The tool 10 shown in FIG. 5 is provided above the joining position 11 shown in FIG. 1 so as to be movable up and down and in the XY directions. As shown in Figures 1 to 4,
Below the tool 10, there are two die mounting tables 1 on the upper surface.
A rotary table 13 to which parts 2 and 12 are fixed is rotatably supported by a vertical slide block 14, and the rotary table 13 is driven by a motor (not shown).
It is driven intermittently in 180 degree increments. The vertical slide block 14 is an XY table 15 driven in the XY direction.
It is vertically movably attached to a support block 16 fixed to.

A vertical adjustment screw 20 is vertically screwed into the vertical slide block 14.
A bevel gear 21 is fixed to the lower end side of 0. Further, a holder 22 is fixed to the side surface of the vertical slide block 14, and a horizontally arranged adjustment pin 23 is rotatably supported on this holder 22. This adjustment pin 23 has a knob 24 at one end.
is fixed, and a bevel gear 25 that meshes with the bevel gear 21 is fixed to the other end.

A detection plate 30 is fixed to the upper end of the vertical adjustment screw 20, and an upper limit detection sensor 3 is mounted on the vertical slide block 14 while sandwiching the detection plate 30.
1 and the lower limit detection sensor 32 are fixed. A cam follower 33 is rotatably attached to the lower end of the vertical adjustment screw 20.
3 is in contact with a linear cam 34 having a cam surface on its upper surface. The linear cam 34 is horizontally moved by an air cylinder 35 fixed to the XY table 15. Further, a guide block 36 that guides the bottom surface of the linear cam 34 is fixed on the XY table 15 corresponding to the linear cam 34, and guide rollers 37 that guide both side surfaces of the linear cam 34 are rotatably supported on this guide block 36. There is.

Therefore, when the knob 24 is turned, the adjustment pin 23,
Vertical adjustment screw 20 via bevel gears 25 and 21
rotates. Since the rotary table 13 moves up and down together with the up and down slide block 14 in accordance with the rotation of the up and down adjusting screw 20, the upper limit position of the die mounting table 12 can be adjusted. Also air cylinder 3
5, the vertical adjustment screw 20 moves up and down together with the cam follower 33 according to the cam surface of the linear cam 34, and the rotary table 13 moves up and down.

Therefore, during the bonding operation, the semiconductor pellet 40 is placed on the die mounting table 12 that is away from the bonding position 11.
When the rotary table 13 is rotated and the semiconductor pellet 40 is positioned at the bonding position 11, the tool 10 is lowered, and the air cylinder 35 is actuated to raise the rotary table 13 and attach the film carrier (not shown). After the internal leads are connected to the electrodes of the semiconductor pellet 40, the tool 10 is raised and the rotary table 13 is lowered.

Next, the tool cleaning mechanism, which is a feature of the present invention, will be explained. As shown in FIGS. 1, 5 to 7, a cleaning turntable 51 having a grindstone 50 attached to its upper surface is disposed near the joining position 11. This cleaning rotary table 51 is fixed to a holder 52 with screws 53 to facilitate attachment and detachment. The holder 52 is fitted into the cleaning table 54 with a slight gap. Therefore, the holder 52 can freely tilt in the radial direction within the range of the gap. A vertical groove 52a is formed in the holder 52 so that it can rotate together with the cleaning table 54, and the tip of a screw 55 screwed into the cleaning table 54 is engaged with the vertical groove 52a. Further, a spring 56 is provided between the holder 52 and the cleaning table 54 to bias the holder 52 upward.
is installed. Further, a pulley 57 is fixed to the cleaning table 54. The cleaning table 54 includes a support plate 59 via a bearing 58 and a support plate 6 fixed to the support plate 59.
0 is rotatably supported.

The support plate 59 is fixed to a support plate 65 shown in FIG. 3, and the support plate 65 is fixed to the support block 16. A motor 66 is fixed to the support plate 65, and a belt 68 is stretched between a pulley 67 fixed to the output shaft of the motor 66 and the pulley 57. Further, a blower pipe 70 that blows air onto the grindstone 50 from the rotary table 13 side is fixed to the support plate 65 and arranged near the grindstone 50 . Further, a suction duct 71 for sucking air from the blower pipe 70 is arranged on the opposite side of the blower pipe 70 with the grindstone 50 in the center.

Next, the effect will be explained. The internal leads of the film carrier 41 described above are covered with semiconductor pellets 40.
After performing the operation of bonding to the electrode a certain number of times, the tool 10 is moved above the grindstone 50 and then lowered to bring the tool 10 into contact with the grindstone 50. As described above, the holder 52, that is, the cleaning rotary table 51 and the grindstone 50 that are integrally attached to the holder 52 can float in the radial direction with respect to the cleaning table 54.
The grindstone 50 is brought into close contact with the lower surface of the tool 10 by the action of a spring 56. In this state, grindstone 5
When the tool 10 rotates, the foreign matter adhering to the lower surface of the tool 10 is peeled off and removed from the lower surface of the tool 10 as if being scraped off.

In this case, the foreign matter removed by the grindstone 50 becomes dust and scatters around, so air is blown by the blower pipe 70 and the dust is sucked by the suction duct 71 to prevent it from scattering.

In this way, since the grindstone 50 is a floating mechanism that is rotationally driven and can be tilted freely, cleaning can be performed with the grindstone 50 in close contact with the bottom surface of the tool 10 regardless of the inclination angle of the bottom surface of the tool 10. Further, by providing the blower pipe 70 and the suction duct 71, scattering of dust can be prevented.

[Effects of the Invention] As is clear from the above description, according to the present invention, there is provided a cleaning table rotatably supported and provided in the vicinity of a joining position where internal lead joining etc. are performed, and a cleaning table that is rotatably supported. A cleaning turntable held on a cleaning table so as to be rotatable and slightly inclined in the radial direction, a grindstone attached to the top surface of the cleaning turntable, and a grindstone so as to be in close contact with the tool. Since it is comprised of an elastic member that urges the cleaning rotary table upward and a cleaning table rotation drive mechanism that rotates the cleaning table, the grindstone sticks to the bottom surface of the tool regardless of the inclination angle of the bottom surface of the tool. Cleaning can be done. Further, by providing a blower pipe and a suction duct, scattering of dust can be prevented.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing one embodiment of the present invention, and FIG.
The figure is a front view of Figure 1, Figure 3 is a partial vertical sectional view taken along the line 3-3 in Figure 2, Figure 4 is a cross-sectional view of the vertical adjustment mechanism of the rotary table, and Figure 5 is a 5-5 view of Figure 1. 6 is a right side view of the main part of FIG. 1, and FIG. 7 is a rear view of the main part of FIG. 1. DESCRIPTION OF SYMBOLS 10...Tool, 50...Whetstone, 51...Turnable table for cleaning, 54...Table for cleaning, 56...Spring, 57...Pulley, 6
6...Motor, 67...Pulley, 68...Belt, 70...Blower pipe, 71...Suction duct.

Claims (1)

[Claims] 1. A bonder that performs internal lead bonding, etc. using a tool that is movable in the vertical and XY directions,
A cleaning table is provided in the vicinity of the joining position where the internal lead joining etc. is performed and is rotatably supported, and the cleaning table is rotatable together with the cleaning table and is held by the cleaning table so as to be able to tilt slightly in the radial direction. a cleaning rotary table, a grindstone attached to the top surface of the cleaning rotary table, an elastic member that biases the cleaning rotary table upward so that the grindstone comes into close contact with the tool, and the cleaning table. A tool cleaning mechanism for a bonder, comprising: a rotation drive mechanism for a cleaning table; and a rotation drive mechanism for a cleaning table. 2. In a bonder that performs internal lead bonding, etc. using a tool that is movable in the vertical and XY directions, a cleaning table that is rotatably supported and provided near the bonding position where the internal lead bonding, etc. is performed; A cleaning turntable that is rotatable together with the cleaning table and held on the cleaning table so as to be able to tilt slightly in the radial direction; a grindstone attached to the top surface of the cleaning turntable; and a grindstone that is connected to the tool. an elastic member that biases the cleaning rotary table upward so that it comes into close contact with the cleaning table; a cleaning table rotation drive mechanism that rotationally drives the cleaning table; A bonder tool cleaning mechanism comprising a blower pipe that blows air and a suction duct that sucks air from the blower pipe.