JPH0455855A - Photomask - Google Patents

Photomask

Info

Publication number
JPH0455855A
JPH0455855A JP2167220A JP16722090A JPH0455855A JP H0455855 A JPH0455855 A JP H0455855A JP 2167220 A JP2167220 A JP 2167220A JP 16722090 A JP16722090 A JP 16722090A JP H0455855 A JPH0455855 A JP H0455855A
Authority
JP
Japan
Prior art keywords
pattern
isolated
pressure water
photomask
dry plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2167220A
Other languages
Japanese (ja)
Inventor
Takumi Niike
新池 巧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP2167220A priority Critical patent/JPH0455855A/en
Publication of JPH0455855A publication Critical patent/JPH0455855A/en
Pending legal-status Critical Current

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  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To prevent the damaging of an isolated pattern by providing a pattern for connecting the isolated pattern in the central part of a mask dry plate and the pattern in the outer peripheral part and diffusing the electric charge generated by the friction between high-pressure water and a glass substrate at the time of washing by the high-pressure water. CONSTITUTION:The pattern 6 for connecting the pattern 4 of the outer peripheral part and the isolated pattern 5 in the central part of the mask dry plate is the pattern finer than the resolution of an aligner. This pattern 6 is narrower in width than the resolution of the aligner and is, therefore, not transferred to the wafer and does not affect the device at all. The isolated pattern 5 in the central part of the mask dry plate and the pattern 4 of the outer peripheral part are connected in such a manner, by which the electric charge generated by the friction between the high-pressure water and the glass substrate at the time of washing by the high-pressure water is diffused from the isolated pattern 5 to the outer peripheral part and, therefore, the etching by the electrification of the isolated pattern 5 is prevented.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は半導体集積回路の製造に用いられるフォトマス
クに関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a photomask used in the manufacture of semiconductor integrated circuits.

従来の技術 従来から、ウェハ上にパターンを転写するためのフォト
マスクとして、ハードマスクが広く用いられている。
2. Description of the Related Art Hard masks have been widely used as photomasks for transferring patterns onto wafers.

以下、ハードマスクについて述べる。The hard mask will be described below.

ハードマスクは石英や低膨張ガラス等の基板上に形成さ
れた、クロムなどの金属や金属酸化物あるいはモリブデ
ンシリサイドなどの金属化合物を遮光膜として用い、こ
の遮光膜の所定部以外を除去することによりパターンを
形成したものである。
Hard masks are made by using metals such as chromium, metal oxides, or metal compounds such as molybdenum silicide as a light-shielding film formed on a substrate such as quartz or low-expansion glass, and by removing areas other than the designated areas of this light-shielding film. A pattern is formed.

パターン形成されたフォトマスクやステッパー用のレキ
クルは外観、パターン欠陥、素子寸法およびパターン重
ね合せ精度など多数の項目について検査を行ない、パタ
ーン欠陥については必要により修正を行った後合格した
ものだけが使用可能となる。使用前には検査時等に付着
したパーティクルを洗浄により除去し、必要によりペリ
クルカバーを装着して使用する。
Pattern-formed photomasks and stepper requiles are inspected for numerous items such as appearance, pattern defects, element dimensions, and pattern overlay accuracy, and only those that pass are used after pattern defects are corrected as necessary. It becomes possible. Before use, remove particles that have adhered during inspection etc. by cleaning, and if necessary, attach a pellicle cover.

洗浄は酸あるいは有機溶剤等の溶液による洗浄、スポン
ジやブラシ等によるスクラブ洗浄、高圧水による洗浄等
を組み合せて行なわれる。このうち、高圧水による洗浄
は洗浄能力が高いため、最終段階の洗浄として最もよく
用いられている。
Cleaning is performed by a combination of cleaning with a solution such as an acid or an organic solvent, scrubbing with a sponge or brush, cleaning with high-pressure water, and the like. Among these, cleaning with high-pressure water has a high cleaning ability, so it is most often used as the final stage of cleaning.

発明が解決しようとする課題 しかしながら、高圧水による洗浄を多数回繰り返して行
なうと乾板中央部のパターンが損傷を受けるという問題
が発生している。このパターン損傷は、通常、乾板中央
部でのみ発生し、損傷するパターンの形状は孤立パター
ンと呼ばれる外周部へつながっていないパターンに限ら
れる。さらに孤立パターンの周辺にパターンのない領域
がある場合に限られる。
Problems to be Solved by the Invention However, there has been a problem in that when washing with high pressure water is repeated many times, the pattern in the center of the dry plate is damaged. This pattern damage usually occurs only in the center of the dry plate, and the pattern shape that is damaged is limited to patterns called isolated patterns that are not connected to the outer periphery. Furthermore, this is limited to cases where there is an area without a pattern around the isolated pattern.

パターン損傷の一例を第2図に示す。第2図において1
は孤立パターン2はパターン損傷部を示す。このような
パターン損傷は、高圧水とガラス基板との間にまさつ電
気が生じ、その電荷により孤立パターン1が帯電し、そ
の結果パターンのエツチングが起きるために発生するも
のである。
An example of pattern damage is shown in FIG. In Figure 2, 1
Isolated pattern 2 indicates a damaged pattern. Such pattern damage occurs because electricity is generated between the high-pressure water and the glass substrate, and the isolated pattern 1 is charged by the electric charge, resulting in etching of the pattern.

パターン損傷部2を防止するために、洗浄水圧を下げた
り、洗浄水の比抵抗を下げる等の対策が実施されている
が洗浄能力を落とさずにパターン損傷を防止することは
容易ではない。
In order to prevent pattern damage 2, measures such as lowering the washing water pressure and lowering the specific resistance of the washing water have been taken, but it is not easy to prevent pattern damage without reducing the washing ability.

本発明は上記従来の問題点を解決するもので、パターン
損傷の発生しないフォトマスクのパターンを提供するも
のである。
The present invention solves the above conventional problems and provides a photomask pattern that does not cause pattern damage.

課題を解決するための手段 この目的を達成するために、本発明のフォトマスクはマ
スク乾板中央部の孤立パターンと外周部のパターンとを
接続するパターンを設けている。
Means for Solving the Problems In order to achieve this object, the photomask of the present invention is provided with a pattern that connects the isolated pattern at the center of the mask dry plate and the pattern at the outer periphery.

作用 このフォトマスクでは、高圧水による洗浄により、高圧
水とガラス基板との間にまさつ電気が生じても、その電
荷は孤立パターンに帯電することはなく、外周部に接続
されたパターンを通して移動するため、孤立パターンが
エツチングされることはない。
Function: With this photomask, even if electricity is generated between the high-pressure water and the glass substrate during cleaning with high-pressure water, the charge will not be charged to isolated patterns, but will move through patterns connected to the outer periphery. Therefore, isolated patterns are not etched.

実施例 以下、本発明の実施例について図面を参照しながら説明
する。
EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例におけるフォトマスクのパタ
ーンを示すものである。第1図において、3はフォトマ
スクの外形、4は外周部のパターン、5はマスク乾板中
央部の孤立パターン、6は外周部パターン4と孤立パタ
ーン5を接続したパターンであり、アライナ−の解像度
よりも細いパターンである。
FIG. 1 shows a pattern of a photomask in one embodiment of the present invention. In FIG. 1, 3 is the outer shape of the photomask, 4 is a pattern on the outer periphery, 5 is an isolated pattern in the center of the mask dry plate, and 6 is a pattern that connects the outer periphery pattern 4 and the isolated pattern 5. It is a thinner pattern.

このように、乾板中央部の孤立パターン5と外周部ツバ
ターン4を接続することにより、高圧水による洗浄時に
高圧水とガラス基板との間のまさっにより発生した電荷
は孤立パターン5から外周部に拡散するため、孤立パタ
ーン5の帯電によるエツチングを防止することができる
In this way, by connecting the isolated pattern 5 at the center of the dry plate and the outer periphery brim turn 4, the electric charge generated due to the collision between the high pressure water and the glass substrate during cleaning with high pressure water is diffused from the isolated pattern 5 to the outer periphery. Therefore, etching of the isolated pattern 5 due to charging can be prevented.

また、孤立パターン5と外周部パターン4を接続したパ
ターン6はアライナ−の解像度よりも幅が狭いため、ウ
ェハに転写されることはなく、デバイスには何の影響も
与えない。
Moreover, since the pattern 6 which connects the isolated pattern 5 and the outer peripheral pattern 4 has a width narrower than the resolution of the aligner, it is not transferred to the wafer and has no effect on the device.

なお、本実施例では外周部と接続したパターン6が遮光
膜よりなるフォトマスクを示したが、パターンが透明部
よりなるフォトマスクの場合もマスク乾板の周辺部は遮
光膜部よりなるため、本実施例と同様に乾板中央部の孤
立パターンと周辺部を接続することができる。
Note that in this example, a photomask in which the pattern 6 connected to the outer periphery is made of a light-shielding film is shown, but even in the case of a photomask in which the pattern is made of a transparent part, the peripheral part of the mask dry plate is made of a light-shielding film. As in the embodiment, the isolated pattern in the center of the dry plate and the peripheral part can be connected.

発明の効果 本発明は、マスク乾板上に金属または金属化合物からな
る遮光膜によりパターンを形成したフォトマスクにおい
て、マスク乾板中央部の孤立パターンと外周部のパター
ンを接続するパターンを設けて、高圧水による洗浄時に
高圧水とガラス基板との間のまさつにより発生した電荷
を拡散させることにより孤立パターンが損傷されること
を防止するフォトマスクを実現できるものである。
Effects of the Invention The present invention provides a photomask in which a pattern is formed on a mask dry plate using a light-shielding film made of a metal or a metal compound. It is possible to realize a photomask that prevents isolated patterns from being damaged by diffusing the charges generated by the collision between high-pressure water and the glass substrate during cleaning.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例におけるフォトマスクのパタ
ーン平面図、第2図は高圧水洗浄によるパターン損傷の
一例を示す要部パターン図である。 3・・・・・・フォトマスク、4・・・・・・外周部パ
ターン、5・・・・・・孤立パターン、6・・・・・・
外周部と接続したパターン。
FIG. 1 is a plan view of a pattern of a photomask according to an embodiment of the present invention, and FIG. 2 is a diagram of a main part pattern showing an example of pattern damage caused by high-pressure water cleaning. 3...Photomask, 4...Outer pattern, 5...Isolated pattern, 6...
A pattern connected to the outer periphery.

Claims (1)

【特許請求の範囲】[Claims]  フォトマスクと、前記フォトマスク上に形成された遮
光膜と、前記遮光膜で前記フォトマスク中央部の孤立パ
ターンと外周部のパターンを接続するアライナーの解像
度以下のパターン幅を持つパターンを設けたことを特徴
とするフォトマスク。
A photomask, a light-shielding film formed on the photomask, and a pattern having a pattern width less than or equal to the resolution of an aligner that connects the isolated pattern at the center of the photomask and the pattern at the outer periphery with the light-shielding film. A photomask featuring
JP2167220A 1990-06-25 1990-06-25 Photomask Pending JPH0455855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2167220A JPH0455855A (en) 1990-06-25 1990-06-25 Photomask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2167220A JPH0455855A (en) 1990-06-25 1990-06-25 Photomask

Publications (1)

Publication Number Publication Date
JPH0455855A true JPH0455855A (en) 1992-02-24

Family

ID=15845668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2167220A Pending JPH0455855A (en) 1990-06-25 1990-06-25 Photomask

Country Status (1)

Country Link
JP (1) JPH0455855A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853855A (en) * 1995-08-10 1998-12-29 Nemoto; Takeshi Bellows
KR100425459B1 (en) * 2001-08-23 2004-03-30 삼성전자주식회사 Photomask and method for manufacturing the same, and method for detecting/reparing defect of photomask
KR20160121418A (en) 2015-04-10 2016-10-19 가부시기가이샤 디스코 Method of manufacturing bellows

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853855A (en) * 1995-08-10 1998-12-29 Nemoto; Takeshi Bellows
KR100425459B1 (en) * 2001-08-23 2004-03-30 삼성전자주식회사 Photomask and method for manufacturing the same, and method for detecting/reparing defect of photomask
KR20160121418A (en) 2015-04-10 2016-10-19 가부시기가이샤 디스코 Method of manufacturing bellows

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