JPH0456088A - Connecting method of electronic parts - Google Patents

Abstract

PURPOSE:To absorb the thermal stress during the use with conductors, and restrict the thermal stress to low by connecting between each terminal of two electronic parts with the conductors, and thereafter, turning one or both of electronic parts to bend the conductors. CONSTITUTION:A LCD parts 1 and a printed substrate 2 are located on one horizontal surface with a predetermined space l to perform positioning. Next, multiple conductors 8 at a predetermined length are prepaired, and both ends thereof are connected to multiple terminals 3 and multiple terminals 5 in order to form connection parts 9, 10. When all of the terminals 3 and the terminals 5 are connected to each other by the conductors 8, next, when the printed substrate 2 is raised up shown with an arrow (a) to be turned at 90 deg. around of near the center of the conductors 8, all of the conductors 8 are bended with this turning. The LCD parts 1 and the printed substrate 2 forms a L-form mutually to be connected to each other electrically and mechanically.

Description

[Detailed Description of the Invention] [Industrial Field of Application J] This invention is an L
The present invention relates to a method for connecting electronic components that is suitable for use in cases where the electronic components are connected in the form of a letter.

[Conventional technology]

FIG. 9 shows a conventional electronic component connection method when, for example, a liquid crystal side component (hereinafter referred to as LCD component) and a printed circuit board in a liquid crystal display device are electrically and mechanically connected to each other in an L-shape. 1 is a side view showing an LCD component as a first electronic component, and two members 1a,
Consisting of lb.

2 is a printed circuit board as a second electronic component, which is connected to the LCD component 1 and forms an L-shape together with the LCDCD component; 3 is a plurality of terminals arranged at the common ends of the LCDCD component;
4 is solder applied to the terminal 3 in advance, and 5 is a plurality of terminals arranged at the end of the printed circuit board 2, which are formed as lands by removing the insulating resin applied to the wiring conductive foil of the printed circuit board 2. . 6 is solder applied to the terminal 5 in advance, and 7 is solder obtained by melting and hardening the solder 4.6.

Next, a method for joining the terminals 3 and 5 will be explained.

Solder 4.6 is applied to the terminals 3 and 5 in advance, and these terminals 3 and 5 are connected to the LCD component 1 and the printed circuit board 2.
It is accurately positioned so that it forms an L-shape and there is no displacement in the front-rear direction.

Next, when terminals 3 and 5 are heated with a soldering iron, solder 4.
6 is melted again and solder 7 is formed in a predetermined shape on the L-shaped abutted portion, and the terminals 3 and 5 are soldered together. At this time, if the size of the solder 7 is small, solder is supplied from the outside so that the shape of the solder 7 becomes an appropriate shape.

[Problem to be solved by the invention] Since the conventional method of connecting electronic components is performed as described above, while precisely positioning the terminals 3.5 in an L shape,
Soldering is required, which makes automation difficult and the only way to do it is by hand, which is inefficient and the quality is unstable.Also, the terminals 5 of the printed circuit board 2 have one side made of resin. Since the solder 7 is hardened, a large thermal stress is applied to the solder 7 due to the difference in thermal expansion between the LCD component 1 and the printed circuit board 2 during use of the liquid crystal display device, which may cause the solder 7 to break. Furthermore, there was a problem that 7 parts of the solder broke due to variations in the quality of soldering.

This invention was made to solve the above-mentioned problems, and it is an electronic component that can be easily automated, has stable quality, and has sufficient strength against thermal stress during use. The purpose is to obtain a connection method.

Means for Solving Problem 1] A method for connecting electronic components according to the present invention involves placing two electronic components on the same plane, positioning two opposing terminals with an appropriate distance between them, and then connecting two electronic components. After connecting two terminals with a conductor, one or both of the two electronic components are rotated to bend the conductor at a predetermined angle, such as a right angle.

[Function] The method of connecting electronic components according to the present invention can be easily automated, and thermal stress can be absorbed by the conductor.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
3, the same parts as in FIG. 9 are designated by the same reference numerals, and the explanation thereof will be omitted.

1 and 2 show a state in which the LCD component 1 and the printed circuit board 2 are connected in an L-shape, and 8 is a conductor that connects the terminals 3 and 5, such as a wire such as a rolled copper wire or a nickel wire. is used. 9 is a joint between one end of the conductor 8 and the terminal 3;
10 is a joint between the other end of the conductor 8 and the terminal 5.

FIG. 3 is a side view showing the connection method according to the present invention.

Next, the connection method will be explained.

First, as shown in FIG. 3, the LCD component 1 and the printed circuit board 2 are placed and positioned on the same horizontal plane with a predetermined distance ρ.

Next, a plurality of conductors 8 of a predetermined length are prepared, and both ends thereof are sequentially joined to the plurality of terminals 3 and the plurality of terminals 5, respectively, to form a joint portion 9.10. This joining may be done on either terminal 3.5 first (or may be done at the same time).The joining methods include soldering by micro spot heating, micro spot welding, laser welding, laser soldering, and resistance heating. Soldering, wire bonding, or other methods may be used.Also, the bonding method may be different between the bonding portion 9 and the IO.After all the terminals 3 and 5 are connected by the conductor 8, next When the printed circuit board 2 is raised as shown by arrow a and rotated by 90° around the center of the conductor 8, all the conductors 8 are bent approximately 90° as a result of this rotation. As shown in FIGS. 1 and 2, a state is obtained in which the LCD component 1 and the printed circuit board 2 form an L-shape and are electrically and mechanically bonded to each other.

In FIG. 2, if the spacing between the conductors 8 is narrow, there is a risk that adjacent conductors 8 will come into contact with each other. In order to prevent the conductors from coming into contact with each other, an insulating coating may be applied to each conductor 8 in the state shown in FIG. 2. Alternatively, as the conductor 8, a wire such as an enameled wire may be used, which has been previously coated with an insulating coating.

4 to 8 show other embodiments of the present invention, each of which is a method for preventing the conductors 8 from coming into contact with each other.

In FIG. 4, the portion including the joint 10 between the conductor 8 and the terminal 5 is molded with an insulator 11 such as synthetic resin, and the above-mentioned parts are fixed.

In FIG. 5, a portion of the conductor 8 including the joint portion 9 with the terminal 3 is molded with an insulator 11.

In FIG. 6, the central portion of the conductor 8, excluding the joint portions 9 and 10, is molded with an insulator 11.

In FIG. 7, the joint portions 9 and 10 excluding the central portion of the conductor 8 are molded with an insulator 11.

In FIG. 8, all parts including the conductor 8 and the joints 9 and 10 are molded with an insulator 11.

In the case of FIG. 8, it is preferable to use an insulator 11 having a coefficient of thermal expansion between that of the LCD component 1 and that of the printed circuit board 2. In the case of FIG. Furthermore, as the insulator 11, a very soft insulator such as silicone resin may be used.

Further, in the case of FIGS. 4, 5, and 7, the state shown in FIG. 3, that is, the molding with the insulators 1, 1 can be performed before the conductor 8 is bent.

In the above embodiment, the connection between the LCD component 1 of the liquid crystal display device and the printed circuit board 2 was described, but the present invention
For example, the same effect can be achieved even when applied to connecting other electronic components such as two printed circuit boards.

Further, in the above embodiment, the LCD component 1 and the printed circuit board 2 are placed on the same horizontal plane during bonding, but the same effect can be achieved if they are placed on the same plane whether it is a vertical plane or an inclined plane.

Further, in FIG. 3, the printed circuit board 2 is rotated by 90 parts, but the LCD component 1 may also be rotated, or the LCD component 1 and the printed circuit board. According to the invention, after connecting each terminal of two electronic components with a conductor, one or both electronic components are rotated to bend the conductor, so that thermal stress during use can be absorbed by the conductor. , it is possible to keep thermal stress low, and at the same time connects two electronic components on the same plane, making it possible to connect them with various types of automation equipment, thus achieving economic efficiency and stabilization of quality through automation systems. There are other effects.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a method for connecting electronic components according to the present invention, Fig. 2 is a side view, Fig. 3 is a side view showing a part of the process, and Figs. 4 to 8 are other embodiments of the invention. FIG. 9 is a perspective view showing the connection direction of electronic components according to an example, and FIG. 9 is a side view showing a conventional method of connecting electronic components. 1 is the liquid crystal side parts, 2 is the printed circuit board, 3 and 5 are the terminals, 8
is a conductor, 9. to is the joint. In addition, in the figures, the same reference numerals are the same or the corresponding parts are omitted.

Claims (1)

[Claims] A first electronic component and a second electronic component are arranged on the same plane at a predetermined interval, and a terminal of the first electronic component and a terminal of the second electronic component are connected to each other via a conductor. physically and mechanically connect the first electronic component and/or the second electronic component.
A method for connecting electronic components, the electronic component being rotated at a predetermined angle to bend the conductor.