JPH0456344A - Resin sealed semiconductor device and metal mold for sealing - Google Patents

Abstract

PURPOSE:To smoothly fill a cavity with a resin without making smaller a gate diameter by forming a trace of gate at the external circumference of a resin-sealed area. CONSTITUTION:A gate 13 is provided at the one end side of a cavity 19 and is opposed to a lead wire 10. Moreover, resin flowing direction to the cavity 19 in the gate 13 is set to form a swirl along the internal circumferential surface of cavity 19 bypassing the lead wire 10. Therefore, the gate 13 can have sufficiently large diameter to lower the velocity of resin flowing through the gate 13 and ensure good flowing condition of resin into the cavity 19. Moreover, the lead wire 10 does not give any interference and can be cut or separated smoothly and a trace of gate 21 after the separation of lead wire is formed at the external circumferential surface of a sealing resin part 12. Accordingly, the trace of gate 21 can be processed easily by rotating the sealing resin part 12.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor chip, such as a diode, in which lead wires are connected to a semiconductor chip, and a sealing resin portion is formed around the semiconductor chip. The present invention relates to a resin-sealed semiconductor element and a mold for manufacturing the semiconductor element.

[Conventional technology]

Conventionally, for example, a diode element made of a resin package in which a diode chip is sealed with resin has lead wires l connected to both ends of the diode chip, and a cylindrical wire around the diode chip, as shown in FIG. A sealing resin part 2 is formed, and one end surface 3 of this sealing resin part 2
The resin was manufactured by filling resin from a gate 4 formed in the gate 4 and a runner 5 communicating with the gate 4 into a cavity (gap) for molding the sealing resin part 2 formed between templates. Therefore, after resin molding (after insert molding)
It is necessary to separate the product taken out from the mold from the solidified resin inside the gate.

[Problem to be solved by the invention]

Incidentally, in recent years, the size of the diode element described above has progressed, and in particular, the diameter of the sealing resin part 2 is becoming smaller.For this reason, the end face 3 of the sealing resin part 2 where the gate is set is As a result, the area of the gate becomes narrower, and the diameter of the gate needs to be reduced, and there is a risk that the product after being released from the mold and the solidified resin in the gate will not be separated well.

In other words, if the diameter of the gate is made small, the speed of the resin flowing through the gate will increase, and the resin will not be filled properly in the cavity.In particular, the air in the sealing resin part 2 on the side where the gate is provided will be increased. There is a possibility that pinholes may easily appear due to insufficient punching. In addition, in the process of separating the product after release from the solidified resin in the gate, the small diameter of the sealing resin part 2 causes the lead wire 1 to get in the way, making it difficult to cut, as shown in Figure 5. In some cases, the gate mark 6 protrudes beyond a predetermined amount, and the length of the sealing resin part 2 falls outside the tolerance specified by the product standard, and the lead wire 1 is bent when using this diode. In such a case, there is a concern that the gate marks (protrusions) 6 may become a hindrance, and problems such as the inability to maintain the interval between the bent lead wires 1 at a predetermined value may occur.

The present invention has been made in view of the above-mentioned circumstances, and its purpose is to enable smooth filling of resin into the cow cavity without the need to reduce the gate diameter, and to
A resin-sealed semiconductor element and a resin-sealed semiconductor element that can prevent the occurrence of pinholes, etc., can easily separate the product from the solidified resin in the gate, and can reliably and easily treat gate marks. The purpose of the present invention is to provide a mold for sealing.

[Means to solve the problem]

In order to achieve the above object, claim 1 of the present invention provides a resin-sealed semiconductor element in which a lead wire is connected to a semiconductor chip and a sealing resin part is formed around the semiconductor chip. , a gate mark is formed on the outer periphery of the sealing resin part.

In addition, claim 2 of the present invention provides a resin-sealed product by inserting an insert component in which a lead wire is connected to a semiconductor chip into a cavity formed between a pair of templates, and filling the cavity with resin. In a sealing mold for manufacturing a semiconductor element, a gate for injecting a resin into the cavity is arranged opposite to an insert component in the cavity.

[Effect]

In the resin-sealed semiconductor element and mold for molding of the present invention, by providing a gate in the mold corresponding to the outer periphery of the molding resin part, the gate diameter can be made sufficiently large, and the product can be easily It is easy to dispose of the gate residue after separation from the solidified resin inside the gate.

〔Example〕

Hereinafter, one embodiment of the present invention will be described based on FIGS. 1 to 3.

In these figures, the reference numeral 10 indicates a diode chip 11.
A cylindrical sealing resin portion 12 is formed in a portion of the diode chip 11 and both lead wires 10. A solidified resin 14 inside the gate 13 is integrally molded near one end of the outer peripheral portion of this sealing resin portion 12.
3 is connected to a runner 15.

The insert part 16 is constituted by the diode chip 11 and both lead wires 10, and the transfer molding die into which this insert part 16 is inserted and transfer molded has a pair of upper and lower parts as shown in FIGS. 2 and 3. A cylindrical cavity 1 is formed on the opposing surfaces of the molds 17 and 18.
9 is formed, and a recess 20 for inserting the lead wire 10 is formed on both end faces of the cavity 190, while the gate 13 is located near one end of the cavity 19 and in the lower mold 18, where the lead wire 10 is inserted. It is arranged opposite to the line 10. In addition, the cavity 19 of the above game) 13
The injection direction of the resin is set so that a swirling flow is formed along the inner peripheral surface of the cavity 19, avoiding the lead wire 10.

When manufacturing a resin-sealed diode element by performing insert molding on the insert part 16 consisting of the diode chip 11 and the lead wire 10 using the transfer molding mold configured as described above, first, the second As shown in FIG. 3 and FIG. 3, the insert part 16 is inserted into the cavity 19 and the recess 20 formed between the upper mold 17 and the lower mold 18, and when the mold is closed, the insert part 16 is inserted into the pot. The molten resin is pushed out by a movable body and injected into the cavity 19 via the runner 15 and the gate 13.

In this case, the gate 13 is disposed near one end of the cavity 19 and facing the lead wire 10, and the direction in which the resin is injected into the cavity 19 of the gate 13 avoids the lead wire lO. Since the swirling flow force is set to be formed along the inner peripheral surface of the cavity 19, the diameter of the gate 13 is smaller than when the gate 13 is formed on the end surface of the cavity 19 as in the conventional case. can be made sufficiently large, therefore, the speed of the resin flowing through the gate 13 can be slowed down, and the cavity 19 can be filled with resin well.In addition, the relationship between the product and the solidified resin 14 in the gate 13 after molding can be In the separation process, the lead wire 10 does not get in the way and can be cut and separated smoothly, and the gate mark 21 after separation is also formed on the outer peripheral surface of the cylindrical sealing resin part 12 of the product. Therefore, the sealing resin part 12
By rotating the gate mark 21, the gate trace 21 can be easily processed.

In the above embodiment, the gate 13 is arranged near one end of the cavity 19, but the pair of gates 13 may be arranged near both ends of the cavity 19.

〔Effect of the invention〕

As explained above, claim 1 of the present invention provides a resin-sealed semiconductor element in which a lead wire is connected to a semiconductor chip and a sealing resin portion is formed around the semiconductor chip. A gate mark is formed on the outer periphery of the resin part.A second aspect of the present invention also provides an insert part in which a lead wire is connected to a semiconductor chip in a cavity formed between a pair of templates. In a sealing mold for manufacturing a resin-sealed semiconductor element by inserting the resin into the cavity and filling the cavity with resin, a gate for injecting the resin into the cavity is arranged opposite to the insert part in the cavity. Therefore, by providing a gate in the mold corresponding to the outer periphery of the sealing resin part, there is no need to reduce the gate diameter, and the gate diameter can be made sufficiently large, making it possible to fit inside the cavity. Not only can resin be filled smoothly, pinholes etc. can be prevented from occurring, but the product and the solidified resin inside the gate can be easily separated, ensuring that gate marks can be treated reliably and easily. can be done.

[Brief explanation of the drawing]

Figures 1 to 3 show one embodiment of the present invention.
Figure 1 is a perspective view, Figure 2 is a plan view of the lower mold of the transfer mold, Figure 3 is a sectional view of the transfer mold, and Figures 4 and 5 show a conventional diode element. FIG. 4 is a perspective view, and FIG. 5 is a front view. 16... Insert parts, 17... Upper mold, 18.
...Lower mold, 19...cavity.

Claims (1)

[Scope of Claims] 1) In a resin-sealed semiconductor element in which a lead wire is connected to a semiconductor chip and a sealing resin portion is formed around the semiconductor chip, an outer circumferential portion of the sealing resin portion is provided. A resin-sealed semiconductor element characterized in that a gate trace is formed. 2) For sealing, in which an insert component consisting of a semiconductor chip with lead wires connected to it is inserted into a cavity formed between a pair of templates, and this cavity is filled with resin to manufacture a resin-sealed semiconductor element. 1. A mold for encapsulating a semiconductor device, characterized in that a gate for injecting resin into the cavity is arranged opposite to an insert component in the cavity.