JPH0456364A - Inter-substrate optical data link - Google Patents
Inter-substrate optical data linkInfo
- Publication number
- JPH0456364A JPH0456364A JP2167020A JP16702090A JPH0456364A JP H0456364 A JPH0456364 A JP H0456364A JP 2167020 A JP2167020 A JP 2167020A JP 16702090 A JP16702090 A JP 16702090A JP H0456364 A JPH0456364 A JP H0456364A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- optical
- light receiving
- light emitting
- data link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 title abstract description 6
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は基板間光データリンクに関し、ＬＳＩチップ間
やＨ−ＩＣ基板間の接続を光配線で行う基板間光データ
リンクに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an inter-board optical data link, and more particularly, to an inter-board optical data link in which connections between LSI chips and H-IC boards are made using optical wiring.
従来の基板間光データリンクは、例えば、第２図に示す
様に、電気部品７が実装された２枚の対向する電気回路
基板６の各々に、光送信器９および光受信器１０をそれ
ぞれ搭載し、光ファイバ１１で接続していた。この方法
は、一つの光送信器と光受信器との間に必ず一本の光フ
ァイバが必要であり、複数の光伝達経路が要求される場
合には、光送信器９及び光受信器１ｏの数及び光ファイ
バ１１の数も増え、電気回路基板６の上に大きなスペー
スを必要とする。また、電気回路基板の小型化にっても
、光送信器９及び光受信器１ｏの大きさから制約を受け
ていた。A conventional inter-board optical data link, for example, as shown in FIG. It was installed and connected via optical fiber 11. This method requires one optical fiber between one optical transmitter and one optical receiver, and when multiple optical transmission paths are required, optical transmitter 9 and optical receiver 1o and the number of optical fibers 11 also increase, requiring a large space on the electric circuit board 6. Furthermore, the size of the optical transmitter 9 and the optical receiver 1o also limits the miniaturization of the electric circuit board.
従来の基板間光データリンクは、電気部品が実装された
２枚の対向する電気回路基板の各々に、光送信器及び光
受信器をそれぞれ搭載し、光ファイバで接続していたの
で、複数の光伝送経路が要求される場合には、光送信器
及び光受信器の数が増え、電気回路基板上に大きなスペ
ースを必要とするという問題点がある。また、電気回路
基板の小型化についても、光送信器及び光受信器の大き
さから、制約を受は限界があるという問題点もある。In conventional inter-board optical data links, an optical transmitter and an optical receiver are mounted on each of two opposing electrical circuit boards on which electrical components are mounted, and are connected using optical fibers. When an optical transmission path is required, there is a problem in that the number of optical transmitters and optical receivers increases, and a large amount of space is required on the electrical circuit board. Further, there is also the problem that miniaturization of electric circuit boards is limited by the size of the optical transmitter and optical receiver.
本発明の目的は、光伝達経路が増加しても経済的に対応
可能で、かつ電気回路基板の小型化ができる基板間光デ
ータリンクを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an inter-board optical data link that can economically cope with an increase in the number of optical transmission paths and that can reduce the size of an electric circuit board.
本発明の基板間光データリンクは、電気回路を搭載する
複数の基板間の信号伝達を光信号を用いて行う基板間光
データリンクにおいて、前記複数の基板上に指向性を持
つ発光素子および受光素子を設け相互に信号伝達を行う
構成である。The inter-board optical data link of the present invention is an inter-board optical data link in which signal transmission between a plurality of boards on which electrical circuits are mounted is carried out using optical signals, in which a directional light emitting element and a light receiving element are provided on the plurality of boards. This is a configuration in which elements are provided and signals are transmitted between them.
本発明の基板間光データリンクは、前記指向性を持つ発
光素子および受光素子を光軸調整可能な反射体と半導体
発光素子および半導体受光素子とで構成してもよい。In the inter-substrate optical data link of the present invention, the light emitting element and the light receiving element having the above-mentioned directivity may be constituted by a reflector whose optical axis can be adjusted, and a semiconductor light emitting element and a semiconductor light receiving element.
前記光軸調整可能な反射体の光軸調整を反射角が相互に
若干異なる複数の光軸固定の反射体の中から適切なもの
を選択して使用することにより行ってもよい。The optical axis adjustment of the optical axis adjustable reflector may be performed by selecting and using an appropriate one from among a plurality of optical axis fixed reflectors having slightly different reflection angles.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は、本発明の一実施例の断面図である。FIG. 1 is a sectional view of one embodiment of the present invention.
電気部品７が実装された２枚の電気回路基板６が基板保
持部材８で、一定間隔を保って固定されている。ここで
使用されている電気回路基板６は、熱膨張の少ない材質
、例えばセラミックでつくられている。２枚の電気回路
基板６の対向する面に、それぞれ半導体発光素子１及び
半導体受光素子２がパッケージに入って固定されている
。このパッケージは、平面板３とガラスブロック４とで
構成され、平面板３に実装された半導体発光素子１及び
半導体受光素子２は、ガラスブロック４で出射光５の光
路を変えるようになっている。従って、ガラスブロック
４の形状を変えて出射光５の経路を変えることにより、
半導体発光素子１及び半導体受光素子２を電気回路基板
６の対向する面上の任意の場所に設けても、相互の信号
の授受を可能としている。すなわち、ガラスブロック４
で曲げられた半導体発光素子１の出射光５は、光軸調整
により半導体受光素子２の側のガラスブロック４に入射
し、半導体受光素子２へ入射する。Two electrical circuit boards 6 on which electrical components 7 are mounted are fixed at a constant distance by a board holding member 8. The electric circuit board 6 used here is made of a material with low thermal expansion, such as ceramic. A semiconductor light-emitting device 1 and a semiconductor light-receiving device 2 are fixed in a package to opposing surfaces of two electric circuit boards 6, respectively. This package is composed of a flat plate 3 and a glass block 4, and the semiconductor light emitting device 1 and the semiconductor light receiving device 2 mounted on the flat plate 3 change the optical path of the emitted light 5 by the glass block 4. . Therefore, by changing the shape of the glass block 4 and changing the path of the emitted light 5,
Even if the semiconductor light emitting device 1 and the semiconductor light receiving device 2 are provided at arbitrary locations on opposing surfaces of the electric circuit board 6, mutual signals can be exchanged. That is, glass block 4
The emitted light 5 of the semiconductor light emitting device 1 bent by is incident on the glass block 4 on the side of the semiconductor light receiving device 2 by optical axis adjustment, and is incident on the semiconductor light receiving device 2.
これにより光伝達経路が１つ形成される。２枚の電気回
路基板６に、この様な光伝達経路を複数形成する事が可
能である。This forms one optical transmission path. It is possible to form a plurality of such optical transmission paths on two electric circuit boards 6.
以上説明したように本発明は、半導体発光素子と半導体
受光素子と電気部品とを含む電気回路が形成されていて
、互いに対向している２枚の電気回路基板間の基板間光
データリンクを形成するため、半導体発光素子及び半導
体受光素子の出射光を任意の方向へ光路変更することが
可能な半導体発光素子のパッケージ及び半導体受光素子
のパッケージを設け、２枚の電気回路基板の対向する面
にも光軸調整して固定して信号の授受を行うことにより
、多くの光伝送経路を安価に作ることを可能とし、同時
に電気回路基板の小型化も可能となるという効果を有す
る。As explained above, the present invention forms an inter-board optical data link between two electrical circuit boards facing each other in which an electrical circuit including a semiconductor light-emitting element, a semiconductor light-receiving element, and an electrical component is formed. In order to do this, a package for a semiconductor light emitting element and a package for a semiconductor light receiving element that can change the optical path of the emitted light from the semiconductor light emitting element and the semiconductor light receiving element in any direction are provided. By adjusting and fixing the optical axis and transmitting and receiving signals, it is possible to create many optical transmission paths at low cost, and at the same time, it is possible to downsize the electric circuit board.
第１図は本発明の一実施例の断面図、第２図は従来の基
板間光データリンクの断面図である。
１・・・半導体発光素子、２・・・半導体受光素子、３
・・・平面板、４・・・ガラスブロック、５・・・出射
光、６・・・電気回路基板、７・・・電気部品、８・・
・基板保持部材、９・・・光送信器、１０・・・光受信
器、１１・・・光ファイバ。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional inter-board optical data link. 1... Semiconductor light emitting device, 2... Semiconductor light receiving device, 3
...Flat plate, 4...Glass block, 5...Emitted light, 6...Electric circuit board, 7...Electrical component, 8...
- Substrate holding member, 9... optical transmitter, 10... optical receiver, 11... optical fiber.
Claims (1)
号を用いて行う基板間光データリンクにおいて、前記複
数の基板上に指向性を持つ発光素子および受光素子を設
け相互に信号伝達を行うことを特徴とする基板間の光デ
ータリンク。 ２、前記指向性を持つ発光素子および受光素子を光軸調
整可能な反射体と半導体発光素子および半導体受光素子
とで構成することを特徴とする請求項１記載の基板間光
データリンク。 ３、前記光軸調整可能な反射体の光軸調整を反射角が相
互に若干異なる複数の光軸固定の反射体の中から適切な
ものを選択して使用することにより行うことを特徴とす
る請求項２記載の基板間光データリンク。[Claims] 1. In an inter-board optical data link that uses optical signals to transmit signals between a plurality of boards on which electric circuits are mounted, a light emitting element and a light receiving element with directionality are provided on the plurality of boards. An optical data link between boards, characterized in that they are provided and mutually transmit signals. 2. The inter-board optical data link according to claim 1, wherein the directional light emitting element and light receiving element are constituted by a reflector whose optical axis can be adjusted, a semiconductor light emitting element, and a semiconductor light receiving element. 3. The optical axis adjustment of the optical axis adjustable reflector is performed by selecting and using an appropriate one from among a plurality of fixed optical axis reflectors having slightly different reflection angles. 3. The inter-board optical data link according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2167020A JPH0456364A (en) | 1990-06-26 | 1990-06-26 | Inter-substrate optical data link |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2167020A JPH0456364A (en) | 1990-06-26 | 1990-06-26 | Inter-substrate optical data link |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0456364A true JPH0456364A (en) | 1992-02-24 |
Family
ID=15841905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2167020A Pending JPH0456364A (en) | 1990-06-26 | 1990-06-26 | Inter-substrate optical data link |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0456364A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07131063A (en) * | 1993-11-01 | 1995-05-19 | Nec Corp | Multichip module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329993U (en) * | 1976-08-20 | 1978-03-14 | ||
| JPH01108519A (en) * | 1987-10-22 | 1989-04-25 | Asahi Optical Co Ltd | Luminous flux adjusting method for scan type optical device |
-
1990
- 1990-06-26 JP JP2167020A patent/JPH0456364A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329993U (en) * | 1976-08-20 | 1978-03-14 | ||
| JPH01108519A (en) * | 1987-10-22 | 1989-04-25 | Asahi Optical Co Ltd | Luminous flux adjusting method for scan type optical device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07131063A (en) * | 1993-11-01 | 1995-05-19 | Nec Corp | Multichip module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112969946B (en) | Network switch ASIC and optical transceiver assembly | |
| US6583902B1 (en) | Modular fiber-optic transceiver | |
| KR102297454B1 (en) | Optical interconnect system, interconnect device for optical communications and method for producing the same | |
| JP6959316B2 (en) | High-speed free space optical communication | |
| US5754948A (en) | Millimeter-wave wireless interconnection of electronic components | |
| US4063083A (en) | Data communication system using light coupled interfaces | |
| US5663739A (en) | Method and arrangement for establishing networks of electro-optical display-field modules | |
| US5848214A (en) | Optically-guiding multichip module | |
| US20050276547A1 (en) | Fiber optic transceiver module with rigid and flexible circuit boards | |
| US20010033497A1 (en) | Alignment of optical interfaces for data communication | |
| EP3345030B1 (en) | System, method, and apparatus for optical broadcast transmission in a circuit board | |
| JPH05500280A (en) | Optical interconnect printed circuit structure | |
| JP2010530670A (en) | Optical wiring | |
| JPH0456364A (en) | Inter-substrate optical data link | |
| CN107925478B (en) | Systems, methods, and apparatus for performing alignment between an optical transceiver and an optical reflector | |
| WO2013115782A1 (en) | Monolithically integrated, self-aligning, optical-fiber ferrule | |
| WO2005002301A1 (en) | Method for transmission of signals in a circuit board and a circuit board | |
| US20110091168A1 (en) | Opto-electrical assemblies and associated apparatus and methods | |
| JPH07113924A (en) | Optical circuit component and manufacturing method thereof | |
| US20040208438A1 (en) | Optical routing system | |
| JPH03109837A (en) | Optical data transmission system | |
| JP6447649B2 (en) | Optical space transmission system | |
| JPH04179171A (en) | Semiconductor device | |
| US5235661A (en) | Optical connection device of a planar type | |
| TWI917027B (en) | Optical module assembly and fiber optic connector |