JPH045649U - - Google Patents
Info
- Publication number
- JPH045649U JPH045649U JP4579590U JP4579590U JPH045649U JP H045649 U JPH045649 U JP H045649U JP 4579590 U JP4579590 U JP 4579590U JP 4579590 U JP4579590 U JP 4579590U JP H045649 U JPH045649 U JP H045649U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- casing
- lid
- conductor layer
- grounding conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例の分解縦断面図、第
２図は他の実施例の縦断面図、第３図は従来例の
縦断面図である。
１１，２１……電子部品、１２……筐体、１３
，２３……回路基板、１４……蓋体、１７……接
地用導体層、１９，２９……固定部材。
FIG. 1 is an exploded longitudinal sectional view of one embodiment of the present invention, FIG. 2 is a longitudinal sectional view of another embodiment, and FIG. 3 is a longitudinal sectional view of a conventional example. 11, 21... Electronic component, 12... Housing, 13
, 23... Circuit board, 14... Lid, 17... Grounding conductor layer, 19, 29... Fixing member.
Claims (1)
、前記回路基板を収容する導電性の筐体と、前記
筐体を封止する蓋体とを備えた電子部品において
、 前記蓋体と前記回路基板との間に配置された、
前記蓋体を前記筐体に装着することにより、前記
回路基板の前記接地用導体層を前記筐体の内面に
当接する固定部材を備えていることを特徴とする
電子部品。[Claims for Utility Model Registration] An electronic device comprising a circuit board having a grounding conductor layer on one main surface, a conductive casing that houses the circuit board, and a lid that seals the casing. In the component, disposed between the lid body and the circuit board,
An electronic component comprising: a fixing member that brings the grounding conductor layer of the circuit board into contact with an inner surface of the casing by attaching the lid to the casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4579590U JPH045649U (en) | 1990-04-27 | 1990-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4579590U JPH045649U (en) | 1990-04-27 | 1990-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045649U true JPH045649U (en) | 1992-01-20 |
Family
ID=31560289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4579590U Pending JPH045649U (en) | 1990-04-27 | 1990-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045649U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014010074A1 (en) * | 2012-07-13 | 2014-01-16 | 三菱電機株式会社 | Semiconductor device |
-
1990
- 1990-04-27 JP JP4579590U patent/JPH045649U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014010074A1 (en) * | 2012-07-13 | 2014-01-16 | 三菱電機株式会社 | Semiconductor device |
| US9363914B2 (en) | 2012-07-13 | 2016-06-07 | Mitubishi Electric Corporation | Semiconductor device |
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