JPH0457049B2 - - Google Patents
Info
- Publication number
- JPH0457049B2 JPH0457049B2 JP59254557A JP25455784A JPH0457049B2 JP H0457049 B2 JPH0457049 B2 JP H0457049B2 JP 59254557 A JP59254557 A JP 59254557A JP 25455784 A JP25455784 A JP 25455784A JP H0457049 B2 JPH0457049 B2 JP H0457049B2
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- polymerizable compound
- insulated conductor
- cationic polymerizable
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、良好な特性の絶縁導体（電線、電子
部品回路形成用導体）を効率よく製造する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for efficiently manufacturing insulated conductors (electric wires, conductors for forming electronic component circuits) with good characteristics.
絶縁導体における導体と絶縁層との間の接着
は、絶縁特性を阻害せず、使用時の曲げ加工等の
苛酷な条件に耐えうる強力なものであることが要
求されるとともに、かかる絶縁導体は、工業生産
に対応しうる線速が必要である。
The bond between the conductor and the insulating layer in an insulated conductor is required to be strong enough to withstand harsh conditions such as bending during use without impeding the insulation properties. , a line speed that can accommodate industrial production is required.
従来、絶縁導体、就中縦ぞえ導体の製造に際し
ては、熱硬化性接着剤を用いて絶縁テープを導体
上に接着、被覆しているが、かかる方法の場合、
線速が遅いので生産効率が遅く、非工業的であ
る。 Conventionally, when manufacturing insulated conductors, particularly vertical conductors, insulating tape is adhered and coated onto the conductor using a thermosetting adhesive, but in the case of such a method,
Since the linear speed is slow, the production efficiency is low and it is non-industrial.
また、熱硬化性接着剤に代えて、光硬化性樹脂
を使用する方法も提案されているが、その際使用
される光硬化性接着剤としては、一般式
（式中、R1は水素原子又はメチルを、R2は付
加物のエステル化反応残基を示す）
で表わされるアクリル基含有化合物に光開始剤を
加えたものが用いられてるが、かかる光硬化性接
着剤を用いた場合には、Ａ種絶縁（105℃）まで
が限度であり、また線速が遅い場合が多く、非工
業的傾向がある。 In addition, a method of using a photocurable resin instead of a thermosetting adhesive has been proposed, but the photocurable adhesive used in that case is of the general formula (In the formula, R 1 is a hydrogen atom or methyl, and R 2 is an esterification reaction residue of the adduct.) A compound containing a photoinitiator is used in which a photoinitiator is added to an acrylic group-containing compound represented by When a curable adhesive is used, it is limited to class A insulation (105° C.), and the line speed is often slow, which tends to be unindustrial.
本発明の目的は、極めて速い線速においても、
接着剤の硬化が十分で強力に接着された絶縁導体
の製造方法を提供することである。
The purpose of the present invention is to
It is an object of the present invention to provide a method for manufacturing an insulated conductor in which an adhesive is sufficiently cured and is strongly bonded.
本発明の他の目的は、耐熱性に優れ、Ｂ種絶縁
（130℃）が可能な絶縁導体の製造方法を提供する
ことである。 Another object of the present invention is to provide a method for manufacturing an insulated conductor that has excellent heat resistance and is capable of Class B insulation (130° C.).
本発明は、下記(a)，(b)，(c)および(d)を含有する
樹脂組成物よりなる光硬化性接着剤層を片面に形
成せしめた透光性フイルムの当該接着剤層を、導
体面に対応する如く施した後、光照射を行うこと
によつて接着剤層を硬化せしめることを特徴とす
る絶縁導体の製造方法よりなるものである。
The present invention provides a photocurable adhesive layer formed on one side of a transparent film made of a resin composition containing the following (a), (b), (c) and (d). , a method for producing an insulated conductor, characterized in that the adhesive layer is applied in a manner corresponding to the conductor surface and then cured by irradiation with light.
(a) １分子中にオキシラン環を２個以上有するエ
ポキシ樹脂を主成分とする１種以上のカチオン
重合性化合物。(a) One or more cationically polymerizable compounds whose main component is an epoxy resin having two or more oxirane rings in one molecule.
(b) 紫外線照射により、前記カチオン重合性化合
物の重合を開始しうるルイス酸触媒を遊離する
ことのできる、前記カチオン重合性化合物に対
して0.5〜10％の有効量の光開始剤。(b) A photoinitiator in an effective amount of 0.5 to 10% based on the cationically polymerizable compound, which is capable of liberating a Lewis acid catalyst capable of initiating polymerization of the cationically polymerizable compound upon irradiation with ultraviolet light.
本発明に使用される(a)成分のカチオン重合性化
合物は、１分子中にオキシラン環を２個以上有す
るエポキシ樹脂を主成分とする１種以上のカチオ
ン重合性化合物であり、前記エポキシ樹脂として
はビスフエノールＡ型エポキシ樹脂、ノボラツク
型エポキシ樹脂、脂環式エポキシ樹脂などが好ま
しい。 The cationically polymerizable compound as component (a) used in the present invention is one or more cationically polymerizable compounds whose main component is an epoxy resin having two or more oxirane rings in one molecule. Preferred examples include bisphenol A type epoxy resin, novolac type epoxy resin, and alicyclic epoxy resin.
かかるビスフエノールＡ型エポキシ樹脂として
は、たとえばエピコート828、エピコート834、エ
ピコート836、エピコート1001、エピコート1004、
エピコート1007（以上、シエル化学社製、商品
名）、DER331，DER332，DER661，DER664，
DER667，（以上、ダウケミカル社製、商品名）、
アラルダイト260、アラルダイト280、アラルダイ
ト6071、アラルダイト6084、アラルダイト6097
（以上、チバガイギー社製、商品名）などがあげ
あれ、それらが単独または混合として用いられ
る。 Such bisphenol A type epoxy resins include, for example, Epicote 828, Epicote 834, Epicote 836, Epicote 1001, Epicote 1004,
Epicote 1007 (manufactured by Ciel Chemical Co., Ltd., product name), DER331, DER332, DER661, DER664,
DER667, (manufactured by Dow Chemical Company, product name),
Araldite 260, Araldite 280, Araldite 6071, Araldite 6084, Araldite 6097
(all manufactured by Ciba-Geigy, trade name), etc., and these may be used alone or in combination.
また、前記ノボラツク型エポキシ樹脂として
は、例えばエピコート152、エピコート154（以上、
シエル化学社製、商品名）、アラルダイト
EPN1138，アラルダイトEPN1139，アラルダイ
トECN1235，アラルダイトECN1273、アラルダ
イトECN1280、アラルダイトECN1299（以上、チ
バガイギー社製、商品名）、DEN431、DEN438
（以上、ダウケミカル社製、商品名）などがあげ
られ、それが単独または混合して用いられる。 In addition, examples of the novolac type epoxy resin include Epikote 152 and Epikote 154 (the above,
Manufactured by Ciel Chemical Co., Ltd., trade name), Araldite
EPN1138, Araldite EPN1139, Araldite ECN1235, Araldite ECN1273, Araldite ECN1280, Araldite ECN1299 (manufactured by Ciba Geigy, product name), DEN431, DEN438
(all manufactured by Dow Chemical Company, trade name), etc., which may be used alone or in combination.
さらに前記脂環式エポキシ樹脂としては、たと
えばアラルダイトCY175、アラルダイトCY177、
アラルダイトCY179、アラルダイトCY184，アラ
ルダイトCY192（以上、チバガイギー社製、商品
名）、ERL−4221、ERL−4229、ERL−4234（以
上、ユニオンカーバイド社製、商品名）などがあ
げられ、それらが単独または混合して用いられ
る。 Further, examples of the alicyclic epoxy resin include Araldite CY175, Araldite CY177,
Examples include Araldite CY179, Araldite CY184, Araldite CY192 (trade name, manufactured by Ciba Geigy), ERL-4221, ERL-4229, ERL-4234 (trade name, manufactured by Union Carbide), etc., and these can be used alone or Used in combination.
その他ブタジエン系エポキシ樹脂などの使用も
可能であり、前記各種エポキシ樹脂を混合したも
のも使用しうる。 Other butadiene-based epoxy resins can also be used, and mixtures of the various epoxy resins mentioned above can also be used.
前記カチオン重合性化合物には硬化特性が低下
しない範囲内で１官能エポキシ希釈剤が使用され
うる。 A monofunctional epoxy diluent may be used in the cationically polymerizable compound as long as the curing properties are not deteriorated.
かかる１官能エポキシ希釈剤としては、たとえ
ばフエニルグリシジルエーテル、ｔ−ブチルグリ
シジルエーテルなどがあげられる。 Examples of such monofunctional epoxy diluents include phenyl glycidyl ether and t-butyl glycidyl ether.
さらにカチオン重合性ビニル化合物を該エポキ
シ樹脂に混合して使用することも可能であり、か
かるカチオン重合性ビニル化合物としては、たと
えばスチレン、アリルベンゼン、ビニルエーテ
ル、Ｎ−ビニルカルバゾール、Ｎ−ビニルピロリ
ドンなどがあげられる。 Furthermore, it is also possible to use a cationically polymerizable vinyl compound mixed with the epoxy resin, and examples of such cationically polymerizable vinyl compounds include styrene, allylbenzene, vinyl ether, N-vinylcarbazole, and N-vinylpyrrolidone. can give.
本発明に使用される(b)成分の紫外線照射によ
り、(a)成分のカチオン重合性化合物の重合を開始
しうるルイス酸触媒を遊離する光開始剤として
は、芳香族ハロニウム塩、第ａ族または第Va
族元素の光感応性芳香族オニウム塩などがあげら
れる。 The photoinitiator used in the present invention, which releases a Lewis acid catalyst capable of initiating polymerization of the cationic polymerizable compound of component (a) by UV irradiation of component (b), includes aromatic halonium salts, group a group or Article Va
Examples include photosensitive aromatic onium salts of group elements.
かかる芳香族ハロニウム塩としては一般式
（）
［（R3）a（R4）bＸ］+ C［MQd］- (d Such an aromatic halonium salt has the general formula () [(R 3 ) a (R 4 ) b X] + C [MQ d ] - (d
Claims (1)
物よりなる光硬化性接着剤層を片面に形成せしめ
た透光性フイルムの当該接着剤層を、導体面に対
応する如く施した後、光照射を行うことによつて
接着剤層を硬化せしめることを特徴とする絶縁導
体の製造方法。 (a) １分子中にオキシラン環を２個以上有するエ
ポキシ樹脂を主成分とする１種以上のカチオン
重合性化合物。 (b) 紫外線照射により、前記カチオン重合性化合
物の重合を開始しうるルイス酸触媒を遊離する
ことのできる、前記カチオン重合性化合物に対
して0.5〜10％（重量％、以下同様）の有効量
の光開始剤。 (c) 前記カチオン重合性化合物に対して0.5〜20
％の分子量が10000〜60000の範囲のフエノキシ
樹脂および、 (d) 前記カチオン重合性化合物に対して0.5〜20
％の分子中に水酸基を２個以上有する多価アル
コール。 ２ 光硬化性接着剤の硬化に際して、光照射とと
もに加熱を行うことを特徴とする特許請求の範囲
第１項記載の絶縁導体の製造方法。 ３ 導体と透光性テープとの間に絶縁層を設けて
なる特許請求の範囲第１項記載の絶縁導体の製造
方法。 ４ 透光性テープが化学的処理若しくは電気的コ
ロナ放電処理によつて接着剤との親和性を改善さ
れてなる特許請求の範囲第１項記載の絶縁導体の
製造方法。[Scope of Claims] 1. Adhesion of a transparent film having a photocurable adhesive layer formed on one side thereof made of a resin composition containing the following (a), (b), (c) and (d): 1. A method for manufacturing an insulated conductor, which comprises applying an adhesive layer so as to correspond to the conductor surface, and then curing the adhesive layer by irradiating with light. (a) One or more cationically polymerizable compounds whose main component is an epoxy resin having two or more oxirane rings in one molecule. (b) An effective amount of 0.5 to 10% (wt%, same hereinafter) based on the cationic polymerizable compound that can liberate a Lewis acid catalyst capable of initiating polymerization of the cationic polymerizable compound by ultraviolet irradiation. photoinitiator. (c) 0.5 to 20 for the cationic polymerizable compound
(d) a phenoxy resin having a molecular weight of 10,000 to 60,000, and (d) a molecular weight of 0.5 to 20% relative to the cationic polymerizable compound.
% of polyhydric alcohols having two or more hydroxyl groups in the molecule. 2. The method for manufacturing an insulated conductor according to claim 1, wherein the photocurable adhesive is cured by heating together with light irradiation. 3. The method for manufacturing an insulated conductor according to claim 1, wherein an insulating layer is provided between the conductor and the translucent tape. 4. The method of manufacturing an insulated conductor according to claim 1, wherein the light-transmitting tape has its affinity with an adhesive improved by chemical treatment or electric corona discharge treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25455784A JPS61133514A (en) | 1984-11-30 | 1984-11-30 | Manufacture of insulated conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25455784A JPS61133514A (en) | 1984-11-30 | 1984-11-30 | Manufacture of insulated conductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61133514A JPS61133514A (en) | 1986-06-20 |
| JPH0457049B2 true JPH0457049B2 (en) | 1992-09-10 |
Family
ID=17266697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25455784A Granted JPS61133514A (en) | 1984-11-30 | 1984-11-30 | Manufacture of insulated conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61133514A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5928599A (en) | 1995-06-01 | 1999-07-27 | Batesville Services, Inc. | Method of forming articles of manufacture of various shapes including undercuts therein with generic tool |
| JP2000144079A (en) * | 1998-11-18 | 2000-05-26 | Sekisui Chem Co Ltd | Reactive hot melt adhesive composition and bonding method |
| JP5691261B2 (en) * | 2010-06-25 | 2015-04-01 | 東洋インキＳｃホールディングス株式会社 | Photocurable adhesive for polarizing plate formation and polarizing plate |
| JP6679454B2 (en) * | 2016-09-20 | 2020-04-15 | 住友化学株式会社 | Polarizing plate and laminated optical member using the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3951769A (en) * | 1974-03-01 | 1976-04-20 | American Can Company | Epoxide photopolymerizable compositions containing cyclic amides as gelation inhibitor and methods of polymerizing |
| US4356050A (en) * | 1979-12-11 | 1982-10-26 | General Electric Company | Method of adhesive bonding using visible light cured epoxies |
| DE3225691A1 (en) * | 1981-10-29 | 1983-05-11 | General Electric Co., Schenectady, N.Y. | Process for the production of improved safety glass laminates |
-
1984
- 1984-11-30 JP JP25455784A patent/JPS61133514A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61133514A (en) | 1986-06-20 |
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