JPH0457099B2 - - Google Patents
Info
- Publication number
- JPH0457099B2 JPH0457099B2 JP60174268A JP17426885A JPH0457099B2 JP H0457099 B2 JPH0457099 B2 JP H0457099B2 JP 60174268 A JP60174268 A JP 60174268A JP 17426885 A JP17426885 A JP 17426885A JP H0457099 B2 JPH0457099 B2 JP H0457099B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- drying device
- transferred
- transfer
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
半導体の樹脂封止において、成形品中にボイド
が出ると表面性状悪化等の理由で不良品となる。
このボイド発生の要因はいくつかあるが、その中
で樹脂中に含まれる水分が最大の要因であること
が定説となつている。従つて現在樹脂の移送・保
管には種々の配慮が必要となつている。本発明
は、ボイド発生の原因となつている水分を除去す
るための乾燥装置をトランスフアーモールドプレ
スのクラウン上に備えた樹脂封止装置に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) In the resin encapsulation of semiconductors, if voids appear in the molded product, the product will be defective due to deterioration of the surface quality or the like.
There are several factors that cause this void generation, but it is well-established that water contained in the resin is the biggest factor. Therefore, various considerations are currently required when transporting and storing resin. The present invention relates to a resin sealing device that is equipped with a drying device on the crown of a transfer mold press to remove moisture that causes voids.
（従来技術）
従来は樹脂を乾燥することなく、保管場所より
取出されたタブレツト状樹脂をそのまま、大気中
に於て高周波加熱炉等で短時間予熱したのち、樹
脂封止装置に投入していた。(Prior technology) Conventionally, tablet-shaped resin was taken out from storage without drying, and after being preheated in the atmosphere for a short time in a high-frequency heating furnace, etc., it was put into a resin sealing machine. .
しかし、これでは切角加熱しても、樹脂封止装
置のポツトに投入するまでの間に水分を含み、ボ
イド発生はさけられなかつた。 However, with this method, even if the cut-edge heating is performed, moisture is retained before being put into the pot of the resin sealing device, and the generation of voids cannot be avoided.
（発明が解決しようとする問題点）
プレスのクラウン上に樹脂乾燥装置を備え、こ
の乾燥装置をトランスフアーモールドプレスと一
体として、一旦乾燥した樹脂が成形前に再び湿ら
ないようにして樹脂成形品のボイド発生を防ぐこ
とを目的とする。(Problem to be Solved by the Invention) A resin drying device is provided on the crown of the press, and this drying device is integrated with the transfer mold press to prevent the dried resin from becoming wet again before molding. The purpose is to prevent the occurrence of voids.
（発明による解決手段）
トランスフアーモールドプレスＡのクランに、
樹脂６の出入口以外を密閉され、一端に熱風入口
４を、他端に熱風出口５を有している乾燥装置本
体１内に樹脂乾燥用のコンベヤ２を配した樹脂乾
燥装置Ｂを設け、該樹脂乾燥装置Ｂから送り出さ
れた樹脂６を樹脂横送りシリンダ７の先端に設け
たＵ溝７′に移し、これをさらに移送用シリンダ
１１によつて往復動する爪１０で掴んでポツト１
２の上部に移送し、ポツト１２に移された樹脂６
をシリンダ１３によつて樹脂受板１４上を移送し
プレスの中心位置まで送り、樹脂落し口１５から
金型１６の中に装入するよう構成した樹脂移送装
置Ｃで結んだ。(Solution by invention) In the clan of transfer mold press A,
A resin drying apparatus B is provided in which a conveyor 2 for drying the resin is disposed within a drying apparatus main body 1 which is sealed except for the entrance and exit of the resin 6 and has a hot air inlet 4 at one end and a hot air outlet 5 at the other end. The resin 6 sent out from the resin drying device B is transferred to the U groove 7' provided at the tip of the transverse resin feed cylinder 7, and is further gripped by the claw 10 reciprocated by the transfer cylinder 11 and transferred to the pot 1.
Resin 6 transferred to the upper part of 2 and transferred to pot 12
was transferred onto a resin receiving plate 14 by a cylinder 13 to the center of the press, and tied by a resin transfer device C configured to be charged into a mold 16 from a resin drop port 15.
この構成により、密閉状態で乾燥された樹脂を
樹脂密閉装置に直ちに移送して水分を吸収する時
間をなくし、樹脂の移送・保管等にさして気を使
わなくてもすむようにした。 This configuration eliminates the need to immediately transfer the sealed and dried resin to the resin sealing device to absorb moisture, and eliminates the need for special care in transferring and storing the resin.
（実施例）
第１図〜第４図に基いて説明する。Ａはトラン
スフアーモールドプレスである。該プレスＡのク
ラウン上に樹脂乾燥装置Ｂが一体に設けられてい
る。Ｃは樹脂乾燥装置Ｂにて乾燥された樹脂移送
装置である。(Example) An explanation will be given based on FIGS. 1 to 4. A is a transfer mold press. A resin drying device B is integrally provided on the crown of the press A. C is a resin transfer device dried in resin drying device B.
樹脂乾燥装置Ｂは、樹脂６の出入口以外を密閉
した乾燥装置本体１と、この密閉された本体１内
部には樹脂６をのせてコンベヤ駆動用のモータ３
によつて極く低速で駆動される樹脂乾燥用のコン
ベヤ２が配されている。乾燥装置本体１は一端に
乾燥用の熱風入口４を他端に熱風出口５を有して
いる（第３，４図）。 The resin drying device B includes a drying device main body 1 whose parts other than the entrance and exit of the resin 6 are sealed, and a motor 3 for driving a conveyor with the resin 6 placed inside the sealed main body 1.
A conveyor 2 for drying the resin is provided which is driven at a very low speed by a conveyor belt. The drying device main body 1 has a hot air inlet 4 for drying at one end and a hot air outlet 5 at the other end (FIGS. 3 and 4).
樹脂乾燥装置Ｂから出た樹脂６は樹脂横送りシ
リンダ７の先端に設けたＵ溝７′に移される。Ｕ
溝７′に移された樹脂６は移送用シリンダ１１に
よつてガイドロツド８に案内されて往復動される
移動可能な爪用クロスヘツド９に装着された爪１
０（第３図）で掴まれてポツト１２の上部に移送
され、そこで爪１０を開きポツト１２に落し込
む。ポツト１２に移された樹脂はシリンダ１３に
よつて樹脂受板１４上を移送され、プレスの中心
位置まで送られ樹脂落し口１５から金型１６の中
に挿入される。 The resin 6 discharged from the resin drying device B is transferred to a U groove 7' provided at the tip of the resin transverse feed cylinder 7. U
The resin 6 transferred to the groove 7' is guided by a transfer cylinder 11 to a guide rod 8, and the claw 1 is attached to a movable claw crosshead 9 which is reciprocated.
0 (FIG. 3) and is transferred to the upper part of the pot 12, where the claw 10 is opened and it is dropped into the pot 12. The resin transferred to the pot 12 is transferred by the cylinder 13 over the resin receiving plate 14, sent to the center of the press, and inserted into the mold 16 through the resin drop port 15.
（効果）
(1) 密閉型の樹脂乾燥装置Ｂをトランスフアーモ
ールドプレスＡのクラウンに一体にとりつけた
ので、樹脂乾燥装置Ｂから封止装置までの距離
が短縮され、移送中の水分の再吸収がなくな
り、成形品のボイド発生を減らすことができ
る。(Effects) (1) Since the closed type resin drying device B is integrally attached to the crown of the transfer mold press A, the distance from the resin drying device B to the sealing device is shortened, and moisture is reabsorbed during transfer. This eliminates the occurrence of voids in molded products.
(2) 樹脂のハンドリングの自動化が可能となつ
た。(2) Automation of resin handling has become possible.
(3) 樹脂乾燥装置Ｂをクラウン上に設けたので、
省スペースが可能となつた。(3) Since resin drying device B was installed on the crown,
It became possible to save space.
第１図は半導体樹脂封止装置の正面図。第２図
は第１図の矢視側面図。第３図は同じく矢視
平面図。第４図は同じく矢視図。
図において；Ａ……トランスフアーモールドプ
レス、Ｂ……樹脂乾燥装置、Ｃ……樹脂移送装
置、１……乾燥装置本体、２……樹脂乾燥用コン
ベヤ、３……コンベヤ駆動モータ、４……乾燥熱
風入口、５……熱風出口、６……樹脂、７……樹
脂横送りシリンダ、７′……Ｕ溝、８……ガイド
ロツド、９……爪用クロスヘツド、１０……爪、
１１……移送用シリンダ、１２……ポツト、１３
……エヤシリンダ、１４……樹脂受板、１５……
樹脂落し口、１６……金型。
FIG. 1 is a front view of a semiconductor resin sealing device. FIG. 2 is a side view taken in the direction of the arrows in FIG. 1. FIG. 3 is also a plan view as viewed from the arrow. Figure 4 is also a view in the direction of the arrow. In the figure: A...Transfer mold press, B...Resin drying device, C...Resin transfer device, 1...Drying device main body, 2...Resin drying conveyor, 3...Conveyor drive motor, 4... Dry hot air inlet, 5...Hot air outlet, 6...Resin, 7...Resin cross feed cylinder, 7'...U groove, 8...Guide rod, 9...Cross head for claw, 10...Claw,
11... Transfer cylinder, 12... Pot, 13
...Air cylinder, 14...Resin receiving plate, 15...
Resin outlet, 16...Mold.
Claims (1)
入口４を他端に熱風出口５を有する乾燥装置本体
１内に樹脂乾燥用のコンベヤ２を配した樹脂乾燥
装置ＢをトランスフアーモールドプレスＡのクラ
ウンに設け、該樹脂乾燥装置Ｂから送られた樹脂
６を、樹脂横送りシリンダ７の先端に設けたＵ溝
７′に移して横送りし、これをさらに移送用シリ
ンダ１１によつて往復動する爪１０で掴みポツト
１２の上部に移送し、ポツト１２に移された樹脂
６をさらにシリンダ１３によつて樹脂受板１４上
を移送し、樹脂落し口１５から金型１６内に装入
するよう構成した樹脂移送装置Ｃで移送するよう
にしたことを特徴とする樹脂の乾燥装置を有する
半導体樹脂封止装置。1 A resin drying device B is installed in a transfer mold press A, in which a conveyor 2 for drying resin is arranged inside a drying device main body 1, which is sealed except for the entrance and exit of the resin 6, and has a hot air inlet 4 at one end and a hot air outlet 5 at the other end. The resin 6 sent from the resin drying device B provided on the crown is transferred to the U groove 7' provided at the tip of the transverse resin feed cylinder 7, and is fed laterally, and is further reciprocated by the transfer cylinder 11. The resin 6 transferred to the pot 12 is further transferred onto the resin receiving plate 14 by the cylinder 13, and charged into the mold 16 through the resin drop port 15. A semiconductor resin encapsulating device having a resin drying device, characterized in that the resin is transferred by a resin transfer device C configured as above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17426885A JPS6235629A (en) | 1985-08-09 | 1985-08-09 | Semiconductor encapsulating device with resin dryer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17426885A JPS6235629A (en) | 1985-08-09 | 1985-08-09 | Semiconductor encapsulating device with resin dryer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6235629A JPS6235629A (en) | 1987-02-16 |
| JPH0457099B2 true JPH0457099B2 (en) | 1992-09-10 |
Family
ID=15975676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17426885A Granted JPS6235629A (en) | 1985-08-09 | 1985-08-09 | Semiconductor encapsulating device with resin dryer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6235629A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07117581B2 (en) * | 1989-07-19 | 1995-12-18 | トヨタ自動車株式会社 | Car navigation system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6040362B2 (en) * | 1978-05-17 | 1985-09-10 | 株式会社日立製作所 | mold machine |
-
1985
- 1985-08-09 JP JP17426885A patent/JPS6235629A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6235629A (en) | 1987-02-16 |
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