JPH0458520A - Chemical discharger - Google Patents
Chemical dischargerInfo
- Publication number
- JPH0458520A JPH0458520A JP17125290A JP17125290A JPH0458520A JP H0458520 A JPH0458520 A JP H0458520A JP 17125290 A JP17125290 A JP 17125290A JP 17125290 A JP17125290 A JP 17125290A JP H0458520 A JPH0458520 A JP H0458520A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- diaphragm
- valve
- opening
- pneumatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000126 substance Substances 0.000 title claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体集積回路の製造工程のフォトエツチング
工程において、ウェハーの周縁の絶縁被膜に溶剤をかけ
て溶かすサイトリンス工程等に用いられる薬液を吐出す
る装置に関する。[Detailed Description of the Invention] Industrial Application Field The present invention discharges a chemical solution used in a photoetching process in the manufacturing process of semiconductor integrated circuits, such as a site rinsing process in which a solvent is applied to an insulating coating on the periphery of a wafer to dissolve it. Regarding equipment.
従来の技術
例えば、ウェハーを取り扱う場合に周縁の絶縁被膜は剥
れ落ちて基板上に付着することにより不良品となるおそ
れがあるため、上記のようなサイドリンスが施されるが
、溶剤を吐出するのに従来はベローズポンプまたは不活
性ガスによる加圧圧送が行われていた。Conventional technology For example, when handling a wafer, the insulating coating on the periphery may peel off and adhere to the substrate, resulting in a defective product. Conventionally, pressurized pressure feeding using a bellows pump or an inert gas was used for this purpose.
発明が解決しようとする問題点
しかし、ながら、このような吐出方法では、開弁の瞬間
に一時的に大流量の溶剤が吐出され、ウェハーに当たっ
て跳ね返ることにより他の部分の絶縁被膜に付着してそ
の部分を溶かしたり、あるいは必要以上の幅で溶かされ
ることにより不良品が生ずる不具合があり、また、跳ね
返りが生しないような低圧に調整するとサイドリンスに
必要な流量が得られないという欠点があった。Problems to be Solved by the Invention However, with this type of dispensing method, a large amount of solvent is temporarily dispensed at the moment the valve is opened, and as it bounces off the wafer, it may adhere to the insulating coating on other parts. There is a problem that defective products may be produced if the part is melted or the width is melted more than necessary.Also, if the pressure is adjusted to a low level that does not cause rebound, there is a problem that the flow rate required for side rinsing cannot be obtained. Ta.
なお、このような問題はサイドリンス以外の薬液の吐出
にも起こり得る問題であった。Incidentally, such a problem may also occur when discharging chemical liquids other than side rinse.
問題点を解決するための手段
本発明の薬液吐出装置はこのような問題点を解決するた
めの手段として、薬液タンクと薬液ノズルとに接続され
たエアー駆動式のダイヤフラムポンプと、そのダイヤフ
ラムポンプを駆動する加圧エアーを供給する加圧エアー
供給装置と、その加圧エアー供給装置の供給エアー圧力
を電気的に制御する制御装置とを備えた構成とした。Means for Solving the Problems The chemical liquid dispensing device of the present invention, as a means for solving such problems, includes an air-driven diaphragm pump connected to a chemical liquid tank and a chemical liquid nozzle, and the diaphragm pump. The configuration includes a pressurized air supply device that supplies driving pressurized air, and a control device that electrically controls the air pressure supplied by the pressurized air supply device.
作用及び効果
本発明は上記構成になり、制御装置により加圧エアー供
給装置の供給エアー圧力を任意に調整することができ、
これによりダイヤフラムポンプの作動圧力を任意に制御
することができる。Functions and Effects The present invention has the above-mentioned configuration, and the supply air pressure of the pressurized air supply device can be arbitrarily adjusted by the control device.
This makes it possible to arbitrarily control the operating pressure of the diaphragm pump.
したがって、薬液ノズルから吐出される薬液の最低圧力
と最高圧力及び最低圧力から最高圧力に至る時間を任意
に制御することができ、例えば、吐出開始時には低圧に
しておき、次第に高圧となるように制御することにより
跳ね返りを防止することができるのであって、最良の条
件で薬液を吐出することができる効果がある。Therefore, it is possible to arbitrarily control the minimum pressure and maximum pressure of the chemical liquid discharged from the chemical liquid nozzle, as well as the time from the minimum pressure to the maximum pressure. For example, the pressure may be kept low at the start of discharge, and then controlled to gradually increase to a high pressure. By doing so, splashing can be prevented, and the medicinal liquid can be ejected under the best conditions.
実施例
以下、本発明の一実施例を添付図面に基づいて説明する
。EXAMPLE Hereinafter, an example of the present invention will be described based on the accompanying drawings.
第1図において、1は薬液を収容したタンクであって、
その中に吸込管2が挿入されており、その吸込管2には
エアー駆動式の第1の開閉弁3が介設されている。4は
ダイヤフラム4aを備えたエアー駆動式のダイヤフラム
ポンプであって、その上面に吸込管2と吐出管5が接続
されており、吐出管5にはエアー駆動式の第2の開閉弁
7が介設され、先端にはノズル6が接続されている。8
は空圧出力部であって、ダイヤフラム42Lの下面側に
加圧空気を供給する電空比例弁とダイヤフラム4aの下
面側を負圧にする真空発生器と第1及び第2の開閉弁3
.7の駆動用の空圧弁10.11とが内蔵されており、
この空圧出力部8は制御5装置9により電気的に制御さ
れるようになっている。In FIG. 1, 1 is a tank containing a chemical solution,
A suction pipe 2 is inserted into the suction pipe 2, and an air-driven first on-off valve 3 is interposed in the suction pipe 2. Reference numeral 4 denotes an air-driven diaphragm pump equipped with a diaphragm 4a, to which a suction pipe 2 and a discharge pipe 5 are connected.A second air-driven on-off valve 7 is connected to the discharge pipe 5. A nozzle 6 is connected to the tip. 8
is a pneumatic output section, which includes an electropneumatic proportional valve that supplies pressurized air to the lower surface of the diaphragm 42L, a vacuum generator that makes the lower surface of the diaphragm 4a a negative pressure, and the first and second on-off valves 3.
.. It has built-in pneumatic valves 10 and 11 for driving 7.
This pneumatic output section 8 is electrically controlled by a control 5 device 9.
次に、本実施例の作動を説明する。Next, the operation of this embodiment will be explained.
まず、空圧出力部の一方の空圧弁11を閉じ、第2の開
閉弁7への加圧空気の供給を遮断して閉弁させるととも
に他方の空圧弁IOを開き、第1の開閉弁3へ加圧空気
を供給して開弁させた状態において、真空発生器を作動
させてダイヤフラム4aの下面側を負圧にすると、ダイ
ヤフラム4aが下面側に湾曲し、上面側の体積が増大す
るためタンクI内の薬液が吸い上げられてダイヤフラム
4aの上面側に充満する。ここで、第1の開閉弁3を閉
じるとともに真空発生器を停止させ、電空比例弁を作動
させると、制御装置9から人力される電気信号の大きさ
に比例した圧力の加圧空気がダイヤフラム4aの下面に
作用し、上面の薬液を同圧で加圧する。薬液に加わる圧
力は電空比例弁に人力される電気信号の大きさに比例す
るのであって、例えば、第2図に示すように、加圧初期
の圧力を低くし、次第に上昇させて最高値にしばらく保
持し、その後次第に低下させるように制御することがで
きるのであって、この圧力変化のどの範囲において第2
の開閉弁7を閉弁するかによって薬液のノズル6からの
吐出速度を任意に制御することができるのであり、前述
のサイドリンス工程においては、溶剤を最初は低圧で吐
出させ、次第に高圧にすることによって開弁初期の急激
な吐出による跳ね返りを防止し、かつ、サイドリンスに
必要な流量を確保することができるのであって、溶剤の
跳ね返りによる不良品の発生を防止し、かつ、サイドリ
ンスを確実に行うことかできる。First, one pneumatic valve 11 of the pneumatic output section is closed, the supply of pressurized air to the second on-off valve 7 is cut off, and the valve is closed, and the other pneumatic valve IO is opened, and the first on-off valve 3 is closed. When pressurized air is supplied to the valve and the valve is opened, when the vacuum generator is activated to create a negative pressure on the bottom side of the diaphragm 4a, the diaphragm 4a curves downward and the volume on the top side increases. The chemical liquid in the tank I is sucked up and fills the upper surface side of the diaphragm 4a. Here, when the first on-off valve 3 is closed, the vacuum generator is stopped, and the electro-pneumatic proportional valve is activated, pressurized air at a pressure proportional to the magnitude of the electric signal manually inputted from the control device 9 is supplied to the diaphragm. It acts on the lower surface of 4a and pressurizes the chemical solution on the upper surface with the same pressure. The pressure applied to the chemical liquid is proportional to the magnitude of the electric signal manually applied to the electropneumatic proportional valve. For example, as shown in Figure 2, the initial pressure is low and then gradually increased to reach the maximum value. The pressure can be controlled to be maintained for a while and then gradually lowered, and in which range of this pressure change the second
The discharge speed of the chemical solution from the nozzle 6 can be arbitrarily controlled by closing the on-off valve 7. In the side rinsing process described above, the solvent is initially discharged at a low pressure and then gradually raised to a high pressure. By doing so, it is possible to prevent splashing caused by rapid discharge at the initial stage of opening the valve, and to secure the flow rate necessary for side rinsing. You can do it for sure.
本実施例は制御装置9から発せされる電気信号により電
空比例弁を介してダイヤフラムポンプ4の吐出圧力を制
御し、かつ、第2の開閉弁7の開弁タイミングを選択す
ることによりノズル6からの薬液の吐出速度を任意に制
御することができるのであって、サイドリンスの他、レ
ジスト液(フォトエツチング用薬液)の吐出にも使用す
ることができるとともに、−船釣な薬液の吐出にも使用
することができる。In this embodiment, the discharge pressure of the diaphragm pump 4 is controlled via the electropneumatic proportional valve by an electric signal issued from the control device 9, and the opening timing of the second on-off valve 7 is selected. The discharge speed of the chemical solution can be controlled arbitrarily, and it can be used not only for side rinsing but also for dispensing resist solution (chemical solution for photo-etching). can also be used.
第1図は本発明の一実施例の説明図、第2図は吐出圧力
の変化を示すグラフである。
14タンク 4:ダイヤフラムポンプ 6:ノズル 8
・空圧出力部(加圧エアー供給装置)9:制御装置
出願人 シーケーディ株式会社FIG. 1 is an explanatory diagram of an embodiment of the present invention, and FIG. 2 is a graph showing changes in discharge pressure. 14 Tank 4: Diaphragm pump 6: Nozzle 8
・Pneumatic output section (pressurized air supply device) 9: Control device applicant: CKD Co., Ltd.
Claims (1)
のダイヤフラムポンプと、該ダイヤフラムポンプを駆動
する加圧エアーを供給する加圧エアー供給装置と、該加
圧エアー供給装置の供給エアー圧力を電気的に制御する
制御装置とを備えたことを特徴とする薬液吐出装置An air-driven diaphragm pump connected to a chemical liquid tank and a chemical liquid nozzle; a pressurized air supply device that supplies pressurized air to drive the diaphragm pump; A chemical liquid dispensing device characterized in that it is equipped with a control device that controls the
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17125290A JPH0458520A (en) | 1990-06-28 | 1990-06-28 | Chemical discharger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17125290A JPH0458520A (en) | 1990-06-28 | 1990-06-28 | Chemical discharger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0458520A true JPH0458520A (en) | 1992-02-25 |
| JPH0568095B2 JPH0568095B2 (en) | 1993-09-28 |
Family
ID=15919878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17125290A Granted JPH0458520A (en) | 1990-06-28 | 1990-06-28 | Chemical discharger |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0458520A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0620052A1 (en) * | 1993-04-16 | 1994-10-19 | Martin Marietta Corporation | Controlled agitation cleaning system |
| US10330963B2 (en) | 2014-11-07 | 2019-06-25 | Boe Technology Group Co., Ltd. | Machine table |
-
1990
- 1990-06-28 JP JP17125290A patent/JPH0458520A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0620052A1 (en) * | 1993-04-16 | 1994-10-19 | Martin Marietta Corporation | Controlled agitation cleaning system |
| US10330963B2 (en) | 2014-11-07 | 2019-06-25 | Boe Technology Group Co., Ltd. | Machine table |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0568095B2 (en) | 1993-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100511066C (en) | Pressure regulation by transfer of a calibrated gas volume | |
| CN110034041B (en) | Treatment liquid supply device and degassing method thereof | |
| CN100376945C (en) | Substrate bonding equipment and substrate bonding process | |
| KR20070051880A (en) | Chemical supply system | |
| JPS587831A (en) | Washing method for wafer by high pressured water and device thereof | |
| JPH0458520A (en) | Chemical discharger | |
| US9027789B2 (en) | Automated vacuum assisted valve priming system and methods of use | |
| JP2004128441A (en) | Photoresist purge control device and photoresist purge control method for semiconductor coating equipment | |
| KR100904462B1 (en) | Substrate Processing Equipment and Substrate Processing Method | |
| KR100254793B1 (en) | Chemical blast for semiconductor device and slop tank | |
| JP4583216B2 (en) | Substrate processing method | |
| JPH11121422A (en) | Chemical supply device | |
| JP2024017777A (en) | Suckback method and substrate processing equipment | |
| JP4446917B2 (en) | Substrate processing method and substrate processing apparatus | |
| JPH08318195A (en) | Bond coating device and coating method | |
| JP3442263B2 (en) | Liquid supply mechanism, liquid processing apparatus and liquid processing method | |
| JP7002696B2 (en) | Coating equipment | |
| KR100921725B1 (en) | Photoresist coating apparatus and control method thereof | |
| KR102939977B1 (en) | Suck-back method and substrate processing apparatus | |
| JP2813197B2 (en) | Processing liquid supply device | |
| JP5195608B2 (en) | Paste coating apparatus, electronic component joining apparatus, paste coating method, and electronic component joining method | |
| KR100390519B1 (en) | Photoresist dispensing system for manufacturing semiconductor device | |
| JP5195626B2 (en) | Paste coating apparatus, electronic component joining apparatus, paste coating method, and electronic component joining method | |
| JP2003341623A (en) | Water supply device for enclosure | |
| JP2008159871A (en) | Substrate processing apparatus and substrate processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080928 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090928 Year of fee payment: 16 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090928 Year of fee payment: 16 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100928 Year of fee payment: 17 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100928 Year of fee payment: 17 |