JPH045883A - Installing device for component - Google Patents
Installing device for componentInfo
- Publication number
- JPH045883A JPH045883A JP10651590A JP10651590A JPH045883A JP H045883 A JPH045883 A JP H045883A JP 10651590 A JP10651590 A JP 10651590A JP 10651590 A JP10651590 A JP 10651590A JP H045883 A JPH045883 A JP H045883A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- resistors
- mounting frame
- leads
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明はフラット型ICを使用した小型電子部品実装回
路の部品実装に係り、特に終端抵抗等の部品取付装置に
関するものである。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to component mounting of a small electronic component mounting circuit using a flat IC, and particularly relates to a device for mounting components such as a terminating resistor. be.
(従来の技術)
従来、高速動作する回路の信号伝送には高周波特性をそ
こなわないようインピーダンスマツチングをとるため、
伝送路の特性インピーダンスに等しい抵抗値で伝送路を
終端する技術が知られている。第5図はこの技術を用い
た回路の接続図の例である。第5図において、入力端1
4をもつ回路素子15と回路素子18は信号伝送路16
により接続さている。そして終端抵抗17は信号伝送路
16の特性インピーダンスに等しい値の抵抗であり、終
端抵抗17を回路素子18の入力端子間近に配置するこ
とによりこの回路の高周波特性は最良となる。ところで
、第6図は従来のフラット型ICを使用した高速回路の
終端抵抗の実装例をしめす図である。第6図において2
4はプリント基板の表面に形成された伝送路パターンで
あり、フラット型IC21の入力端が半田付けにより接
続されている。22は終端抵抗として使用されるチップ
抵抗でありプリント基板の他の導体層から引き出された
終端電位電極23と伝送路パターン24との間にそれぞ
れ半田付けにより接続され高速信号伝送回路を構成して
いる。(Prior art) Conventionally, impedance matching has been used to transmit signals in circuits that operate at high speed in order to avoid damaging high frequency characteristics.
A technique for terminating a transmission line with a resistance value equal to the characteristic impedance of the transmission line is known. FIG. 5 is an example of a circuit connection diagram using this technique. In Figure 5, input terminal 1
The circuit element 15 and the circuit element 18 having 4 are connected to the signal transmission line 16.
It is connected by The terminating resistor 17 has a value equal to the characteristic impedance of the signal transmission path 16, and by arranging the terminating resistor 17 near the input terminal of the circuit element 18, the high frequency characteristics of this circuit are maximized. By the way, FIG. 6 is a diagram showing an example of mounting a terminating resistor in a high-speed circuit using a conventional flat type IC. In Figure 6, 2
Reference numeral 4 denotes a transmission path pattern formed on the surface of the printed circuit board, to which the input end of the flat IC 21 is connected by soldering. Reference numeral 22 denotes a chip resistor used as a terminating resistor, which is connected by soldering between a terminating potential electrode 23 drawn out from another conductor layer of the printed circuit board and a transmission path pattern 24 to form a high-speed signal transmission circuit. There is.
(発明が解決しようとする課題)
上述じた終端抵抗の実装方式では、終端抵抗それぞれに
装着面積がプリント基板上に必要となり部品の実装密度
か低下してしまうという問題点があった。(Problems to be Solved by the Invention) The above-described mounting method for terminating resistors has the problem that each terminating resistor requires a mounting area on the printed circuit board, which reduces the mounting density of components.
またフラット型ICの入力端子が隣接して並んでいる場
合など終端抵抗の装着面積によりIC端子間近に配置で
きない場合も生じており高周波特性が嵩足できないとい
う問題点があった。Furthermore, in some cases, such as when the input terminals of a flat IC are arranged adjacent to each other, the terminating resistor cannot be placed close to the IC terminals due to the mounting area, resulting in the problem that the high frequency characteristics cannot be bulky.
さらに終端抵抗が半田付けにより取り付けられているた
め、導体パターンの特性インピーダンスが当初予定して
いた値と違っていることが判明した場合でも終端抵抗の
交換は困難であるという問題点もあった。Furthermore, since the terminating resistor is attached by soldering, there is also the problem that it is difficult to replace the terminating resistor even if it turns out that the characteristic impedance of the conductor pattern is different from the originally planned value.
本発明は上述した問題点を解決するためになされるもの
であり、IC端子の間近に抵抗を配置でき、かつこの抵
抗の交換を容易に行なえる部品数上述した目的を達成す
る為に、本発明による部品取付装置はICのリードもし
くはこのリードに接続された伝送路パターンと接続する
よう配置された抵抗とこの抵抗が前記リード若しくは伝
送路パターンと垂直方向に収納される構造をもった抵抗
収納部なる取付枠と、挿入された終端抵抗の他端を終端
電位に接続する導電部とからなる。The present invention has been made in order to solve the above-mentioned problems, and in order to achieve the above-mentioned objects, the present invention has a number of components that allow a resistor to be placed close to an IC terminal and that allows the resistor to be easily replaced. The component mounting device according to the invention includes a resistor arranged to be connected to an IC lead or a transmission line pattern connected to the lead, and a resistor housing having a structure in which the resistor is housed in a direction perpendicular to the lead or transmission line pattern. The conductive part connects the other end of the inserted terminating resistor to the terminating potential.
(作 用)
本発明の部品取付装置によれば、終端用抵抗部品をプリ
ント基板と垂直方向に立体的に配置出来るので装着面積
がほとんど必要とならず回路全体を高密度に実装出来る
。また、終端抵抗がICリード上もしくは間近のパター
ン上に配置出来るので余分な導電パターンの引き回しに
よる配線の悪影響がなく理想的なインピーダンスマツチ
ングが出来る。(Function) According to the component mounting device of the present invention, the terminating resistor component can be arranged three-dimensionally in a direction perpendicular to the printed circuit board, so almost no mounting area is required, and the entire circuit can be mounted with high density. Furthermore, since the terminating resistor can be placed on the IC lead or on a nearby pattern, ideal impedance matching can be achieved without any negative effects on the wiring due to the routing of extra conductive patterns.
また終端抵抗は半田付は接続されていないので抵抗値を
変更する場合など部品の交換が容易に出来る。Furthermore, since the terminal resistor is not connected by soldering, parts can be easily replaced when changing the resistance value.
(実施例)
第1図、第2図、第3図は、本発明による終端抵抗取付
装置の一実施例を示すものであって、第1図は断面斜視
図(第2図A−A’部)であり、第2図はその平面図(
後述するフタ取り外しである)であり、第3図は要部断
面図(第2図BB′部)である。(Embodiment) FIGS. 1, 2, and 3 show an embodiment of the terminating resistor mounting device according to the present invention, and FIG. 1 is a cross-sectional perspective view (FIG. 2 A-A' part), and Figure 2 is its plan view (
FIG. 3 is a sectional view of the main part (section BB' in FIG. 2).
プリント基板1の表面には銅箔などによりその特性イン
ピーダンスが一定となる機制御された導電パターン2及
びIC接続用パッド3が形成されている。フラット型I
C4はIC接続用パッドにそのリード線が半田付けによ
りプリント基板1上に装着されている。On the surface of the printed circuit board 1, a conductive pattern 2 and an IC connection pad 3 are formed, which are mechanically controlled to have a constant characteristic impedance using copper foil or the like. Flat type I
The lead wire of C4 is attached to the printed circuit board 1 by soldering to an IC connection pad.
取付枠5はフラット型IC4の外周を囲うように、固定
用ネジ6で基板上に固定されている。この取付枠5には
フラット型IC4に相対する位置に抵抗収納用孔7があ
けられている。また取付枠5の一部にはあらかじめプリ
ント基板上に銅箔などにより形成された終端電位パター
ン8と接触する導電体9が取付枠上部まで形成されてい
る。The mounting frame 5 is fixed onto the substrate with fixing screws 6 so as to surround the outer periphery of the flat IC 4. This mounting frame 5 has a resistor housing hole 7 formed at a position facing the flat IC 4. Further, in a part of the mounting frame 5, a conductor 9 is formed up to the upper part of the mounting frame so as to be in contact with a terminal potential pattern 8 formed in advance on a printed circuit board using copper foil or the like.
ここでインピーダンスマツチングを取る必要のあるフラ
ット型IC4の入力端子には形成された導電パターン2
の特性インピーダンスに等しい抵抗値のチップ型抵抗1
0(以下、抵抗という)が挿入されている。取付枠5の
上部には金属などの導電体のフタ11が取付ネジ12で
取付枠5に固定されている。フタ11には抵抗収納用孔
7に対応した突起13が設けられていて抵抗10と機械
的・電気的に接続が行われると同時に抵抗10の他の端
面はフラット型IC4のリードとも機械的・電気的に接
続される。この突起13により抵抗10をフタ11とフ
ラット型IC4のリードとの機械的・電気的な接続をよ
り確実に行なうことができる。Here, a conductive pattern 2 is formed on the input terminal of the flat IC 4 that requires impedance matching.
A chip resistor 1 with a resistance value equal to the characteristic impedance of
0 (hereinafter referred to as resistance) is inserted. A lid 11 made of a conductive material such as metal is fixed to the upper part of the mounting frame 5 with mounting screws 12. The lid 11 is provided with a protrusion 13 corresponding to the resistor housing hole 7, and is mechanically and electrically connected to the resistor 10. At the same time, the other end surface of the resistor 10 is mechanically and electrically connected to the lead of the flat IC 4. electrically connected. This protrusion 13 allows the resistor 10 to be mechanically and electrically connected to the lid 11 and the leads of the flat IC 4 more reliably.
なお本実施例では円筒形状のチップ型抵抗としたが取付
枠5の抵抗収納用孔7の形状を変えれば角型など他の形
状のものでも構わない。また、導体パターン2間の距離
により、抵抗収納用孔7をそれぞれ互い違いに取付枠5
に設けることもできる。In this embodiment, a cylindrical chip-type resistor is used, but other shapes such as a rectangular shape may be used as long as the shape of the resistor storage hole 7 of the mounting frame 5 is changed. Also, depending on the distance between the conductor patterns 2, the resistor housing holes 7 are arranged alternately in the mounting frame 5.
It can also be provided in
第4図は本発明による部品取付装置の第二の実施例であ
りリードの短いフラット型IC4に対応したものを示す
。ここでは第一の実施例でチップ型抵抗10の一端が接
触していたICのリードの(B)
代わりにリードが半田付は接続されている導電パターン
2と接触する様に取付枠の形状を変えたものである。FIG. 4 shows a second embodiment of the component mounting device according to the present invention, which is compatible with a flat type IC4 with short leads. Here, the shape of the mounting frame is changed so that instead of the IC lead (B) that one end of the chip-type resistor 10 was in contact with in the first embodiment, the lead contacts the conductive pattern 2 that is soldered. It has been changed.
(発明の効果)
上述した様に、本発明の部品取付装置によれば、終端抵
抗がフラット型ICのリードもしくはリードに接続され
た導電パターンと垂直方向に収納される取付枠によって
立体的に終端回路を構成することにより、部品実装密度
の大幅な向上と、高周波特性の改善、及び部品交換の簡
便さを実現したものである。(Effects of the Invention) As described above, according to the component mounting device of the present invention, the terminating resistor is three-dimensionally terminated by the mounting frame housed perpendicularly to the lead of the flat IC or the conductive pattern connected to the lead. By configuring the circuit, we have achieved a significant increase in component mounting density, improved high frequency characteristics, and ease of component replacement.
第1図、第2図、第3図はそれぞれ本発明による部品取
付装置の一実施例を示す図、第4図は第二の実施例を示
す断面図、第5図は伝送路をしめず接続図、第6図は従
来の終端抵抗実装平面図である。
1・・・プリント基板、2・・・導電パターン、4・・
・フラット型IC,5・・・取付枠、8・・・終端電位
バタン、10・・・チップ型抵抗、11・・・フタ。1, 2, and 3 are views showing one embodiment of the component mounting device according to the present invention, FIG. 4 is a sectional view showing the second embodiment, and FIG. 5 is a diagram showing the transmission line without closing it. The connection diagram and FIG. 6 are plan views of a conventional terminating resistor mounted. 1... Printed circuit board, 2... Conductive pattern, 4...
・Flat type IC, 5... Mounting frame, 8... Terminating potential button, 10... Chip type resistor, 11... Lid.
Claims (1)
と接続するよう配置された抵抗と、この抵抗を収納する
抵抗収納部と、前記抵抗の接続される電位に接続された
導電部とからなる部品取付装置。(1) Consisting of a resistor arranged to be connected to an IC lead or a transmission line pattern connected to the lead, a resistor storage part that stores this resistor, and a conductive part connected to the potential to which the resistor is connected. Parts mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10651590A JPH045883A (en) | 1990-04-24 | 1990-04-24 | Installing device for component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10651590A JPH045883A (en) | 1990-04-24 | 1990-04-24 | Installing device for component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045883A true JPH045883A (en) | 1992-01-09 |
Family
ID=14435553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10651590A Pending JPH045883A (en) | 1990-04-24 | 1990-04-24 | Installing device for component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045883A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288614A (en) * | 1995-04-19 | 1996-11-01 | Nec Corp | High frequency transistor circuit structure |
-
1990
- 1990-04-24 JP JP10651590A patent/JPH045883A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288614A (en) * | 1995-04-19 | 1996-11-01 | Nec Corp | High frequency transistor circuit structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3252605B2 (en) | Electronic component and method of manufacturing the same | |
| JP2960374B2 (en) | Piezoelectric oscillator | |
| US6087912A (en) | High frequency multi-layer module comprising a dielectric resonator | |
| JP2947198B2 (en) | Piezoelectric transformer | |
| JPH045883A (en) | Installing device for component | |
| JP3821630B2 (en) | High frequency shield structure | |
| JP3344355B2 (en) | Connector with low-pass filter function | |
| JPH02301182A (en) | Printed circuit board for flat mounting structure | |
| JPH0661609A (en) | Circuit board | |
| JP4103466B2 (en) | High-frequency connector surface mounting method, high-frequency connector mounting printed circuit board, and printed circuit board | |
| US6545855B1 (en) | Low inductance termination for electronic components | |
| JPH07183627A (en) | Printed circuit board | |
| JP2002134639A (en) | High frequency electronic component package and high frequency electronic component using the same | |
| JP2538642B2 (en) | Electronic circuit component mounting structure | |
| JPH04365396A (en) | High-frequency surface-mounted module | |
| JPH03257990A (en) | Mounting method for hybrid integrated circuit board | |
| JP2869943B2 (en) | Hybrid IC with relay board with resistance | |
| JPH09167884A (en) | Circuit board | |
| JPS6344317B2 (en) | ||
| JP2003110215A (en) | Fitting structure of electric part to circuit board | |
| JP3885586B2 (en) | Terminal resistor mounting structure of high frequency relay and mounting method thereof | |
| JP2000124576A (en) | Circuit board | |
| JPS62208691A (en) | Double-sided hybrid integrated circuit | |
| JPH0865013A (en) | Concentrated constant type isolator | |
| JPH0831969A (en) | High frequency electronic circuit module case |