JPH045884A - Manufacturing method of printed wiring board for mounting chip components - Google Patents

Abstract

PURPOSE:To fix a chip component easily at a specified position with high accuracy while reducing the dispersion of the degree of cure of a resin, to facilitate etching, burying, etc., and to improve reliability by using a semirigid resin copper-clad laminated board. CONSTITUTION:A semirigid resin copper-clad laminated board, the peeling strength of a copper foil of which is 0.2kg/cm or more, preferably 0.3kg/cm or more and is kept within a range of peeling strength of 90% or less after full cure, is employed. A printed wiring pattern 2 in which a small-sized chip component mounting section is also left as a conductor foil is formed on the laminated board through an etching method, thus manufacturing a smooth printed board. The small-sized chip component mounting section required in the smooth printed board is removed through etching to form a chip component mounting section 3, and a chip component is mounted on the section 3, and soldered 4 and fixed. Accordingly, the chip component can be fastened easily at a specified position with high accuracy while reducing the dispersion of the degree of cure of a resin, etching, burying, etc., are facilitated extremely, and reliability can be improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is a novel method for manufacturing a printed wiring board for mounting chip components, which makes it possible to reliably mount small chip components that are difficult to fix. be.

[Conventional technology and its problems]

Conventionally, in the case of resistors, capacitors, diodes, etc. that have a small number of electrodes, the conventional method for mounting chip components on a printed wiring board is to print paste solder or the like on the desired position in advance, or apply it by other means. There is a method of placing chip parts on the board and fixing them by melting solder paste, etc.Also, in the case of a product with many connecting parts, if desired, the chip parts can be fixed in the desired position with a fast-curing adhesive etc. After that, methods such as fixing by soldering are used.

However, the former components are rapidly becoming smaller, and the number of ultra-small components of one cylinder or less is increasing, making it difficult to fix them in a predetermined position on the board.

[Problem to be solved by the invention]

The present inventors have discovered that a continuous method for manufacturing laminates is particularly effective as a method for manufacturing semi-cured resin laminates,
We have carefully considered the effective use of this. As a result, it was surmised that by using this semi-cured resin copper-clad laminate, it would be possible to easily mount the above-mentioned ultra-small components on a printed wiring board.

[Means for Solving the Problems] That is, the present invention provides a method for manufacturing a printed wiring board in which chip components are mounted on a desired portion of the printed wiring board, in which a small-sized After forming a printed wiring network by leaving the conductor foil in the chip component part mounting area, press molding is performed to form a printed wiring board in which the conductor surface and the board surface are substantially on the same plane, and then the small chip component part is mounted. A method for manufacturing a printed wiring board for mounting chip components, characterized in that the semi-cured resin copper-clad laminate is formed by etching away the conductive foil of the part, and the semi-cured resin copper-clad laminate has a peel strength of 0.2 kg/cyn or more. 90% when fully cured
It must be made by heating and pressurizing so that the following range is achieved, and it must have a semi-cured resin layer between the copper foil and the base material with a thickness of at least 20/7 m, and the semi-cured resin copper The stretched laminate is manufactured by continuous pressing using a double belt press method or by a batch rapid press forming method in which a single laminate is press-formed between a pair of hot platens. This is a method for manufacturing printed wiring boards for mounting chip components.

First, the semi-cured resin copper-clad laminate of the present invention has a copper foil peel strength of 0.2 kg/cm or more, preferably 0.3 kg/cm.
cm or more and 90% or less of the peel strength after complete curing. This rough guideline for copper foil peel strength can be determined from the glass transition temperature when a composition mainly composed of thermosetting resin is used as the matrix resin.
Glass transition temperature of matrix resin (TgS'C)/Glass transition temperature of matrix resin after complete curing Tgf'
C) Corresponds to the range of -0.55 to 0.90. In particular, in the method of forming a printed wiring pattern using an organic solvent type resist stripper, TgS/Tg"=0.65 to 0.85
A range of degrees is preferred. In addition, hardening can be achieved by using adhesive-coated copper foil or resin layer prepreg, for example, or by using non-woven fabric prepreg at the copper foil bonding part, so that there are 20 or more resin layers between the copper foil and the base material. Even in cases where the degree of embedding is high, it is desirable to have improved pattern embeddability. Here, if the copper foil peel strength is less than 0.2 kg/cm,
It is difficult and undesirable to form a printed wiring network, and if the peel strength exceeds 90% of the peel strength after complete curing, curing progresses too much, and the printed wiring network produced must be embedded in an insulating resin layer by heating and pressurizing. This is not preferable because it becomes difficult. In addition, when using conventional epoxy prepreg for multistage presses, the peel strength of copper foil after heating at 200°C for 1 to 3 minutes is 0.3 to 15 kg/'cm (copper foil peel strength after complete curing). 2.0kg/cyn or more), Tgs
/Tg' -0.70 to about 0.85, and 18
When heated at 0'C for 2-4 minutes, the peel strength is 0.4-1.
．． 0 kg/cm, Tgs/Tg' = 0.6~0
．． It is about 75. The resin used may be any conventional resin, such as polyester, epoxy,
Polyimide type, cyanate ester type, etc. are not particularly limited.

The printed wiring network of the present invention is formed using a conventional method of forming a printed wiring network using a semi-cured resin copper-clad laminate, in particular, by leaving the conductive foil at the small chip component fixing part. be. In addition, when using a semi-cured resin copper-clad laminate manufactured by the preferred manufacturing method of the present invention, the etching conditions are much smaller than those of the conventional method. More stringent conditions are available compared to .

A printed wiring board in which the conductor layer, including the conductor foil of the chip component mounting portion manufactured as described above, is raised above the resin surface of the substrate is press-molded, and the printed wiring conductor layer is embedded in the insulating layer.

The conditions used for embedding may be the same as those for manufacturing conventional smooth printed boards (=flash circuits), but
In the case of a semi-cured resin laminate manufactured by the preferred manufacturing method of the present invention,
Since basically one sheet is pressed at a time, the range of variation in the degree of semi-curing of the resin is small, and it is possible to use a lower pressure than in the past.

From the above two conditions, it is understood that the smooth printed board used in the present invention can be manufactured with extremely high productivity.

Next, only the chip/tube component mounting portion left above of this smooth printed board is removed by etching.

The chip component mounting area obtained in this way has a depression corresponding to the amount of embedding, and as a result,
By simply placing the chip components, misalignment will not occur easily.

As a result, even when placed in an atmosphere that melts paste I, solder, etc., the parts are fixed at desired positions without any displacement.

〔Example〕

Embodiments of the present invention will be described below using the accompanying drawings.

FIG. 1 is an example of a sectional view showing the flow of the manufacturing process and fixing process of a printed wiring board for mounting chip components having a recess in the chip component mounting portion of the present invention.

In Figure 1, glass nonwoven fabric (100g/rtT
) 3 sheets of glass non-woven epoxy resin prepreg obtained using
Stack the sheets one by one, and add 3 layers to the outermost layer on both sides.
Copper foils of 5Irm were stacked, fed continuously into a double belt press, and heated and pressed for 1 minute at a temperature of 200℃ and a pressure of 50kg/cJ, and the adhesive strength of the copper foils was 0.85kg/c.
m, glass transition temperature 92°C (after complete curing = 136°
Using the semi-cured resin copper-clad laminate of C), a printed wiring pattern [2] was formed on the semi-cured resin copper-clad laminate by etching the small chip 8. The printed wiring pattern [2] was also left as a conductive foil in the parts mounting area. After (a) in Figure 1, the temperature is 170°.
Press molding was performed at a C1 surface pressure of 75 kg/c+ff, and this pattern was embedded to obtain a smooth printed board [FIG. 1 b].

During etching, there were no problems such as peeling due to poor adhesion of the pattern, and there were no gaps due to embedding.
It was below ItWl.

Next, the required small chip component mounting area of this smooth printed board is removed by etching to form the chip component mounting area.
3] was formed [c in Figure 1].

Next, a chip component was placed on this part and fixed by soldering [4] [Fig. 1 d].

In the process of mounting and soldering this chip component,
It was confirmed that there was no concern about the problem of the chip components moving from their predetermined positions.

[Operation and effects of the invention]

As is clear from the above detailed description of the invention, a smooth printed board (flash circuit) is manufactured using the semi-cured resin copper clad board of the present invention, with the conductor foil remaining in the chip component mounting area, and the chip Printed wiring boards for mounting small chip components, in particular, are made by removing the conductive foil from the component mounting area during etching.
Chip components can be easily fixed in place with high precision.

In addition, since the semi-cured resin copper-clad laminate preferably used in the present invention is manufactured by a double belt press method or a method of continuously laminating one laminate at a time, There is little variation in the degree of curing of the resin, and etching, embedding, etc. are extremely easy.

As a result, the printed wiring board for mounting chip components manufactured by the manufacturing method of the present invention has great industrial significance as a highly reliable mounting method for increasingly smaller components.

[Brief explanation of drawings]

FIG. 1 is an example of a sectional view showing the flow of the manufacturing process and fixing process of a printed wiring board for mounting chip components having a recess in the chip component mounting portion of the present invention. Patent Applicant Mitsubishi Gas Chemical Co., Ltd. Agent (9070) Patent Attorney Sadafumi Tegori Engraving of Drawing Figure 1 Procedural Amendment (Method) % Formula % 2. Name of Invention Method for Manufacturing Printed Wiring Board for Mounting Chip Components 23. Patent Applicant Address (■100) 2-5-2 Marunouchi, Chiyoda-ku, Tokyo Name (446) Mitsubishi Gas Chemical Co., Ltd. Representative Reiji Kuyo 4, Agent. Residence (■100) 2-5-2-5 Marunouchi, Chiyoda-ku, Tokyo, Date of amendment order.

Claims (1)

[Claims] 1. A method of manufacturing a printed wiring board in which chip components are mounted on a desired portion of the printed wiring board, in which a conductive foil is mounted on a semi-cured resin copper clad laminate as the printed wiring board, and a conductive foil is mounted on a portion where a small chip component is mounted. After forming a printed wiring network by leaving a trace, press molding is performed to form a printed wiring board in which the conductor surface and the substrate surface are substantially on the same plane.Then, the conductor foil at the part mounting part of the small chip component is removed by etching. A method for manufacturing a printed wiring board for mounting chip components, characterized by: 2. The semi-cured resin copper-clad laminate has a copper foil peel strength of 0.
2. The method of manufacturing a printed wiring board for mounting chip components according to claim 1, wherein the printed wiring board for mounting chip components is heated and pressurized at a pressure of 2 kg/cm or more to achieve a hardening rate of 90% or less. 3. The method for manufacturing a printed wiring board for mounting chip components according to claim 2, wherein the semi-cured resin copper-clad laminate has a semi-cured resin layer having a thickness of at least 20 μm between the copper foil and the base material. 4. The method of manufacturing a printed wiring board for mounting chip components according to claim 2, wherein the semi-cured resin copper-clad laminate is manufactured by continuous pressing using a double belt press method. 5. The printed wiring board for mounting chip components according to claim 2, wherein the semi-cured resin copper-clad laminate is manufactured by a batch continuous press molding method in which one laminate is press-molded between a pair of hot platens. Manufacturing method.