JPH04592B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a lead frame supply device for supplying a lead frame on which a semiconductor is mounted to a molding device for resin-sealing the lead frame.

[Technical background of the invention and its problems]

A molding device for resin-sealing a lead frame mounted with a semiconductor includes, for example, a mold press body to which an upper mold that moves up and down with a cylinder or the like and a lower mold on which the lead frame is placed are mounted. The lead frame placed in a predetermined position is fixed by an upper mold, and the semiconductor on the lead frame is molded with resin.

As a lead frame supply method for supplying the lead frames 1, _{1 1} , 1 ₂ as shown in FIGS. 1a and 1b to predetermined positions of the lower mold, the following methods are conventionally known. ing.

One method is to arrange a plurality of lead frames 1 on a loading jig 2 as shown in FIG. Place the lead frame 1 at the position.

Two of them are composed of a lead frame positioning and alignment table and a movable chuck such as a vacuum chuck or a mechanical chuck. Using a chuck, place the parts one after another in the predetermined positions on the lower mold.

However, in the recent manufacturing of semiconductor devices, it is desired to be compatible with high-variety, _low -volume production. When molding a lead frame ₁₂ having a width of B, the loading jig 2 is used in the first method, and the lead frame positioning and alignment table and chuck are used in _the second method. It was necessary to replace it with one that matched the external shape, which was disadvantageous and inconvenient. As the number of external shapes of lead frames increases in response to high-mix, low-volume production, it is necessary to separately prepare jigs and devices for positioning and aligning lead frames, which reduces manufacturing efficiency due to replacement of these jigs and devices. However, there were drawbacks such as increased storage space, management, maintenance, and associated costs.

[Purpose of the invention]

The present invention has been made in order to eliminate the drawbacks of the conventional technology as described above, and it replaces the lead frame positioning alignment stand, jig, etc. that were prepared according to the external shape of each lead frame in response to high-mix, low-volume production. It is an object of the present invention to provide a lead frame supply device which has a general-purpose function that corresponds to changes in the external shape of the lead frame.

[Summary of the invention]

In order to achieve the above object, the present invention includes a lead frame alignment device for arranging lead frames loaded with semiconductors at predetermined positions, and a mold device for sequentially moving the lead frames to predetermined positions for resin sealing. In the lead frame supply device, the lead frame alignment device includes a fixed inner guide rail, and a lead frame alignment device arranged to be movable in the width direction of the inner guide rail. an outer guide rail that guides the lead frame in the longitudinal direction from both sides together with the guide rail; The lead frame conveying device includes a belt for moving the lead frame along between the guide rails, and a stopper provided between the guide rails for locking the lead frame at a predetermined position. a chuck claw disposed on a side end of the lead frame that is capable of gripping the inner end of the lead frame and is movable up and down; and a sliding device for moving the chuck claw to a predetermined position of the molding device. It is characterized by

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 3 is a schematic diagram of the lead frame supply device according to this embodiment. In Figure 3, 10
0 is a lead frame alignment device, in which lead frames 1 transported by a belt conveyor or the like are accurately positioned and aligned by a lead frame alignment device 100, and then transferred to a lead frame conveying device 200.
The molding device 300 is then moved to the molding device 300. The molding device 300 includes a lower mold 302 and an upper mold 301 on which the lead frame 1 is placed using a cylinder or the like. The semiconductor on the lead frame 1 is fixed with a mold 301 and molded using resin.

FIG. 4 shows the structure of the lead frame alignment device 100, with FIG. 4a being a plan view and FIG. 4b being a left side view. In FIG. 4, 101 is a base plate, and this base plate 101 is provided with a guide rod 103 held by a bracket 102. The guide rod 103 guides an outer guide rod 105 on both sides of the inner guide rail 105 via a bearing 104 guided by the guide rod 103. Guide rails 106, 106 are attached. Also, the base plate 101 has a screw bearing 107.
A screw 108 is pivotally supported between the threaded bearing 107 and the inner guide rail 105, and one end of the screw 108 is connected to a screw drive motor 110 via a joint 109. Further, nuts 111 screwed into the screw 108 are fixed to the outer guide rails 106, 106, respectively. When the screw drive motor 110 rotates in response to an external drive command, the screw 108 rotates, and the outer guide rails 106 approach both sides of the inner guide rail 105 by a distance of width A via the nut 111. , or a distance of width B in the width direction from both sides of the inner guide rail 105, and guides the movement of lead frames 1 ₁ and 1 ₂ of width A or B along the longitudinal direction. A plurality of pulleys 112 are pivotally attached to both side surfaces of the inner guide rail 105 and inner surfaces of the outer guide rails 106, 106, respectively, and a belt shaft 1 is mounted on the base plate 101.
A plurality of movable fixed pulleys 115 are attached to the belt shaft 113.
15 and pulley 112 are each provided with a belt 116.
are hung endlessly. When the belt drive motor 118 connected to the belt shaft 113 via the joint 117 is rotated by an external drive command, the fixed pulley 115 rotates via the belt shaft 113, and the belt 116 rotates in the longitudinal direction. The inner guide rail 105 and the outer guide rail 10 are moved and placed on this belt 116.
The lead frame 1 guided by 6,106 is the fourth
Move from left to right in figure a. Base plate 101
A stopper 119 that can protrude and retract is provided at a predetermined position on the top, and this stopper 119 allows the belt 11
6, the moving lead frames 1 are sequentially stopped at predetermined positions and aligned. When the alignment of the lead frames 1 is completed, this is detected by a sensor (not shown) and the belt drive motor 118 is stopped. This lead frame 1 is then moved to a molding device 300 by a lead frame conveying device 200.

FIG. 5 shows the configuration of the main parts of the lead frame transport device 200, with FIG. 5a being a front view and FIG. 5b being a left side view. This lead frame conveying device 200 includes a gripping device that picks up the lead frames 1 on the lead frame alignment device 100, and a molding device 300 to transfer the picked up lead frames 1 to a molding device 300.
It consists of a sliding device that moves the As shown in FIG. 3, the sliding device includes a sliding drive motor 201, and the rotational force of this sliding driving motor 201 is transmitted to a sliding screw 205 via a driving pulley, a driving belt 203, and a driven pulley 204. Then, the gripping device 208 screwed onto the sliding screw 205 and supported by the guide shaft 206 via the sliding bearing 207 is moved to the molding device 300. As shown in FIG. 5, the gripping device 208 has a fixed base 21 fixed to a sliding bearing 207.
0, and a movable base plate 214 connected to a fixed base 210 and movable up and down via a vertical cylinder 211, a vertical motion bearing 212, and a vertical guide shaft 213. And movable base plate 21
4 is equipped with a moving motor 215, and the rotational force of this moving motor 215 is applied to a moving pulley 216,
A pair of chuck claws 220 and 22 are transmitted to the moving screw 219 via the moving belt 217 and the moving pulley 218 and are used to pick up the lead frame 1 attached to the movable base plate 214.
0 in the lateral direction of FIG. 5b. Here, a pair of chuck claws 220, 220 are arranged on both ends of the inner guide rail 105. FIG. 6 shows a partially enlarged view of the chuck pawl 220. The chuck pawl 220 is moved up and down by a chuck pawl cylinder 221 to which a movable base plate 214 is attached, and is moved via a moving screw 219 as shown in FIG. It is composed of a movable claw 220 ₁ that slides in the lateral direction of b, and a fixed claw 220 ₂ that slides in the lateral direction together with the movable claw 220 ₁ via a moving screw 219.
In order to use the chuck pawl 220 to pick up the lead frame 1 placed on the lead frame alignment device 100, the chuck pawl cylinder 22 is
1 to lower the movable claw 220 ₁ , move the movable claw 220 ₁ and the fixed claw 220 ₂ to the side ends of the lead frame 1 via the moving screw 219 , and move the movable claw 220 1 by the chuck claw cylinder 221 .
₁ to grasp the lead frame 1, and then move the movable base plate 2 using the vertical cylinder 211.
Raise 14. And sliding screw 205
The gripping device 208 is moved to the molding device 300 side via the lead frame 1, and the lead frame 1 is placed at a predetermined position on the lower mold 302 by performing an operation opposite to the aforementioned picking operation.

In the lead frame supply device configured as described above, a lead frame ₁₁ having a width A as shown in FIG.
The operation for sequentially placing the paper on the second predetermined position will be further explained. First, in the lead frame alignment device 100 shown in FIG. 4, the screw drive motor 110 is rotated in response to an external drive command to move the outer guide rails 106, 106 closer to the inner guide rail 105, and the space between the two guide rails is After adjusting the width to approximately A, the belt drive motor 118 is rotated to rotate the belt 116. Then, the lead frame ₁₁ is moved to the inner guide rail 105 and the outer guide rails 106, 10 by a belt conveyor or the like.
6, the lead frame ₁₁ is guided by the inner guide rail 105 and the outer guide rails 106, 106, moves to the right by the belt 116, comes into contact with the stopper 119, and is aligned at a predetermined position. . Then, this is detected by a sensor (not shown), and the belt drive motor 118 is stopped, and the vertical cylinder 21 in the lead frame conveying device 200 shown in FIGS. 3 and 5 is stopped.
1 is activated. When the movable base plate 214 is lowered by the operation of the up/down cylinder 211, this is detected by a sensor (not shown), and the chuck claw cylinder 221 is activated to lower the movable claw ₂₂₀₁ .
When the movable claw 220 ₁ descends, this is detected by a sensor (not shown), the moving motor 215 rotates, and the moving claw 220 1 is moved down via the moving screw 219 .
20 ₁ and the fixed claw 220 ₂ move to the side end of the lead frame 1 ₁ , the chuck claw cylinder 221
As a result, the movable claw 220 ₁ rises and this movable claw 22
0 ₁ and the fixing claw 220 ₂ lead frame 1 ₁
The inner edge of is grasped. When the lead frame 1 1 is gripped by _the movable claw 220 ₁ and the fixed claw 220 ₂ , the movable base plate 2 is held by the vertical cylinder 211.
14 rises. This leads to lead frame 1 ₁
The picking operation is completed, this is detected by a sensor (not shown), and the sliding drive motor 201 rotates. The sliding screw 205 rotates due to the rotation of the sliding drive motor 201, and the gripping device 208 moves to the upper surface position of the lower mold 302. As a result, the rotation of the sliding drive motor 201 is stopped, and the vertical cylinder 211 The movable base plate 214 descends to near the upper surface of the lower mold 302. Then, the chuck claw cylinder 221 and the moving screw 2
19 is activated, the lead frame 1 ₁ comes out of the chuck claw 220 and is placed in a predetermined position in the lower mold 302 . After the movable claw 220 ₁ and the fixed claw 220 ₂ return to their original positions in the lateral direction via the moving screw 219, the vertical cylinder 21
1 moves the movable base plate 214 up and down, the sliding screw 205 is rotated in the opposite direction by the sliding drive motor 201, and the gripping device 208 returns to the lead frame alignment device 100 side, completing the supplying work of the lead frame 1 ₁ . do. After that, the molding device 300
The molding operation of the lead frame ₁₁ is carried out, and when this is completed, the molded product is taken out, the molds 301 and 302 are cleaned, and then the lead frame conveying device 200 is activated and the lead frames are sequentially molded by the above-described operation. 1 ₁ is supplied to the molding device 300.

Next, in order to sequentially supply lead frames 1 ₂ of width B as shown in FIG. 1b to the molding device 300,
The screw drive motor 110 in the lead frame alignment device 100 shown in FIG. After adjusting the width to approximately B, the belt drive motor 118 is rotated to rotate the belt 116. Then, the lead frame 1 ₂ is moved to the inner guide rail 105 and the outer guide rail 106 by a belt conveyor or the like.
When the lead frames 1 2 are sequentially carried in from the left side between 106 and 106, the lead frames 1 ₂ are aligned at predetermined positions by the lead frame aligning device 100 in the same manner as described above, and then the lead frame conveying devices placed on both ends of the inner guide rail 105 200 chuck claws 220
After the inner end of the lead frame 1 ₂ is picked up, the lead frame 1 2 is sequentially placed in a predetermined position in the molding device 300 . As described above, in this embodiment, when changing the shape of the lead frames 1 ₁ and 1 ₂ to be molded, the outer guide rails 106 and 106 in the lead frame alignment device 100 are moved in the width direction with the inner guide rail 105 as the center. The lead frames 1 ₁ and 1 ₂ can be fed to the predetermined positions of the molding device 300 by simply moving the lead frames 1 ₁ and 1 ₂ to the predetermined positions of the molding device 300 by adjusting the distance between both guide rails according to the widths of the lead frames 1 1 and 1 2 . ₁ , 1, ₂ can be easily and accurately adapted to external changes, and work efficiency can be improved even in high-mix, low-volume production.

In the above embodiment, although not shown in FIG. 4, a sensor for checking the presence or absence of the lead frames 1 ₁ and 1 ₂ is provided on the base plate 101 to check the presence or absence of the lead frames 1 ₁ and 1 ₂ . The lead frame may be picked up by the chuck claws 220 after the lead frame is warmed up, and a frame preheating device is provided between the inner guide rail 105 and the outer guide rails 106, 106, and the lead frame is preheated by this frame preheating device. It is also possible to supply it to the post-molding device 300 to facilitate the molding operation. Further, the width adjustment between the inner guide rail 105 and the outer guide rails 106, 106 is not limited to the dimensions A and B, but can be adjusted to various widths other than these, and furthermore, the width can be adjusted in the longitudinal direction of the lead frames 1 ₁ , 1 _2. Also, the position of the stopper 119 can be changed based on an external command signal to accommodate various lengths of the lead frames 1 ₁ and 1 ₂ in the longitudinal direction. Furthermore, although the number of channels between the inner guide rail 105 and the outer guide rails 106, 106 in FIG. Claw 22
0 may be provided.

〔Effect of the invention〕

As explained above, according to the present invention, in the lead frame alignment device, the lead frame is guided by the fixed inner guide rail and the inner guide rail disposed so as to be movable in the width direction, and the lead frame is guided to the stop. Since the lead frame is locked in a predetermined position, not only can the lead frame be positioned and aligned easily and accurately, but also the positioned lead frame can be picked up by the chuck claw of the lead frame conveying device and sequentially moved to the molding device. , the operation of placing the lead frame on the molding device can be carried out smoothly and accurately.
Moreover, since the inner end of the lead frame is picked up by the chuck claw, when changing the external dimensions of the lead frame, the outer guide rail is moved in the width direction and the gap between the inner and outer guide rails is removed. It is only necessary to adjust the external dimensions of the lead frame, so there is no need to replace each unit as in the past, and setup time can be shortened by changing the external dimensions of the lead frame due to high-mix, low-volume production. Supply work efficiency can be improved. In addition, since the movement of the outer guide rail can be automatically adjusted based on external command signals, the lead frame can be positioned with high precision without reducing the accuracy of the stop position of the lead frame alignment device.
In addition, the replacement unit that was previously required when changing the external dimensions of lead frames is no longer required, reducing the cost of the entire device.This is a versatile lead frame that can accommodate various external dimensions of lead frames. Supply equipment can be provided.

[Brief explanation of drawings]

Figures 1a and b are plan views of the lead frame, Figure 2
Figures a and b are external views of a loading jig related to a conventional lead frame supply apparatus, Figures 3 to 6 show an embodiment of the present invention, and Figure 3 shows the overall configuration of the lead frame supply apparatus. Figures 4a and 4b are external views of the lead frame alignment device, and Figures 5a and 5b are
6 is an external view of the lead frame conveying device, and FIG. 6 is a partially enlarged view of the chuck claw in FIG. 5. 1 ₁ , 1 ₂ ... Lead frame, 100 ... Lead frame alignment device, 110, 118 ... Motor, 200 ... Lead frame conveying device, 300
...Mold device, 105...Inner guide rail, 106...Outer guide rail, 116...Belt, 119...Stopper, 201...Motor,
208...Gripping device, 220, 220 ₁ , 220 ₂
...Chick nails.

Claims (1)

[Claims] 1. A lead frame alignment device for arranging lead frames loaded with semiconductors at predetermined positions, and a molding device for resin sealing to sequentially move and place the lead frames at predetermined positions. In the lead frame supply device, the lead frame alignment device is arranged to be movable in the width direction of the fixed inner guide rail, and the lead frame alignment device is arranged to be movable in the width direction of the inner guide rail. An outer guide rail that guides the lead frame in the longitudinal direction from both sides, and an outer guide rail that is stretched between the inner guide rail and the outer rail so as to be movable in the longitudinal direction, and the lead frame is placed between the guide rails. The lead frame conveying device includes a belt for moving the lead frame along the inner guide rail, and a stopper provided between the guide rails to lock the lead frame at a predetermined position. The lead frame is characterized by comprising a chuck claw disposed on the lead frame that is capable of grasping the inner end of the lead frame and is movable up and down, and a sliding device for moving the chuck claw to a predetermined position of the molding device. Lead frame supply device.