JPH0459681A - Production of glazed base board - Google Patents
Production of glazed base boardInfo
- Publication number
- JPH0459681A JPH0459681A JP17289790A JP17289790A JPH0459681A JP H0459681 A JPH0459681 A JP H0459681A JP 17289790 A JP17289790 A JP 17289790A JP 17289790 A JP17289790 A JP 17289790A JP H0459681 A JPH0459681 A JP H0459681A
- Authority
- JP
- Japan
- Prior art keywords
- glass paste
- glaze
- photosensitive resin
- light
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 239000011342 resin composition Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 10
- 230000000873 masking effect Effects 0.000 claims abstract description 5
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 230000003746 surface roughness Effects 0.000 abstract description 4
- 239000004014 plasticizer Substances 0.000 abstract description 2
- 239000003504 photosensitizing agent Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 15
- 238000007650 screen-printing Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000001293 FEMA 3089 Substances 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 salt compound Chemical class 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はサーマルヘッド等に用いるグレーズド基板に関
し、特にセラミック基板表面に部分的にグレーズ層を形
成したグレーズド基板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a glazed substrate used for a thermal head or the like, and particularly to a method for manufacturing a glazed substrate in which a glaze layer is partially formed on the surface of a ceramic substrate.
(従来の技術)
従来、セラミック表面の一部にグレーズ層を形成した部
分グレーズド基板は、主にスクリーン印刷でグレーズ層
を形成し、焼付けて作成していた。(Prior Art) Conventionally, partially glazed substrates in which a glaze layer is formed on a portion of a ceramic surface have been produced mainly by forming a glaze layer by screen printing and then baking the glaze layer.
しかし、スクリーン印刷はメツシュを使用するため、グ
レーズラインの直線性が悪く、これが原因して部分グレ
ーズ頂上部の凹凸が生じるという欠点があった。この欠
点を除くため、目開きの小さいメツシュを使用すると、
所定のグレーズ厚みを出すために何度も印刷乾燥を繰り
返す必要があった。例えば60メツシユで60μmの乾
燥膜厚が得られていたグレーズペーストi用いて400
メツシユのスクリーン印刷用すると、60μmの乾燥厚
みを得るのに4回印刷、乾燥を繰り返す必要がめった。However, since screen printing uses a mesh, the linearity of the glaze line is poor, which has the disadvantage of causing unevenness at the top of the partial glaze. To eliminate this drawback, if you use a mesh with a small opening,
It was necessary to repeat printing and drying many times to achieve the desired glaze thickness. For example, using glaze paste i that had obtained a dry film thickness of 60 μm with 60 meshes,
When used for mesh screen printing, it was often necessary to repeat printing and drying four times to obtain a dry thickness of 60 μm.
これらスクリーン印刷法の欠点を取り除くために、特開
昭63−71365号公報には基材上に転写用のグレー
ズパターンをあらかじめ形成しておき、このパターンを
セラミック基板上に加圧転写する方法が開示されている
。In order to eliminate these drawbacks of the screen printing method, Japanese Patent Application Laid-Open No. 63-71365 discloses a method in which a glaze pattern for transfer is previously formed on a base material and this pattern is transferred under pressure onto a ceramic substrate. Disclosed.
(発明が解決しようとする課題)
しかし、特開昭63−71365号公報に開示されてい
る方法では、ファインラインの形成と厚いグレーズ層を
一度に形成するという点は改善されるものの、グレーズ
ラインの位置ff度が低下するという欠点がめった。す
なわち、−度基材に形成したパターンをセラミック基板
に加圧転写するため位置ずれが避けられなかった。(Problems to be Solved by the Invention) However, although the method disclosed in JP-A-63-71365 improves the ability to form fine lines and form a thick glaze layer at the same time, The disadvantage is that the position ff degree of the position decreases. That is, since the pattern formed on the substrate is pressure-transferred onto the ceramic substrate, misalignment is unavoidable.
本発明は2部分グレーズのファインライン性にすぐれ、
厚いグレーズ層を一度に形成でき、さらに部分グレーズ
の位置精度が高いグレーズド基板の創造法を提供するも
のである。The present invention has excellent fine line properties of the two-part glaze,
The present invention provides a method of creating a glazed substrate in which a thick glaze layer can be formed at one time and furthermore, the positional accuracy of partial glazes is high.
(課題を解決するための手段)
本発明は、露光された部分が現1象液に不溶となる感光
性樹脂組成物及び無機ガラス粉末を含むガラスペースト
をセラミック基板に塗布後、所望のクレー 、t: パ
ターン部以外の部分をマスキングして光を照射し1次い
で現像後焼成することを特徴とするグレーズド基板の製
造法に関する。(Means for Solving the Problems) The present invention provides a method of applying a glass paste containing a photosensitive resin composition and an inorganic glass powder whose exposed portions are insoluble in a liquid to a ceramic substrate, and then applying a glass paste containing a desired clay to a ceramic substrate. t: It relates to a method for manufacturing a glazed substrate characterized by masking a portion other than the pattern portion, irradiating it with light, first developing it, and then baking it.
本発明において用いる感光性樹脂組成物は。The photosensitive resin composition used in the present invention is as follows.
船釣にネガ型感光性樹脂組成物として公知のものが使用
できる。そのようなネガ型感光性樹脂組成物には9例え
ば、トリメチロールプロパン、ペンタエリスリトール、
テトラエチレングリコール等の多価アルコールとアクリ
ル酸等の不飽和モノカルボン酸とを反応させて得られる
不飽和基含有化合物、エポキシ樹脂と不飽和モノカルボ
ン酸トヲ反応させて得られる不飽和基含有化合物、2価
アルコールと不飽和2価カルボン酸(又はその無水物)
とを反応させて得られる不飽和ポリエステル樹脂、など
の反応性不飽和基を有する化合物を生成分とし、必要に
応じて光開始剤、増感剤、可塑剤。For boat fishing, known negative photosensitive resin compositions can be used. Such negative photosensitive resin compositions include, for example, trimethylolpropane, pentaerythritol,
Unsaturated group-containing compounds obtained by reacting polyhydric alcohols such as tetraethylene glycol with unsaturated monocarboxylic acids such as acrylic acid; unsaturated group-containing compounds obtained by reacting epoxy resins with unsaturated monocarboxylic acids. , dihydric alcohol and unsaturated dihydric carboxylic acid (or its anhydride)
The product is a compound having a reactive unsaturated group such as an unsaturated polyester resin obtained by reacting with a photoinitiator, a sensitizer, and a plasticizer as necessary.
反応性希釈剤、バインダー樹脂、熱安定化剤などを含ん
だものが知られている。′また。エポキシ樹脂と、その
光開始剤としての芳香族オニウム塩化合物とを含有する
組成物もネガ型感光性樹脂組成物として使用できる。Those containing reactive diluents, binder resins, heat stabilizers, etc. are known. 'Also. A composition containing an epoxy resin and an aromatic onium salt compound as its photoinitiator can also be used as a negative photosensitive resin composition.
これらの感光性樹脂組成物は通常溶剤に溶解して使用さ
れる。溶剤は感光性樹脂組成物と相容性の良いものであ
れば特に制限はない。無機カラス粉末は、良好な部分グ
レーズパターンを得るために、粉末の平均粒径が5μm
以下のものが好ましい。このガラス粉末に感光性樹脂組
成物及び該樹脂組成物の溶剤を加えてガラスペーストを
作成するが、感光性樹脂組成物を8まシ多く添加すると
。These photosensitive resin compositions are usually used after being dissolved in a solvent. The solvent is not particularly limited as long as it is compatible with the photosensitive resin composition. In order to obtain a good partial glaze pattern, the inorganic glass powder has an average particle size of 5 μm.
The following are preferred. A photosensitive resin composition and a solvent for the resin composition are added to this glass powder to create a glass paste, but when 8 units more of the photosensitive resin composition is added.
焼付けてグレーズパターンを得る時にガラスの濃度が低
いためガラスのはしけが起こってしまう。When baking to obtain a glaze pattern, glass barge occurs due to the low concentration of the glass.
ま之、感光性樹脂が少な過ぎるとペースト化が困難にな
る。このため、感光性樹脂組成物の添加量はガラス粉末
の容積1dに対して好ましくは0.3crIi′からZ
1cm’であり、さらに好ましくは0.4 cm’から
1.5 cm’である。また、後述するそれぞれの塗布
法に適した粘度、チクソトロピー性などをガラスペース
トに付与するために溶剤が加えられる。セラミック基板
はアルミナ基板やAI!N基板、ぺIJ リア基板等が
用いられる。また、セラミック基板の表面粗さが小さい
方が良好なグレーズパターンが得られ、好ましくFi1
μmR,a以下である。However, if the amount of photosensitive resin is too small, it will be difficult to form a paste. Therefore, the amount of the photosensitive resin composition added is preferably from 0.3 crIi' to Z
1 cm', more preferably 0.4 cm' to 1.5 cm'. Further, a solvent is added to give the glass paste a viscosity, thixotropy, etc. suitable for each coating method described below. Ceramic substrates are alumina substrates and AI! N board, PEJ rear board, etc. are used. In addition, a better glaze pattern can be obtained when the surface roughness of the ceramic substrate is smaller, and it is preferable that Fi1
μmR,a or less.
セラミック基板にガラスペーストを均一に塗布する方i
hスクリーン印刷法、デイツピング法。How to uniformly apply glass paste to a ceramic substrate
h Screen printing method, date printing method.
ロールコータ法、スピンコータ法、転写法等が用いられ
るが、スクリーン印刷法が厚く印刷できて好ましい。A roll coater method, a spin coater method, a transfer method, etc. are used, but a screen printing method is preferable because it can print thickly.
光の照射は所望のグレーズパターン部だけが露光される
ように他の部分を光が透過しないフィルム等で被覆(マ
スキング)して行われる。マスキングの方法は特に制限
はない。光は感光が充分にできる波長及び量を選定する
。光照射後必要に応じてポストベークを行うのが好まし
い。次いでマスク’t*去し、充分に現像、水洗を行い
、j1光されない部分のガラスペーストを除去する。現
像液rri感光性樹脂組成物用の酸、アルカリ、有機溶
剤等が使用され、スプレー等により付着しているガラス
粉末をも除去する。圧縮空気で吹き飛ばす方法も用い得
る。最後に焼成して基板にグレーズパターンを焼付ける
が、グレーズパターンに欠点カ生じないようにする必要
があり、蓋付の入れものに設置して焼付けるのが好まし
い。Light irradiation is performed by covering (masking) other parts with a film or the like that does not transmit light so that only a desired glaze pattern part is exposed. There are no particular restrictions on the masking method. The wavelength and amount of light is selected to provide sufficient sensitization. It is preferable to perform post-baking as necessary after light irradiation. Next, the mask 't* is removed, and the image is sufficiently developed and washed with water to remove the glass paste in the areas that are not exposed to j1 light. An acid, alkali, organic solvent, etc. for the developer rri photosensitive resin composition is used, and adhering glass powder is also removed by spraying or the like. A method of blowing with compressed air may also be used. Finally, the substrate is fired to print the glaze pattern on the substrate, but it is necessary to prevent defects from occurring in the glaze pattern, so it is preferable to place it in a container with a lid and bake it.
本発明の例全図面を用いて説明する。第1図に示したセ
ラミック基板l上に感光性樹脂組成物。An example of the present invention will be explained using all the drawings. A photosensitive resin composition is placed on the ceramic substrate l shown in FIG.
ガラス粉末及び溶剤からなるガラスペースト2を塗布し
、その後乾燥してから第2図に示すように所望のグレー
ズパターン部分だけを露光できるように作製したフォト
マスク3を乾燥後のガラスペ−スト5の上に重ね光4を
照射する。A glass paste 2 made of glass powder and a solvent is applied, and after drying, a photomask 3 prepared so as to expose only a desired glaze pattern portion is applied to the dried glass paste 5 as shown in FIG. The light 4 is applied over the top.
次に未露光部分を洗い落とし、第3図に示すように光照
射されたガラスペースト6を有する基板を得る。これを
電気炉等で現成してグレーズ層8を有するグレーズド基
板7を得る。Next, the unexposed portions are washed off to obtain a substrate having the glass paste 6 irradiated with light as shown in FIG. This is developed in an electric furnace or the like to obtain a glazed substrate 7 having a glazed layer 8.
(実施例) 以下本発明の詳細な説明する。(Example) The present invention will be explained in detail below.
実施例
感光性樹脂組成物の溶液として、以下のものを調整した
。Examples The following solutions of photosensitive resin compositions were prepared.
■ フェノールノボラック型エポキシ樹脂とアクリル酸
とを(酸当量)/(エポキシ当量)比1.0で付加反応
させた後、さらにテトラヒドロフタル酸無水物を(酸無
水物当量)/(エポキシ基とカルボキシル基との反応で
生成する水酸基の当量)比0.4で付加反応させて得ら
れる不飽和基含有化合物100重量部、ベンゾフェノン
6重量部、44′−ビス(ジエチルアミノ)ベンゾフェ
ノン0.6重量部及び溶剤としてのプロピレングリコー
ルモノメチルエーテルアセテート60重量部。■ After the addition reaction of phenol novolak type epoxy resin and acrylic acid at a ratio of (acid equivalent)/(epoxy equivalent) of 1.0, tetrahydrophthalic anhydride is added to (acid anhydride equivalent)/(epoxy group and carboxyl 100 parts by weight of an unsaturated group-containing compound obtained by addition reaction at a ratio of 0.4 (equivalents of hydroxyl groups produced by reaction with groups), 6 parts by weight of benzophenone, 0.6 parts by weight of 44'-bis(diethylamino)benzophenone, and 60 parts by weight of propylene glycol monomethyl ether acetate as a solvent.
■ メタクリル酸/メタクリル酸メチル/アクリル酸ブ
チル(20/7515重量比)共重合体(分子量約7万
)70重量部、トリメチロールプロパントリアクリレー
ト30重量部、2−メチル−1−(4−メチルチオフェ
ニル)−2−モルフォリノ−プロパン−1(チパカイギ
ー社製。■ 70 parts by weight of methacrylic acid/methyl methacrylate/butyl acrylate (20/7515 weight ratio) copolymer (molecular weight approximately 70,000), 30 parts by weight of trimethylolpropane triacrylate, 2-methyl-1-(4-methylthio phenyl)-2-morpholino-propane-1 (manufactured by Cipakaigyi).
IRGACURE 907 )6重量部、4.4’−ビ
ス(ジエチルアミノ)ベンゾフェノン0.6重量部及び
プロピレングリコールモノメチルエーテルアセテート6
0重量部。IRGACURE 907) 6 parts by weight, 0.6 parts by weight of 4,4'-bis(diethylamino)benzophenone, and 6 parts by weight of propylene glycol monomethyl ether acetate
0 parts by weight.
■ メタクリル酸メチル重合体(分子量約2万)70重
1部、ジペンタエリスリトールへキサメタクリレート3
0重量部、ベンゾフェノン6重量部。■ Methyl methacrylate polymer (molecular weight approximately 20,000) 70 parts by weight, 3 parts dipentaerythritol hexamethacrylate
0 parts by weight, 6 parts by weight of benzophenone.
4.4′−ビス(ジエチルアミノ)ベンゾフェノン0.
6重量部及び0−キシレン60重量部。4.4'-bis(diethylamino)benzophenone0.
6 parts by weight and 60 parts by weight of 0-xylene.
■、■又は■の感光性樹脂組成物の溶液及び硼珪酸アル
ミニウム系ガラス粉末(組成はS i 0240 mo
l %、 Aj’20310moI!%、 B2O31
5rno1%、 CaO15m01!s、 Mg05m
O/%及びPb015m0/%で平均粒径が第1表に示
される)を第1表の割合で混合した。この混合物を摺潰
機でテレピン油(和光紬薬製 試薬1級)を添加しなが
ら混練し、粘度が500Pa−sになるように調整し。Solution of the photosensitive resin composition of ■, ■ or ■ and aluminum borosilicate glass powder (composition is S i 0240 mo
l%, Aj'20310moI! %, B2O31
5rno1%, CaO15m01! s, Mg05m
O/% and Pb015m0/%, the average particle size of which is shown in Table 1) were mixed in the proportions shown in Table 1. This mixture was kneaded using a grinder while adding turpentine oil (Wako Tsumugi Pharmaceutical Co., Ltd. reagent grade 1), and the viscosity was adjusted to 500 Pa-s.
ガラスペースト1〜10番を得た。このガラスペースト
を60メツシユのスクリーンを用いて100皿角で1r
Im厚で第1表に示す表面粗さを有するアルミナ基板上
に均一に塗布した。塗布後80℃20分間乾燥器内で乾
燥させた。乾燥物に幅400μm及び長さ100印のパ
ターン部分だけ露光できるフィルムマスクをかぶせて高
圧水銀灯で露光した。露光量は325 nmの光に対し
て700m J / cm”とした。露光後の試料を1
〜9番は、1チ炭酸ナトリウム水溶液のシャワーをあて
て現像し、10番Fil、1.1−)リクロルエタンの
シャワーをあてて現像した。現像後水洗し、水切りした
サンプルをセラミック族の耐火物容器に並べ、不透明石
英製の板で蓋をした。これを電気炉中、毎時150℃の
昇温速度で1100℃まで昇温し。Glass pastes Nos. 1 to 10 were obtained. Apply this glass paste for 1r using a 60 mesh screen and 100 plate angles.
It was uniformly coated onto an alumina substrate having a thickness of Im and a surface roughness shown in Table 1. After coating, it was dried in a dryer at 80°C for 20 minutes. The dried product was covered with a film mask capable of exposing only a pattern portion having a width of 400 μm and a length of 100 marks, and exposed to light using a high-pressure mercury lamp. The exposure amount was 700 mJ/cm'' for 325 nm light.The sample after exposure was
No. 9 to No. 9 were developed by applying a shower of aqueous sodium carbonate solution, and No. 10 Fil, 1.1-) was developed by applying a shower of dichloroethane. After development, the samples were washed with water, drained, and placed in a ceramic refractory container, which was covered with an opaque quartz plate. This was heated to 1100°C in an electric furnace at a rate of 150°C per hour.
30分保持後炉冷した。冷却したサンプルのグレーズラ
イン部分の幅、高さを評価した結果、第2表に示すよう
に、試料番号が1.2.3,8.9及びlOOものは良
好な結果が得られた。しかし。After holding for 30 minutes, the mixture was cooled in the furnace. As a result of evaluating the width and height of the glaze line portion of the cooled samples, as shown in Table 2, good results were obtained for samples with sample numbers 1.2.3, 8.9, and 1OO. but.
樹脂の量が多い4番はガラスがはじけ、逆に少ない5番
はペーストがゲル化し、ガラス粉末粒径の大きい6番及
び基板表面粗さの粗い4番は焼成後のグレーズラインに
不具合が生じた。No. 4, which has a large amount of resin, causes the glass to burst, conversely, No. 5, which has a small amount of resin, causes the paste to gel, and No. 6, which has a large glass powder particle size, and No. 4, which has a rough substrate surface, have problems with the glaze line after firing. Ta.
第1表
第2表
比較例
硼珪酸アルミニウム系ガラス粉末(平均粒径5pm 8
iQ240mol!% 、 A/20310mi! ’
% 、Btu315mo/%、 CaO15mol %
、 Mg 0.5mo/%及びPb015mo1%)1
00重量部、エチルセルロース(関東化学層、100C
1))5重量部及びテレピン油を摺潰機で混合した。テ
レピン油はガラスペーストの粘度が500Pa、sにな
るように適宜加えた。このペーストを長さ100口9幅
400μmツバターンが抜いである100メツシユ、2
00メツシユ又は400メツシユでエマルジョン厚み2
0 ttmのスクリーンを用いて1100trr角Xl
a厚で表面粗さ0.4μmPaのアルミナ基板上に印刷
した。印刷物を乾燥機中100℃20分間乾燥した後、
セラミツクシ耐火物容器に並べて不透明石英の仮で蓋を
して電気炉中、毎時150℃の昇温速度で1100℃ま
で昇温し、30分保持後炉冷した。冷却したサンプルの
グレーズラインta分の幅、高さを評価した結果、10
0メツシユのスクリーンを用いたときは幅が600μm
±90μm及び高さが40μm±6μmでろ、9,20
0メンシニのスクリーンを用いたときは幅500μm±
40μm及び高さが28μm±3μm、4QQメツシュ
のスクリーンを用いたときは、440μm±25μm及
び高さが15μm±2μmでめった。Table 1 Table 2 Comparative Examples Aluminum borosilicate glass powder (average particle size 5pm 8
iQ240mol! %, A/20310mi! '
%, Btu315mol/%, CaO15mol%
, Mg 0.5mo/% and Pb015mo1%)1
00 parts by weight, ethyl cellulose (Kanto Chemical Layer, 100C
1)) 5 parts by weight and turpentine were mixed in a grinder. Turpentine oil was appropriately added so that the viscosity of the glass paste was 500 Pa, s. This paste was made into 100 meshes with a length of 100 openings, a width of 400 μm, and 2
Emulsion thickness 2 with 00 mesh or 400 mesh
1100trr angle Xl using 0 ttm screen
Printing was carried out on an alumina substrate having a thickness of a and a surface roughness of 0.4 μmPa. After drying the printed matter in a dryer at 100°C for 20 minutes,
The containers were placed in a ceramic refractory container, covered with a temporary lid made of opaque quartz, heated to 1100°C at a rate of 150°C per hour in an electric furnace, held for 30 minutes, and then cooled in the furnace. As a result of evaluating the width and height of the glaze line ta of the cooled sample, 10
When using a screen with 0 mesh, the width is 600 μm.
±90μm and height 40μm±6μm, 9,20
Width: 500μm± when using a 0.0mm screen
When a 4QQ mesh screen of 40 μm and a height of 28 μm±3 μm was used, it was found to be 440 μm±25 μm and a height of 15 μm±2 μm.
実施例で評価が良かった試料番号1,2,3゜8.9E
lび10に比べて比ffMJではグレーズラインの幅精
度及び高さ精度がいずれも劣っていた。Sample numbers 1, 2, and 3°8.9E that were evaluated well in the examples
Both the width accuracy and height accuracy of the glaze line were inferior in the ratio ffMJ compared to the glaze line width and height.
また、比較例中幅精度の最も良かった400メツシユス
クリーン使用の場合ではグレーズ高さが15μmと低く
、−度に高さの高いグレーズラインを形成することはで
きなかった。Furthermore, in the case of using a 400 mesh screen, which had the best width accuracy among the comparative examples, the glaze height was as low as 15 μm, and it was not possible to form a very high glaze line.
(発明の効果)
本発明によれば9部分グレーズのファインライン性にす
ぐれ、厚いグレーズ層を一度に形成でき。(Effects of the Invention) According to the present invention, a nine-part glaze has excellent fine-line properties, and a thick glaze layer can be formed at once.
さらに部分グレーズの位置精度が高いグレーズド基板が
容易に得られる。Furthermore, a glazed substrate with high positional accuracy of the partial glaze can be easily obtained.
第1図は本発明のガラスペーストを塗布したセラミック
基板の斜視図、第2図はフォトマスクを用いてガラスペ
ーストの必要部分に光を照射する説明図、第3図は未露
光部分を除去したセラミンク基板の斜視図及び第4図は
グレーズド基板の斜視図である。
符号の説明
l・・・セラミック基板 2・・・ガラスペースト3
・・・フォトマスク 4・・・光5・・・乾燥後の
ガラスペースト
6・・・光照射されたガラスペーストFigure 1 is a perspective view of a ceramic substrate coated with the glass paste of the present invention, Figure 2 is an explanatory diagram of irradiating light onto the required areas of the glass paste using a photomask, and Figure 3 is a diagram showing the removal of unexposed areas. A perspective view of the ceramic substrate, and FIG. 4 is a perspective view of the glazed substrate. Explanation of symbols 1...Ceramic substrate 2...Glass paste 3
...Photomask 4...Light 5...Glass paste after drying 6...Glass paste irradiated with light
Claims (1)
成物及び無機ガラス粉末を含むガラスペーストをセラミ
ック基板に塗布後、所望のグレーズパターン部以外の部
分をマスキングして光を照射し、次いで現像後焼成する
ことを特徴とするグレーズド基板の製造法。1. After coating a ceramic substrate with a glass paste containing a photosensitive resin composition and inorganic glass powder whose exposed areas are insoluble in a developer, masking areas other than the desired glaze pattern area and irradiating with light; A method for producing a glazed substrate, which is characterized in that it is then developed and then baked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17289790A JPH0459681A (en) | 1990-06-29 | 1990-06-29 | Production of glazed base board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17289790A JPH0459681A (en) | 1990-06-29 | 1990-06-29 | Production of glazed base board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459681A true JPH0459681A (en) | 1992-02-26 |
Family
ID=15950367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17289790A Pending JPH0459681A (en) | 1990-06-29 | 1990-06-29 | Production of glazed base board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459681A (en) |
-
1990
- 1990-06-29 JP JP17289790A patent/JPH0459681A/en active Pending
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