JPH0459751B2 - - Google Patents
Info
- Publication number
- JPH0459751B2 JPH0459751B2 JP63155632A JP15563288A JPH0459751B2 JP H0459751 B2 JPH0459751 B2 JP H0459751B2 JP 63155632 A JP63155632 A JP 63155632A JP 15563288 A JP15563288 A JP 15563288A JP H0459751 B2 JPH0459751 B2 JP H0459751B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- film
- conductive paste
- printed circuit
- metal terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 description 50
- 239000002184 metal Substances 0.000 description 50
- 229920006267 polyester film Polymers 0.000 description 27
- 229910052782 aluminium Inorganic materials 0.000 description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 25
- 239000011888 foil Substances 0.000 description 19
- 229910000679 solder Inorganic materials 0.000 description 15
- 229920003002 synthetic resin Polymers 0.000 description 15
- 239000000057 synthetic resin Substances 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 229920001169 thermoplastic Polymers 0.000 description 14
- 239000004416 thermosoftening plastic Substances 0.000 description 14
- 229920001225 polyester resin Polymers 0.000 description 11
- 239000004645 polyester resin Substances 0.000 description 11
- 238000004898 kneading Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000002585 base Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ポリエステルフイルム等の熱可塑性
合成樹脂フイルム上に形成されたアルミニウム箔
をエツチング処理してパターンを形成してなるフ
レキシブルプリント基板の端子構造に関するもの
である。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a flexible printed circuit board terminal formed by etching an aluminum foil formed on a thermoplastic synthetic resin film such as a polyester film to form a pattern. It's about structure.
近年電子機器に使用される電子部品は、小型化
及び薄型化が進んでおり、該電子部品の小型化及
び薄型化を進める上で、フレキシブルプリント基
板は空間の有効利用という点で極めて有用である
ことから多く利用されている。即ちフレキシブル
プリント基板は、メンブレンスイツチ構成部材と
して或いはフラツトケーブル構成部材等に多く利
用されてる。
In recent years, electronic components used in electronic devices have become smaller and thinner, and flexible printed circuit boards are extremely useful in terms of effective use of space as electronic components become smaller and thinner. This is why it is widely used. That is, flexible printed circuit boards are often used as components of membrane switches, flat cables, and the like.
上記フレキシブルプリント基板は、所謂絶縁フ
イルム上に導電体パターンを形成したもである
が、一般に使用されているフレキシブルプリント
基板としては下記のようなものがある。即ち、
ポリイミドフイルム等の熱可塑性合成樹脂フ
イルムに銅箔を貼つてなる基板に、エツチング
処理等を施して導電パターンを形成したもの、
ポリエステル等の熱可塑性合成樹脂フイルム
上に銅箔又はアルミニウム箔を貼つてなる基板
にエツチング処理等を施して導電パターンを形
成したもの、或いはポリエステルの絶縁フイル
ム上に銀ペースト等の導電ペーストをスクリー
ン印刷して導電パターンを形成したものであ
る。 The above-mentioned flexible printed circuit board is one in which a conductor pattern is formed on a so-called insulating film, and commonly used flexible printed circuit boards include the following. In other words, a substrate made by pasting copper foil on a thermoplastic synthetic resin film such as a polyimide film, which is subjected to an etching process to form a conductive pattern, and a substrate made by applying a conductive pattern to a thermoplastic synthetic resin film such as polyester. A conductive pattern is formed by etching the attached substrate, or a conductive pattern is formed by screen printing a conductive paste such as silver paste on a polyester insulating film.
上記フレキシブルプリント基板の内、は耐熱
性の高いポリイミドフイルムを用いるため、半田
付けが可能であるという利点はあるが価格が非常
に高くなるという欠点がある。そこで安価な上記
のポリエステルフイルム等の熱可塑性合成樹脂
フイルムを用いたものが使用されている。
Among the above-mentioned flexible printed circuit boards, since a polyimide film with high heat resistance is used, it has the advantage of being soldered, but has the disadvantage of being very expensive. Therefore, a film using an inexpensive thermoplastic synthetic resin film such as the above-mentioned polyester film is used.
しかしながら、例えばポリエステルフイルムに
銅箔を貼付けた後エツチング処理して導体パター
ンを形成したものは、ポリエステルフイルムは耐
熱性に劣るから、低温半田による半田付けは可能
であるものの、低温半田による半田付け作業は、
通常の半田付け作業に比較し、その作業性が悪い
という問題がある。 However, for example, when copper foil is pasted on a polyester film and then etched to form a conductive pattern, it is possible to solder with low-temperature solder because the polyester film has poor heat resistance. teeth,
There is a problem that the workability is poor compared to normal soldering work.
また、ポリエステルフイルム等の熱可塑性合成
樹脂フイルムにアルミニウム箔を貼り付けた後エ
ツチング処理して導体パターンを形成したもの
は、アルミニウム用の特殊な半田を用いた半田付
けは可能であるが、通常の半田付けができないと
いう問題がある。 In addition, if aluminum foil is attached to a thermoplastic synthetic resin film such as polyester film and then etched to form a conductive pattern, it is possible to solder it using a special solder for aluminum, but it is possible to solder it using a special solder for aluminum. There is a problem that soldering is not possible.
また、ポリエステルフイルム等の熱可塑性合成
樹脂フイルムに銀ペースト等の導電ペーストをス
クリーン印刷して導電パターンを形成したものは
製造コストは安いが、導電ペーストを印刷しして
パターンを形成するためこのパターンの電気抵抗
が大きく、使用範囲が限定されるという問題や半
田付けが不可能であるという問題があつた。 In addition, manufacturing costs are low for those in which a conductive pattern is formed by screen printing a conductive paste such as silver paste on a thermoplastic synthetic resin film such as a polyester film, but since the pattern is formed by printing the conductive paste, this pattern has a large electrical resistance, which limits its range of use and makes it impossible to solder.
本発明は上述の点に鑑みてなされたもので、導
電パターンに大きい電流を流すことが可能、即ち
電流容量を大きく、電気的接続の信頼性及び機械
的接続強度も高く、且つ極めて安価なフレキシブ
ルプリント基板の端子構造を提供することにあ
る。 The present invention has been made in view of the above-mentioned points, and it is possible to flow a large current through a conductive pattern, that is, it has a large current capacity, has high electrical connection reliability and mechanical connection strength, and is extremely inexpensive and flexible. The purpose of the present invention is to provide a terminal structure for a printed circuit board.
上記問題点を除去するため本発明はフレキシブ
ルプリント基板の端子構造を下記のように構成し
た。
In order to eliminate the above-mentioned problems, the present invention configures the terminal structure of a flexible printed circuit board as follows.
ポリエステルフイルム等の熱可塑性合成樹脂フ
イルム上にアルミニウム箔を接着剤で接着して形
成するか又は真空蒸着で形成し、該アルミニウム
箔をエツチング処理にて所定形状のパターンを形
成し、熱可塑性合成樹脂フイルムの端子部を除く
所定部分に合成樹脂の絶縁被膜を施してなるフレ
キシブルプリント基板の端子部のパターン上にポ
リエステル樹脂にニツケル粉を混練してなる導電
ペースト層を形成し、導電ペースト層上に該端子
部から所定寸法外部に突出させて金属端子片を載
置し、該金段端子片の上から端子部に熱可塑性合
成樹脂フイルムと同質の熱可塑性合成樹脂からな
る端子固定用フイルムを載置し、フレキシブルプ
リント基板の金属端子片が位置する部分を除く所
定部分と端子固定用フイルムとを局部的熱溶着す
ると共に導電ペースト層を加熱して金属端子片を
パターンに接着する。 An aluminum foil is formed on a thermoplastic synthetic resin film such as a polyester film by adhering it with an adhesive or by vacuum deposition, and the aluminum foil is etched to form a pattern of a predetermined shape, and then the thermoplastic synthetic resin is A conductive paste layer made by kneading nickel powder with polyester resin is formed on the terminal pattern of a flexible printed circuit board, which is made by applying a synthetic resin insulating coating to a predetermined portion of the film, excluding the terminal portions, and then coats the conductive paste layer on the conductive paste layer. A metal terminal piece is placed so as to protrude to the outside by a predetermined distance from the terminal part, and a terminal fixing film made of a thermoplastic synthetic resin of the same quality as the thermoplastic synthetic resin film is placed on the terminal part from above the metal terminal piece. Then, the terminal fixing film is locally thermally welded to a predetermined portion of the flexible printed circuit board other than the portion where the metal terminal piece is located, and the conductive paste layer is heated to bond the metal terminal piece to the pattern.
また、導電ペーストは重量比で80%乃至30%の
ポリエステル樹脂と同じく重量比で20%乃至70%
ニツケル粉とを混練して製造する。 In addition, conductive paste is 20% to 70% by weight, similar to polyester resin which is 80% to 30% by weight.
Manufactured by kneading with nickel powder.
フレキシブルプリント基板の端子構造を上記の
如く構成することより、金属端子片をアルミニウ
ム箔からなるパターンの端子部に接着する導電ペ
ーストは、ポリエステル樹脂ニツケル粉を混練し
てなる導電ペーストであるから、後述のようにア
ルミニウム箔と金属端子片との接触抵抗が極めて
小さくなる。また、半田付け作業を必要としない
から、基板基材として安価で且つ耐熱性の弱いポ
リエステルフイルム等の熱可塑性合成樹脂フイル
ムを使用しても何ら支障がない。
By configuring the terminal structure of the flexible printed circuit board as described above, the conductive paste for adhering the metal terminal piece to the terminal part of the pattern made of aluminum foil is a conductive paste made by kneading polyester resin nickel powder. The contact resistance between the aluminum foil and the metal terminal piece becomes extremely small. Further, since no soldering is required, there is no problem in using an inexpensive thermoplastic synthetic resin film such as polyester film, which is low in heat resistance, as the substrate base material.
また、導電パターンの材料として導電性が良
く、安価なアルミニウム箔を用いるから、電流容
量が大きく、且つ価格が安価なフレキシブルプリ
ント基板の端子構造となる。 Furthermore, since aluminum foil, which has good conductivity and is inexpensive, is used as the material for the conductive pattern, the terminal structure of the flexible printed circuit board has a large current capacity and is inexpensive.
以下、本発明の一実施例を図面に基づいて説明
する。
Hereinafter, one embodiment of the present invention will be described based on the drawings.
第1図は本発明に係るフレキシブルプリント基
板の端子構造を示す図で、同図aは一部平面図、
同図bは同図aのA−A線上断面拡大矢視図、同
図cは同図aのB−B線上断面拡大矢視図、同図
dは同図cのD部分の拡大図である。また、第2
図はフレキシブルプリント基板の製造方法を説明
するための図、第3図は金属端子片、第4図は端
子固定用フイルムを示す平面図である。 Fig. 1 is a diagram showing the terminal structure of a flexible printed circuit board according to the present invention, and Fig. 1a is a partial plan view;
Figure b is an enlarged cross-sectional view taken along line A-A in figure a, figure c is an enlarged cross-sectional view taken along line B-B in figure a, and figure d is an enlarged view of part D in figure c. be. Also, the second
3 is a plan view showing a metal terminal piece, and FIG. 4 is a plan view showing a terminal fixing film.
フレキシブルプリント基板11の製造は、第2
図aに示すようにアルミニウム箔13とポリエス
テルフイルム12とを用意する。次に該アルミニ
ウム箔13とポリエステルフイルム12を第2b
示すように接着剤で接着する。次に、該アルミニ
ウム箔13をエツチング処理して、導電パターン
13aを形成する。 The manufacturing of the flexible printed circuit board 11 is carried out in the second
As shown in Figure a, aluminum foil 13 and polyester film 12 are prepared. Next, the aluminum foil 13 and the polyester film 12 are
Glue as shown. Next, the aluminum foil 13 is etched to form a conductive pattern 13a.
上記エツチング処理の方法としては、アルミニ
ウムは酸でもアルカリでも溶ける金属であるか
ら、第5図に示すようにアルミニウム箔13上に
形成する導電パターン13aの形状に溶剤剥離型
のエツチングレジストHRを塗布し、該エツチン
グレジストHRが塗布されない部分を酸又はアル
カリで溶かして除去し、導電パターン13aを形
成し、最後にこのエツチングレジストHRを有機
溶剤で除去して導電パターン13aを露出させ
る。なお、アルミニウム箔13の形成は、ポリエ
ステルフイルム12上に真空蒸着等により形成し
てもよい。 As for the method of the above-mentioned etching treatment, since aluminum is a metal that dissolves in both acids and alkalis, a solvent-removable etching resist HR is applied to the shape of the conductive pattern 13a to be formed on the aluminum foil 13, as shown in FIG. The portion where the etching resist HR is not applied is removed by dissolving it with an acid or alkali to form a conductive pattern 13a, and finally the etching resist HR is removed with an organic solvent to expose the conductive pattern 13a. Note that the aluminum foil 13 may be formed on the polyester film 12 by vacuum deposition or the like.
本発明に係るフレキシブルプリント基板の端子
構造は、第1図a乃至dに示すように、ポリエス
テルフイルム12の端子部14に形成された導電
パターン13a上に後に詳述するように、ポリエ
ステル樹脂にニツケル粉を混練してなる導電ペー
スト層16を形成して金属端子片17を載置し、
その上からポリエステルフイルム12と同じポリ
エステルフイルムからなる端子固定用フイルム1
8を載置し、該端子部14の金属端子片17の位
置する部分以外の所定部分のポリエステルフイル
ム12の端子固定用フイルム18とを溶着部19
を形成して溶着し、金属端子片17をポリエステ
ルフイルム12と端子固定用フイルム18の間に
挾み込む。その後導電ペースト層16を加熱硬化
させ、金属端子片17と端子部14の導電パター
ン13とを接続する。 The terminal structure of the flexible printed circuit board according to the present invention is as shown in FIGS. A conductive paste layer 16 is formed by kneading powder, and a metal terminal piece 17 is placed thereon.
From above, a terminal fixing film 1 made of the same polyester film as the polyester film 12.
8 is placed, and a predetermined portion of the terminal portion 14 other than the portion where the metal terminal piece 17 is located is attached to the terminal fixing film 18 of the polyester film 12 at the welded portion 19.
are formed and welded, and the metal terminal piece 17 is sandwiched between the polyester film 12 and the terminal fixing film 18. Thereafter, the conductive paste layer 16 is heated and hardened, and the metal terminal piece 17 and the conductive pattern 13 of the terminal portion 14 are connected.
以下、上記フレキシブルプリント基板の端子構
造の製造方法を詳細に説明する。金属端子片17
は、第3図に示すようにアルミニウム板を板金加
工にて複数の金属端子片17を基材20と一体的
に形成する。この金属端子片17の表面には半田
付け作業性を良くするために半田メツキを施す。
この場合、アルミニウムと半田を接続することに
なるが、アルミニウムは鉛と相性が悪いので半田
中の鉛は10%以下の低鉛半田を用いる。また、金
属端子片17の両側縁には複数の凸部17aが形
成されている。なお、上記例の該凸部17aは金
属端子片17の両側縁に複数固形成した片側縁で
も良く、又凸部の個数も複数である必要がなく一
個でもよい。 Hereinafter, a method for manufacturing the terminal structure of the flexible printed circuit board will be described in detail. Metal terminal piece 17
As shown in FIG. 3, a plurality of metal terminal pieces 17 are integrally formed with a base material 20 by sheet metal processing of an aluminum plate. The surface of this metal terminal piece 17 is solder plated to improve soldering workability.
In this case, aluminum and solder are connected, but since aluminum is incompatible with lead, low-lead solder with less than 10% lead in the solder is used. Further, a plurality of convex portions 17a are formed on both side edges of the metal terminal piece 17. Incidentally, the protrusions 17a in the above example may be formed on one side by forming a plurality of protrusions on both side edges of the metal terminal piece 17, and the number of protrusions need not be plural but may be one.
端子固定用フイルム18は第4図に示すよう
に、ポリエステルフイルム12と同じポリエステ
ルフイルムの幅寸法l1はフレキシブルプリント基
板11の幅寸法l3と略等しく、その長さ寸法l2は
フレキシブルプリント基板11の端子部14の長
さ寸法l4より若干大きく形成されている。なお、
端子固定用フイルム18の寸法は上記寸法に限定
されるものではなく、例えば幅寸法l1を上記以上
大きくしポリエステルフイルム12と端子固定用
フイルム18を溶着後、端子部14をはみ出た部
分を切断除去してもよい。 As shown in FIG. 4, the terminal fixing film 18 is the same polyester film as the polyester film 12, and its width l1 is approximately equal to the width l3 of the flexible printed circuit board 11, and its length l2 is the same as that of the flexible printed circuit board. The length dimension l4 of the terminal portion 14 of No. 11 is slightly larger than that of the terminal portion 14 of No. 11. In addition,
The dimensions of the terminal fixing film 18 are not limited to the above dimensions; for example, the width dimension l1 may be made larger than the above, and after welding the polyester film 12 and the terminal fixing film 18, the portion protruding from the terminal portion 14 is cut off. May be removed.
導電ペーストは、ポリエステル樹脂ニツケル粉
を混練して構成する。通常の導電ペーストは金属
をフレーク状にしたものと球状のものを適度に混
練してペーストとするが、本実施例の場合は膜厚
方向の金属端子片17と導電ペースト13aとの
電気的導通をはかるために金属接触が良好である
必要があり、金属粉は球状のニツケル粉とした方
が安定した導通が得られる。また、粒径は余り細
かいと膜厚方向に導電パスがいくつもできてしま
うので粒径は数μm程度のものが良好である。ま
た、ニツケル粉の含有量は少ないと電気的導通が
不安定になり、多過ぎるとポリエステル樹脂が少
ない分機械的接着力が弱くなり、更に導電ペース
ト中のポリエステル樹脂は固着部を封じ込め各種
循環湿度や有害なガス等から守る作用を有するか
ら、導電ペースト中のポリエステル樹脂が少ない
と、この固着部の封じ込め作用が小さくなり導電
ペーストとして不適当である。 The conductive paste is made by kneading polyester resin nickel powder. Normal conductive paste is made by properly kneading metal flakes and spheres, but in this embodiment, electrical continuity between the metal terminal piece 17 and the conductive paste 13a in the thickness direction In order to measure this, good metal contact is required, and stable conduction can be obtained by using spherical nickel powder as the metal powder. Furthermore, if the particle size is too small, many conductive paths will be formed in the film thickness direction, so a particle size of about several μm is preferable. In addition, if the content of nickel powder is too low, electrical conductivity will become unstable, and if it is too high, the mechanical adhesion will be weak due to the lack of polyester resin.Furthermore, the polyester resin in the conductive paste will seal the adhesive part and allow various types of circulating humidity to be used. If the amount of polyester resin in the conductive paste is small, the sealing effect of the fixed portion will be reduced, making it unsuitable as a conductive paste.
本実施例では重量比でニツケル粉の含有量を50
%としたが、20%乃至70%であれば使用できるこ
とを確認した。 In this example, the content of nickel powder was 50% by weight.
%, but it was confirmed that it can be used at 20% to 70%.
上記フレキシブルプリント基板11の端子部1
4の導電パターン13aに前記導電ペーストを印
刷して導電ペースト層16を形成すると共に、該
導電ペースト層16を加熱乾燥させる。 Terminal section 1 of the flexible printed circuit board 11
The conductive paste is printed on the conductive pattern 13a of No. 4 to form a conductive paste layer 16, and the conductive paste layer 16 is heated and dried.
次に、第6図に示すように金属製の台21の上
に端子部14の導電パターン13aに導電ペース
ト層16を形成したポリエステルフイルム12を
載置し、該導電パターン13aの上に前記基材2
0と一体的に形成された金属端子片17を載置
し、さらにその上に端子固定用フイルム18を載
置する。この状態で超音波発射用のホーン22を
端子固定用フイルム18に載置する。ここでホー
ン22の先端は図示するように、端子部14の金
属端子片17が位置する部分以外の端子固定用フ
イルム18上に当るように凸部22aが形成され
ており、該凸部22aを金属端子片17が位置す
る部分以外の端子固定用フイルム18上に当接
し、ホーン22より超音波を発射し、凸部22a
の位置する部分のポリエステルフイルム12と端
子固定用フイルム18を超音波加熱により局部的
に溶融する。ここでポリエステルフイルム12と
端子固定用フイルム18は同じ材質であるから、
両者は溶着する。これにより第1図aに示すよう
に端子部14の金属端子片17が位置する部分以
外の所定位置に溶着部19が形成されると共に、
ホーン22の凹部が位置する端子固定用フイルム
18も加熱し、その冷却による収縮力により金属
端子片17が絶縁フイルム12と端子固定用フイ
ルム18の間に強固に挾持されることになる。こ
の時金属端子片17の両縁に形成された凸部17
aは上記溶着部19に係合するから、金属端子片
17を引つ張つても金属端子片17は容易に脱着
させない作用を奏する。また、このポリエステル
フイルム12と端子固定用フイルム18を超音波
加熱で溶着する際、このとき超音波の振動は端子
部14の導電ペースト層16のニツケル粉に伝わ
りその表面の薄い酸化被膜をつき破るから導電性
が更によくなる。 Next, as shown in FIG. 6, the polyester film 12 on which the conductive paste layer 16 is formed on the conductive pattern 13a of the terminal portion 14 is placed on a metal stand 21, and the base plate is placed on the conductive pattern 13a. material 2
A metal terminal piece 17 integrally formed with the metal terminal piece 0 is placed thereon, and a terminal fixing film 18 is further placed thereon. In this state, the horn 22 for emitting ultrasonic waves is placed on the terminal fixing film 18. Here, as shown in the figure, the tip of the horn 22 is formed with a convex portion 22a so as to touch the terminal fixing film 18 other than the portion where the metal terminal piece 17 of the terminal portion 14 is located. The metal terminal piece 17 is brought into contact with the terminal fixing film 18 other than the part where it is located, and the horn 22 emits ultrasonic waves, and the convex part 22a
The polyester film 12 and the terminal fixing film 18 in the area where is located are locally melted by ultrasonic heating. Here, since the polyester film 12 and the terminal fixing film 18 are made of the same material,
Both are welded together. As a result, as shown in FIG. 1a, a welded part 19 is formed at a predetermined position other than the part where the metal terminal piece 17 of the terminal part 14 is located, and
The terminal fixing film 18 in which the concave portion of the horn 22 is located is also heated, and the metal terminal piece 17 is firmly sandwiched between the insulating film 12 and the terminal fixing film 18 by the contraction force caused by the cooling. At this time, convex portions 17 formed on both edges of the metal terminal piece 17
Since a is engaged with the welded portion 19, the metal terminal piece 17 is prevented from being easily attached or detached even if the metal terminal piece 17 is pulled. Furthermore, when this polyester film 12 and the terminal fixing film 18 are welded by ultrasonic heating, the ultrasonic vibrations are transmitted to the nickel powder of the conductive paste layer 16 of the terminal portion 14 and break through the thin oxide film on the surface. The conductivity becomes even better.
上記の如く絶縁フイルム12の端子部14に端
子固定用フイルム18を溶着し、金属端子片17
を固定したものを第7図に示すように台23の上
に載置し、その上から加熱コテ24を当接させ導
電ペースト層16を加熱することにより、導電ペ
ースト層16は固まり、金属端子片17は導電パ
ターン13aに固着される。これにより金属端子
片17と導電パターン13aとが電気的及び機械
的に接続されると共に、隣接する端子間は既に溶
着された絶縁フイルム12と端子固定用フイルム
18により隔離されているため、金属端子片17
と17は導電性接着剤により短絡されることがな
い。 As described above, the terminal fixing film 18 is welded to the terminal portion 14 of the insulating film 12, and the metal terminal piece 17 is welded.
As shown in FIG. 7, the fixed conductive paste layer 16 is placed on a stand 23, and the heating iron 24 is brought into contact with it to heat the conductive paste layer 16, so that the conductive paste layer 16 hardens and forms a metal terminal. Piece 17 is fixed to conductive pattern 13a. As a result, the metal terminal piece 17 and the conductive pattern 13a are electrically and mechanically connected, and since adjacent terminals are separated by the already welded insulating film 12 and terminal fixing film 18, the metal terminal Piece 17
and 17 are not short-circuited by the conductive adhesive.
最後に、金属端子片17を第3図のE−E線上
で切断し、基材20を除去する。これにより金属
端子片17はそれぞれ個々に分離され、その先端
は絶縁フイルム12の端子部14より所定寸法外
部に突出した構造の本発明に係るフレキシブルプ
リント基板の端子構造は完成する。 Finally, the metal terminal piece 17 is cut along the line EE in FIG. 3, and the base material 20 is removed. As a result, the metal terminal pieces 17 are separated individually, and the terminal structure of the flexible printed circuit board according to the present invention is completed, in which the tips of the metal terminal pieces 17 protrude outward by a predetermined distance from the terminal portions 14 of the insulating film 12.
また、金属端子片17の縁部に形成する凸部1
7aは溶着部19に係合し、引つ張り強度を増加
させる作用を有するが、この凸部17aは必ずし
も必要なものではなく、引つ張り強度をある程度
犠性にすればなくてもよい。 Further, the convex portion 1 formed on the edge of the metal terminal piece 17
Although the convex portion 7a engages with the welded portion 19 and has the effect of increasing the tensile strength, the convex portion 17a is not necessarily necessary and may be omitted if the tensile strength is sacrificed to some extent.
第8図は上記実施例で用いたポリエステル樹脂
にニツケル粉を混練してなる導電ペーストと他の
導電ペーストのアルミニウム箔対金属端子片の接
触抵抗の測定結果を示す図である。図から明らか
なように、ポリエステル樹脂にニツケル粉を混練
してなる導電ペーストを用いた場合の初期値の接
触抵抗値は、金属紛として銅粉、銀粉を用いたも
の又はハンダの場合に比較し小さくなる。特にポ
リエステルフイルム12と端子固定用フイルム1
8の間の局部的に超音波溶着した場合は、超音波
の振動が導電ペーストのニツケル粉に伝わりその
表面の薄い酸化被膜をつき破るから導電性が更に
良くなる(図中、超音波有の項を参照)。また、
温度60℃、相対湿度90〜95%の環境下で加速試験
を行なつた場合、ニツケル粉を混練したものは他
の金属粉を混練したものに比較し、その接触抵抗
値が小さいことが分かる。 FIG. 8 is a diagram showing the measurement results of the contact resistance between aluminum foil and metal terminal piece of the conductive paste made by kneading nickel powder into the polyester resin used in the above example and another conductive paste. As is clear from the figure, the initial contact resistance value when using a conductive paste made by kneading nickel powder into polyester resin is higher than that when using copper powder or silver powder as metal powder or when using solder. becomes smaller. Especially polyester film 12 and terminal fixing film 1
If ultrasonic welding is carried out locally between 8 and 8, the ultrasonic vibrations are transmitted to the nickel powder of the conductive paste and break through the thin oxide film on its surface, resulting in even better conductivity. (see section). Also,
When accelerated tests are conducted in an environment with a temperature of 60°C and a relative humidity of 90-95%, it can be seen that the contact resistance value of products kneaded with nickel powder is smaller than those kneaded with other metal powders. .
なお、上記実施例ではフレキシブルプリント基
板11の基板フイルムとして、ポリエステルフイ
ルム12を使用したが、基板フイルムとしてはこ
れに限定されるものではなく熱可塑性合成樹脂フ
イルムであれば良い。また、端子固定用フイルム
18もポリエステルフイルムに限定されるもので
はなく、基板と同質の熱可塑性合成樹脂フイルム
であれば良い。 In the above embodiment, the polyester film 12 was used as the substrate film of the flexible printed circuit board 11, but the substrate film is not limited to this, and any thermoplastic synthetic resin film may be used. Further, the terminal fixing film 18 is not limited to a polyester film, but may be any thermoplastic synthetic resin film having the same quality as the substrate.
以上、説明したように本発明によれば下記のよ
うな優れた効果が得られる。
As explained above, according to the present invention, the following excellent effects can be obtained.
金属端子片をアルミニウム箔からなるパター
ンの端子部に接着する導電ペーストに、ポリエ
ステル樹脂にニツケル粉を混練してなる導電ペ
ーストを用いるから、端子部のアルミニウム箔
と金属端子片の接触抵抗が極めて小さくなる。 The conductive paste used to bond the metal terminal pieces to the terminals of the aluminum foil pattern uses a conductive paste made by mixing nickel powder with polyester resin, so the contact resistance between the aluminum foil and the metal terminal pieces is extremely low. Become.
また、アルミニウム箔導体に直接半田付けす
るのは非常に困難であるが、すでに金属端子片
がフレキシブルプリント基板に取り付けられて
いるため、金属端子片を介しての半田付けは容
易であり、基板基材として安価で且つ耐熱性の
小さいポリエステルフイルム等の熱可塑性合成
樹脂フイルムを使用でき、且つ導電パターンの
材料として導電性が良く極めて安価なアルミニ
ウム箔を用いることができるから、大電流容量
で且つ価格が極めて安価なフレキシブルプリン
ト基板の端子構造となる。 In addition, although it is very difficult to solder directly to the aluminum foil conductor, since the metal terminal piece is already attached to the flexible printed circuit board, it is easy to solder through the metal terminal piece, and the board base is easy to solder. Thermoplastic synthetic resin film such as polyester film, which is inexpensive and has low heat resistance, can be used as the material, and aluminum foil, which has good conductivity and is extremely cheap, can be used as the material for the conductive pattern, so it has a large current capacity and is inexpensive. This results in an extremely inexpensive terminal structure for flexible printed circuit boards.
第1図は本発明に係るフレキシブルプリント基
板の端子構造を示す図で、同図aは一部平面図、
同図bは同図aのA−A線上断面拡大矢視図、同
図cは同図aのB−B線上断面拡大矢視図、同図
dは同図cのD部分の拡大図、第2図はフレキシ
ブルプリント基板の製造方法を説明するための
図、第3図は金属端子片を示す平面図、第4図は
端子固定用フイルムを示す平面図、第5図は導電
パターンの形成行程を示す図、第6図及び第7図
はフレキシブルプリント基板の端子構造の製造方
法を説明するための図、第8図はポリエステル樹
脂にニツケル粉を混練してなる導電ペーストと他
の導電ペーストのアルミニウム箔対金属端子片の
接触抵抗の測定結果を示す図である。
図中、11…フレキシブルプリント基板、12
…ポリエステルフイルム、13…アルミニウム
箔、14…端子部、15…絶縁被膜、16…導電
ペースト層、17…金属端子片、18…端子固定
用フイルム、19…溶着部。
Fig. 1 is a diagram showing the terminal structure of a flexible printed circuit board according to the present invention, and Fig. 1a is a partial plan view;
Figure b is an enlarged cross-sectional view taken along line A-A in figure a, figure c is an enlarged cross-sectional view taken along line B-B in figure a, figure d is an enlarged view of part D in figure c, Fig. 2 is a diagram for explaining the method for manufacturing a flexible printed circuit board, Fig. 3 is a plan view showing a metal terminal piece, Fig. 4 is a plan view showing a terminal fixing film, and Fig. 5 is a plan view showing the formation of a conductive pattern. Figures 6 and 7 are diagrams showing the process, and Figures 6 and 7 are diagrams for explaining the manufacturing method of the terminal structure of a flexible printed circuit board. Figure 8 is a diagram showing a conductive paste made by kneading nickel powder into polyester resin and other conductive pastes. FIG. 3 is a diagram showing the measurement results of contact resistance between aluminum foil and metal terminal piece. In the figure, 11...Flexible printed circuit board, 12
... Polyester film, 13... Aluminum foil, 14... Terminal portion, 15... Insulating coating, 16... Conductive paste layer, 17... Metal terminal piece, 18... Terminal fixing film, 19... Welding part.
1 接続端子を収納する端子収納部を有するハウ
ジングにおいて、ハウジング本体の前記端子収納
部の底部に前記接続端子の後抜けを防止するため
の第1の係止突起を形成し、前記底部の先端部に
内側に向けて弾発性を有し前記接続端子の前端部
を係止するための係止片を設け、前記端子収納部
の天井部には基部を前記ハウジング本体に取り付
け中間部に前記接続端子の後抜けを防止するため
の第2の係止突起を形成し先端部を自由端とした
可動片を設け、前記接続端子の収納後に前記可動
片の第2の係止突起が前記接続端子に嵌合するよ
うに前記可動片を移動して固定する固定部材を前
記ハウジング本体に挿着することを特徴とするコ
ネクタハウジング。
1. In a housing having a terminal accommodating portion for accommodating a connecting terminal, a first locking protrusion is formed at the bottom of the terminal accommodating portion of the housing body to prevent the connecting terminal from coming off later, and a tip end of the bottom portion is formed. is provided with a locking piece that has elasticity toward the inside and locks the front end of the connection terminal, and a base portion is attached to the housing body on the ceiling of the terminal storage portion, and the connection terminal is attached to the intermediate portion. A movable piece is provided with a second locking protrusion and a free end for preventing the terminal from coming off later, and after the connecting terminal is stored, the second locking protrusion of the movable piece locks the connecting terminal. A connector housing characterized in that a fixing member that moves and fixes the movable piece so as to fit into the housing body is inserted into the housing body.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63155632A JPH025374A (en) | 1988-06-23 | 1988-06-23 | Terminal structure of flexible printed circuit board |
| US07/365,116 US5111363A (en) | 1988-06-23 | 1989-06-12 | Mount for electronic parts |
| DE68918995T DE68918995T2 (en) | 1988-06-23 | 1989-06-12 | Assembly of electronic components. |
| EP89201520A EP0347974B1 (en) | 1988-06-23 | 1989-06-12 | Mount for electronic parts |
| KR1019890008678A KR950008430B1 (en) | 1988-06-23 | 1989-06-23 | Mount for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63155632A JPH025374A (en) | 1988-06-23 | 1988-06-23 | Terminal structure of flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH025374A JPH025374A (en) | 1990-01-10 |
| JPH0459751B2 true JPH0459751B2 (en) | 1992-09-24 |
Family
ID=15610229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63155632A Granted JPH025374A (en) | 1988-06-23 | 1988-06-23 | Terminal structure of flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025374A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2580333Y2 (en) * | 1991-04-09 | 1998-09-10 | 帝国通信工業株式会社 | Battery holder board mounting structure |
| JP6986347B2 (en) * | 2016-01-20 | 2021-12-22 | Fdk株式会社 | Mounting method of laminated type power storage element and laminated type power storage element |
| CN112397107A (en) * | 2019-08-16 | 2021-02-23 | 神讯电脑(昆山)有限公司 | Heating and radiating structure of storage device |
-
1988
- 1988-06-23 JP JP63155632A patent/JPH025374A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH025374A (en) | 1990-01-10 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |