JPH0459943B2 - - Google Patents

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Publication number
JPH0459943B2
JPH0459943B2 JP12774286A JP12774286A JPH0459943B2 JP H0459943 B2 JPH0459943 B2 JP H0459943B2 JP 12774286 A JP12774286 A JP 12774286A JP 12774286 A JP12774286 A JP 12774286A JP H0459943 B2 JPH0459943 B2 JP H0459943B2
Authority
JP
Japan
Prior art keywords
powder
supply
injection nozzle
spray gun
thermal spray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12774286A
Other languages
Japanese (ja)
Other versions
JPS631474A (en
Inventor
Chikara Komaki
Hiroyuki Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAIICHI METEKO KK
Original Assignee
DAIICHI METEKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAIICHI METEKO KK filed Critical DAIICHI METEKO KK
Priority to JP12774286A priority Critical patent/JPS631474A/en
Publication of JPS631474A publication Critical patent/JPS631474A/en
Publication of JPH0459943B2 publication Critical patent/JPH0459943B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、母材に対しセラミツト等の粉末材料
を溶射ガンによるプラズマ焔によつて溶射するプ
ラズマ溶射装置において、前記溶射ガンへの粉末
材料の供給を制御する装置に関するものである。
Detailed Description of the Invention (Industrial Application Field) The present invention provides a plasma spraying apparatus for spraying a powder material such as ceramic onto a base material using a plasma flame from a spray gun. This invention relates to a device for controlling the supply of.

(従来の技術) 従来、この種のプラズマ溶射装置にあつては、
プラズマ焔を噴射するための溶射ガンに対して該
噴射口付近に粉末噴射ノズルを設け、この粉末噴
射ノズルと溶射すべき粉末材料を供給するホツパ
を含む供給手段とをホース等の供給管路にて接続
し、そして、前記供給手段のホツパ側に設けた制
御弁により、溶射ガンの溶射及び停止動作に対応
して該溶射ガンへの粉末材料の供給を制御する構
成であつた。
(Prior art) Conventionally, in this type of plasma spraying equipment,
A powder injection nozzle is provided near the injection port of a thermal spray gun for injecting plasma flame, and the powder injection nozzle and a supply means including a hopper for supplying the powder material to be thermally sprayed are connected to a supply pipe such as a hose. A control valve provided on the hopper side of the supply means controls the supply of powder material to the thermal spray gun in response to spraying and stopping operations of the thermal spray gun.

(発明が解決しようとする問題点) しかしながら、上記構成のものにあつては、制
御弁が供給手段のホツパ側に設けてあるので、該
制御弁により溶射ガンへの粉末材料の供給を停止
しても、同供給手段から溶射ガンにおけの粉末噴
射ノズルとの間の供給管路内には粉末材料が残る
ため、次の溶射開始に伴なつてその残留した供給
管路内の粉末材料が一度に噴射される(第2図ハ
参照)問題点を有し、とくに溶射ガンの溶射開始
に伴なう粉末材料の供給の立ちあがりが瞬間的で
あるこの種プラズマ溶射にあつては粉末材料の供
給不均一等種々の弊害を及ぼすものであつた。
(Problem to be Solved by the Invention) However, in the case of the above structure, since the control valve is provided on the hopper side of the supply means, the supply of powder material to the thermal spray gun is stopped by the control valve. However, powder material remains in the supply pipe between the supply means and the powder injection nozzle of the thermal spray gun, so when the next thermal spray starts, the powder material remaining in the supply pipe will be removed. This type of plasma spraying has the problem that the powder material is injected all at once (see Figure 2 C), and the supply of powder material is instantaneous when the spray gun starts spraying. This caused various problems such as uneven supply.

本発明は上記した従来の欠点を解消するための
ものであり、粉末材料の定量供給及び溶射ガンへ
の溶射開始に伴なう瞬時的な供給に確実に対応す
ることができるプラズマ溶射装置における粉末材
料の供給制御装置を提供することを目的とする。
The present invention is intended to solve the above-mentioned conventional drawbacks, and is to provide a powder in a plasma spraying apparatus that can reliably cope with the quantitative supply of powder material and the instantaneous supply of powder material at the start of thermal spraying to a thermal spray gun. The purpose of the present invention is to provide a material supply control device.

(問題点を解決するための手段) 上記目的を達成するために本発明は、プラズマ
焔を噴射する噴射口及び該噴射口付近に粉末噴射
ノズルを設けた溶射ガンと、溶射すべき粉末材料
を前記溶射ガンの粉末噴射ノズルに供給する手段
とよりなり、前記粉末材料を前記溶射ガンの粉末
噴射ノズルに供給して母材に溶射するプラズマ溶
射装置において、前記粉末材料の供給手段と前記
溶射ガンの粉末噴射ノズルとを接続する粉末材料
の供給路に対し、該粉末噴射ノズルの近傍に切換
弁を組込み、この切換弁は前記供給路から前記粉
末噴射ノズルへの連通を許す通路と、該通路を遮
断して前記供給手段側または別の貯溜タンクへ戻
す通路とを形成して非溶射時には前記供給路内の
粉末材料の流通を許容するように前記溶射ガンの
溶射動作に連繋して切換制御される構成である。
(Means for Solving the Problems) In order to achieve the above object, the present invention provides a thermal spray gun having an injection port for injecting plasma flame and a powder injection nozzle near the injection port, and a powder material to be sprayed. A plasma spraying apparatus comprising a means for supplying the powder material to a powder injection nozzle of the thermal spray gun, and for supplying the powder material to the powder injection nozzle of the thermal spray gun to spray the base material, the powder material supply means and the thermal spray gun. A switching valve is installed near the powder injection nozzle for a powder material supply path that connects the powder injection nozzle to the powder injection nozzle. switching control in conjunction with the thermal spraying operation of the thermal spray gun so as to form a passage that shuts off the powder material and returns it to the supply means side or another storage tank, and allows the flow of the powder material in the supply passage during non-thermal spraying. This is the configuration that will be used.

(発明の作用) 溶射ガンの溶射動作、すなわち溶射時に伴なつ
て切換弁が作動され、該切換弁により供給路と溶
射ガンの粉末噴射ノズルとの連通が許容されるの
で、粉末材料が供給手段から供給路を経て溶射ガ
ンの粉末噴射ノズルへ供給される。また溶射ガン
の非溶射時に伴なつて切換弁が切換作動され、前
記通路を遮断して前記供給手段側へ戻す通路と連
通されるため、前記供給手段からの粉末材料は前
記粉末噴射ノズルへ供給されず、供給路内から供
給手段側または別の貯溜タンクへ戻されるもので
ある。
(Operation of the Invention) The switching valve is operated during the thermal spraying operation of the thermal spray gun, that is, during thermal spraying, and the switching valve allows communication between the supply path and the powder injection nozzle of the thermal spray gun. The powder is supplied to the powder injection nozzle of the thermal spray gun via the supply path. In addition, when the thermal spray gun is not spraying, the switching valve is operated to switch and communicate with the passage that blocks the passage and returns to the supply means, so that the powder material from the supply means is supplied to the powder injection nozzle. Instead, it is returned to the supply means side or another storage tank from within the supply path.

(実施例) 以下、本発明の一実施例を図面にしたがつて詳
述すると、図中1はプラズマ溶射装置の一つを構
成する粉末供給制御スイツチ(図示しない)を備
えた溶射ガンであつて、直流電力及び窒素と水素
等のプラズマガスさらには冷却水が投入され、そ
の噴射口1aからプラズマ焔Fを噴射するように
構成され、同噴射口1aの先端部には噴射口1a
とほぼ直角状に位置された粉末噴射ノズル2がブ
ラケツト3を介して取付けられている。また、プ
ラズマ溶射装置の一つを構成する、例えばセラミ
ツク等の溶射すべき粉末材料Wを供給する供給手
段4は、該粉末材料Wを収容するホツパ5と、同
ホツパ5の出口側に装着された供給量調節装置6
と、該ホツパ5内の粉末材料Wを搬送するガスを
供給する搬送ガス供給装置7とから構成されてい
て、前記ホツパ5の出口側は前記溶射ガン1の粉
末噴射ノズル2側にホース等の供給路8を介して
接続されている。しかして、ホツパ5内の粉末材
料Wは溶射動作に伴なつてプラズマ溶射装置のメ
インスイツチ(図示しない)の「オン」「オフ」
によりそれぞれ制御駆動される搬送ガス供給装置
7による搬送ガスにより供給量調節装置6で設定
された量づつ供給路8内に供給されるものであ
る。
(Embodiment) Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the figure, 1 is a thermal spray gun equipped with a powder supply control switch (not shown) constituting one of the plasma spraying apparatuses. Then, DC power, plasma gas such as nitrogen and hydrogen, and cooling water are injected, and the plasma flame F is injected from the injection port 1a.
A powder injection nozzle 2 is mounted via a bracket 3, which is positioned substantially perpendicular to the powder injection nozzle. Further, a supply means 4 for supplying a powder material W to be thermally sprayed, such as ceramic, which constitutes one of the plasma spraying apparatuses, is attached to a hopper 5 that accommodates the powder material W and to the exit side of the hopper 5. supply amount adjustment device 6
and a carrier gas supply device 7 that supplies gas to transport the powder material W in the hopper 5, and the outlet side of the hopper 5 is connected to the powder injection nozzle 2 side of the thermal spray gun 1 by a hose or the like. They are connected via a supply path 8. Accordingly, the powder material W in the hopper 5 is turned on and off by the main switch (not shown) of the plasma spraying apparatus during the spraying operation.
The carrier gas is supplied into the supply path 8 by the carrier gas by the carrier gas supply device 7 controlled and driven by the carrier gas in the amount set by the supply amount adjusting device 6.

前記供給路8には2位置3ポート形式に構成さ
れた切換弁9が組込まれており、この切換弁9は
前記溶射ガン1の粉末噴射ノズル2の近傍のブラ
ケツト3上部に対して取付け固定され、その入口
側のポートaは前記供給路8と連通され、また出
口側の一方のポートbは前記粉末噴射ノズル2と
連通されかつ他方のポートcは前記供給手段4の
ホツパ5に連通する戻し通路10と連通されてい
る。なお、切換弁9は前記溶射ガン1の溶射動作
に伴なつて該溶射ガン1に備えた粉末供給制御ス
イツチの「オン」「オフ」により制御されるエア
によつて動作される複動シリンダにより切換動作
がなされるように構成されている。しかして、前
記溶射ガン1の溶射動作に伴なつて切換弁9が切
換制御され、この切換弁9は溶射時に供給路8と
粉末噴射ノズル2との連通を許容し、非溶射時に
同供給路8と粉末噴射ノズル2との連通を遮断し
て供給路8と戻し通路10との連通を許容するも
のである。
A switching valve 9 configured in a 2-position, 3-port type is incorporated in the supply path 8, and this switching valve 9 is mounted and fixed to the upper part of the bracket 3 near the powder injection nozzle 2 of the thermal spray gun 1. , the port a on the inlet side communicates with the supply path 8, one port b on the outlet side communicates with the powder injection nozzle 2, and the other port c communicates with the hopper 5 of the supply means 4. It communicates with the passage 10. The switching valve 9 is a double-acting cylinder operated by air, which is controlled by turning on or off a powder supply control switch provided in the thermal spraying gun 1 as the thermal spraying gun 1 sprays. The switching operation is configured to be performed. As the thermal spraying operation of the thermal spraying gun 1 is carried out, the switching valve 9 is controlled to switch, and this switching valve 9 allows communication between the supply passage 8 and the powder injection nozzle 2 during thermal spraying, and allows communication between the supply passage 8 and the powder injection nozzle 2 during non-thermal spraying. 8 and the powder injection nozzle 2, while allowing communication between the supply path 8 and the return path 10.

本実施例は上述のように構成したものであり、
さて、プラズマ溶射作業において、プラズマ溶射
装置におけるメインスイツチ(図示しない)を
「オン」すると、これにより供給量調節装置6及
び搬送ガス供給装置7が駆動されるので、供給手
段4のホツパ5内の粉末材料Wは、この搬送ガス
供給装置7による搬送ガスによつて、前記供給量
調節装置6で設定された定量づつ常に供給路8内
に供給されている。そこで、溶射ガン1による溶
射動作を開始すると、この溶射時に作動される粉
末供給制御スイツチの「オン」動作により制御さ
れるエアによつて動作される複動シリンダにより
切換弁9が切換制御されて供給路8と粉末噴射ノ
ズル2とが連通されるため、該供給路8内の粉末
材料Wは、前記供給量調節装置6で設定された定
量づつ前記搬送ガス供給装置7による搬送ガスに
よつて、溶射ガン1の粉末噴射ノズル2内に供給
される(第2図イ参照)。そして、粉末材料Wが
該粉末噴射ノズル2から溶射ガン1の噴射口1a
の前部近傍に噴射供給される。一方、溶射ガン1
には直流電力及びプラズマガスさらには冷却水が
投入されていて、その噴射口1aからプラズマ焔
Fが噴射されているので、このプラズマ焔Fの噴
射によつて前記溶射ガン1の噴射口1aの前部近
傍に噴射供給された粉末材料Wを母材(図示しな
い)に溶射するものである。
This embodiment is configured as described above,
Now, in the plasma spraying operation, when the main switch (not shown) in the plasma spraying apparatus is turned on, the supply amount adjusting device 6 and the carrier gas supplying device 7 are driven. The powder material W is constantly supplied into the supply path 8 by the carrier gas from the carrier gas supply device 7 in a constant amount set by the supply amount adjusting device 6. Therefore, when the thermal spraying operation by the thermal spraying gun 1 is started, the switching valve 9 is switched and controlled by a double-acting cylinder operated by air controlled by the "on" operation of the powder supply control switch activated during thermal spraying. Since the supply path 8 and the powder injection nozzle 2 are communicated with each other, the powder material W in the supply path 8 is fed by the carrier gas by the carrier gas supply device 7 at a constant rate set by the supply amount adjusting device 6. , is supplied into the powder injection nozzle 2 of the thermal spray gun 1 (see FIG. 2A). Then, the powder material W is transferred from the powder injection nozzle 2 to the injection port 1a of the thermal spray gun 1.
is injected near the front of the On the other hand, thermal spray gun 1
DC power, plasma gas, and even cooling water are injected into the , and plasma flame F is injected from the injection port 1 a of the thermal spray gun 1 . The powder material W that is sprayed and supplied near the front part is thermally sprayed onto a base material (not shown).

上記のようにして所望のプラズマ溶射行ない、
しかる後、その作業を停止すべく粉末供給制御ス
イツチを「オフ」動作すると、この動作(非溶射
時)により制御されるエアによつて動作される複
動シリンダにより切換弁9が前述とは逆に切換制
御されて同供給路8と粉末噴射ノズル2との連通
を遮断して供給路8と戻し通路10とが連通され
るため、同供給路8内の粉末材料Wは粉末噴射ノ
ズル2へ供給されることなく、戻し通路10を経
て前記供給手段4のホツパ5内に戻されるもので
ある。(第2図ロ参照) この粉末材料Wの戻し動作は前記溶射ガン1の
非溶射時において、供給量調節装置6及び搬送ガ
ス供給装置7が駆動されている間行なわれて、次
の溶射に対応するものである。
Perform the desired plasma spraying as described above,
After that, when the powder supply control switch is turned "off" to stop the operation, the double-acting cylinder operated by the air controlled by this operation (when not thermal spraying) turns the switching valve 9 in the opposite direction as described above. The switching control is performed to cut off the communication between the supply path 8 and the powder injection nozzle 2 and to connect the supply path 8 and the return path 10, so that the powder material W in the supply path 8 is transferred to the powder injection nozzle 2. It is returned to the hopper 5 of the supply means 4 via the return passage 10 without being supplied. (See Figure 2B) This return operation of the powder material W is performed while the supply amount adjusting device 6 and the carrier gas supply device 7 are being driven when the thermal spray gun 1 is not spraying, and is carried out for the next thermal spraying. It corresponds to this.

なお、本実施例は戻し通路10を供給手段4の
ホツパ5内に連通させた場合について説明した
が、これにかえて、別の貯溜タンク(図示しな
い)に連通させる構成としてもよい。
In this embodiment, a case has been described in which the return passage 10 is communicated with the hopper 5 of the supply means 4, but instead of this, a configuration may be adopted in which the return passage 10 is communicated with another storage tank (not shown).

(発明の効果) 以上詳述したように、本発明は、プラズマ焔を
噴射する噴射口及び該噴射口付近に粉末噴射ノズ
ルを設けた溶射ガンと、溶射すべき粉末材料を前
記溶射ガンの粉末噴射ノズルに供給する手段とよ
りなり、前記粉末材料を前記溶射ガンの粉末噴射
ノズルに供給して母材に溶射するプラズマ溶射装
置において、前記粉末材料の供給手段と前記溶射
ガンの粉末噴射ノズルとを接続する粉末材料の供
給路に対し、該粉末噴射ノズルの近傍に切換弁を
組込み、この切換弁は前記供給路から前記粉末噴
射ノズルへの連通を許す通路と、該通路を遮断し
て前記供給手段側または別の貯溜タンクへ戻す通
路とを形成して非溶射時には前記供給路内の粉末
材料の流通を許容するように前記溶射ガンの溶射
動作に連繋して切換制御したものであるから、従
来のものと異なり、非溶射時における供給手段側
と粉末噴射ノズルとの間に残留する粉末材料を無
くすることができるので、溶射時ごとに対応して
常に粉末材料の定量供給を図ることができるとと
もに、溶射開始に伴なう瞬時的な供給に確実かつ
円滑に対応することができる。
(Effects of the Invention) As described in detail above, the present invention provides a thermal spray gun having an injection port for ejecting plasma flame and a powder injection nozzle near the injection port, and a powder material to be sprayed in the powder of the thermal spray gun. In a plasma spraying apparatus comprising a means for supplying the powder material to a spray nozzle, the powder material is supplied to the powder spray nozzle of the thermal spray gun for thermal spraying onto a base material, the supply means for the powder material and the powder spray nozzle of the thermal spray gun; A switching valve is installed in the vicinity of the powder injection nozzle for a powder material supply path that connects the This is because switching control is performed in conjunction with the thermal spraying operation of the thermal spray gun to form a passage that returns to the supply means side or to another storage tank, and to allow the flow of the powder material within the supply passage during non-thermal spraying. Unlike conventional methods, it is possible to eliminate powder material remaining between the supply means side and the powder injection nozzle during non-thermal spraying, so it is possible to always supply a fixed amount of powder material for each thermal spraying operation. At the same time, it is possible to reliably and smoothly respond to the instantaneous supply associated with the start of thermal spraying.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の一実施例を示し、第1図は供給回
路を含む要部の断面図、第2図イ,ロ,ハは溶射
動作と粉末材料の供給関係を示す説明図である。 1……溶射ガン、1a……噴射口、2……粉末
噴射ノズル、4……供給手段、8……供給路、9
……切換弁、10……戻し通路、W……粉末材
料。
The drawings show one embodiment of the present invention, in which FIG. 1 is a cross-sectional view of the main parts including the supply circuit, and FIGS. DESCRIPTION OF SYMBOLS 1... Thermal spray gun, 1a... Injection port, 2... Powder injection nozzle, 4... Supply means, 8... Supply path, 9
...Switching valve, 10...Return passage, W...Powder material.

Claims (1)

【特許請求の範囲】[Claims] 1 プラズマ焔を噴射する噴射口及び該噴射口付
近に粉末噴射ノズルを設けた溶射ガンと、溶射す
べき粉末材料を前記溶射ガンの粉末噴射ノズルに
供給する手段とよりなり、前記粉末材料を前記溶
射ガンの粉末噴射ノズルに供給して母材に溶射す
るプラズマ溶射装置において、前記粉末材料の供
給手段と前記溶射ガンの粉末噴射ノズルとを接続
する粉末材料の供給路に対し、該粉末噴射ノズル
の近傍に切換弁を組込み、この切換弁は前記供給
路から前記粉末噴射ノズルへの連通を許す通路
と、該通路を遮断して前記供給手段側または別の
貯溜タンクへ戻す通路とを形成して非溶射時には
前記供給路内の粉末材料の流通を許容するように
前記溶射ガンの溶射動作に連繋して切換制御され
ることを特徴とするプラズマ溶射装置における粉
末材料の供給制御装置。
1 A thermal spray gun having an injection port for ejecting plasma flame and a powder injection nozzle near the injection port, and a means for supplying powder material to be sprayed to the powder injection nozzle of the thermal spray gun, In a plasma spraying apparatus that supplies a powder to a powder injection nozzle of a thermal spray gun to spray the base material, a powder injection nozzle is connected to a powder material supply path that connects the powder material supply means and the powder injection nozzle of the thermal spray gun. A switching valve is installed near the powder injection nozzle, and the switching valve forms a passage that allows communication from the supply passage to the powder injection nozzle, and a passage that blocks the passage and returns to the supply means side or another storage tank. A supply control device for powder material in a plasma spraying apparatus, characterized in that switching control is performed in conjunction with the thermal spraying operation of the thermal spray gun so as to allow the flow of the powder material in the supply path during non-thermal spraying.
JP12774286A 1986-06-02 1986-06-02 Apparatus for controlling supply of powdery material in plasma spraying apparatus Granted JPS631474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12774286A JPS631474A (en) 1986-06-02 1986-06-02 Apparatus for controlling supply of powdery material in plasma spraying apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12774286A JPS631474A (en) 1986-06-02 1986-06-02 Apparatus for controlling supply of powdery material in plasma spraying apparatus

Publications (2)

Publication Number Publication Date
JPS631474A JPS631474A (en) 1988-01-06
JPH0459943B2 true JPH0459943B2 (en) 1992-09-24

Family

ID=14967558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12774286A Granted JPS631474A (en) 1986-06-02 1986-06-02 Apparatus for controlling supply of powdery material in plasma spraying apparatus

Country Status (1)

Country Link
JP (1) JPS631474A (en)

Also Published As

Publication number Publication date
JPS631474A (en) 1988-01-06

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