JPH0459947U - - Google Patents
Info
- Publication number
- JPH0459947U JPH0459947U JP10396090U JP10396090U JPH0459947U JP H0459947 U JPH0459947 U JP H0459947U JP 10396090 U JP10396090 U JP 10396090U JP 10396090 U JP10396090 U JP 10396090U JP H0459947 U JPH0459947 U JP H0459947U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- main surface
- stopper
- detached
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例のＩＣパツケージを
示す斜視図、第２図は第１図のストツパを示す斜
視図である。 １，２……リード、３……セラミツクキヤツプ
、６，６′……ストツパ、９，９′……ねじ。
示す斜視図、第２図は第１図のストツパを示す斜
視図である。 １，２……リード、３……セラミツクキヤツプ
、６，６′……ストツパ、９，９′……ねじ。
Claims (1)
- 半導体集積回路素子を内蔵した絶縁性パツケー
ジの主表面上の開口部を覆うセラミツクキヤツプ
を設け、前記キヤツプが脱着できるように前記キ
ヤツプを前記主表面に固定するストツパを設けた
ことを特徴とするＩＣパツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10396090U JPH0459947U (ja) | 1990-10-01 | 1990-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10396090U JPH0459947U (ja) | 1990-10-01 | 1990-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459947U true JPH0459947U (ja) | 1992-05-22 |
Family
ID=31849046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10396090U Pending JPH0459947U (ja) | 1990-10-01 | 1990-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459947U (ja) |
-
1990
- 1990-10-01 JP JP10396090U patent/JPH0459947U/ja active Pending