JPH0262737U - - Google Patents
Info
- Publication number
- JPH0262737U JPH0262737U JP14208788U JP14208788U JPH0262737U JP H0262737 U JPH0262737 U JP H0262737U JP 14208788 U JP14208788 U JP 14208788U JP 14208788 U JP14208788 U JP 14208788U JP H0262737 U JPH0262737 U JP H0262737U
- Authority
- JP
- Japan
- Prior art keywords
- reference piece
- package body
- recognized
- exposed
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図は
その平面図、第３図は内部構造の平面図である。 １…半導体チツプ、２，２Ａ…リード、３…パ
ツケージ本体、４…基準片。
その平面図、第３図は内部構造の平面図である。 １…半導体チツプ、２，２Ａ…リード、３…パ
ツケージ本体、４…基準片。
Claims (1)
- 半導体チツプと共にパツケージ本体内に封止さ
れるリードの一部に基準片を設け、この基準片を
前記パツケージ本体の一部から露出させて認識可
能に構成したことを特徴とする基準片付半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14208788U JPH0262737U (ja) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14208788U JPH0262737U (ja) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262737U true JPH0262737U (ja) | 1990-05-10 |
Family
ID=31407732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14208788U Pending JPH0262737U (ja) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262737U (ja) |
-
1988
- 1988-10-31 JP JP14208788U patent/JPH0262737U/ja active Pending