JPH0460908A - Production of alloy magnetic thin film laminated body - Google Patents
Production of alloy magnetic thin film laminated bodyInfo
- Publication number
- JPH0460908A JPH0460908A JP16773490A JP16773490A JPH0460908A JP H0460908 A JPH0460908 A JP H0460908A JP 16773490 A JP16773490 A JP 16773490A JP 16773490 A JP16773490 A JP 16773490A JP H0460908 A JPH0460908 A JP H0460908A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- magnetic thin
- magnetic
- alloy magnetic
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000956 alloy Substances 0.000 title claims abstract description 28
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 28
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000010408 film Substances 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 239000011521 glass Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 9
- 229910018125 Al-Si Inorganic materials 0.000 claims abstract 2
- 229910018520 Al—Si Inorganic materials 0.000 claims abstract 2
- 238000003475 lamination Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 6
- 230000035882 stress Effects 0.000 abstract description 5
- 238000005304 joining Methods 0.000 abstract description 2
- 230000008646 thermal stress Effects 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 230000008602 contraction Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＶＴＲ等に使用される磁気へ・ラドコアの製造
工程に関し、特に合金薄膜積層型ヘッドの特性向上に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a manufacturing process for magnetic rad cores used in VTRs and the like, and particularly to improving the characteristics of an alloy thin film laminated head.
従来の合金薄膜積層型ヘッドの製造工程を第４図（Ａ）
〜（Ｍ）によって説明する。以下、この項で記す（Ａ）
〜（Ｍ）は第４図（Ａ）〜（Ｍ）の意味である。Figure 4 (A) shows the manufacturing process of a conventional alloy thin film laminated head.
This will be explained by ~(M). Hereinafter, it will be described in this section (A)
-(M) have the meanings of FIGS. 4(A)-(M).
まず、非磁性基板１を用意する。（Ａ）０次に非磁性基
板 Ｉの片面に合金磁性薄膜（例えばセンダスト合金）
２をスパッタリング等の方法によって形成する。（Ｂ）
、 このとき高周波特性をよくするために、絶縁層３
を介した多層構造にする。つぎに、この上にさらに低融
点ガラスＡ４をスパッタリング等の方法で被着させる。First, a nonmagnetic substrate 1 is prepared. (A) An alloy magnetic thin film (e.g. Sendust alloy) on one side of the zero-order non-magnetic substrate I
2 is formed by a method such as sputtering. (B)
, At this time, in order to improve high frequency characteristics, the insulating layer 3
Create a multilayer structure through Next, low melting point glass A4 is further deposited on top of this by a method such as sputtering.
（Ｃ）。(C).
こうしてつくられた基板１θ、１０，１０．・・・・を
重ね合わせた状態で溶着治具（図示せず）により基板の
厚さ方向に加圧したまま熱処理炉中で加熱し、低融点ガ
ラスＡによって接合された合金磁性薄膜積層体１２を得
る。（Ｄ）、 この合金磁性薄膜積層体１２を線分２
０．２０．２０・・・および線分２１．２１ 。The thus made substrates 1θ, 10, 10. The alloy magnetic thin film laminate 12 is heated in a heat treatment furnace while being pressed in the thickness direction of the substrate with a welding jig (not shown) and bonded with low melting point glass A. get. (D), this alloy magnetic thin film laminate 12 is divided into line segments 2
0.20.20... and line segment 21.21.
２１・・・で示す位置で切断しくＥ）積層バー１３Ａ。21... E) Laminated bar 13A.
１３Ｂ、を得る。（Ｆ）、積層バー１３Ａ、１３Ｂに溝
１４．１５を形成しくＧ）、ギャップ形成面１ｅＡ 、
ＩＧＢを研磨する。（Ｈ）、つぎに、研磨面にギャッ
プスペーサとして５１０２膜（図示せず）をスパッタリ
ングで成膜する。この積層バー１３Ａ、１３Ｂの成膜面
を突き合わせて合金磁性薄膜の位置を合わせて、溶着治
具（図示せず）により固定し、低融点ガラスＢ６を載せ
て（Ｉ）、熱処理炉中で加熱接合しヘッドバー１７を得
る。（Ｊ）、続いて、ヘッドバーの先端部分１８を曲面
に研磨 （Ｋ）。13B is obtained. (F), grooves 14.15 are formed in the laminated bars 13A and 13B; G), gap forming surface 1eA;
Polish the IGB. (H) Next, a 5102 film (not shown) is formed as a gap spacer on the polished surface by sputtering. The film-formed surfaces of the laminated bars 13A and 13B are butted against each other to align the alloy magnetic thin film, fixed with a welding jig (not shown), placed with low melting point glass B6 (I), and heated in a heat treatment furnace. The head bar 17 is obtained by joining. (J), then polish the tip portion 18 of the head bar into a curved surface (K).
した後、２２，２２，２２．・・・で示す位置でスライ
スして（Ｌ）、ヘッドチップエ９が完成する。（Ｍ）。After that, 22, 22, 22. The head chip 9 is completed by slicing at the positions indicated by (L). (M).
合金磁性薄膜は単に成膜しただけでは良好な磁気特性を
示さず、−膜内には所定の条件で熱処理を行うことで、
特性が発揮される。基板の積層接合には、上記の様に低
融点ガラスを用いる方法があり、接合時にはガラスが軟
化する温度まで加熱を行う。この加熱条件はガラスを適
切に選択することで、合金磁性薄膜の熱処理条件と合わ
せることができ、−度の加熱で接合と膜の熱処理を同時
に済ませることができる。このとき膜の体積は収縮する
傾向にあり、その結果基板には反りが生ずる。An alloy magnetic thin film does not exhibit good magnetic properties simply by forming it, but by heat-treating the inside of the film under predetermined conditions,
Characteristics are demonstrated. As described above, there is a method of laminating and bonding substrates using low-melting glass, and during bonding, heating is performed to a temperature at which the glass softens. By appropriately selecting the glass, these heating conditions can be matched with the heat treatment conditions for the alloy magnetic thin film, and bonding and film heat treatment can be completed at the same time with -degree heating. At this time, the volume of the film tends to shrink, and as a result, the substrate warps.
ところが、合金磁性薄膜積層体を作る工程においては、
治具等によって磁性膜が拘束された状態で熱処理される
ことになる。すなわち、合金磁性薄膜を形成し低融点ガ
ラスを表裏に被着させた基板を重ね合わせて、溶着治具
によって基板の厚さ方向に圧力をかけそれぞれの基板を
密着させ、その状態で熱処理を行なう 一方、非磁性
基板と磁性薄膜の熱膨張差および、磁性薄膜の体積収縮
は基板の反りとなっ、て現われる。このため、これらを
治具で加圧することは磁性膜の変形を拘束することにな
る。この状態では加圧力に加えて非磁性基板と磁性膜の
熱膨張差による熱応力、さらには磁性膜の体積収縮に伴
う応力変化が同時に加わった状態で加熱されるために、
磁性膜の良好な磁気特性が発揮されず、結果としてヘッ
ドの特性が悪くなるという問題があった。However, in the process of making an alloy magnetic thin film laminate,
The magnetic film is subjected to heat treatment while being restrained by a jig or the like. In other words, substrates on which an alloy magnetic thin film is formed and low-melting point glass is coated on the front and back are stacked together, pressure is applied in the thickness direction of the substrates using a welding jig to bring them into close contact, and heat treatment is performed in this state. On the other hand, the difference in thermal expansion between the nonmagnetic substrate and the magnetic thin film and the volumetric contraction of the magnetic thin film result in warpage of the substrate. For this reason, pressing these with a jig will restrict the deformation of the magnetic film. In this state, in addition to the pressurizing force, thermal stress due to the difference in thermal expansion between the non-magnetic substrate and the magnetic film, and stress changes due to the volumetric contraction of the magnetic film are applied at the same time.
There is a problem in that the magnetic film does not exhibit good magnetic properties, resulting in poor head properties.
そこで、本発明では非磁性基板上に合金磁性薄膜を形成
した後、外部から応力のかからない状態で熱処理し所望
の磁気特性を得た後に、低融点ガラス等によって接合す
る。Therefore, in the present invention, after an alloy magnetic thin film is formed on a non-magnetic substrate, it is heat-treated in a state where no stress is applied from the outside to obtain desired magnetic properties, and then bonded using a low-melting point glass or the like.
予め、外部からの例えば、溶着治具による加圧という拘
束のない状態で熱処理を行っているために、良好な磁気
特性を得ることができその後の接合処理においても特性
の劣化が少ない。従って、本発明の製造方法を用いれば
従来よりも磁気ヘッドの特性向上が実現できる。Since the heat treatment is performed in advance without being constrained by external pressure, for example, by a welding jig, good magnetic properties can be obtained and there is little deterioration in the properties during the subsequent bonding process. Therefore, by using the manufacturing method of the present invention, it is possible to improve the characteristics of the magnetic head compared to the conventional method.
以下、工程図である第１図を参照しながら本発明の一実
施例を説明する。従来との比較を容易にするため従来例
の工程図を第３図に示す。An embodiment of the present invention will be described below with reference to FIG. 1 which is a process diagram. In order to facilitate comparison with the conventional method, a process diagram of the conventional example is shown in FIG.
非磁性基板上にＦｅ−Ａｌ−５ｉを主成分とする合金磁
性薄膜と絶縁体膜を交互にをスパッタリングにより形成
する。（■）、その後、熱処理炉中で加熱し合金磁性薄
膜の特性を出すための熱処理を行う。（■）、そして、
スパッタリングによって低融点ガラスを成膜（（ＩＩＩ
）、）ｌ、た基板を積層して溶着治具で固定し、熱処理
炉で加熱することでガラスを溶融させ接合する。（■）
。An alloy magnetic thin film containing Fe-Al-5i as a main component and an insulating film are alternately formed on a nonmagnetic substrate by sputtering. (■) Then, heat treatment is performed in a heat treatment furnace to bring out the characteristics of the alloy magnetic thin film. (■), and
A film of low melting point glass is formed by sputtering ((III
), )l, laminated substrates are stacked and fixed with a welding jig, and heated in a heat treatment furnace to melt the glass and join them. (■)
.
また、別の実施例として合金磁性薄膜を形成した後、ス
パッタリング装置内でそのまま加熱を行い熱処理を行い
、続いて低融点ガラスをスパッタリングする方法も可能
である。この場合には基板の積層接合直前まで真空状態
を破ることなく作業ができるために、基板へのゴミの付
着、汚染がきわめて少ない状態を保つことができる。As another example, it is also possible to form an alloy magnetic thin film and then heat it in a sputtering apparatus to perform heat treatment, and then sputter a low melting point glass. In this case, since the work can be carried out without breaking the vacuum state until just before the substrates are stacked and bonded, it is possible to maintain a state in which the adhesion of dust and contamination to the substrates is extremely low.
本発明の工程により製造した合金磁性薄膜積層体の透磁
率の周波数特性を従来の工程で製造した場合と比較して
第２図に示す。The frequency characteristics of the magnetic permeability of the alloy magnetic thin film laminate manufactured by the process of the present invention are shown in FIG. 2 in comparison with those manufactured by the conventional process.
以上の説明およびデータから明らかなように、本発明の
製造方法によれば、磁性膜の特性が従来に比べて向上す
るためにＶＴＲ用磁気ヘッド、高密度ディスク装置用ヘ
ッド等に応用することで電磁変換特性の向上が期待でき
る。また接合後の合金磁性膜および基板の残留応力が低
減されるため一〇−
に、特に、合金磁性膜の膜厚が厚い場合に問題であった
、接合後の基板のクラックも低減されるために歩留の向
上にも貢献する。As is clear from the above explanation and data, according to the manufacturing method of the present invention, the characteristics of the magnetic film are improved compared to conventional ones, so that it can be applied to magnetic heads for VTRs, heads for high-density disk drives, etc. Improvements in electromagnetic conversion characteristics can be expected. In addition, residual stress in the alloy magnetic film and substrate after bonding is reduced, and cracks in the substrate after bonding, which were a problem especially when the thickness of the alloy magnetic film was thick, are also reduced. This also contributes to improved yield.
第１図、は本発明による工程図、第２図は本発明と従来
例による合金磁性薄膜積層体の透磁率の周波数特性を示
すグラフ、第３図は従来例による工程図、第４図は合金
薄膜積層型ヘッドの製造工程を説明するための斜視図で
ある。
Ｉ・・・非磁性基板、
２・・・合金磁性薄膜、
４・・・低融点ガラスＡ１
１２・・・合金磁性薄膜積層体、
１３Ａ、Ｂ・・・積属バー
１７・・・ヘッドバー
本発明の工程図
第
図
従来の工程図
第
図
（Ａ）
第
図
＜Ｄ＞
（Ｅ）FIG. 1 is a process diagram according to the present invention, FIG. 2 is a graph showing the frequency characteristics of magnetic permeability of alloy magnetic thin film laminates according to the present invention and a conventional example, FIG. 3 is a process diagram according to a conventional example, and FIG. FIG. 3 is a perspective view for explaining the manufacturing process of the alloy thin film laminated head. I...Nonmagnetic substrate, 2...Alloy magnetic thin film, 4...Low melting point glass A1 12...Alloy magnetic thin film laminate, 13A, B...Stacking bar 17...Head bar book Process diagram of the invention Diagram of the conventional process diagram Diagram (A) Diagram <D> (E)
Claims (1)
性薄膜と、絶縁体膜を交互に積層形成し、５００℃〜８
００℃の熱処理によって所望する軟磁気特性を得た後に
、上記熱処理温度よりも低い温度で低融点ガラスにより
積層接合することを特徴とする、合金磁性薄膜積層体の
製造方法An alloy magnetic thin film mainly composed of Fe-Al-Si and an insulating film are alternately laminated on a non-magnetic substrate, and heated at 500°C to 8°C.
A method for manufacturing an alloy magnetic thin film laminate, characterized in that after obtaining desired soft magnetic properties by heat treatment at 00°C, lamination and bonding are performed using low melting point glass at a temperature lower than the above heat treatment temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16773490A JP2874787B2 (en) | 1990-06-25 | 1990-06-25 | Manufacturing method of alloy magnetic thin film laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16773490A JP2874787B2 (en) | 1990-06-25 | 1990-06-25 | Manufacturing method of alloy magnetic thin film laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0460908A true JPH0460908A (en) | 1992-02-26 |
| JP2874787B2 JP2874787B2 (en) | 1999-03-24 |
Family
ID=15855152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16773490A Expired - Lifetime JP2874787B2 (en) | 1990-06-25 | 1990-06-25 | Manufacturing method of alloy magnetic thin film laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2874787B2 (en) |
-
1990
- 1990-06-25 JP JP16773490A patent/JP2874787B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2874787B2 (en) | 1999-03-24 |
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