JPH046095B2 - - Google Patents

Description

[Detailed description of the invention] [Technical field to which the invention pertains]

The present invention relates to a semiconductor device, such as a diode bridge or thyristor module, in which a semiconductor element is housed in a container consisting of a thermally conductive bottom plate and an insulating side frame, and the element is fixed on the bottom plate.

[Prior art and its problems]

FIG. 2 shows a conventional semiconductor device as described above, in which an insulating plate 3 is fixed on a heat dissipating bottom plate 1 with solder 9, and a heat sink 4 and a semiconductor chip 5 are placed on top of the insulating plate 3.
are respectively brazed with solder 9, and further, a lead wire 6 is soldered to the chip electrode, and a terminal conductor 7 is brazed to the lead wire with solder 9, respectively. Although only one element is shown in the figure, similar steps are performed for a plurality of elements in a composite semiconductor device. After this, the insulating side frame 2 is fixed on the bottom plate 1, and the casting resin 8 is
to coat the semiconductor chip. However, when assembling such a semiconductor device, a jig is required to position each component during brazing, making the process complicated. In addition, in order to avoid the influence of the casting resin on the semiconductor chip, glass packaging is required on the chip surface, which is expensive and
For high-voltage elements of 2000V or more, sufficient stability cannot be obtained by itself.

[Purpose of the invention]

The present invention solves the above-mentioned problems, is easy to assemble, can hermetically close the container, and has surface stabilization using bonding coating resin (JCR), which is used in conventionally manufactured hermetically sealed semiconductor devices. The object of the present invention is to provide a semiconductor device that can also use a chip made of chips.

[Key points of the invention]

In the semiconductor device according to the present invention, a side frame made of a heat-resistant insulator integrated with a bottom part having a protrusion for positioning the semiconductor element on a heat-conducting bottom plate is fixed by the bottom part, and an upper part of the side frame is airtight. The terminal conductor connected to the semiconductor element passes through the cover plate and is airtightly brazed to the area around the through hole in the cover plate. Since the container, including the bottom part, is made of heat-resistant material, it can be used as a positioning jig when brazing the semiconductor element substrate.Also, since the semiconductor element is hermetically sealed inside the container, high pressure resistance can be achieved by filling it with gas. The above purpose can be achieved.

[Embodiments of the invention]

FIG. 1 shows an embodiment of the present invention, and parts common to those in FIG. 2 are given the same reference numerals. In this semiconductor device, the side frame 2 is made of a material such as ceramic that is heat resistant to 300° C. or higher, and is further integrated with the bottom portion 21. This bottom part serves as the insulating plate 3 of the conventional device shown in FIG. 2, and also has a convex part 10 on the top part, which is useful for positioning the heat sink 4 fixed to the top surface by solder 9. Soldering can be done simply by charging the soldering device into the furnace, and there is no need to remove the jig after soldering. FIG. 1b shows a lid plate 11 according to the invention, which is made of ceramic, for example, and has a metallized part 31 on the periphery. This cover plate is placed over the side frame, and the metallized part 31 and the metallized part 32 provided on the upper edge of the side frame 2 are hermetically soldered. At the same time, the terminal conductor 7 connected to the semiconductor chip 5 on the heat sink 4 via the lead wire 6 is passed through the through hole 12 of the cover plate 11, and the metallized portion 33 provided around the through hole and the conductor 7 are made airtight by soldering. braze. The bottom part 21 of the side frame is fixed to the heat dissipating bottom plate 1 with good thermal conductivity by adhesive or the like. Thereby, the semiconductor element is hermetically sealed in the container consisting of the side frame 2, the bottom part 21, and the lid plate 11. Therefore, it is possible to fill gas therein, and with the semiconductor chip 5 whose surface is stabilized by JCR, a withstand voltage of 2000V or more can be obtained.

【Effect of the invention】

According to the present invention, by using the lower part of the container made of a heat-resistant insulating material, the insulating plate between the semiconductor element and the heat dissipation bottom plate can be omitted, and since it is heat-resistant, it is possible to use a positioning jig when brazing the semiconductor element. Also useful. By using a lid plate that can be airtightly connected to the lower part of the container by brazing, gas sealing similar to that of a hermetic sealing element is possible, and the mesa-shaped chip with JCR stabilization treatment also provides a semiconductor with high withstand voltage characteristics. You can get the equipment at a low price.

[Brief explanation of drawings]

FIG. 1 shows an embodiment of the present invention, in which a is a partially exploded perspective view, b is a perspective view of a lid plate, and FIG. 2 is a perspective view of a conventional example. 1: Bottom plate, 2: Side frame, 3: Insulating bottom, 4: Heat sink, 5: Semiconductor chip, 6: Lead wire,
7: Terminal conductor, 9: Solder, 10: Positioning protrusion, 11: Cover plate, 12: Through hole, 31, 32, 3
3: Metallization part.

Claims (1)

[Claims] 1. A container that houses a semiconductor device in a container consisting of a thermally conductive bottom plate and an insulating side frame, and insulates and fixes the device on the bottom plate, which is integrated with the bottom having a protrusion for positioning the semiconductor device. A side frame made of a heat-resistant insulator is fixed to the bottom plate by the bottom part, and the upper part of the side frame is closed by an insulating cover plate that is brazed to the top of the side frame, and the terminal conductor connected to the semiconductor element is connected to the cover plate. A semiconductor device that penetrates a plate and is airtightly brazed to the periphery of a through hole of a cover plate.