JPH0461175A - Photo-coupler device - Google Patents
Photo-coupler deviceInfo
- Publication number
- JPH0461175A JPH0461175A JP2165194A JP16519490A JPH0461175A JP H0461175 A JPH0461175 A JP H0461175A JP 2165194 A JP2165194 A JP 2165194A JP 16519490 A JP16519490 A JP 16519490A JP H0461175 A JPH0461175 A JP H0461175A
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- light emitting
- solder
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電気信す入力側に発光素子を接続Ｉ、電気信
号入力端に受光素子を接続し１、電気信号入力端と電気
１７３号出力側を光学的に結合［、て信づを伝達する装
置、すなわち、フォトカッシラ装置に関するものである
。[Detailed Description of the Invention] [Industrial Application Field] The present invention connects a light emitting element to the electrical signal input side, connects a light receiving element to the electrical signal input terminal, and connects the electrical signal input terminal to the electrical signal input terminal. It relates to a device that transmits signals by optically coupling the output side, that is, a photocassillary device.
１従来の技術］
複数台の訓算機・端末を不、トワーク化するにあだ、っ
では、装置百聞の電気的−′ｆルや伝送路から装置への
電気雑音侵入か問題となる。フ第１・カップラ装置こ゛
は、入力された電気信号は入力側で光信号に変換され、
光学的な結合１．″より電気缶弓出力側に伝達されるた
め、化け入出力の間は電気的に完全分離さ４］る１、従
〕で、フォトカップラ装置を計ｐ機等の電気信号入力端
に設置ずれば、」−述１、た電気的干渉や雑音侵入の間
８を解決”４る有効な手段となる。1. Prior Art] When a plurality of computer computers/terminals are networked, the problem arises as to whether electrical noise intrudes into the equipment from the electrical noise of the equipment or from the transmission line. The first coupler device converts the input electrical signal into an optical signal on the input side,
Optical coupling 1. Since the signal is transmitted to the output side of the electric can, there is complete electrical separation between input and output. This is an effective means for solving the problem of electrical interference and noise intrusion.
第ｈｏｔｅｌは、ｔＮ来のフォ）・カップラ装置の−・
例である１、第１０図中、１は受光素子、２は受光部、
３は発光素子、４は発光部、９ａ、９ｈ）はリー ドフ
し一ムである。受！素子１ ｉ；ｔ ’） ＝ ドア
Ｌ、・−ム９ａに、発光素子３はり一トソＬ、＝ −□
−ｊｉ ９ ｋ）ｉ：：：タイホントさイー１１受先部
７）、公７発Ａ部４７、かほぼ中１ｔ１に配置され対向
〔でいる。The hotel is equipped with a coupler device since tN.
As an example, 1, in Fig. 10, 1 is a light receiving element, 2 is a light receiving part,
3 is a light emitting element, 4 is a light emitting part, and 9a, 9h) are lead plates. Receive! Element 1 i;t') = door
L, ・-M 9a, light emitting element 3 beam L, = -□
-ji9k)i:::TaihontoSai11receivingpart7),public7departmentA47,or is located almost in the middle 1t1 and is opposite.
１発明か解決し５ようＪ−４“る課題−しか（、なから
、１−５肥構必のフォトカップラ装置て−は、受′Ａ′
、素子１と発光素子３かそれイれ別の１ノー１フレーム
（こタイホシトされるため、や光素子１の受ル部２の中
心と発光素子３の発光部４．４）中心とを精度良く同軸
上（こ一致さ十」−るには、おのおののフォト・カップ
ラ装置組立時１１、リ−１）１５２１、ノ・１３ａと９
１〕の相力位置を高精度ＩＪ位置合わせ調整１′る必要
かあり、組立に長時間を要づるどともに、歩留りが低い
なとの問題かあ１．また。However, the photocoupler device that requires a 1-5 structure is accepted by 'A'.
, the element 1 and the light emitting element 3 are placed in separate 1-1 frames (because they are aligned, the center of the receiver part 2 of the light element 1 and the center of the light emitting part 4.4 of the light emitting element 3) To ensure good coaxial alignment, when assembling each photo coupler device 11, 1) 1521, No. 13a and 9.
1) It is necessary to perform high-precision IJ alignment adjustment 1' for the phase force position, which requires a long time to assemble and has a low yield. Also.
本発明の［１的は−１−記問題を解決し、組立時の発光
素子と受光素子の相互位置調整か不要なフォトカップラ
装置を提供するごとにある。[1] An object of the present invention is to solve the problems described in -1- above and provide a photocoupler device that does not require mutual positional adjustment of a light emitting element and a light receiving element during assembly.
ｒ課す巻解法するための１段）
かかる［−１的を達成するため、本発明では元素ｒ、光
導波路、レンズ等を形成し、た複数の基板に、はんた濡
れの良好な金属パターンを形成し７、こイ１ら基板のは
んた温石の良好な金属パターン同］づ゛はんたバンプ接
続するようにしたものである。In order to achieve the objective [-1], in the present invention, an element r, an optical waveguide, a lens, etc. are formed, and a metal pattern with good solder wettability is formed on a plurality of substrates. 7, and the solder bumps can be connected using a good metal pattern of the solder hot stone on the board.
「作用］
」−記構成であると、はんだバンプ接続に際し、７て溶
融はんだの表面張力ζｌ：す、受光部と発光部とが中心
を同Ｕ＜Ｌ、て位置合わゼされる３、［実施例］
次に本発明の詳細な説明する。"Function" - With the configuration described above, when connecting the solder bumps, the surface tension of the molten solder ζl:S, the light receiving part and the light emitting part are aligned with the center at the same U<L.3,[ Examples] Next, the present invention will be explained in detail.
（実施例１）
第１図ないし第３図は本発明の第・の実施例である。図
中、１は受光素子、２は受光部、３は発光素子、４は発
光部、１０ははんたバンプ、１ｊａ、ｌｌｂ、１１．ｃ
、ｌｉｄは金属パターンであり、順に受光素子１のｐ側
およびｒ１側の電極、発光素子３のｐ側およびＤ側の電
極である。金属パターン相互は、例えば、基板上に絶縁
層を形成し、絶綽層上に金属パターンを形成することで
十分にアイソレーションされ−Ｃいる。また、少なくと
もはんだバンブ接続される部分には、はんだ濡れの良好
な金属パターンか形成されでおり、受光素子１十のはん
だ濡れの良好な金属パターンと発光素ｊ′−３１−のは
んた繻れの良６＋な金属パターンの相７７゜位置関係は
、受光素子１の受光部２の中心と発光素子３の発光部４
の中心を同一の軸線ＯＩ−に一致させ、画素子を向かい
合わせた時、受光素子１土のはんだ濡れの良好な金属バ
ターヘンと発光素ｒ：３十のはんた濡れの良好な金属パ
ターン（ｔ、両者の中心が同一の軸線０ｐＡｄ、］−に
一致する。(Embodiment 1) FIGS. 1 to 3 show a second embodiment of the present invention. In the figure, 1 is a light receiving element, 2 is a light receiving part, 3 is a light emitting element, 4 is a light emitting part, 10 is a solder bump, 1ja, llb, 11. c.
, lid are metal patterns, which are, in order, the p-side and r1-side electrodes of the light receiving element 1, and the p-side and D-side electrodes of the light emitting element 3. The metal patterns are sufficiently isolated from each other by, for example, forming an insulating layer on the substrate and forming the metal pattern on the insulating layer. In addition, a metal pattern with good solder wettability is formed at least in the portion to be connected with the solder bump, and the metal pattern with good solder wettability of the light receiving element 10 and the solder fiber of the light emitting element j'-31- are formed. The phase 77° positional relationship of the metal pattern with a good 6+ angle is between the center of the light receiving part 2 of the light receiving element 1 and the light emitting part 4 of the light emitting element 3.
When the centers of the pixels are aligned with the same axis OI- and the pixel elements face each other, the light-receiving element 1 has a metal pattern with good solder wetting and the light-emitting element r: 30 has a metal pattern with good solder wetting ( t, the centers of both coincide with the same axis 0pAd,]-.
受光素子″−１と発光素子３ど苓はんたバンプ接続する
と、両者は、溶融はんだの表面張力により、受光部２と
発光部４とか対向する位置に自動的かつ高精度に接続さ
れる、これは、はんだバンプの自動位置合わせ作用に基
づくものである。はんだバンプの自動位置合わゼ作用に
ついては、第１図の０軸と直交する平面上の位置精度、
および、Ｏ軸に沿う高さ方向への精度ともに、１μｍ程
度の精度を持つことが、近年の研究により明らかにされ
ており、（参考文献・例えば［１］林・大崎、「はんだ
バンプによる高精度端子接続法の検討」、昭和６２年電
子情報通信学会 情報・システム、半導体・材料部門全
国入会 ５９−６．１２ ：ＲＡ（−、、、、、Ｂａ、
ｃｈｅ ｅｔ ａｌ、、、”ＢＯＮＤ Ｄｌ＋５Ｉ
ＧＮ ＡＮＤ Ａｌ、ｌ Ｇ Ｎ Ｍ ＩＥＮＴ Ｉ
Ｎ Ｆｌ、ＩＰ ＣＩＩＩＰ ＳＯＬ、ＤＥｉン
ＢｏＮｐ＋Ｎｃ“、１゛■〜ｏｃ、８ｔｈ ＩＥＰ
Ｓ Ｃｏｎｆ、 Ｄａｌｌａｓ、Ｕ、Ｓ、Ａ、、Ｎｏｖ
、１９８８）、この精度は、受光素子１の受光部２と発
光素］−３の発光部４とか光結合するのに十分である。When the light receiving element "-1" and the light emitting element 3 are connected with solder bumps, the surface tension of the molten solder automatically and precisely connects the light receiving element 2 and the light emitting element 4 to opposing positions. This is based on the automatic positioning action of the solder bumps.The automatic positioning action of the solder bumps is based on the positional accuracy on the plane orthogonal to the 0 axis in Figure 1,
Recent research has revealed that the accuracy in the height direction along the O axis is approximately 1 μm. "Study of Accuracy Terminal Connection Methods", 1986 IEICE Information/Systems, Semiconductor/Materials Division Nationwide Membership 59-6.12: RA(-,,,,,Ba,
che et al,,,”BOND Dl+5I
GN AND Al, l GN M IENT I
N Fl, IP CIIIP SOL, DEin BoNp+Nc", 1゛■~oc, 8th IEP
S Conf, Dallas, U,S,A,, Nov.
, 1988), this accuracy is sufficient for optically coupling the light receiving section 2 of the light receiving element 1 and the light emitting section 4 of the light emitting element ]-3.
このため、受光素ｒ１の受光部１しと発光素子３の発光
部４とか自動１的に同一の軸線０土に高精度に重なり、
組立時１′：受光素子１と受光素′ｆ−２の相Ｋｉ位置
を注意深く調整する必要かなく、短時間で歩留まり良く
、フメトカ、プラ装置を組み立てることか司能である３
、（実施例２）
第４図は本発明の第二の実施例である。第４図中、１は
受光素子、２は受光部、３は発光素子、４は発光部、Ｆ
〕は透明基板、１０ａ、１０１）ははんだバンブ、ｌｌ
ａ、ｌｌｂ、Ｉｌｃ、ｌｉｄは金属パターンであり、順
に受光素子１のｎ側おＪ、ひＴ’ｌ側の電極、発光素子
３のｎ側およびｎ側の電極である。金属パターン相互は
、例えば、基板上に絶縁層を形成し５、絶縁層上に金属
パターンを形成することで十分にアイソレーンコシされ
ている１、また、少なくともはんたバンプ接続さ才する
部分（、″は、はんた濡れの良好な金属バター〉か什釣
戊されでおり、受光素子ｌ上のｉＪんｆ’−濡れの良好
）、ζ金属パターン、透明基板５手、のは／′（７た順
；れの良好な金属パターン、および、発３Ｗ、素子３Ｌ
のは／（また謡；イ′Ｊの良好な金属パターンの相互付
置関係は、透明基板５を挾ん゛Ｃ受光素Ｆｌの受光部２
の中心と発光素Ｊ−３の発光部４の中心を同一の軸線０
上に一致させ、画素子を向かい合わせた時、受）し素イ
ｌ土のはんた濡れの良好な金属パターン、発光素子３−
ノーのはんだ濡れの良好な金属パターン、おまひ、透明
基板５上のはんた濡れの良好な金属パターンは、おのお
のの中心が同一の軸線０９．、、ｄｊ−に一致する。Therefore, the light receiving part 1 of the light receiving element r1 and the light emitting part 4 of the light emitting element 3 automatically overlap with the same axis 0 with high precision,
Assembling 1': There is no need to carefully adjust the phase Ki position of photodetector 1 and photodetector 'f-2, and it is easy to assemble the plastic device in a short time with a high yield.
, (Embodiment 2) FIG. 4 shows a second embodiment of the present invention. In Fig. 4, 1 is a light receiving element, 2 is a light receiving part, 3 is a light emitting element, 4 is a light emitting part, F
] is a transparent substrate, 10a, 101) is a solder bump, ll
a, llb, Ilc, and lid are metal patterns, which are, in order, the n-side, J, and T'l-side electrodes of the light-receiving element 1, and the n-side and n-side electrodes of the light-emitting element 3. The metal patterns are sufficiently isolated by, for example, forming an insulating layer on the substrate 5 and forming the metal pattern on the insulating layer 1, and at least the portions to be connected by solder bumps. (, ″ is a metal butter with good solder wettability, and iJf′-good wetting on the light-receiving element l), ζ metal pattern, transparent substrate 5 hands, is / '(7 order; good metal pattern, emitting 3W, element 3L
The good mutual placement relationship of the metal patterns of ``Noha/(also: ``I'J'') is that the transparent substrate 5 is sandwiched between the light-receiving portions 2 of the photo-receiving elements Fl.
The center of the light emitting element J-3 and the center of the light emitting part 4 of the light emitting element J-3 are aligned with the same axis 0.
When the pixel elements are placed facing each other, the metal pattern with good solder wettability on the surface of the substrate, the light emitting element 3-
The metal patterns with good solder wetting on the transparent substrate 5 have their centers aligned with the same axis 09. , dj-.
本実施例においては、はんだバンプの自動位Ｉｔ合わせ
作用により、受光素子１と透明基板［）の相勾−位置、
および、透明基板５と発光素子３の相り１位置が、おの
おの自動位置合わせされる結製、透明基板５を挾んて受
光素子１の受光部２と発光素子 ３の発光部４とか自動
的に同一の軸線０−Ｆ、に高精度に重なり、組立時に受
光素子１、透明基板；′〕、および、受光素ｒ２の＋ｒ
ｌ互位置を注意深く調整−イ゛る必要がなく、短時間で
歩留まり良く、フオ！・カップラ装置を組み〜′ｆでる
ことかり能である。In this embodiment, the phase gradient position between the light-receiving element 1 and the transparent substrate [) is
Then, the mutual positions of the transparent substrate 5 and the light emitting element 3 are automatically aligned, and the light receiving part 2 of the light receiving element 1 and the light emitting part 4 of the light emitting element 3 are automatically aligned by sandwiching the transparent substrate 5. overlap with the same axis 0-F with high precision, and when assembling, the +r of the photodetector 1, the transparent substrate;
l Carefully adjust the mutual position - No need to move, short time, high yield, FO!・It is possible to assemble the coupler device and get ~'f.
なお、はんたバンプ１０ａ、１０ｂは融点の同し材料を
用いでも、融点の異なる材料を用いても良い。融点の同
し、材料の場合は受光素子１に透明基板５と発光素Ｆ
３を同時に搭載し、同時にはんだを溶融する。融点の異
なる材料であれば、高融点のはんだによる接続を始めに
行い、次に低融点のはんだによる接続を行う。Note that the solder bumps 10a and 10b may be made of materials having the same melting point or may be made of materials having different melting points. In the case of materials with the same melting point, a transparent substrate 5 and a light emitting element F are used for the light receiving element 1.
3 at the same time and melt the solder at the same time. If the materials have different melting points, the connection is first made using a high melting point solder, and then the connection is made using a low melting point solder.
第５図は本発明の第二の実施例の別の一例であり、透明
基板！′）にはレンズ部６か形成されている。FIG. 5 is another example of the second embodiment of the present invention, and is a transparent substrate! ') is formed with a lens portion 6.
本実施例においては、はんたバンブの自動位置合わせ作
用により受光素子Ｉと透明基板５の相０位置、および、
透明基板５と発光素子２の相互位置がおのおの自動位置
合わせされる結果、受光素子１１−の受光部２、透明基
板５］−のレンズ部６、および、発光素子３上の発光部
４か同一の軸線Ｏ上に高精度に重なり、組立時に受光素
子１、透明基板５、および、発電素子３の柑Ａノ１位置
を〆１意深く肌１整する必要かなく、短詩ＩＵＪて歩留
まり良く、フォ）・カップラ装置を組シーひてるこ閏が
ｍｉＪ能であて〉３、（実施例、′３）
第１３図は不発明の第三の実施例である。第６図中、１
は受光素子、２は受光部、ｊ３は発光素子、４は発光部
、７は導波路基板、）３は導波路部、ｌＯははλだバン
プ、ｌｌａ、ｌｌｂ、１１（，１１ｄは金属パターンで
あり、順に受光素子１の１）側およびｒ１側の電極、発
光素子３の丁〕側および丁〕側の電極である。電属パタ
ーン相月は、例えば、基板」−に絶縁層を形成（７、絶
縁層」＝に金属ｉｔ夕・−ンを形成することで十分にア
イソレーンヨンされている。また、少なくともはんだ）
−ンブ接続される部分には、はんだ濡れの良好な金属パ
ターンか形成されＣおり、受光素子１上のはんだ濡れの
良好な金属パターンと導波路基板７−１−のはんた濡れ
の良好な金属パターンの相互・位置関係は、受光素子１
の受光部２の中心と導波路基板７の導波路部８の光軸を
同一の軸線０．０” −Ｌ、に一致させ、・ヴ尤素ｊ＝
１と導波路す板７を向かいｔすわ→Ｊた時、受光素子１
上のはんた濡れの良好な金属パターンと導波路基板７上
のはんだ廂；ねの良好な金属パターンは、おのおの中心
か同一の軸線０ｐａｄＥに一致する。発光素子３上のは
んた濡れの世好な金属パターンと導波路基板７１゛のは
んた濡れの良好な金属バター・ンの相し２′、位置関係
についても、受光素〕ｒ１１１のはんだ濡イ゛１の良好
な金属パターンと導波路基板７上のはんだ濡れの良好な
金属パターンのｔｆ＋互位置関係と同様な関係か成立す
る。In this embodiment, the phase 0 position of the light receiving element I and the transparent substrate 5 is adjusted by the automatic positioning action of the solder bump, and
As a result of automatic alignment of the mutual positions of the transparent substrate 5 and the light-emitting element 2, the light-receiving part 2 of the light-receiving element 11-, the lens part 6 of the transparent substrate 5-, and the light-emitting part 4 on the light-emitting element 3 are the same. overlaps the axis O with high precision, there is no need to carefully align the positions of the light receiving element 1, the transparent substrate 5, and the power generating element 3 during assembly, and the yield rate is high. 4) Assembling the coupler device and using the miJ function>3, (Embodiment, '3) FIG. 13 shows a third embodiment of the invention. In Figure 6, 1
is a light receiving element, 2 is a light receiving part, j3 is a light emitting element, 4 is a light emitting part, 7 is a waveguide substrate, )3 is a waveguide part, IO is a λ bump, lla, llb, 11 (, 11d are metal patterns) These are, in order, the electrodes on the 1) side and r1 side of the light receiving element 1, and the electrodes on the 1) side and 1) side of the light emitting element 3. The electrical pattern is sufficiently isolated, for example, by forming an insulating layer on the substrate (7, forming a metal layer on the insulating layer, and at least solder).
- A metal pattern with good solder wetting is formed on the part to be connected to the waveguide substrate 7-1, and a metal pattern with good solder wetting is formed on the light receiving element 1 and a metal pattern with good solder wetting on the waveguide substrate 7-1-. The mutual and positional relationship of the metal patterns is determined by the light receiving element 1.
The center of the light-receiving section 2 and the optical axis of the waveguide section 8 of the waveguide substrate 7 are made to coincide with the same axis line 0.0"-L, and
When the light receiving element 1 and the waveguide plate 7 face each other, the light receiving element 1
The metal pattern with good solder wetting on the top and the metal pattern with good solder wetting on the waveguide substrate 7 coincide with the center or the same axis 0padE. The metal pattern on the light-emitting element 3 with good solder wettability and the metal pattern with good solder wettability on the waveguide substrate 71' are compatible with each other, and the positional relationship is also determined by the solder on the light-receiving element R111. A relationship similar to the tf+ positional relationship between the metal pattern with good solder wetting on the waveguide substrate 7 and the metal pattern with good solder wetting on the waveguide substrate 7 is established.
本実施例においては、はんだバンブの自動位置合わ１！
作用により、受光素子１ど導波路基板７の＋１−ｌカニ
位置、及び、発光素子３と導波路基板７の相互位置か、
おのおの自動（ｔ′ｌ置合わせされる結果、受光素子１
の受光部２と発光素′ｔ３の発光部４よが自動的に導波
路人工板７の導波路部８の光軸０、ｒ） ’ 、１、に
高精度に重なり、組（ム時に受光素子１、発光素−１３
、および、導波路基板７の柑〜位置を注意深く、週整す
る必要かなく、短時間”Ｃ歩留まり良く、フォトカッシ
ラ装置を紹み１１４てど（、、二、ジ・が「Ｉゴ能−こ
゛ある３゜
（実が０例・４）
実施例、４は、実施例３の発光素３′、もしくは、受光
素子か、導波路基板にモノリジ７・り２ 積Ｄ ｔｔた
形態であり、第９図に本発明の第四の実施例のうち、発
光素子か導波路基板にモ／す・ツク集積された場合を例
示する。第９図中、１は受光素子、２は受光部、７は導
波路基板、４は発光部、８は光導波路である。In this embodiment, automatic positioning of solder bumps 1!
Due to the action, the +1-l positions of the light receiving element 1 and the waveguide substrate 7, and the mutual positions of the light emitting element 3 and the waveguide substrate 7,
As a result of each automatic (t'l alignment), the light receiving element 1
The light receiving part 2 of the light emitting element 't3 and the light emitting part 4 of the light emitting element 't3 automatically overlap the optical axes 0, r)', 1, of the waveguide part 8 of the artificial waveguide board 7 with high precision, and the light receiving part 4 of the light emitting element 't3 Element 1, light emitting element-13
Introducing a photocassillary device that can achieve high yields in a short period of time without the need to carefully adjust the position of the waveguide substrate 7 on a weekly basis. In Example 4, the light-emitting element 3' of Example 3 or the light-receiving element was mounted on the monolithic substrate 7. Figure 9 illustrates a fourth embodiment of the present invention in which a light emitting element is integrated into a waveguide substrate.In Figure 9, 1 is a light receiving element, 2 is a light receiving part, and 7 4 is a waveguide substrate, 4 is a light emitting part, and 8 is an optical waveguide.
本実施例においては、はんたバンプの自動６１． 、Ｗ
合わ１４作用により、受光素子１と導波路基板ｌ′の相
ｎ位置か自動位置合わせされる結果、受光素子１の受光
部２か自動的に導波路基板゛１′の光導波路８の光軸０
、土に高精度に小なり、組１″１時に受光素４１、発非
１素了３、お３Ｌひ、導波路基板７の＋１１互位置を注
意深く訳ｊ整する必要かなく、短時間で社留まり良く、
フォトカッシラ装置を組み立てることか司ｔｒｉ−，で
ある。In this embodiment, solder bump automatic 61. ,W
As a result of the automatic alignment of the phase n position of the light-receiving element 1 and the waveguide substrate l', the light-receiving part 2 of the light-receiving element 1 automatically aligns the optical axis of the optical waveguide 8 of the waveguide substrate l'. 0
, it is not necessary to carefully adjust the positions of the photodetector element 41, the emitting element 41, the emitting element 3, the +11 of the waveguide substrate 7, and in a short time. Good retention,
The task is to assemble the photocassilla device.
なよ５、実施例３、実施例４においては、光導波路の入
出射部（こし・ンズをモ／゛す／ツクに菓積しても良く
、または、第５図に小ず実施例２の別の形態と同様に、
しンズを杉成し、た透明基板４−１導波路基板と元素ｒ
の間（、挾ん′こはんたハ〉・ブ接続［。5. In Embodiments 3 and 4, the input/output part of the optical waveguide may be attached to the input/output part (reflector/lens), or as shown in FIG. As well as another form of
Transparent substrate 4-1 Waveguide substrate and element R
Between (, 挾澾′こHANTAHA〉・Bu connection [.
でもＪコい。But J-koi.
［発明の効果ゴ
以１．説明【たように、本発明によるフォ１−力７・ブ
ラ装置にｂいては、光素子や光導波路を形成した基板等
を対向さゼて接続する際、溶融はんたの表面張力により
両基板に形成されたはんた濡れの良好な金属層の中心軸
回１か同軸上に自動的に重なるので、光素子の受発光部
の中心や光導波路の光軸中心が自動的に同軸上に高精度
に位置合わせされる１、このため、組立時のγ４意深い
調整か不要となり、安価なフォトカップラ装置が提供で
きる。[Effects of the invention 1. [Explanation] As described above, in the photo-bracing device according to the present invention, when optical elements and substrates on which optical waveguides are formed are connected facing each other, the surface tension of the molten solder causes the surface tension of the molten solder to Since the center axis of the metal layer with good solder wettability formed on the substrate is automatically aligned on the same axis, the center of the light receiving/emitting part of the optical element and the optical axis center of the optical waveguide are automatically aligned on the same axis. 1, which eliminates the need for significant adjustment of γ4 during assembly, making it possible to provide an inexpensive photocoupler device.
第１図ないし第３図は本発明の第一・の実施例を示し５
、第１図は平面図、第２図は第１図のＩｌ［−Ｉｌ線に
沿う矢視図、第３図は第１図の月１−ｍ線に沿う矢視図
である。第４図１」本発明の第、の実施例を示す断面図
である。第５図は不発明の第二の実施例の変形例を示す
断面図−ζある３、第６図ない（、第８図は本発明の第
三ヨーの実ｈ←例を示し、第０図は平面図、第７図は第
０図の■−■線に沿う矢視図、第Ｆ３図は第６図の〜メ
ｌ−■線に沿う矢視図である。
第９図は本発明の第四の実施例を示す断面図である。第
１０図は従来の〕、１． ｌ・カップラの一例を示す断
面図Ｃある。
１ 受光素子、２ ・受光部、３・・・・発光素子、
４ 発光部、５ 透明基板、６ レンズ部、７・
・導波路基板、８・・・導波路部、９ａ９ ｂ ・
リー ドフレーム、１０，１．ｏａ、］Ｏｂはんたバ
ンプ、Ｉ ｌａ、 １．１ｔ：ｉ、 Ｉ Ｉｃ、
１１ｄ ・金属パターン。1 to 3 show a first embodiment of the present invention.
, FIG. 1 is a plan view, FIG. 2 is a view along the line Il[-Il in FIG. 1, and FIG. 3 is a view along the line 1-m in FIG. FIG. 4 is a sectional view showing a second embodiment of the present invention. Fig. 5 is a sectional view showing a modification of the second embodiment of the invention - 3 with ζ, Fig. 6 without (, Fig. 8 shows an actual example of the third yaw of the invention, The figure is a plan view, FIG. 7 is a view taken along the line ■-■ in FIG. 0, and FIG. F3 is a view taken along the line ~M--■ in FIG. 6. FIG. 10 is a cross-sectional view showing an example of a conventional 1. L coupler. 1. Light-receiving element, 2. Light-receiving section, 3... light emitting element,
4 light emitting section, 5 transparent substrate, 6 lens section, 7.
・Waveguide substrate, 8... waveguide section, 9a9b ・
Lead frame, 10,1. oa, ] Ob solder bump, I la, 1.1t:i, I Ic,
11d ・Metal pattern.
Claims (6)
同じくしてかつ互いに対向させて配置するとともに、こ
れら受光素子と発光素子とをはんだバンプ接続してなる
フォトカップラ装置。(1) A photocoupler device in which a light-receiving part of a light-receiving element and a light-emitting part of a light-emitting element are disposed with the same axis and facing each other, and the light-receiving element and the light-emitting element are connected by solder bumps.
同じくしてかつ透明基板を介して互いに対向させて配置
するとともに、これら受光素子および発光素子をそれぞ
れ前記透明基板にはんだバンプ接続してなるフォトカッ
プラ装置。(2) The light-receiving part of the light-receiving element and the light-emitting part of the light-emitting element are arranged with the same axis and facing each other with a transparent substrate interposed therebetween, and the light-receiving element and the light-emitting element are respectively connected to the transparent substrate by solder bumps. A photocoupler device.
発光素子の発光部と軸線を同じくするレンズが形成され
てなる請求項２記載のフォトカップラ装置。(3) The photocoupler device according to claim 2, wherein a lens having the same axis as a light receiving portion of the light receiving element and a light emitting portion of the light emitting element is formed on the transparent substrate.
素子をはんだバンプ接続し、前記受光素子の受光部の中
心、前記導波路の光軸、および、前記発光素子の発光部
の中心を同軸上に一致させてなるフォトカップラ装置。(4) A light-receiving element and a light-emitting element are connected by solder bumps on a substrate on which an optical waveguide is formed, and the center of the light-receiving part of the light-receiving element, the optical axis of the waveguide, and the center of the light-emitting part of the light-emitting element are coaxial. A photocoupler device that matches the top.
つとを集積した基板に、前記受光部に対向して発光素子
を、あるいは前記発光部に対向して受光素子をはんだバ
ンプ接続し、前記光導波路の光軸と前記発光素子の発光
部あるいは前記受光素子の受光部の中心とを同軸上に一
致させてなるフォトカップラ装置。(5) A light emitting element facing the light receiving part or a light receiving element facing the light emitting part is connected by solder bumps to a substrate on which an optical waveguide and either a light receiving part or a light emitting part are integrated; A photocoupler device in which an optical axis of an optical waveguide and a center of a light emitting part of the light emitting element or a light receiving part of the light receiving element are coaxially aligned.
路を形成した基板をはんだバンプ接続し、該透明基板の
反対の面に発光素子、受光素子をはんだバンプ接続し、
該導波路の光軸、該レンズの中心、および、該発光素子
の発光部もしくは該受光素子の受光部の中心とを同軸上
に一致させたフォトカップラ装置。(6) A substrate on which an optical waveguide is formed is connected by solder bumps to one side of a transparent substrate on which a lens is formed, and a light emitting element and a light receiving element are connected to the opposite side of the transparent substrate by solder bumps,
A photocoupler device in which the optical axis of the waveguide, the center of the lens, and the center of the light emitting part of the light emitting element or the light receiving part of the light receiving element are coaxially aligned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16519490A JP2903095B2 (en) | 1990-06-22 | 1990-06-22 | Photo coupler device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16519490A JP2903095B2 (en) | 1990-06-22 | 1990-06-22 | Photo coupler device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0461175A true JPH0461175A (en) | 1992-02-27 |
| JP2903095B2 JP2903095B2 (en) | 1999-06-07 |
Family
ID=15807624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16519490A Expired - Fee Related JP2903095B2 (en) | 1990-06-22 | 1990-06-22 | Photo coupler device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2903095B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183570A (en) * | 1993-12-24 | 1995-07-21 | Nec Corp | Multichip module |
| JP2001015794A (en) * | 1999-06-18 | 2001-01-19 | Agilent Technol Inc | Photoconductive relay, assembly and method of assembling photoconductive relay |
| US6483161B1 (en) | 2001-08-14 | 2002-11-19 | Sumitomo Electric Industries, Ltd. | Submount with filter layers for mounting a bottom-incidence type photodiode |
| WO2005067061A1 (en) * | 2003-12-26 | 2005-07-21 | Nec Corporation | Semiconductor integrated circuit with optical element |
| WO2005067062A1 (en) * | 2003-12-26 | 2005-07-21 | Nec Corporation | Substrate with light input, substrate with light output, substrate with light input/output, and semiconductor integrated circuit with optical element |
| JP2010049170A (en) * | 2008-08-25 | 2010-03-04 | Shinko Electric Ind Co Ltd | Package for optical-electrical wiring, and lead frame having optical waveguide |
-
1990
- 1990-06-22 JP JP16519490A patent/JP2903095B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183570A (en) * | 1993-12-24 | 1995-07-21 | Nec Corp | Multichip module |
| JP2001015794A (en) * | 1999-06-18 | 2001-01-19 | Agilent Technol Inc | Photoconductive relay, assembly and method of assembling photoconductive relay |
| US6483161B1 (en) | 2001-08-14 | 2002-11-19 | Sumitomo Electric Industries, Ltd. | Submount with filter layers for mounting a bottom-incidence type photodiode |
| WO2005067061A1 (en) * | 2003-12-26 | 2005-07-21 | Nec Corporation | Semiconductor integrated circuit with optical element |
| WO2005067062A1 (en) * | 2003-12-26 | 2005-07-21 | Nec Corporation | Substrate with light input, substrate with light output, substrate with light input/output, and semiconductor integrated circuit with optical element |
| JPWO2005067062A1 (en) * | 2003-12-26 | 2007-12-20 | 日本電気株式会社 | SUBSTRATE WITH LIGHT INPUT, SUBSTRATE WITH LIGHT OUTPUT, SUBSTRATE WITH OPTICAL INPUT / OUTPUT AND MANUFACTURING METHOD THEREOF |
| JPWO2005067061A1 (en) * | 2003-12-26 | 2007-12-20 | 日本電気株式会社 | Optical element integrated semiconductor integrated circuit and manufacturing method thereof |
| JP2010049170A (en) * | 2008-08-25 | 2010-03-04 | Shinko Electric Ind Co Ltd | Package for optical-electrical wiring, and lead frame having optical waveguide |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2903095B2 (en) | 1999-06-07 |
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