JPH0462014B2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention is for obtaining position information of a thermal infrared generating part by detecting the area of the thermal infrared generating part by the amount of thermal infrared rays in thermal infrared measurement. infrared detection element,
As an example, monitoring one end of a heating element at a constant temperature;
The present invention relates to a method of manufacturing an infrared detection element used to measure the position of its end.

Configuration of conventional example and its problems The conventional thermopile type infrared detection element will be explained with reference to FIG. The thin layers 3 and 4 are alternately arranged in series with their ends stacked and joined,
The stacked joints of these two types of metal thin layers 3 and 4 are arranged separately into a temperature-sensitive joint 5 and a reference joint 6 (see Figure 2) every other time, and a red layer is placed on top of the temperature-sensitive joint 5. An outer absorbent layer 7 is arranged. Note that the reference joint portion 6 is located on both left and right upper surfaces of the substrate thin film 2 on which the left and right support stands 1, 1 are located, so that the temperature does not rise even if infrared rays are incident thereon. Reference numeral 8 denotes a signal extraction electrode which is placed overlappingly at the ends of the two metal thin layers 3 and 4 which are connected in series.

In the thermopile-type infrared detection element 9 having such a configuration, when the infrared absorption layer 7 is irradiated with infrared rays, the temperature-sensitive junction 5
temperature rises, and an electromotive force corresponding to the temperature difference with the reference junction 6 is generated at the signal extraction electrode 8 due to the Seebeck effect. It is necessary to reduce the heat capacity as much as possible. Therefore, the thickness of the substrate thin film 2 on which the infrared absorbing layer 7 and the temperature-sensitive junction 5 are deposited is made as thin as possible, but a thickness of about 10 μm is extremely difficult to handle and requires a lot of effort in various vapor deposition operations. and mounting work, especially the substrate thin film 2 on the support bases 1, 1.
It is extremely difficult to adhere to the infrared detection element 9, which causes a decrease in yield in manufacturing the infrared detection element 9.

OBJECTS OF THE INVENTION The present invention aims to provide a manufacturing method that can improve the yield in manufacturing a thermopile-type infrared detection element, and enables mass production and cost reduction.

Structure of the Invention The present invention involves bonding a substrate thin film to the periphery of a counterbore portion of a metal plate having a counterbore in the middle and an opening in the central portion as a view-limiting window, and then Two types of metal thin layers are alternately deposited on the opposite side of the plate so that their ends are stacked and arranged in series, and the ends of the two types of metal thin layers are arranged in series. A signal extraction electrode is deposited on the metal plate, and finally, using the field-of-view limiting window, which is the opening of the metal plate, as a deposition mask pattern, a field-limiting window that is geometrically congruent with the field-of-view limiting window is formed on the opposite side of the temperature-sensitive junction of the substrate thin film. This method is characterized in that the infrared absorbing layer is vapor-deposited so as not to come into contact with the metal plate.

DESCRIPTION OF EMBODIMENTS An embodiment of the method for manufacturing a thermopile type infrared detection element according to the present invention will be described with reference to FIGS. 2a and 2b. First, the middle part is counter-bored leaving both the front and rear ends to reduce the thickness.
A substrate thin film 22 made of Kapton film 10 μm thick is bonded over the left and right sides of the counterbore 11 of a metal plate 10 made of a 0.2 mm thick copper plate with a thickness of 0.1 mm and an opening in the center. do. The metal plate 10 can be easily manufactured by etching using a photomask. The adhesive for bonding the substrate thin film 2 is a two-component epoxy resin system, and is solidified at 300°C. Next, a vapor deposition mask having a pattern as shown in FIG. Thin metal layers 3 and 4 of bismuth and antimony are arranged alternately, and their ends are stacked and joined in series, and a signal extraction electrode 8 of gold is arranged at the end of the thin metal layers 3 and 4. . Bismuth and antimony are deposited by raising the temperature to approximately 200℃. The stacked joints of the two types of metal thin layers 3 and 4 are separated into temperature-sensitive joints 5 and reference joints 6 every other time. Finally, on the opposite side of the group of temperature-sensitive junctions 5 on the substrate thin film 2, the openings 12 of the metal plate 10 (which will become the view-limiting windows of the infrared absorbing layer 7 after formation) are formed as a vapor deposition mask pattern in the same area. The infrared absorbing layer 7 is formed by depositing gold black at the same position, that is, so that both the opening 12 and the infrared absorbing layer 7 are in a geometrically congruent relationship.
Place.

The thermopile-type infrared detecting element thus manufactured is then fixed to a package via support stands 1, 1 by bonding a fine gold wire with a diameter of 30 μm to the signal extraction electrode 8 with dotite. Thereafter, a fine gold wire is bonded to the terminal of the package with dotite, a germanium window plate, which is an infrared transmitting plate, is hermetically bonded to the package, and the package is vacuum-sealed by evacuation through an exhaust copper pipe. In this way, a thermopile type infrared detector is completed.

Effects of the Invention As detailed above, according to the method for manufacturing a thermopile-type infrared detection element of the present invention, a substrate thin film is bonded to a metal plate with a counterbore in the middle and an opening in the center. Two types of metal thin layers and signal extraction electrodes can be easily deposited and placed on a thin film using a deposition mask, and the infrared absorbing layer can be placed on the substrate thin film with the same area by using the openings of the metal plate as a deposition mask pattern. Since both can be deposited and arranged in the same position, that is, in a geometrically congruent relationship, an infrared absorbing layer with high dimensional accuracy can be easily obtained. In this way, all the deposition work can be performed with the substrate thin film bonded to the metal plate, improving yields and eliminating the relatively time-consuming evaporation process after the substrate thin film is bonded to the metal plate. As a result, the vapor deposition work is no longer invalidated due to adhesion failure, and it is possible to improve the yield and significantly reduce the time required for invalid work. In fact, in the production of thermopile-type infrared detection elements, the conventional method involved 50% of ineffective work, but with the present invention, this has been reduced to 5%, less than 1/10.

Furthermore, the thermopile-type infrared detection element manufactured by such a method can eliminate measurement errors caused by irradiation of infrared light (or stray light) onto areas other than the infrared absorption layer.

That is, in the present invention, the metal plate is ground around the substrate thin film (infrared absorbing layer) so as not to come into contact with the substrate thin film (infrared absorbing layer), and then
Furthermore, the shape and size of the infrared absorbing layer are geometrically congruent with the viewing window, so all infrared light passing through the viewing window is absorbed only by the infrared absorbing layer, eliminating stray light. "The signal (error) caused by the infrared light is absorbed by the surrounding area other than the infrared absorption layer.
can be prevented from occurring.

As described above, in the present invention, the openings in the metal plate are used as vapor deposition mask patterns for the infrared absorbing layer during manufacturing, and the openings are utilized as viewing-limiting windows for the infrared absorbing layer after manufacturing.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional thermopile-type infrared detection element, FIGS. 2a and 2b show a thermopile-type infrared detection element manufactured by the manufacturing method of the present invention, and FIG. Figure b is a sectional view taken along line AA in figure a. DESCRIPTION OF SYMBOLS 1... Support stand, 2... Substrate thin film, 3, 4... Metal thin layer, 5... Temperature sensitive junction, 6... Reference junction,
7... Infrared absorbing layer, 8... Signal extraction electrode, 9'...
...Thermopile-type infrared detection element manufactured by the manufacturing method of the present invention, 10... Metal plate, 11... Counterbore, 1
2...Opening.

Claims (1)

[Scope of Claims] 1. A substrate thin film is bonded around the counterbore portion of a metal plate having an opening with a counterbore in the middle and a view-limiting window in the center, and then the metal of the substrate thin film is bonded. Two types of metal thin layers are alternately deposited on the opposite side of the plate so that their ends are stacked and arranged in series, and the ends of the two types of metal thin layers are arranged in series. A signal extraction electrode is deposited on the metal plate, and finally, using the field-of-view limiting window, which is the opening of the metal plate, as a deposition mask pattern, a field-limiting window that is geometrically congruent with the field-of-view limiting window is formed on the opposite side of the temperature-sensitive junction of the substrate thin film. 1. A method of manufacturing a thermopile type infrared detection element, comprising depositing an infrared absorbing layer such that the infrared absorbing layer does not come into contact with the metal plate.