JPH0462466B2 - - Google Patents

Info

Publication number
JPH0462466B2
JPH0462466B2 JP59177798A JP17779884A JPH0462466B2 JP H0462466 B2 JPH0462466 B2 JP H0462466B2 JP 59177798 A JP59177798 A JP 59177798A JP 17779884 A JP17779884 A JP 17779884A JP H0462466 B2 JPH0462466 B2 JP H0462466B2
Authority
JP
Japan
Prior art keywords
drive circuit
capacitance
circuit section
bonding pad
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59177798A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6155959A (ja
Inventor
Takashi Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP59177798A priority Critical patent/JPS6155959A/ja
Publication of JPS6155959A publication Critical patent/JPS6155959A/ja
Publication of JPH0462466B2 publication Critical patent/JPH0462466B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/191—Photoconductor image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Wire Bonding (AREA)
JP59177798A 1984-08-27 1984-08-27 原稿読み取り装置 Granted JPS6155959A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59177798A JPS6155959A (ja) 1984-08-27 1984-08-27 原稿読み取り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59177798A JPS6155959A (ja) 1984-08-27 1984-08-27 原稿読み取り装置

Publications (2)

Publication Number Publication Date
JPS6155959A JPS6155959A (ja) 1986-03-20
JPH0462466B2 true JPH0462466B2 (cs) 1992-10-06

Family

ID=16037271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59177798A Granted JPS6155959A (ja) 1984-08-27 1984-08-27 原稿読み取り装置

Country Status (1)

Country Link
JP (1) JPS6155959A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62276871A (ja) * 1986-05-24 1987-12-01 Kyocera Corp 読取り装置
JP4635191B2 (ja) * 2003-10-21 2011-02-16 国立大学法人静岡大学 超解像画素電極の配置構造及び信号処理方法

Also Published As

Publication number Publication date
JPS6155959A (ja) 1986-03-20

Similar Documents

Publication Publication Date Title
US4360732A (en) Infrared charge transfer device (CTD) system
JPS6156912B2 (cs)
JP4144892B2 (ja) 光電変換装置及び撮像装置
JPS6313348B2 (cs)
EP0498664B1 (en) Solid-state imaging device
IT9048392A1 (it) Dispositivo per la registrazione termica di immagini
JPH0462466B2 (cs)
KR940006933B1 (ko) 콘택 영상 센서
JP4633991B2 (ja) 信号読出回路
JPH0328871B2 (cs)
JPH023551B2 (cs)
JPH0748786B2 (ja) イメージセンサ
JPH0546137B2 (cs)
JP2591346B2 (ja) 画像読取装置
US6455909B1 (en) Image sensor
JPS58195373A (ja) 固体光電変換装置
JPS60248063A (ja) 密着型イメ−ジセンサ
JP3279094B2 (ja) イメージセンサ
JPH0624234B2 (ja) １次元光電変換装置
JPS61231754A (ja) 混成集積化一次元光センサ
JPH05227363A (ja) イメージセンサ及びその読み取り方法及び画像読取装置
JPH0645580A (ja) イメージセンサ
JP2803825B2 (ja) イメージセンサの駆動方法
JPS62276871A (ja) 読取り装置
JPH0662321A (ja) ２次元イメージセンサ