JPH0462995A - Board mounting device - Google Patents

Abstract

PURPOSE:To simplify a structure and to realize accurate mounting of an insulator board by providing a plurality of grooves opposed through the board between the part to be mounted of a mounting plate and the board. CONSTITUTION:A pair of grooves 13, 13 are arranged through a ceramic board 10 between mounting holes 12, 12 of a mounting plate 11 and the board 10 on the plate 11, and formed so as to weaken only the elastic forces of the vicinities of the grooves 13, 13 as compared with that of a periphery. According to this, if a mounting stress is generated due to uneven parts, etc., of mounting surfaces upon mounting of the plate 11 at a mounting body, only the vicinities of the grooves 13, 13 are elastically deformed to absorb the stress to effectively prevent damage, peeling of the board 10 due to the mounting stress for generating an influence of the stress to the securing position of the board 10. Since only the grooves may be formed on the plate 11, its manufacturing work can easily be realized.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention is directed to the use of an insulating substrate on which an electric circuit such as a thin film circuit is formed, for example, as a chassis of a mounted device such as a microwave band amplifier or the like. The present invention relates to a board mounting device used for mounting on a mounting body such as a case.

(Prior art) Generally, this type of board mounting device has the following features as shown in FIG.
Metal is deposited on the mounting surface of an insulator substrate 1, such as a ceramic substrate 1 made of alumina, on which an electric circuit is formed, and the metal-deposited mounting surface of the ceramic substrate 1 is placed at a predetermined position on a mounting plate 2 called a carrier plate. Attach it using soldering or conductive adhesive. Then, the mounting plate 2 to which the ceramic substrate 1 is fixed is attached to a mounting body such as a chassis or a case of a mounted device (not shown) by having a fixing member, for example, a screw, screwed into the mounting hole 3 thereof.

However, in the above-mentioned board mounting device, due to the flatness of the mounting plate 2 and the mounting body (not shown), stress when fixing the mounting plate 2 to the mounting body (not shown) causes the mounting plate to bend. 2 and the mounting body (not shown), the mounting plate 2 is forcibly deformed, and the mounting stress generated may damage the ceramic substrate 1, or the ceramic board 1 may be removed from the mounting plate 2. It had a problem of peeling off.

Therefore, recently, as shown in FIG. 4, a concave substrate accommodating portion 2a is formed at a predetermined position of the mounting plate 2, and the ceramic substrate 1 is similarly fixed to the substrate accommodating portion 2a using flat soldering or adhesive. Therefore, some devices are configured so that the mounting stress caused by mounting the mounting plate 2 to the mounting body (not shown) is absorbed by the gap between the mounting plate 2 and the ceramic substrate 1 in the board accommodating portion 2a.

However, due to the structure of the above-mentioned board mounting device, the board accommodating portion 2a, which has a relatively large processing area, must be machined to a highly accurate flatness, which makes the manufacturing process very troublesome and expensive. has. Additionally, according to this, since the strength of the mounting plate 2 itself is reduced due to its structure, the amount of deformation of the mounting plate 2 increases as a result due to the strength of the ceramic substrate 1, and the ceramic substrate 1 is damaged. or,
This had the problem of causing peeling.

(Problems to be Solved by the Invention) Conventional substrate mounting devices have a problem in that the yield of products is low because the ceramic substrate is damaged or peeled off from the mounting plate.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a board mounting device that can realize highly accurate mounting of an insulator board using component parts.

[Structure of the Invention] (Means for Solving the Problems) The present invention includes mounting an insulating substrate on which an electric circuit is formed on a mounting plate, and attaching the insulating substrate to the mounting body via the mounting plate. In the board mounting device, the mounting plate includes:
A plurality of grooves are provided between the mounting portion and the insulating substrate and facing each other with the insulating substrate sandwiched therebetween.

(Function) According to the above configuration, the elastic force in the vicinity of the groove that sandwiches the insulating substrate is weaker than that in the surrounding area, so that the mounting plate can be attached to the mounting body and attached to each other. When mounting stress is generated due to surface irregularities, etc., the wave grooves are elastically deformed to absorb the mounting stress and prevent it from affecting the fixed location of the insulator substrate.

Therefore, even if mounting stress is generated by mounting the mounting plate, the mounting stress effectively prevents the insulator substrate from being damaged or peeled off.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a substrate mounting apparatus according to an embodiment of the present invention. In the figure, reference numeral 10 denotes an insulating substrate, for example a ceramic substrate made of alumina or the like, on which an electric circuit such as a thin film circuit (not shown) is formed. This ceramic substrate 10 has metal vapor-deposited on its mounting surface, and this mounting surface is placed approximately in the center of the mounting plate 11 and fixed using, for example, soldering or a conductive adhesive.

The mounting plate 11 also has mounting holes 12° and 12° at both ends thereof.
are provided, and mounting holes 12.1, 2 on the board mounting surface side are provided.
For example, a pair of grooves 13.13 are provided at the intermediate portion between the ceramic substrate 10 and the ceramic substrate 10, with the ceramic substrate 10 interposed therebetween.

In the above configuration, the ceramic substrate 10 of the mounting plate 11 is fixed between the grooves 13, 13 by soldering or by using a conductive adhesive. At this time, the grooves 13 and 13 of the mounting plate 11
to prevent solder or adhesive from flowing out, and
2. Prevents adhesion to 12. When the mounting plate 11 is attached to the mounting body (not shown) by screwing the screw (not shown) into the mounting hole 1313, the mounting plate 11 is attached to the mounting surface of the mounting body (not shown). A mounting stress of 1 is generated due to unevenness, etc. Then, this mounting stress is concentrated near the groove 13.13 where the elastic force is weaker than that of the surrounding area, and the mounting stress is concentrated near the groove 13.13.
By elastically deforming the material, it is absorbed in the vicinity of the groove 1313. As a result, the mounting stress generated during mounting to the mounting body (not shown) does not affect the fixed location of the insulator substrate 10 on the mounting plate 11, and the ceramic board 10 can be mounted there with high reliability. Realized.

In this manner, the board mounting device has a pair of grooves 13.13 disposed in the mounting plate 11 between the mounting hole 13.13 and the ceramic substrate 10, with the ceramic substrate 10 sandwiched therebetween.
Wave groove 13. ．． The structure is such that only the elastic force near the point 13 is weaker than that of the surrounding area.

According to this, when mounting stress is generated due to unevenness of the mutual mounting surfaces while mounting the mounting plate 11 to the mounting body (not shown), only the vicinity of the wave grooves 13 and 13 are elastically deformed. By absorbing the stress and preventing the influence of stress on the fixed parts of the ceramic substrate 10, damage and peeling of the ceramic substrate 10 caused by the mounting plate 11 (=1 stress) can be effectively prevented. According to this, there is also an advantage that the manufacturing work can be realized very easily since it is only necessary to perform groove processing on the mounting plate 11.

Further, the grooves 13, 1.3 of the mounting plate 11 are formed on the ceramic substrate 1.
0 is soldered or fixed using conductive adhesive, and if the solder or adhesive flows out, the flow is controlled to prevent it from adhering to the mounting hole 12.12. This makes it possible to perform the fixing work easily and to realize subsequent easy attachment to a mounting body (not shown).

In the above embodiment, the grooves 13.13 are formed on the board mounting surface side of the mounting plate 12, but the present invention is not limited thereto. For example, as shown in FIG. It is possible to form it on the mounting surface side.

Further, in the above embodiment, a case has been described in which the mounting plate 11 on which the ceramic substrate 10 is mounted is directly attached to the mounting body (not shown), but the intermediate shrine is not limited to this. It is also possible to configure it so that it is attached indirectly by intervening.

Therefore, it goes without saying that the present invention is not limited to the above embodiments, and that various modifications can be made without departing from the spirit of the invention.

[Effects of the Invention] As described in detail above, according to the present invention, it is possible to provide a substrate mounting device that has a simple configuration and can realize highly accurate mounting of an insulator substrate.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a board mounting device according to one embodiment of the invention, FIG. 2 is a perspective view showing another embodiment of the invention,
3 and 4 are perspective views showing a conventional board mounting device. 10...Ceramic board, 11...Mounting plate, 12...
・Mounting hole, 13...groove. ○= (NF) C)

Claims (1)

[Claims] Mount the insulator board with the electric circuit formed on the mounting plate,
In the board mounting device in which the insulator board is mounted to the mounting body via the mounting plate, the insulator board is opposed to the mounting plate with the insulator board sandwiched between the mounted part and the insulator board. A board mounting device characterized by having a plurality of grooves.