JPH0464460B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing a glass-sealed semiconductor device in a semi-finished state before a wire bonding process, in which a lead frame and a semiconductor chip are bonded to a substrate.

[Conventional technology]

FIG. 5 shows an exploded view of the constituent members of a glass-sealed semiconductor device, such as a dual-in-line (DIL) semiconductor integrated circuit, until the semiconductor chip is voided. Reference numeral 1 denotes a substrate made of an insulating material such as ceramic, and a cavity 1a is provided at the center of the upper surface, and an adhesive glass (sealing glass) 2 is applied to the center of the cavity 1a and the entire other upper surface. 3 is a lead frame that is bonded onto the substrate 1 with adhesive glass 2; 4 is a metal plate that is bonded to the cavity 1a with adhesive glass 2, and is made of a silver plate or the like. 5 is a small piece for a ground terminal (hereinafter referred to as a "small piece for a terminal") which is soldered to the end of this metal plate.
It is formed from the material shown in FIG. In the figure, 6 is a three-layer metal plywood material made of a 42 alloy material 6a as a base material, an aluminum material 6b on the front surface, and a solder material 6c on the back surface, and is shaped like a tape. This three-layer metal plywood material 6 is punched out into a small circle shown by a chain line to form a small terminal piece 5 shown in an enlarged view in FIG. 9.

Returning to FIG. 5, numeral 7 denotes a thin solder piece for bonding that is attached to the center of the metal plate 4, and 8 denotes a semiconductor chip that is die-bonded to the metal plate 4 through this thin solder piece.

When the metal plate 4 and the lead frame 3 are bonded to the substrate 1 under heat and pressure, a semi-finished product package 9 (generally called a third package) shown in FIG. 6 is obtained after the pressure bonding process is completed.

Further, in a bonding process, a thin solder piece 7 is attached to the metal plate 4, and the small terminal piece 5 and the semiconductor chip 8 are bonded to this semi-finished package 9, thereby forming the subsequent semi-finished package 10 shown in FIG.

Both the conventional manufacturing apparatus and the manufacturing apparatus according to the present invention are apparatuses for assembling a semi-finished package 10 as a semiconductor device before wire bonding.

FIG. 10 shows a pallet 11 on which semi-finished product packages 9 and 10 are arranged and stored.

A conventional semiconductor device manufacturing apparatus for assembling a semi-finished product package 10 will be explained with reference to FIGS. 11 to 14. As shown in FIG. 11a, the jig 12
The upper surface and the cavity 1a are placed on the crosspiece 12b addressed to the pair of
A substrate 1 coated with adhesive glass 2 is placed on the center of the substrate 1, a metal plate 4 is placed on the cavity 1a, and a lead frame 3 is placed on the substrate 1. This state is shown in FIG. 11b.

As shown in FIG. 12, the jig 12 has frame parts 12 on both sides.
A pair of crosspieces 10b are fixed between the crosspieces a, and a substrate 1 in the state shown in FIG. 11b is placed on each crosspiece. Up until now, the process had been done manually.

A jig 1 carrying a plurality of substrates 1 in such a state
2 is placed on the conveyor 14 of the infrared heating furnace 13 shown in FIG. 13, and is heated by running slowly. In this way, the adhesive glass 2 was heated and melted, and the lead frame 3 and the metal plate 4 were adhered by their own weight.

After completing this bonding process, the semi-finished package 9 shown in FIG. 6 is obtained.

As mentioned above, the semi-finished product package 9 carried out from the infrared heating furnace 13 is taken out from the jig 12,
After being washed and dried in a predetermined manner, they are arranged on a pallet 11 shown in FIG. 10 in order to be subjected to a device for the next bonding process.

FIG. 14 shows a manufacturing apparatus for a conventional bonding process. Reference numeral 15 denotes a loader section, on which a pallet 11 containing semi-finished product packages 9 is loaded, and a well-known orthogonal triaxial robot 16 loads the semi-finished products 9 one by one onto a heater rail 17, and bends the lead frame 3. Straddle the lead parts on both sides.

Next, reference numeral 18 denotes a forward feeding means having a plurality of feeding claws 18.
By repeating the operations of protrusion, forward movement of a predetermined stroke, retraction, backward movement, and return, the semi-finished product package 9 on the heater rail 17 is intermittently advanced one by one, and is positioned and fixed by a positioning mechanism (not shown). and heat it up.

Next, as shown in FIG. 9, the pre-punched terminal pieces 5 are supplied to a well-known ball feeder (also called parts feeder) 19, and the terminal pieces 5 from this ball feeder are picked and placed one by one. (Commercially available machine) 20,
The semi-finished product package 9, which is stopped on the heater rail 17, is placed on one end of the metal plate 4 of the substrate 1, and the terminal pieces 5 are joined by melting their own solder. 21 is a solder piece attachment means, and a small piece 5 for terminal
are joined and fed forward on the heater rail 17,
A solder thin piece 7 is placed on the center of the metal plate 4 of the positioned semi-finished product package 9 and bonded. 22 is a chip supply means for positioning and supplying the semiconductor chip 8 in the die bonding process, and is constructed as follows. A tray 24 is fixed on an XY table 23 with a positioning mechanism, and an adhesive sheet is stretched and held on this tray, and a large number of semiconductor chips 8 separated from a wafer are placed on this adhesive sheet.
is attached.

A detection camera 25 detects the position of the semiconductor chip 8 to be picked up, this detection signal is input to a processing circuit, and the movement is adjusted by the XY table 23 according to this command signal so that it is at a predetermined picked up position.

Reference numeral 26 denotes die bonding means, which moves the semiconductor chip 8 on the positioned tray 24 by suctioning it with a suction head 26a, moves it forward on the heater rail 17, and places it on the metal plate 4 of the positioned semi-finished product package 9. Die bonding is performed through the solder thin piece 7. In this way, the latter semi-finished product package 10 shown in FIG. 7 is formed.

This semi-finished product package 10 is fed forward to a storage section 27 and stored on a pallet 11 by a well-known orthogonal triaxial robot 28.

Furthermore, each semi-finished product package 10 stored in the pallet 11 is sent to the next visual inspection process, where it is judged good or bad and defective products are removed. Thereafter, it is sent to the next wire bonding step, and after the wire bonding, an insulating lid is glass-sealed and bonded to the top.

[Problem that the invention seeks to solve]

The conventional glass-sealed semiconductor device manufacturing apparatus described above requires an infrared heating furnace 13, and the lead frame 3 and metal plate 4 are manually placed on the substrate 1 to pass through the heating furnace. The substrate 1 had to be placed on the jig 12 in this state. Heating furnace 13
Each semi-finished package 9 that has been passed through the bonding process is taken out from the jig 12, and in order to remove any foreign matter that has adhered to it,
There was a problem in that cleaning and drying had to be done manually.

Furthermore, in order to supply the semi-finished packages 9 to the means for the bonding process, they must be manually aligned and stored on the pallet 11, resulting in very low workability.

Furthermore, there was a problem in that the terminal pieces 5 were fed in an aligned manner by the ball feeder 19, but the terminal pieces 5 were sometimes delivered with the front and back sides reversed.

Furthermore, the semi-finished package 9 which has been heated through the infrared heating furnace 13 and cooled by cleaning and drying is heated again by the heater rail 17 in order to thermocompress the semiconductor chip 8 by the die bonding means 26. These heat cycles cause the metal plate 4 to
There was a major problem in that an oxide film was formed on the surface of the die bonding, which inhibited the spread of the solder material in the solder flakes 7 during die bonding, resulting in defective die bonding.

This invention was made to solve these problems, and the process of crimping the metal plate and lead frame to the board, and the bonding process of solder thin pieces, terminal pieces, and semiconductor chips are automatically and consistently performed. Manufacture of glass-sealed semiconductor devices that greatly improves productivity, eliminates the adhesion of foreign substances, eliminates the need for cleaning and drying, eliminates conventional heat cycles, and allows for high-quality die bonding. The purpose is to obtain equipment.

Furthermore, defects are automatically detected in each crimping process and each bonding process, and the defective products are passed through the next bonding process without being carried out, and are finally removed as defective products, leaving the non-defective semi-finished product package. The object of the present invention is to provide a manufacturing apparatus for semiconductor devices which is housed in pallets and which eliminates the need for visual inspection and saves labor.

[Means for solving problems]

In the glass-sealed semiconductor device manufacturing apparatus according to the present invention, a heater rail and a transport means are arranged in parallel, the substrate supply means supplies the substrates one by one onto the heater rail, and the transport means supplies the substrates to each step in a predetermined manner. A semi-finished product is formed by intermittent forward feeding to a position, and a metal plate crimping means, a lead frame crimping means, a solder piece adhering means, a terminal small piece crimping means, a die bonding means, and a chip supplying means to the die bonding means are sequentially arranged and bonded. A defective product removing means for removing defective products from the package and a storage means for storing non-defective products in pallets are provided, and an imaging camera as a recognition means is arranged for each crimping process and each bonding process to detect and store the mutual positions of the crimping members. Then, use this information to determine pass/fail.
This information command is given to the defective product removal means.

[Effect]

In this invention, a metal plate is heated and crimped by a metal plate crimping means, a lead frame is heated and crimped by a lead frame crimping means, and then a A thin solder piece is attached to the center using a solder piece adhering means, and then a small terminal piece is bonded to one end of the metal plate using a small terminal piece crimping means,
Furthermore, a semiconductor chip is bonded to the center of the metal plate by die-bonding means through a solder thin piece, and a semi-finished product package is formed. Determine whether it is good or bad,
In response to this command, defective products are removed by the removal means, and good products are sequentially arranged and stored on each pallet by the storage means, so that they can be sent to the next wire bonding process.

〔Example〕

FIG. 1 is a perspective view showing an embodiment of a glass-sealed semiconductor device manufacturing apparatus according to the present invention. 3
Reference numeral 1 denotes a heater rail arranged in the longitudinal direction to heat the substrate 1 placed on the upper part and fed to an appropriate temperature; 32 is a conveying means arranged parallel to this heater rail 31; It is pinched by a pair of front and rear pinching claws 32a and 32b, and is intermittently fed forward to each predetermined process position.

In the front half along the heater rail 31, a substrate supply means 33, a metal plate temporary attachment means 40, a first pressure means 44, a lead frame temporary attachment means 45, and a second pressure means 53 are arranged in order. There is.

Further, in the latter half, a solder piece tacking means 5 is sequentially provided.
4, Terminal small piece crimping means 58, die bonding means 6
2. Defective product removal means 68 and good product storage means 69
is installed. 65 is a chip supply means for supplying the semiconductor chip 8 to the die bonding means 62; 74;
is a control panel that automatically controls the means of each process using a computer.

At each crimping process and bonding process, an imaging camera 81 as a first recognition means and a second
An image pickup camera 82 of the recognition means, an image pickup camera 83 of the third recognition means, and an image pickup camera 84 of the fourth recognition means are arranged. (Illustrations omitted)
It is detected and stored by the video signal circuit of the control panel 74, and the computer of the control panel 74 determines whether it is good or bad and issues an information command.

Reference numeral 85 denotes an imaging camera as a fifth recognition means, which takes images of each of the semiconductor chips 8 of the chip supply means 65, and the recognition means (not shown) detects and stores the position and stores the image using a video signal circuit. The computer of the control panel 74 determines the quality of the product, and issues an information command regarding the quality and its position.

Each of the recognition means has an imaging camera and a video signal processing circuit, and the imaging camera is, for example, an image sensor camera (CCD camera).

The structure and operation of each means in the crimping process in the front half of the apparatus shown in FIG. 1 will be explained with reference to the enlarged view in FIG. 2.

The substrate supply means 33 is configured as follows. Reference numeral 34 denotes a stage that can be moved left and right, and as shown in FIG. There is. The substrate 1 in the tube 35 is pushed up from the bottom by the push-up mechanism 36, and the substrate 1 that has reached the top is 1
The sheet is transferred onto the preheating heater rail 38 by a well-known pick and place 37. The substrate 1 on this preheating heater rail is sent onto the heater rail 31 by the feeding mechanism 39.

In this way, when all the substrates 1 in a certain tube 35 are taken out and become empty, the stage 34 is moved and the next tube 35 is set to the take-out position, and one substrate 1 is taken out.
Each sheet is taken out. This operation is repeated in sequence, and the substrates 1 in each tube 35 are taken out and supplied.

The well-known conveyance means 32 has a pair of front and rear pinching claws 32a, 32b, as shown in the operation explanatory diagram in FIG.
A large number of sets are arranged, and from return position B to C.
The substrate 1 that has been projected to the position and sent onto the heater rail 31 is pinched from both ends. Next, move forward to the D position with a predetermined stroke, and press the pinch claw 32.
a and 32b are released from the pinch, and are pulled into the E position and then returned to the return position B. This operation is repeated to intermittently feed the substrate 1 forward one by one.

In this way, the substrate 1, which is fed forward on the heater rail 31 in the direction A and heated to a predetermined temperature, reaches the position of the metal plate temporary attachment means 40, and the two pinching claws 32a, 3
It is stopped while being pinched by 2b.

The metal plate temporary attachment means 40 is configured as follows. A ribbon-shaped metal material is wound around a reel mechanism 41, and is punched out into a metal plate 4 (see FIG. 5) by a punching mechanism 42, using a well-known pick and place 4.
3, and is temporarily attached to the cavity 1a of the substrate 1, which is stopped at the predetermined position.

The board 1 to which the metal plate 4 is temporarily attached is sent over the heater rail 31 to below the imaging camera 81 of the first recognition means, the metal plate 4 and the board 1 are imaged, and the recognition means detects and stores the positional relationship. Ru.

Subsequently, the board 1 is placed on the heater rail 31 in the first place.
The metal plate 4 is heated and pressed to the position of the pressure means 44 .

The board 1 with the metal plate 4 crimped thereon is fed forward on the heater rail 31 and is attached to the lead frame temporary attachment means 4.
It is stopped at position 5.

The lead frame temporary attachment means 45 is configured as follows. Reference numeral 46 denotes a stage that can be moved left and right, and tubes 47 in which a large number of lead frames 3 are arranged and housed are attached in parallel in a plurality of rows. The lead frames 3 in the tube 47 are pushed up from the bottom by a push-up mechanism 48, and the lead frames 3 that have reached the top are moved one by one onto the preheating heater rail 50 by a well-known pick and place 49. The lead frame 3 on this preheating heater rail is moved by a feeding mechanism 51, and the lead frame 3 is placed on the well-known pick and place 5
2, it is temporarily attached onto the substrate 1 which is stopped at the predetermined position.

The board 1 to which the lead frame 3 is temporarily attached is sent over the heater rail 31 to below the imaging camera 82 of the second recognition means, the board 1 and the lead frame 3 are imaged, and the positional relationship is detected and stored by the recognition means. Ru.

Subsequently, the substrate 1 is sequentially sent on the heater rail 31 to a plurality of sets of second pressurizing means 53, heated to a plurality of temperatures and pressurized, and then placed on the lead frame 3.
is crimped. In this way, a semi-finished package 9 (see FIG. 6) which has completed the crimping process is obtained.

Next, the structure and operation of each means in the bonding process in the latter half of the apparatus shown in FIG. 1 will be explained with reference to the enlarged view in FIG. 4.

The semi-finished product package 9 to which the lead frame 3 is crimped is sent on the heater rail 31 and stopped at the position of the solder piece tacking means 54. This solder piece tacking means 54 is constructed as follows.
A thin ribbon-shaped solder material is wound around a reel mechanism 55, and is cut into solder thin pieces 7 of a predetermined length (see FIG. 5) by a cutting mechanism 56. These thin solder pieces 7 are placed on the board 1 by a pick-and-place 57. Temporarily attach it to the center of the metal plate 4.

The semi-finished product package 9 to which the solder thin piece 7 is temporarily attached is stopped on the heater rail 31 at the position of the terminal small piece crimping means 58.

This terminal small piece crimping means 58 is constructed as follows. Solder material 6c (eighth
A small terminal piece 5 (see Fig. 9) is punched out by a punching mechanism 60 from a ribbon-shaped three-layer plywood material 6 wrapped with a (see figure) on the back side, and is adsorbed by a pick and place 61 to form a solder material 6c. Bonding is performed on one end of the metal plate 4 of the substrate 1 while the substrate 1 is on the back side.

The semi-finished product package 9 to which the small terminal piece 5 is glued is sent over the heater rail 31 to below the imaging camera 83 of the third recognition means, where the metal plate 4 and the small terminal piece 5 are imaged, and the position is determined by the recognition means. Relationships are detected and stored.

The semi-finished product package 9 imaged by the imaging camera 83 is sent on the heater rail 31 to a die bonding process position.

The chip supply means 65 is constructed as follows. A tray 67 with an adhesive sheet stretched and held on its upper surface is fixed on an XY table 66 having a positioning mechanism, and a large number of divided semiconductor chips 8 are pasted on this adhesive sheet.

This tray 67 is placed in the fifth position by the XY table 66.
is moved under the imaging camera 85 of the recognition means, each semiconductor chip 8 is imaged, and the recognition means and computer output information designation of each position and quality.
Based on this designation, the XY table 66 is moved and adjusted to place the good semiconductor chip 8 at a predetermined suction position.

Therefore, the suction head 63 of the well-known die bonding means 62 is moved to the tray 67 side, the semiconductor chip 8 at the suction position is imaged by the imaging camera 84, the position is detected by the fourth recognition means, and a position correction command is issued by the computer. , this results in XY table 6
6 moves and corrects the semiconductor chip 8 to the correct suction position. Next, the semiconductor chip 8 at this suction position is suctioned by the suction head 63, and die bonded via the solder thin piece 7 to the center of the metal plate 4 of the substrate 1 of the semi-finished package 9 waiting on the heater rail 31. .

At this time, the substrate 1 and the semiconductor chip 8 are imaged by the imaging camera 84 of the fourth recognition means supported by the suction head 63, and the mutual positions and the state of wetting and spreading due to the melting of the solder flakes 7 are detected and stored.

In this way, the semi-finished product package 10 (see FIG. 7) that has undergone the bonding process is transferred to the conveying means 3.
2, it is fed forward on the heater rail 31 and reaches the position of the defective product removing means 68. This defective product removal means 68 is composed of a well-known orthogonal triaxial robot.
Defective products are stored in the defective product pallet 11a based on the quality determination information based on the detection for each process by the first to fourth recognition means provided for each of the crimping processes.

On the other hand, the non-defective semi-finished product package 10 is sent to the suction position of the storage means 69 by the conveyance means 32. The storage means 69 is configured as follows. The pallets 11 are stacked by pallet storage mechanisms 70 on both sides, and are provided with a positioning mechanism for the pallets 11 and a pallet moving mechanism (both not shown) capable of moving vertically and horizontally. moreover,
In the center, there is an orthogonal two-axis movement mechanism 71 that can move up and down and back and forth, and a suction mechanism 72 for the semi-finished product package 10.
It is equipped with

By each of these mechanisms, the semi-finished products packages 10 of good quality are sequentially arranged and stored on the pallet 11.

As described above, by repeating the operations by means of each step, the semi-finished package 10 is formed consistently and continuously.

To replenish the substrate 1 and lead frame 3 to the substrate supply means 33 and the lead frame temporary attachment means 45, the tubes 35 and 4 are placed on the stages 34 and 46.
It is only necessary to replenish the liquid every 7 hours, and there is no need to stop the operation of the device.

Metal plate tacking means 40, solder flake tacking means 54
Replacement of each reel with the terminal small piece crimping means 58 can be done by wrapping each tape-like member around the reel to a sufficient length so that replacement is unnecessary for a long time, and when replacing each reel, it is necessary to replace each reel with a refill. All you have to do is replace it, which can be easily done in a short time.

The terminal small piece crimping means 58 has a three-layer plywood material 6 wound around a reel with the solder material 6c on the back side.
Since the solder material 6c is constantly supplied to the back side, there is no front-back misalignment as in the conventional case, and defective products due to this are eliminated.

In the die bonding process, the tray 6
Only non-defective semiconductor chips 8 from the 8 groups of semiconductor chips on the semiconductor chips 7 are adsorbed and supplied by the die bonding means 62, and the remaining defective semiconductor chips 8 are transferred together with the tray 67 to the tray conveying means 65.
The tray is automatically replaced with a new one, and good semiconductor chips 8 are continuously supplied.

In addition, the defective product pallet 11a placed below the defective product removal means 68 is for storing defective semi-finished products generated in each process, but when the manufacturing equipment is in continuous operation, the actual occurrence of defective products does not occur. There is no need to provide an automatic exchange mechanism for the pallets 11a.

Furthermore, in the storage means 69 for the non-defective semi-finished product packages 10, the non-defective semi-finished product packages 10 are sequentially placed on the pallet 11 by a storage mechanism 70 for the pallets 11, a pallet moving mechanism, an orthogonal two-axis moving mechanism 71, and a suction mechanism 72. After they are arranged and stored, they are automatically replaced with empty pallets 11, so the operator only has to replenish the empty pallets 11 and take out the pallets 11 filled with semi-finished product packages 10.

In addition, in the step of joining each member to the substrate 1, if each recognition means determines that the member is defective, the control is such that the member is allowed to pass through the board without being joined in subsequent steps.

〔Effect of the invention〕

As described above, according to the present invention, the substrate feeding means feeds the substrate one by one onto the heater rail, the conveying means advances the substrate to each predetermined position, and the pressing means and bonding means for each member to the substrate are applied. A means for removing defective products and a means for storing non-defective products from the completed semi-finished product package are arranged in order, and images are taken by an imaging camera of a recognition means arranged for each bonding process of each member, and the position of each member is detected. Good basis,
Defects are determined and information commands are used to remove defective products from the semi-finished package using a removing means and store non-defective products in a storage means, so that the bonding process of each component to the board is automatically and consistently. This greatly improves productivity, eliminates the conventional heat cycles and manual work, and improves quality.

In addition, by introducing the recognition means, it is possible to omit visual inspection of all products, resulting in labor savings.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of a glass-sealed semiconductor device manufacturing apparatus according to the present invention, and FIG.
An enlarged perspective view of the configuration of the first half of the device shown in the figure,
Fig. 3 is an explanatory diagram of the operation of a pair of pinching claws of the conveying device shown in Fig. 2, Fig. 4 is an enlarged perspective view of the constituent means of the rear half of the device shown in Fig. 1, and Fig. 5 is a glass sealing FIG. 6 is an exploded perspective view of a semi-finished package for a shaped semiconductor device, and FIG.
The figure is a perspective view of a subsequent semi-finished package made by bonding a small terminal piece and a chip to the semi-finished package shown in Fig. 6, and Fig. 8 is a three-layer metal plywood material used as the material for the ground terminal piece shown in Fig. 5. Perspective view, Figure 9 is the 8th
Fig. 10 is a perspective view showing a small piece for a ground terminal punched from the material shown in Fig. 10;
Figures 1 to 14 show conventional manufacturing equipment, and the first
Figure 1 is a front sectional view showing in order the joining of each member to the board using a jig, Figure 12 is a perspective view of the jig in Figure 11, and Figure 13 is a diagram showing the jig mounted on the jig in Figure 12. Perspective view of infrared heating furnace for semi-finished product packages, No. 14
This figure is a perspective view showing each means part of the bonding process of the semi-finished package processed in the heating furnace of FIG. 13. 1... Board, 1a... Cavity, 2... Adhesive glass, 3... Lead frame, 4... Metal plate, 5... Small piece for ground terminal, 6... Three-layer metal plywood material, 7... Solder Thin piece, 8... Semiconductor chip, 1
0...Semi-finished product package, 11...Pallet, 3
1... Heater rail, 32... Transport means, 32
a, 32b...Pinch claw, 33...Substrate supply means,
40... Metal plate temporary attachment means, 44... First pressurizing means, 45... Lead frame temporary attachment means, 53...
Second pressurizing means, 54...Solder piece tacking means, 5
8...Small piece crimping means for terminal, 62...Die bonding means, 63...Suction head, 65...Chip feeding means, 66...XY table, 67...Tray,
68... Defective product removal means, 69... Storage means, 8
1 to 85...imaging cameras of the first to fifth recognition means, and the same reference numerals in the drawings indicate the same or corresponding parts.

Claims (1)

[Scope of Claims] 1. An apparatus for manufacturing a glass-sealed semiconductor device, which includes the following means arranged in sequence. (a) A heater rail that is arranged in the longitudinal direction and heats the board placed on the top to be fed; (b) A heater rail that is arranged parallel to this heater rail and that heats the board on the heater rail in pairs from both ends. (c) A conveying means that pinches and feeds substrates intermittently using pinching claws and stops at each process position; (d) metal plate temporary attachment means for cutting a tape-shaped metal plate into small pieces of metal plates and temporarily attaching them to the cavity of the substrate on the heater rail; (e) the substrate and the metal plate; The first to detect and store the position of
(f) first pressure means for heat-pressing the metal plate; (g) lead frame tacking means for heating and tacking the lead frame onto the upper surface of the substrate via the adhesive glass; (h) a second recognition means for detecting and storing the position of the board and lead frame in this state; (i) a second pressurizing means for heat-pressing the lead frame; (j) cutting the tape-shaped solder material into solder thin pieces; means for temporarily attaching a solder piece to the center of the metal plate of the board; (k) a small piece for a ground terminal that is punched out of a tape-like three-layer metal plywood material and thermocompressed to one end of the metal plate of the board; crimping means; (l) third recognition means for detecting and storing the positions of the metal plate and the terminal piece; (m) a tray is fixed on an XY table having a positioning mechanism, and an adhesive stretched on the tray; A chip supply means which has a large number of divided semiconductor chips attached to the sheet surface and which places the semiconductor chips at a predetermined adsorption position; (n) detects and stores the position and image of each semiconductor chip on the tray; (p) a fifth recognition means for inputting the detection information into a computer to judge whether the chips are good or bad, and causing the chip supply means to place only non-defective semiconductor chips at the suction position; die-bonding means for adsorbing a semiconductor chip with a suction head and thermocompression-bonding it to the center of the metal plate of the substrate via the solder thin piece; (q) fourth recognition means for detecting and storing the positions of the metal plate and the semiconductor chip; , (r) A computer determines pass/fail based on the information detected by each of the recognition means, and a command thereof is given;
A means for removing defective products from the semi-finished packages after the die bonding process; (s) A storage means for arranging and storing the non-defective products of the semi-finished packages on a pallet.