JPH0465109A - Apparatus for attaching tape to wafer - Google Patents

Abstract

PURPOSE:To obtain a low cost and simplified apparatus for attaching a tape to a wafer by forming a pressing part of press with a soft property material having recovery function and allowing the pressing surface to gradually curved and is protruded toward a film from the external side to the center. CONSTITUTION:A pressing part 2 is formed with a soft property material and is protruded by gradually curving toward the center from the external circumference. When a vacuum chamber B is evacuated to predetermined degree of vacuum to allow the pressing part 2 to move downward, a film C attached to a supporting frame E is pushed by a pushing surface 3, protruding the center thereof. When it is further moved downward, the pressing part 2 of the soft property material is pressed by a semiconductor wafer A through the film C and is deformed conforming to the shape. Thereby, bubbles between the film C and semiconductor wafer A are pushed out to the external side from the center. Moreover, when a press 1 is further operated for pressing, bubbles between the film C and semiconductor wafer A are further pushed out to the outside, causing these materials to be in close contact.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The apparatus for applying tape to a wafer of the present invention is used to apply a tape to one surface of a semiconductor wafer.

(Prior Art) In the post-manufacturing process, semiconductor wafers are protected from damage during cutting by applying a protective tape to the front surface and a tape attached to a frame on the back surface of the semiconductor wafer.

In this case, the film and the semiconductor wafer are pasted in a vacuum chamber of a tape pasting device to prevent air bubbles from entering between the film and the semiconductor wafer. A conventional tape applicator is shown in FIG. This is done after evacuating the inside of vacuum chamber B to a predetermined degree of vacuum using a vacuum evacuation device.
A roller D provided inside moves the film C attached to the support frame E onto the semiconductor wafer A in the direction of arrow Z.
The film C is pressed against the semiconductor wafer A by pressing the film C against the semiconductor wafer A by pressing the film C against the semiconductor wafer A by pressing the film C against the semiconductor wafer A by rotating the same roller D in the direction of the arrow X in the same figure and then moving it in the direction of the arrow y. Ta.

Incidentally, an adhesive is applied to the back surface of the film C in advance, so that simply by pressing the film C onto the semiconductor wafer A, the two can be bonded together.

(Problem to be Solved by the Invention) However, in the conventional vacuum pasting device, the roller drive device F that rotates or moves the roller D is
Since it must be provided within vacuum chamber B, the capacity within chamber B becomes large. As the capacity increases, the amount of exhaust from vacuum chamber B increases, so a large-capacity exhaust device is required to create a high degree of vacuum in chamber B, making the vacuum device large and expensive. .

Furthermore, in order to operate the roller D in a vacuum, various parts including the roller drive device F need to be made airtight, which makes the structure complicated and the device even more expensive.

(Objective of the Invention) An object of the present invention is to provide an apparatus for applying tape to a wafer that does not use conventional rollers, has a small vacuum evacuation device, has a simple structure, and is inexpensive.

(Means for Solving the Problems) As shown in FIGS. 1 to 6, the device for applying tape to a wafer according to the present invention is configured to apply tape to a semiconductor set on a wafer support stand 5 in a vacuum chamber B, as shown in FIGS. In an apparatus for applying tape to a semiconductor wafer that applies a film C to one surface of a wafer A, a press apparatus 1 for pressing a film C onto the semiconductor wafer A is provided above the wafer support stand 5 in the vacuum chamber B, and the press apparatus The pressing part 2 of 1 is formed of a soft material having resilience, and the pressing surface 3 of the pressing part 2 is formed so as to gradually curve and protrude toward the film C from the outside toward the center. This is a characteristic feature.

(Function) In the apparatus for applying tape to a wafer according to the present invention, the suppressing part 2 is formed of a soft material and protrudes gradually from the outer periphery toward the center. After evacuating the vacuum chamber B shown in the figure to a predetermined degree of vacuum, when the pressing part 2 of the press device 1 is lowered in the direction of the arrow in the figure as shown in FIG. The film C is pressed by the pressing surface 3 of the pressing section 2, and its central portion protrudes.

When the pressing part 2 is further lowered from this state by the press device l, the suppressing part 2 made of a soft material as shown in FIG.
The film C is pressed against the semiconductor wafer A through the film C and deformed to follow the shape of the semiconductor wafer A. At the same time, the film C is gradually pressed against the semiconductor wafer A from the center outward, and the film C and the semiconductor are Air bubbles between the wafer A and the wafer A are pushed out from the center. Furthermore, by pushing out the press device 1 or pushing out the wafer pedestal 5 on which the semiconductor wafer A is placed as shown in FIG. When pressed, the air bubbles between the film C and the semiconductor wafer A are pushed out and the two are brought into close contact with each other.

(Example) A shown in FIG. 1, which is an example of the apparatus for applying tape to a wafer of the present invention, is a semiconductor wafer.

B in the figure is a vacuum chamber, which is divided into upper and lower halves into an upper body 10 and a lower body 11. A vacuum exhaust device (not shown) is connected to an exhaust port 12 provided in the upper body 10. Further, an O-ring 13 is attached to the joint surface between the upper body 10 and the lower body 11, so that the airtightness within the vacuum chamber B is maintained when the two are joined.

1 in Fig. 1 is a press device, which is a vacuum chamber B.
It is attached to the upper body lO. This press device 1 is for pressing a film C onto a semiconductor wafer A, and is composed of a cylinder 15 attached to the outside of the upper body 10 and a suppressing part 2 provided inside the upper body 10. The pressing part 2 is attached to a rod 15a of the cylinder 15, and the rod 15a expands and contracts in the vertical direction (arrow a) in the figure.
-b direction). Of course, an O-ring 16 is interposed between the rod 15a and the upper body 10 to maintain airtightness within the vacuum chamber B.

The suppressing portion 2 is made of a resilient soft material, and is attached to the lower surface of a metal mounting plate 17 made of aluminum or the like. As this soft material, for example, a rubber-like material having a hardness of about 20 degrees as defined by JISA can be used, and as long as the hardness is at that level, the film C and the semiconductor wafer A will not be damaged. If it is harder than this, when the semiconductor wafer A is pressed through the film C, there is a risk that the wafer A will be damaged, so it is not preferable.

Moreover, the pressing portion 2 is formed so that its pressing surface 3 gradually curves and protrudes from the outer periphery toward the center. In this embodiment, the amount of protrusion of the pressing surface 3 is approximately 0.5 to 1.0 mm relative to the overall height of the pressing portion 2 of 4 to 6 mm.

E in FIG. 1 is a support frame, and the vacuum chamber B
It is provided below the lower body 11. The lower surface of the film C is attached to this support frame E. Incidentally, the back side of this film C is coated with an adhesive in advance as in the conventional case.

Reference numeral 5 shown in FIG. 1 is a wafer holder provided in the lower body 11 of the vacuum chamber B, which is supported in the direction of arrow c-d in FIG. It is designed to be raised and lowered. An O-ring 22 is installed between the rod 20a and the lower body 11, and an O-ring 24 is installed between the guide 21 and the lower body 11.

Reference numeral 25 in FIG. 1 is an upper body elevating device for elevating the upper body 10 in the direction of the arrow ef force in the figure, and 26 is a lower body elevating device for elevating the lower body 11 in the direction of the arrow gh in the figure. The upper body 10 and the lower body 11 are brought into contact with each other and separated by the device. These lifting devices 2
Reference numerals 5 and 26 have the same structure, and both include a lifting cylinder 27 that moves the upper body 10 or the lower body 11 in the vertical direction.
and an arm 2 that guides the movement of the upper body lO or the lower body 11.
8.29 is provided.

In this embodiment, the film C affixed to the support frame E is set in the vacuum chamber B in detail. Divided vacuum chamber B
The film C may be continuously fed between the upper body IO and the lower body 11, and the film C may be sandwiched between the upper body 10 and the lower body 11.

(Effects of the Invention) The apparatus for applying tape to a wafer of the present invention has the following effects.

(2) Since the air bubbles between the film C and the semiconductor wafer A are pushed out and the two are brought into close contact with each other, there is no need to use the conventional roller D to bond the film C and the semiconductor wafer A. Furthermore, since the drive device F for rotating and moving the roller D is also unnecessary, the capacity of the vacuum chamber B can be reduced, resulting in a small and inexpensive wafer tape application device.

(2) A small and inexpensive vacuum evacuation device for evacuating the inside of the vacuum chamber B can be used, so the entire device becomes compact. Furthermore, since the mechanism for moving the press device 1 is simplified, the inside of the vacuum chamber B can be easily made airtight, and the cost can be further reduced.

[Brief explanation of drawings]

FIG. 1 is a partially sectional front view showing an embodiment of the device for applying tape to a wafer of the present invention, FIGS. 2 to 6 are illustrations for explaining the use of the device, and FIG. FIG. 8 is a partially sectional front view showing another embodiment of the tape applicator, and FIG. 8 is a partially sectional front view showing a conventional tape applicator. l is the press device 2 is the press unit 3 is the press surface 5 is the wafer support stand A is the semiconductor wafer B is the vacuum chamber C is the film

Claims (1)

[Claims] In a semiconductor wafer tape application device that applies a film C to one surface of a semiconductor wafer A set on a wafer support 5 in the vacuum chamber B, the wafer support 5 in the vacuum chamber B is A press device 1 for pressing the film C onto the semiconductor wafer A is provided above, and the pressing section 2 of the press device 1 is made of a resilient soft material, and the pressing surface 3 of the pressing section 2 is pressed from the outside to the center. A device for applying tape to a wafer, characterized in that the device is formed so as to gradually curve and protrude toward the film C side.