JPH0465183A - Circuit board fitted with projections and method of solder application to said board, and jig - Google Patents
Circuit board fitted with projections and method of solder application to said board, and jigInfo
- Publication number
- JPH0465183A JPH0465183A JP17636090A JP17636090A JPH0465183A JP H0465183 A JPH0465183 A JP H0465183A JP 17636090 A JP17636090 A JP 17636090A JP 17636090 A JP17636090 A JP 17636090A JP H0465183 A JPH0465183 A JP H0465183A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pads
- protrusions
- projections
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、突起付き回路基板と、同基板のパッドへの半
田塗布方法および半田塗布治具に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board with protrusions, a method for applying solder to pads on the same board, and a solder application jig.
モールド成形用の金型内に所要の回路パターンを有する
回路フィルムをセットして樹脂のモールド成形を行うと
、樹脂成形体と回路フィルムとが一体化されたいわゆる
モールド回路基板が得られる。このモールド回路基板は
、樹脂成形体の形状を立体的にできるため、例えば部品
実装面に部品位置決め用の突起や補強用の突起を一体に
形成した突起付き回路基板としての用途が見込まれてい
る（実開昭６３−５０１７２号公報）。When a circuit film having a desired circuit pattern is set in a mold for molding and resin molding is performed, a so-called molded circuit board in which the resin molded body and the circuit film are integrated is obtained. Since this molded circuit board allows the shape of the resin molded body to be three-dimensional, it is expected to be used as a circuit board with protrusions, for example, where protrusions for component positioning and protrusions for reinforcement are integrally formed on the component mounting surface. (Utility Model Application Publication No. 63-50172).
ところで回路基板に電子部品を表面実装する場合には、
パッドにクリーム半田を塗布する必要があるが、これに
は通常、スクリーン印刷法が用いられている。この方法
は、回路基板のパッドに対応する部分に穴を形成したマ
スクを回路基板に被せ、その上にクリーム半田を載せて
スキージで擦り付けるという方法である。By the way, when surface mounting electronic components on a circuit board,
It is necessary to apply cream solder to the pad, which is usually done using a screen printing method. In this method, a mask with holes formed in the areas corresponding to the pads of the circuit board is placed over the circuit board, cream solder is placed on top of the mask, and the mask is rubbed with a squeegee.
しかしこのスクリーン印刷法を突起付き回路基板に適用
すると、仮に突起に対応する部分に穴をあけたマスクを
使用したとしても、突起が障害となってスキージを全面
ムラなく移動させることが困難であり、また突起にクリ
ーム半田が付着してしまうため、それを除去することが
難しい。However, when this screen printing method is applied to a circuit board with protrusions, even if a mask with holes corresponding to the protrusions is used, the protrusions become an obstacle and it is difficult to move the squeegee evenly over the entire surface. Also, since cream solder adheres to the protrusions, it is difficult to remove it.
このため突起付き回路基板の場合は、デイスペンサーに
よりクリーム半田を塗布することも考えられるが、この
方法はパッド毎にクリーム半田を載せて行く方式である
ため、時間がかかり、また微細なパッドパターンに対応
できないという難点がある。For this reason, in the case of a circuit board with protrusions, it is possible to apply cream solder using a dispenser, but this method requires applying cream solder to each pad, which is time-consuming and requires a fine pad pattern. The problem is that it cannot respond to
〔課題の解決手段とその作用〕
本発明は、上記のような従来技術の課題を解決した突起
付き回路基板を提供するもので、その構成は、部品実装
面に多数の突起を有する突起付き回路基板において、前
記突起は部品実装面を横切って１方向に延びる１条また
は複数条の帯状区域内に形成し、部品の端子部が半田付
けされるパッドはその帯状区域外に形成したことを特徴
とするものである。[Means for Solving the Problems and Their Effects] The present invention provides a circuit board with protrusions that solves the problems of the prior art as described above. In the board, the protrusion is formed within one or more strip-shaped areas extending in one direction across the component mounting surface, and the pads to which the terminal portions of the components are soldered are formed outside the strip-shaped areas. That is.
このように、突起を１方向に延びる帯状区域内にまとめ
て形成し、パッドをそれ以外の区域に形成したのは、突
起に邪魔されずにクリーム半田のスクリーン印刷が行え
るようにするためである。In this way, the protrusions are formed all together in a band-shaped area extending in one direction, and the pads are formed in other areas so that screen printing of cream solder can be performed without being hindered by the protrusions. .
突起付き回路基板を上記のように構成すると、その回路
基板の、突起を形成した帯状区域以外の区域に、パッド
に対応する穴を形成したマスクを被せて、クリーム半田
をスクリーン印刷するという方法でクリーム半田の塗布
が行える。When the circuit board with protrusions is configured as described above, a mask with holes corresponding to the pads is placed over the area of the circuit board other than the band-shaped area where the protrusions are formed, and cream solder is screen printed. Can apply cream solder.
突起を形成した帯状区域は１方向に延びているから、ス
キージをそれと同方向に移動させれば、スキージが突起
に突き当たることがなく、スキージを全面にムラなく摺
動させることが可能となる。Since the band-shaped area in which the protrusions are formed extends in one direction, if the squeegee is moved in the same direction, the squeegee will not hit the protrusions, and the squeegee will be able to slide evenly over the entire surface.
また上記の突起付き回路基板のパッドにクリーム半田を
塗布するには、パッドに対応する穴を形成したマスクを
、突起付き回路基板の突起が形成された帯状区域以外の
区域を覆うように版枠に固定し、かつ前記マスクには帯
状区域とそれ以外の区域との境界に沿って立上げ縁を形
成した治具を使用するとよい。In addition, in order to apply cream solder to the pads of the above-mentioned circuit board with protrusions, a mask with holes corresponding to the pads is placed on the plate frame so as to cover the area other than the band-shaped area where the protrusions are formed on the circuit board with protrusions. It is preferable to use a jig which is fixed to the mask and has a raised edge formed along the boundary between the band-shaped area and other areas.
上記の立上げ縁は、クリーム半田が帯状区域内に侵入し
ないようにし、パッド以外に半田が付着するのを防止す
る働きをする。The raised edges serve to prevent cream solder from penetrating into the strip area and to prevent solder from adhering to anything other than the pad.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図−１は本発明に係る突起付き回路基板の一実施例を示
す。この突起付き回路基板１１は、所要の回路パターン
を形成した回路フィルム１２の裏面にモールド成形によ
り樹脂成形体１３を一体に形成すると共に、回路フィル
ム１２の表面（部品実装面）側に樹脂成形体１３と一体
に突起１４を形成したものである。回路フィルム１２の
突起１４部分には予め穴が形成されていて、その穴を通
して樹脂成形体１３と突起１４が一体化されている。回
路フィルム１２には部品の端子部が半田付けされるパッ
ド１５が形成されており、パッド１５以外の部分は半田
レジストで覆われている。FIG. 1 shows an embodiment of a circuit board with protrusions according to the present invention. This circuit board 11 with protrusions has a resin molded body 13 integrally formed by molding on the back side of a circuit film 12 on which a required circuit pattern is formed, and a resin molded body 13 on the front surface (component mounting surface) side of the circuit film 12. A protrusion 14 is formed integrally with the protrusion 13. A hole is previously formed in the protrusion 14 portion of the circuit film 12, and the resin molded body 13 and the protrusion 14 are integrated through the hole. Pads 15 to which terminal portions of components are soldered are formed on the circuit film 12, and portions other than the pads 15 are covered with solder resist.
この突起付き回路基板１１の特徴は、突起１４が部品実
装面を横切って１方向に延びる帯状区域Ａ内にまとめて
形成されており、パッド１５がその帯状区域Ａ以外の領
域に形成されていることである。The feature of this circuit board 11 with protrusions is that the protrusions 14 are collectively formed in a band-shaped area A that extends in one direction across the component mounting surface, and the pads 15 are formed in an area other than the band-shaped area A. That's true.
パッド１５以外の回路パターンは図示してないが帯状区
域Ａ内に入っていても差し支えない。Although the circuit patterns other than the pad 15 are not shown, there is no problem even if they are included in the band-shaped area A.
このような突起付き回路基板１１のパッド１５にクリー
ム半田を塗布する方法を図−２に示す。この方法は、突
起付、き回路基板１１の、突起１４を形成した帯状区域
Ａ以外の区域にそれぞれ、パッド１５に対応する穴１６
を形成したマスク１７を被せ、各マスク１７上にクリー
ム半田（図示せず）を載せて、スキージ１８を帯状区域
へと同方向に摺動させることにより、パッド１５上にの
みクリーム半田を付着させるものである。A method of applying cream solder to the pads 15 of such a circuit board 11 with protrusions is shown in FIG. In this method, holes 16 corresponding to the pads 15 are formed in each area of the circuit board 11 with projections other than the band-shaped area A in which the projections 14 are formed.
The cream solder (not shown) is placed on each mask 17, and the cream solder is deposited only on the pads 15 by sliding the squeegee 18 in the same direction to the strip area. It is something.
マスク１７には帯状区域へとそれ以外の区域との境界に
沿って立上げ縁１９が形成されている。各マスク１７は
、図−３に示すように突起付き回路基板１１の帯状区域
Ａ以外の区域を覆うように位置決めされて、版枠２０に
固定され、半田塗布治具２１を構成している。A raised edge 19 is formed on the mask 17 along the boundary between the band-shaped area and other areas. As shown in FIG. 3, each mask 17 is positioned so as to cover an area other than the band-shaped area A of the circuit board 11 with protrusions, and is fixed to the printing frame 20, thereby forming a solder application jig 21.
またスキージ１８には突起１４およびマスク１７の立上
げ縁１９が入る大きさの切欠き２２が形成されている。Furthermore, a notch 22 is formed in the squeegee 18 and is large enough to accommodate the protrusion 14 and the raised edge 19 of the mask 17.
スキージ１８の材質は従来同様ウレタンゴムなどである
。The material of the squeegee 18 is urethane rubber, etc. as in the conventional case.
以上のように構成すれば、突起１４に関係なく、スキー
ジ１８を１方向に移動させるだけで、パッド１５にクリ
ーム半田を塗布することができる。With the above configuration, cream solder can be applied to the pad 15 by simply moving the squeegee 18 in one direction, regardless of the protrusion 14.
図−４は半田塗布治具の他の実施例を示す。この治具２
１は、版枠２０の両端部底面に金属板２３を固定し、こ
の金属板２３にマスク１７の両端部をネジ２４で締付は
固定したものである。金属板２３およびマスク１７のい
ずれか一方のネジ穴は図示してないが例えば十字形にな
っている。このような構成にしておくと、マスク１７相
互のわずかな位置ズレをネジ２３を緩めることによって
修正することができる。Figure 4 shows another embodiment of the solder application jig. This jig 2
1, a metal plate 23 is fixed to the bottom surface of both ends of a plate frame 20, and both ends of a mask 17 are fastened to the metal plate 23 with screws 24. Although not shown, the screw holes in either the metal plate 23 or the mask 17 are shaped like a cross, for example. With this configuration, slight positional deviations between the masks 17 can be corrected by loosening the screws 23.
以上説明したように本発明によれば、スキージを１方向
に摺動させるだけで、突起付き回路基板のパッドにクリ
ーム半田を簡単にしかも一様に塗布することができるよ
うになり、クリーム半田の印刷作業性が向上し、突起付
き回路基板への部品実装コストを低減することができる
。As explained above, according to the present invention, cream solder can be easily and uniformly applied to the pads of a circuit board with protrusions by simply sliding the squeegee in one direction. Printing workability is improved and the cost of mounting components onto a circuit board with protrusions can be reduced.
図−１は本発明に係る突起付き回路基板の一実施例を示
す斜視図、図−２は本発明に係る突起付き回路基板への
半田塗布方法の一実施例を示す断面図、図−３および図
−４はそれぞれ本発明に係る半田塗布治具の実施例を示
す平面図である。
１１：突起付き回路基板 １２：回路フィルム１３：樹
脂成形体 １：４：突起 １５：パッド、：Figure 1 is a perspective view showing an embodiment of a circuit board with projections according to the present invention, Figure 2 is a sectional view showing an embodiment of the method of applying solder to a circuit board with projections according to the invention, and Figure 3 and FIG. 4 are plan views showing embodiments of the solder applicator according to the present invention. 11: Circuit board with protrusions 12: Circuit film 13: Resin molded body 1: 4: Protrusions 15: Pad, :
Claims (3)
において、前記突起は部品実装面を横切って１方向に延
びる１条または複数条の帯状区域内に形成し、部品の端
子部が半田付けされるパッドはその帯状区域外に形成し
たことを特徴とする突起付き回路基板。1. In a circuit board with protrusions having a large number of protrusions on the component mounting surface, the protrusions are formed in one or more strip-shaped areas extending in one direction across the component mounting surface, and the terminal portions of the components are soldered. A circuit board with a protrusion, characterized in that the pad is formed outside the strip area.
付き回路基板の突起を形成した帯状区域以外の区域に、
パッドに対応する穴を形成したマスクを被せて、クリー
ム半田をスクリーン印刷することを特徴とする突起付き
回路基板への半田塗布方法。2. Using the circuit board with projections according to claim 1, in an area other than the band-shaped area where the projections are formed on the circuit board with projections,
A method of applying solder to a circuit board with protrusions, which comprises covering the pads with a mask having holes corresponding to the pads and screen-printing cream solder.
ム半田を塗布する治具であって、パッドに対応する穴を
形成したマスクを、突起付き回路基板の突起が形成され
た帯状区域以外の区域を覆うように版枠に固定し、かつ
前記マスクには帯状区域とそれ以外の区域との境界に沿
って立上げ縁を形成したことを特徴とする突起付き回路
基板への半田塗布治具。3. 2. A jig for applying cream solder to pads of a circuit board with protrusions according to claim 1, wherein a mask having holes corresponding to the pads is used to cover an area of the circuit board with protrusions other than the band-shaped area where the protrusions are formed. 1. A jig for applying solder to a circuit board with protrusions, which is fixed to a printing frame so as to cover the mask, and has a raised edge formed on the mask along a boundary between a band-shaped area and other areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17636090A JPH0465183A (en) | 1990-07-05 | 1990-07-05 | Circuit board fitted with projections and method of solder application to said board, and jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17636090A JPH0465183A (en) | 1990-07-05 | 1990-07-05 | Circuit board fitted with projections and method of solder application to said board, and jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465183A true JPH0465183A (en) | 1992-03-02 |
Family
ID=16012256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17636090A Pending JPH0465183A (en) | 1990-07-05 | 1990-07-05 | Circuit board fitted with projections and method of solder application to said board, and jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465183A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015174087A (en) * | 2014-03-13 | 2015-10-05 | 日立オートモティブシステムズ株式会社 | Mask member for welding and method for welding circuit board |
-
1990
- 1990-07-05 JP JP17636090A patent/JPH0465183A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015174087A (en) * | 2014-03-13 | 2015-10-05 | 日立オートモティブシステムズ株式会社 | Mask member for welding and method for welding circuit board |
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