JPH0465449U - - Google Patents
Info
- Publication number
- JPH0465449U JPH0465449U JP10848090U JP10848090U JPH0465449U JP H0465449 U JPH0465449 U JP H0465449U JP 10848090 U JP10848090 U JP 10848090U JP 10848090 U JP10848090 U JP 10848090U JP H0465449 U JPH0465449 U JP H0465449U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- wire
- sealing agent
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000565 sealant Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す図であり、第２
図は本考案の処理フローを示す図であり、第３図
は従来例を示す図である。
図において、１……基板、２…チツプ、３……
ワイヤ、４……封止剤、５……薄板、をそれぞれ
示す。
FIG. 1 is a diagram showing an embodiment of the present invention, and FIG.
The figure is a diagram showing the processing flow of the present invention, and FIG. 3 is a diagram showing a conventional example. In the figure, 1...substrate, 2...chip, 3...
A wire, 4... a sealant, and 5... a thin plate are shown, respectively.
Claims (1)
、 該チツプ２および該ワイヤ３を密閉した状態で
封止する高流動性の封止剤４と、 該封止剤４上に位置する薄板５と、 を有することを特徴とするペアチツプ実装構造。[Claims for Utility Model Registration] A board 1, a chip 2 mounted on the printed circuit board 1, a wire 3 connecting the board 1 and the chip 2, and a hermetically sealed chip 2 and the wire 3. A paired chip mounting structure comprising: a highly fluid sealing agent 4 that seals in a state in which the chips are in contact with each other; and a thin plate 5 located on the sealing agent 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10848090U JPH0465449U (en) | 1990-10-18 | 1990-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10848090U JPH0465449U (en) | 1990-10-18 | 1990-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465449U true JPH0465449U (en) | 1992-06-08 |
Family
ID=31855504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10848090U Pending JPH0465449U (en) | 1990-10-18 | 1990-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465449U (en) |
-
1990
- 1990-10-18 JP JP10848090U patent/JPH0465449U/ja active Pending
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