JPH0186254U - - Google Patents
Info
- Publication number
- JPH0186254U JPH0186254U JP18165387U JP18165387U JPH0186254U JP H0186254 U JPH0186254 U JP H0186254U JP 18165387 U JP18165387 U JP 18165387U JP 18165387 U JP18165387 U JP 18165387U JP H0186254 U JPH0186254 U JP H0186254U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor
- substrate
- package
- sealing lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案による一実施例の半導体パツケ
ージを示す断面図である。
１…基板、２…半導体素子、３…導体パターン
、５…信号系入出力端子、６…電源系入出力端子
、７…封止用キヤツプ、８…ガス流通孔。
FIG. 1 is a sectional view showing an embodiment of a semiconductor package according to the present invention. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Semiconductor element, 3... Conductor pattern, 5... Signal system input/output terminal, 6... Power supply system input/output terminal, 7... Sealing cap, 8... Gas flow hole.
Claims (1)
して前記半導体素子を気密封止した半導体用パツ
ケージにおいて、 前記基板上に信号系入出力端子から独立して前
記半導体素子の電源系入出力端子となる導体ピン
を前記封止用蓋体を貫通して前記基板上に立設し
たことを特徴とする半導体用パツケージ。[Scope of Utility Model Registration Claim] In a semiconductor package in which a sealing lid is bonded to a substrate on which a semiconductor element is mounted to hermetically seal the semiconductor element, A package for a semiconductor, characterized in that conductor pins serving as input/output terminals of the power supply system of the semiconductor element are erected on the substrate through the sealing lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18165387U JPH0186254U (en) | 1987-11-28 | 1987-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18165387U JPH0186254U (en) | 1987-11-28 | 1987-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186254U true JPH0186254U (en) | 1989-06-07 |
Family
ID=31473131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18165387U Pending JPH0186254U (en) | 1987-11-28 | 1987-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186254U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313751U (en) * | 1989-06-26 | 1991-02-12 |
-
1987
- 1987-11-28 JP JP18165387U patent/JPH0186254U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313751U (en) * | 1989-06-26 | 1991-02-12 |
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