JPH0465452U - - Google Patents
Info
- Publication number
- JPH0465452U JPH0465452U JP10832990U JP10832990U JPH0465452U JP H0465452 U JPH0465452 U JP H0465452U JP 10832990 U JP10832990 U JP 10832990U JP 10832990 U JP10832990 U JP 10832990U JP H0465452 U JPH0465452 U JP H0465452U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- terminal
- electrodes formed
- plate
- extension part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10832990U JPH0465452U (2) | 1990-10-15 | 1990-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10832990U JPH0465452U (2) | 1990-10-15 | 1990-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465452U true JPH0465452U (2) | 1992-06-08 |
Family
ID=31855278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10832990U Pending JPH0465452U (2) | 1990-10-15 | 1990-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465452U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217349A (ja) * | 2001-01-17 | 2002-08-02 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
-
1990
- 1990-10-15 JP JP10832990U patent/JPH0465452U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217349A (ja) * | 2001-01-17 | 2002-08-02 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
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