JPH0465454U - - Google Patents
Info
- Publication number
- JPH0465454U JPH0465454U JP10922290U JP10922290U JPH0465454U JP H0465454 U JPH0465454 U JP H0465454U JP 10922290 U JP10922290 U JP 10922290U JP 10922290 U JP10922290 U JP 10922290U JP H0465454 U JPH0465454 U JP H0465454U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- rectangular plate
- metal frame
- semiconductor device
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の一実施例を示す樹脂封止型
半導体装置の横断面図、第２図ａ〜ｃは従来の一
例を示す樹脂封止型半導体装置の横断面図、―
線縦断面図及びＹ―Ｙ線縦断面図である。
１……半導体素子、２，２ａ……素子搭載部、
３……めつき層、４……封止樹脂体、５……金属
素子、６……内部リード、７ａ，７ｂ……搭載部
支持ピン、８……ろう材。
FIG. 1 is a cross-sectional view of a resin-sealed semiconductor device showing an embodiment of the present invention, and FIGS. 2 a to c are cross-sectional views of a resin-sealed semiconductor device showing a conventional example.
They are a longitudinal sectional view taken along a line and a longitudinal sectional view taken along a YY line. 1... Semiconductor element, 2, 2a... Element mounting part,
3... Plating layer, 4... Sealing resin body, 5... Metal element, 6... Internal lead, 7a, 7b... Mounting part support pin, 8... Brazing material.
Claims (1)
半導体素子と、この半導体素子の裏面を固着する
複数の矩形板形状の素子搭載部と長手方向に並べ
て連結しているとともに前記矩形板より外方に伸
びる搭載部支持ピンをもつ金属フレームと、この
金属フレームと前記半導体素子を包合し、前記搭
載部支持ピンの一端を露出する封止樹脂体とを有
する樹脂封止型半導体装置において、前記搭載部
支持ピンに前記封止樹脂体と密着性の悪いめつき
層が形成されていることを特徴とする樹脂封止型
半導体装置。 ２ 前記素子搭載部の一部を切り欠き、格子状に
したことを特徴とする請求項１記載の樹脂封止型
半導体装置。[Scope of Claim for Utility Model Registration] 1. A semiconductor element having an integrated circuit formed on one principal surface of a semiconductor substrate, and a plurality of rectangular plate-shaped element mounting portions to which the back surface of the semiconductor element is fixed, arranged and connected in the longitudinal direction. a metal frame having mounting part support pins extending outward from the rectangular plate; and a sealing resin body enclosing the metal frame and the semiconductor element and exposing one end of the mounting part support pins. 1. A resin-sealed semiconductor device, wherein a plating layer having poor adhesion to the sealing resin body is formed on the mounting portion support pin. 2. The resin-sealed semiconductor device according to claim 1, wherein a portion of the element mounting portion is cut out to form a lattice shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10922290U JPH0465454U (en) | 1990-10-18 | 1990-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10922290U JPH0465454U (en) | 1990-10-18 | 1990-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465454U true JPH0465454U (en) | 1992-06-08 |
Family
ID=31856388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10922290U Pending JPH0465454U (en) | 1990-10-18 | 1990-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465454U (en) |
-
1990
- 1990-10-18 JP JP10922290U patent/JPH0465454U/ja active Pending
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