JPH0465457U - - Google Patents
Info
- Publication number
- JPH0465457U JPH0465457U JP10826790U JP10826790U JPH0465457U JP H0465457 U JPH0465457 U JP H0465457U JP 10826790 U JP10826790 U JP 10826790U JP 10826790 U JP10826790 U JP 10826790U JP H0465457 U JPH0465457 U JP H0465457U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuit board
- crimp
- metal post
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図はこの考案の一実施例による多層化パツ
ケージの斜断面図、第２図はその上層回路基板を
取り外した状態の斜断面図、第３図はその取り外
した上層回路基板の裏面図、第４図はこの考案の
他の実施例による上層回路基板の裏面図、第５図
は従来の多層化パツケージの斜断面図である。
図中、１は多層化パツケージ、２は下層回路基
板、３は上層回路基板、７ｃ金属ポストである。
なお、図中同一符号は同一又は相当部分を示す。
FIG. 1 is a perspective sectional view of a multilayer package according to an embodiment of the invention, FIG. 2 is a perspective sectional view with the upper layer circuit board removed, and FIG. 3 is a rear view of the removed upper layer circuit board. FIG. 4 is a rear view of an upper layer circuit board according to another embodiment of the present invention, and FIG. 5 is a perspective sectional view of a conventional multilayer package. In the figure, 1 is a multilayer package, 2 is a lower layer circuit board, 3 is an upper layer circuit board, and 7c is a metal post.
Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
するとともに、各階層同士を電気的に接続する手
段を有する多層化パツケージにおいて、上記パツ
ケージの回路基板との接続部位に圧着ボンデイン
グ可能な金属ポストを介装配置したことを特徴と
する多層化パツケージ。 In a multilayer package that stores a plurality of circuit boards in a hierarchical manner within the package and has a means for electrically connecting the layers, a metal post that can be bonded by crimp is inserted at the connection part of the package to the circuit board. A multi-layer package characterized by a multi-layered package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826790U JPH0465457U (en) | 1990-10-15 | 1990-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10826790U JPH0465457U (en) | 1990-10-15 | 1990-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465457U true JPH0465457U (en) | 1992-06-08 |
Family
ID=31855173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10826790U Pending JPH0465457U (en) | 1990-10-15 | 1990-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465457U (en) |
-
1990
- 1990-10-15 JP JP10826790U patent/JPH0465457U/ja active Pending